Intel

EP4CE15U14A7N - Cyclone IV E FPGA 15K LE 256-UBGA | Intel (Altera)

MPN: EP4CE15U14A7N ✓ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 256-ball UBGA (Ultra-FineLine BGA) Package 7 Speed 516,096 bits Memory
From $43.5 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $65.26 $65.26
10 $58.73 $587.30
100 $52.21 $5,221.00
500 $47.85 $23,925.00
1,000 $43.5 $43,500.00
ℹ️ All prices are in USD

EP4CE15U14A7N Overview

The Intel (formerly Altera) EP4CE15U14A7N is a Cyclone IV E Field-Programmable Gate Array (FPGA) featuring 15,408 logic elements, 516,096 bits of embedded memory, and 165 maximum user I/Os, housed in a 256-ball Ultra-FineLine BGA (UBGA) package. The device is built on a low-power 60nm process and supports industrial temperature grades (the "I" designator absent here indicates the commercial variant, speed grade 7) with a 1.2V core operating voltage. The EP4CE15U14A7N belongs to the A7 speed grade, balancing timing margin against power dissipation for cost-sensitive volume production.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement custom digital logic via a configuration bitstream, sitting between fixed-function ASICs and discrete logic in the semiconductor hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs combine programmable logic blocks, configurable interconnect, dedicated DSP/memory blocks, and high-speed transceivers, enabling hardware-level parallelism unmatched by microcontrollers for data-path intensive workloads.

Key features of the EP4CE15U14A7N include 56 embedded 18x18 multipliers for digital signal processing, 4 general-purpose PLLs per device for clock management, and support for external memory interfaces including DDR/DDR2 SDRAM, QDRII SRAM, and RLDRAM II. The Cyclone IV E family consumes up to 30% less power than the prior Cyclone III generation at equivalent performance, making it attractive for power-constrained embedded applications.

From a technical perspective, the 60nm process node and adaptive logic module (ALM) architecture deliver a balanced LUT/register ratio of approximately 8:1, with each ALM containing two 4-input LUTs and two dedicated registers. The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with built-in decompression and AES-128 bitstream encryption available in security-enhanced variants.

Typical applications include industrial control and machine vision, video processing pipelines, motor control, automotive infotainment prototypes, low-cost ASIC prototyping, and communications infrastructure bridges. The 165-user-I/O budget and 56 hardware multipliers make it well-suited for parallel DSP preprocessing.

When designing with this part, ensure proper decoupling on each of the four PLL analog supply pins and adequate thermal relief under the BGA substrate. Bitstream compression reduces configuration memory cost but requires careful Quartus II / Intel Quartus Prime fitter settings to validate timing closure.

This page consolidates distributor pricing, drop-in alternatives, and practical design considerations that complement the manufacturer datasheet with information engineers actively seek when sourcing FPGAs.

Drop-in alternatives for EP4CE15U14A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE15U14A7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Family.

Intel
Package: 144-LQFP Exposed Pad (E22)
Process Technology: 60 nm low-power
Operating Temperature: 0C to +85C
Compare with EP4CE15U14A7N →
Intel
Package: 484-FBGA (F23) 23x23 mm, 1.0 mm pitch
Process Technology: 60 nm low-power CMOS (TSMC)
Operating Temperature: -40C to +100C (Industrial)
Compare with EP4CE15U14A7N →
Intel
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Process Technology: 60 nm low-power CMOS
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CE15U14A7N →
Intel
Package: 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch)
Process Technology: 60 nm low-leakage CMOS
Operating Temperature: 0C to 85C (Commercial)
Compare with EP4CE15U14A7N →
Altera
Package: 256-TFBGA
Process Technology: 60 nm
Compare with EP4CE15U14A7N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE15F23C8N

✅ Drop-In
Intel
📦 256-FBGA
Cyclone IV E · 15,408 · 516,096 bits (63 KBytes) · 343 · 4 · 343 · 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch) · 60 nm low-leakage CMOS

✓ In Stock

$33.1 / Unit

View Datasheet →

EP4CE15E22C8N

✅ Drop-In
Intel
📦 256-FBGA
Cyclone IV E · 15,408 · 516,096 · 504 · 56 · 4 · 81 · 1.2 V

✓ In Stock

$15.95 / Unit

View Datasheet →

EP4CE15F17C7N

✅ Drop-In
📦 256-FBGA
same 15,408 LE die, 81 vs 165 max user I/Os (-51%), industrial C7 grade, NOT in same package family

📋 Reference alternative (not in catalog)

EP4CE15M9I7N

✅ Drop-In
Altera
📦 164-MBGA
Field Programmable Gate Array (FPGA) · Cyclone IV E · 15,408 · 516,096 bits · 165 · 256-TFBGA · 256-ball TFBGA · 60 nm

✓ In Stock

$31.9 / Unit

View Datasheet →

EP4CE10E22C8N

✅ Drop-In
Intel
📦 144-EQFP
Cyclone IV E · EP4CE10 · 10,320 · 46 · 414 Kbit · 91 · 144 · 144-LQFP Exposed Pad (E22)

✓ In Stock

$11.1 / Unit

View Datasheet →

EP4CE115F23I7N

✅ Drop-In
Intel
📦 484-FBGA
Cyclone IV E · EP4CE115 (F23 package) · 114,480 · 3,981,312 bits · 280 · 7,180 · 4 · 266

✓ In Stock

$87.95 / Unit

View Datasheet →

EP4CE15U14A7N Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 15,408
Total Memory Bits 516,096 bits
Embedded 18x18 Multipliers 56
General-Purpose PLLs 4
Maximum User I/Os 165
Package 256-ball UBGA (Ultra-FineLine BGA)
Speed Grade 7
Core Voltage 1.2 V
Process Node 60 nm low-power
Configuration Modes JTAG, AS, AP, PS
Bitstream Encryption AES-128 (security-enhanced variant)
External Memory Support DDR/DDR2 SDRAM, QDRII SRAM, RLDRAM II
RoHS Status Compliant (per distributor listings)

EP4CE15U14A7N 256-ball ubga (ultra-fineline bga) Pin Configuration Guide

Pin configuration for EP4CE15U14A7N (256-ball ubga (ultra-fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball ubga (ultra-fineline bga) package pinout diagram for EP4CE15U14A7N

No detailed pinout data available for EP4CE15U14A7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE15U14A7N is suitable for 6 applications: Industrial Motor Control, Video Processing & Machine Vision, ASIC Prototyping & Emulation, Communications Bridge & Protocol Converter, LED Display & Lighting Controllers, Educational & Development Boards.

🏭

Industrial Motor Control

The EP4CE15U14A7N drives 3-phase BLDC and stepper motor controllers by combining 56 hardware 18x18 multipliers for Field-Oriented Control (FOC) math with deterministic parallel logic. Its 165 user I/Os handle encoder, Hall sensor, and PWM outputs to gate drivers. The 60nm low-power process keeps dissipation modest in enclosed IP65 enclosures where heat-sinking is constrained.

📺

Video Processing & Machine Vision

The EP4CE15U14A7N performs real-time image preprocessing (Sobel filtering, color space conversion, Bayer demosaicing) using 56 hardware multipliers in a pipelined DSP chain. Its 516 Kbits of M9K block RAM buffers scan-line data from parallel image sensors, while 165 I/Os accept MIPI-CSI-2 deserializer outputs and feed processed frames into DDR2 memory at 200 MHz.

🖥️

ASIC Prototyping & Emulation

The EP4CE15U14A7N provides 15,408 logic elements - enough to prototype small ASIC designs or RTL subsystems before mask tape-out. Its 60nm process and free Quartus Prime toolchain make per-unit cost low enough to spin up multiple FPGA boards in parallel. Logic-analyzer-friendly 165 user I/Os allow real-time signal probing at full design clock speeds.

🌐

Communications Bridge & Protocol Converter

The EP4CE15U14A7N bridges industrial protocols (EtherCAT, Modbus, Profibus, CAN) by implementing multiple soft IP cores on its programmable fabric. Each of the 4 PLLs generates independent clock domains for serial transceivers, while 56 hardware accelerators offload CRC and packet-header computation. The 256-ball UBGA package supports high-density routing for multiple physical-layer PHYs.

💡

LED Display & Lighting Controllers

The EP4CE15U14A7N drives large LED video walls and architectural lighting installations by generating time-multiplexed PWM streams across dozens of constant-current driver chains. Its 165 user I/Os handle high channel counts, while 56 multipliers calculate gamma correction and color-space transforms on the fly. Low-power 60nm operation reduces enclosure cooling requirements.

🧩

Educational & Development Boards

The EP4CE15U14A7N is widely adopted in university FPGA courses and DIY developer boards due to its moderate 15K logic-element size, mature Quartus Prime toolchain, and abundant reference designs. Its 165 I/Os expose enough peripherals (buttons, switches, displays, GPIO headers) for embedded-systems coursework, while supporting ARM-based HPS interfaces via soft IP cores.

Recommended Products Summary

IRF7507 MOSFET gate driver companion Used in: Industrial Motor Control EP4CE15M9I7N Altera Used in: Industrial Motor Control MT9V032 CMOS image sensor for machine vision Used in: Video Processing & Machine Vision EP4CE15F23C8N Intel Used in: Video Processing & Machine Vision, Educational & Development Boards MT48LC16M16A2 SDRAM companion for memory-mapped prototypes Used in: ASIC Prototyping & Emulation EP4CE115F23C8N Intel Used in: ASIC Prototyping & Emulation LAN8720A Ethernet PHY for industrial protocols Used in: Communications Bridge & Protocol Converter TJA1050 CAN transceiver companion Used in: Communications Bridge & Protocol Converter TLC5941 16-channel PWM LED driver Used in: LED Display & Lighting Controllers EP4CE10E22C8N Intel Used in: LED Display & Lighting Controllers MT48LC4M32B2 SDRAM for soft-processor NIOS II/e cores Used in: Educational & Development Boards
What is the EP4CE15U14A7N?
The EP4CE15U14A7N is a Cyclone IV E Field-Programmable Gate Array (FPGA) from Intel (formerly Altera) with 15,408 logic elements and 516,096 bits of embedded memory, housed in a 256-ball UBGA package. According to distributor listings (DigiKey product #5698250), it is the commercial-temperature, A7 speed-grade variant intended for cost-sensitive high-volume designs.
How much does the EP4CE15U14A7N cost?
The EP4CE15U14A7N lists at approximately $65.26 per unit at quantity 1 as of 2026-09-10 per Heisener distributor data. Volume pricing drops to roughly $43.50 per unit at 1,000 pieces; lead time on this part typically runs 4-8 weeks due to the older 60nm Cyclone IV process.
Is the EP4CE15U14A7N in stock at distributors?
Yes, the EP4CE15U14A7N is in distributor stock as of 2026-09-10. Heisener lists 5,120 pieces available, while IC-Components reports 4,500 pieces. Lead time is approximately Oct 12-17, 2026 per Heisener; verify real-time stock at DigiKey or Mouser for immediate fulfillment.
Where can I download the EP4CE15U14A7N datasheet PDF?
The official EP4CE15U14A7N datasheet is available at the Altera product page (altera.com/products/fpga/cyclone/iv/e/ep4ce15-u14) or via the Cyclone IV Device Handbook. Third-party distributors such as YIC Electronics, Avaq, and IC-Components also host the PDF; the manufacturer datasheet is the authoritative source for pinout and electrical characteristics.
What is the pinout of the EP4CE15U14A7N?
The EP4CE15U14A7N uses a 256-ball Ultra-FineLine BGA package with 165 user I/O balls plus dedicated supply, ground, JTAG, configuration, and PLL pins. The complete ball map is in the Cyclone IV Device Handbook Pin-Out section; engineers should consult the Intel Quartus Prime pin planner for pin assignments.
What is the difference between EP4CE15U14A7N and EP4CE15F23C8N?
The EP4CE15U14A7N uses a 256-ball UBGA package and targets cost-sensitive designs, while the EP4CE15F23C8N uses a 256-ball FBGA package in industrial temperature grade (speed grade 8). Both contain the same 15,408 logic elements; the U14A7N is the commercial A7 grade, and the F23C8N is the industrial C8 grade with different I/O count.
What is the best drop-in replacement for EP4CE15U14A7N?
Drop-in compatible replacements for the EP4CE15U14A7N are limited to other same-package Cyclone IV E variants. Per the verified cross-reference data, no direct second-source pin-compatible part exists on the open market - the Altera/Intel Cyclone IV E family is single-sourced. Consider EP4CE15F23C8N as a same-die variant with industrial temperature grade, or migrate to Cyclone IV GX / Cyclone V for newer designs.
What is the best Lattice equivalent for EP4CE15U14A7N?
Cross-brand drop-in equivalents for the EP4CE15U14A7N do not exist at pin-to-pin level because BGA ball maps and configuration schemes differ across vendors. The closest Lattice Semiconductor functional alternative is the ECP5 family (e.g., LFE5U-25F-6BG256C) with comparable logic density, but it requires PCB redesign for the BGA pinout and Quartus-to-Diamond tool migration.
Hey Google, what can replace the EP4CE15U14A7N?
The most practical replacement for the EP4CE15U14A7N is another Cyclone IV E device in the same 256-ball UBGA package, such as EP4CE15F23C8N or EP4CE15E22C8N, which share the same logic array but differ in temperature grade or speed. Cross-brand replacements require PCB redesign; Lattice ECP5 and Xilinx Spartan-6 are functional equivalents with comparable LE counts.
When should I choose EP4CE15U14A7N over EP4CE15F23C8N?
Choose the EP4CE15U14A7N (commercial A7 speed grade) for indoor commercial-temperature applications where the lowest unit cost matters. Choose the EP4CE15F23C8N when your design must operate across the full industrial temperature range (-40C to +85C); the C8 speed grade gives slightly tighter timing margins but consumes marginally more power.
What are the key specifications of EP4CE15U14A7N that engineers should know?
The EP4CE15U14A7N provides 15,408 logic elements, 516 Kbits embedded RAM (organized as M9K blocks), 56 18x18 hardware multipliers, 4 PLLs, and 165 user I/Os in a 256-ball UBGA package. Core voltage is 1.2V on the 60nm low-power process; configuration is via JTAG, Active Serial, Active Parallel, or Passive Serial modes, per the Cyclone IV Device Handbook.
What software tool is required to program the EP4CE15U14A7N?
The EP4CE15U14A7N is programmed using Intel Quartus Prime (legacy Altera Quartus II 13.0sp1 is the last officially supported version for Cyclone IV). The toolchain provides synthesis, place-and-route, timing analysis, simulation, and bitstream generation; programmers such as USB-Blaster or JTAG-based cables download the configuration to the device.
How many transceivers does the EP4CE15U14A7N have?
The EP4CE15U14A7N Cyclone IV E device has zero high-speed serial transceivers - the Cyclone IV E family targets general-purpose logic, while Cyclone IV GX adds up to 8 transceivers per device. For serial I/O, use LVDS pairs on the regular user I/Os (up to several hundred Mbps) or migrate to Cyclone IV GX if multi-Gbps serial links are required.
What is the lead time for EP4CE15U14A7N?
Lead time for the EP4CE15U14A7N is approximately 4-8 weeks as of 2026-09-10 per Heisener distributor listings (estimated delivery Oct 12-17, 2026). The Cyclone IV E family remains in active production but volumes are declining; engineers designing new products should evaluate Cyclone V or Cyclone 10 LP as long-term alternatives.
Can the EP4CE15U14A7N be used in automotive applications?
The EP4CE15U14A7N is a commercial-temperature-grade variant and is NOT AEC-Q100 qualified, so it should not be used in automotive safety-critical applications. For automotive designs, choose an AEC-Q100-qualified Cyclone IV GX or Cyclone V device such as EP4CGX22CF19I7N (industrial grade) or migrate to Cyclone V E / Cyclone 10 LP automotive parts.

Engineering reference data for EP4CE15U14A7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE15U14A7N when you need a Cyclone IV E FPGA at the lowest commercial-temperature cost with 15,408 logic elements and 165 user I/Os in a 256-ball UBGA package - ideal for indoor motor control, video processing, communications bridging, and FPGA education platforms. Migrate to EP4CE15F23C8N if your design must operate across -40C to +85C industrial temperatures. Choose EP4CE115F23I7N if your logic utilization exceeds 80% of 15K LEs and you need 115K LE headroom. Avoid the EP4CE10E22C8N unless your design is firmly under 10K LEs - moving to a smaller device forfeits the multiplier and I/O budget you may later need.

Comparison with Alternatives

Parameter This Product EP4CE15F23C8N EP4CE15E22C8N EP4CE15F17C7N EP4CE15M9I7N EP4CE10E22C8N EP4CE115F23I7N
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 256-ball UBGA 256-FBGA 256-FBGA 256-FBGA 164-MBGA 144-EQFP 484-FBGA
Logic Elements 15,408 15,408 15,408 15,408 15,408 10,320 115,000
Total Memory Bits 516,096 516,096 516,096 516,096 516,096 423,936 3,981,312
Max User I/Os 165 164 144 81 84 91 289
18x18 Multipliers 56 56 56 56 56 23 266
PLLs 4 4 4 4 4 2 4
Speed Grade 7 (A7 commercial) 8 (C8 industrial) 8 (C8 industrial) 7 (C7 industrial) 7 (I7 industrial) 8 (C8 industrial) 7 (I7 industrial)

Key Differentiators

  • Lowest unit cost in Cyclone IV E 15K LE tier (vs EP4CE15F23C8N)
  • Highest I/O count at 256-ball UBGA density (vs EP4CE15M9I7N (164-MBGA))
  • Most balanced 15K LE / 56 multiplier / 165 I/O combination (vs EP4CE115F23I7N)

Design Notes

The Cyclone IV E EP4CE15 requires a 1.2V VCCINT core supply, plus 2.5V/3.0V/3.3V VCCIO banks for I/O standards. Use a low-dropout regulator such as the TI TPS74401 for VCCINT, and place 100 nF + 10 uF ceramic decoupling within 5 mm of each power pin. PLL analog supply (VCCA_PLL) must be filtered through a ferrite bead and a 10 uF + 100 nF network per the Cyclone IV Device Handbook power distribution guidelines.

The 256-ball UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 14 C/W with adequate PCB cooling (8-layer board with thermal vias under the BGA). Without thermal vias, theta_JA rises above 25 C/W. For continuous full-utilization operation at industrial temperatures, add a heatsink or thermal interface material; compute junction temperature using TJ = TA + (P x theta_JA) where P includes both static and dynamic dissipation.

Use a 1.0 mm pitch BGA land pattern with non-solder-mask-defined (NSMD) pads for the 256-ball UBGA. Plan escape routing on inner layers; signal layers must support 0.8 mm trace width with 0.15 mm clearance for 4-mil design rules. Place configuration memory (EPCS) and clock sources within 50 mm of the device to minimize skew. The Cyclone IV Device Handbook pin connection guidelines list every supply, ground, and configuration pin that must be connected.

Do not leave unused PLL analog supply pins floating - each PLL block needs VCCA_PLL and VCCD_PLL even if disabled. JTAG pins (TCK, TMS, TDI, TDO) must be pulled up or terminated per datasheet; floating JTAG chains cause configuration failures. nCONFIG must be tied to VCCIO through a 10 kohm resistor; nSTATUS and CONF_DONE need pull-ups. Confirm the bitstream file matches the device speed grade (A7 vs C8) or configuration will silently fail.

Place a complete ground plane on layer 2 directly under the BGA, stitched with 1 via per 4 signal vias to minimize return path inductance. Differential pairs (LVDS) must be length-matched within 150 mils and routed over a continuous reference plane; avoid routing LVDS across plane splits. Source-synchronous DDR interfaces should use the FPGA's dedicated DQS/DQSn pins with matched trace lengths per the Quartus Prime pin planner recommendations.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per distributor listings; commercial temperature variant is NOT AEC-Q100 qualified - use Cyclone IV GX/AGX or automotive-grade Cyclone V for vehicle applications. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CE15U14A7N EP4CE15F23C8N EP4CE15E22C8N EP4CE15M9I7N EP4CE115F23I7N FPGA Field-Programmable Gate Array Cyclone IV E Programmable Logic Device PLD Logic Element ALM (Adaptive Logic Module) M9K memory block 18x18 multiplier PLL Ultra-FineLine BGA UBGA 256-ball BGA Quartus Prime Quartus II USB-Blaster JTAG DDR2 SDRAM QDRII SRAM AEC-Q100 RoHS JEDEC J-STD-020 60nm low-power process 1.2V core voltage industrial temperature grade AES-128 bitstream encryption EtherCAT Modbus Profibus CAN bus FOC (Field-Oriented Control) Lattice ECP5 Xilinx Spartan-6
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