Intel

EP4CE30F19A7N - 28.8K Logic Elements 193 I/O Cyclone IV E FPGA

MPN: EP4CE30F19A7N ✓ Active
In Stock Ships in 1-3 business days
1.0 V / 1.2 V Vdss FBGA-324 (F19) Package 20 Speed 608,256 (76 KB) Memory
From $35.12 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $53.83 $53.83
10 $48.45 $484.50
100 $43.06 $4,306.00
500 $38.9 $19,450.00
1,000 $35.12 $35,120.00
ℹ️ All prices are in USD

EP4CE30F19A7N Overview

The Intel (formerly Altera) EP4CE30F19A7N is a Cyclone IV E field-programmable gate array (FPGA) with 28,848 logic elements, 608,256 bits of embedded memory, and 193 user I/O pins, packaged in a 324-ball fine-pitch BGA (FBGA-324). It is fabricated on a low-power 60 nm process and supports core voltages of 1.0 V and 1.2 V with industrial temperature grade operation.

An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic blocks and interconnect after fabrication. FPGAs sit in the broader hierarchy of programmable logic (PLD) -> CPLD/FPGA -> reconfigurable computing -> ASIC prototyping. Cyclone IV E is Intel's low-cost, low-power FPGA family targeting high-volume, cost-sensitive applications such as industrial control, video processing, and communications infrastructure.

Key features include 28,848 logic elements (LEs), 608,256 bits (76 KB) of embedded SRAM, 66 embedded 18x18 multipliers for DSP operations, 4 general-purpose PLLs, and 20 global clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, with per-pin programmable drive strength and slew rate. Configuration is supported via JTAG, Active Serial (AS), and Passive Serial (PS) modes using industry-standard EPCS or EPCQ configuration devices.

Technically, the Cyclone IV E architecture combines LABs (Logic Array Blocks), M9K memory blocks, and DSP blocks with a multi-level interconnect hierarchy. The 60 nm process delivers lower static power than the previous Cyclone III generation while maintaining compatibility with Quartus Prime design software. Compared with the higher-end Cyclone V or Stratix families, the IV E family trades transceiver support for lower unit cost, making it suitable where serial gigabit transceivers are not required.

Typical applications include industrial motor control, factory automation controllers, video surveillance and image processing, telecom line cards, and ASIC prototyping. The 193 user I/O count and 4 PLLs make it well suited to glue-logic replacement and parallel sensor aggregation in embedded systems.

When designing with this device, allocate sufficient PCB area for the FBGA-324 footprint and follow Intel's recommended decoupling scheme. Quartus Prime Lite provides a free toolchain for synthesis, place-and-route, and timing analysis for this device family.

Drop-in alternatives for EP4CE30F19A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE30F19A7N (same form factor and footprint) — differing in Package, Configuration Modes, Embedded 18x18 Multipliers, RoHS Status, Process Technology.

Intel
Package: 256-ball FBGA (F17)
Process Technology: 60 nm low-power CMOS
Compare with EP4CE30F19A7N →
Intel
Package: FBGA-256 (F19)
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP4CE30F19A7N →
Altera
Package: 324-ball FineLine BGA (F19) 19x19 mm
Configuration Modes: AS, PS, JTAG, FPP
Embedded 18x18 Multipliers: 116
Compare with EP4CE30F19A7N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CE30F19C7N

✅ Drop-In
Intel
📦 FBGA-324 (F19)
Cyclone IV E · 28,880 · 594 Kbits (M9K blocks) · 66 · 329 · 4 · FBGA-256 (F19) · -7 (fastest commercial)

✓ In Stock

$52.8 / Unit

View Datasheet →

EP4CE30F19I7N

✅ Drop-In
📦 FBGA-324 (F19)
Industrial temperature grade vs automotive; same FBGA-324 (F19) footprint, identical 28,848 LEs

📋 Reference alternative (not in catalog)

EP4CE30F23A7N

✅ Drop-In ⚠️ 参数待验证
📦 FBGA-484 (F23)
Larger FBGA-484 package with up to 328 I/O; same 28,848 LEs, NOT pin-to-pin with F19 footprint

📋 Reference alternative (not in catalog)

EP4CE40F19A7N

✅ Drop-In
Altera
📦 FBGA-324 (F19)
Cyclone IV E · 39,600 · 113,560 (cyclone IV E equivalent for LE count) · 1,161,216 · 244 x M9K (32,256 bits each) + 1 x MLAB · 116 · 193 · 4

✓ In Stock

$298.75 / Unit

View Datasheet →

EP4CE22F17I7N

✅ Drop-In ⚠️ 参数待验证
Intel
📦 FBGA-256 (F17)
Cyclone IV E · 22,320 · 608,256 bits (594 Kbits) · 66 M9K blocks · 66 · 153 · 4 · 20

✓ In Stock

$43.4 / Unit

View Datasheet →

EP4CE30F19A7N Maximum Ratings & Electrical Characteristics

Series Cyclone IV E
Logic Elements 28,848
Embedded Memory Bits 608,256 (76 KB)
User I/O Count 193
Number of Pins 324
Package FBGA-324 (F19)
Process Technology 60 nm
Core Voltage 1.0 V / 1.2 V
Embedded 18x18 Multipliers 66
General-Purpose PLLs 4
Global Clock Networks 20
Operating Temperature Automotive / Industrial grade
Configuration Modes JTAG, Active Serial, Passive Serial
RoHS Status Compliant
Mounting Type Surface Mount
Speed Grade 7

EP4CE30F19A7N fbga-324 (f19) Pin Configuration Guide

Pin configuration for EP4CE30F19A7N (fbga-324 (f19) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

fbga-324 (f19) package pinout diagram for EP4CE30F19A7N

No detailed pinout data available for EP4CE30F19A7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE30F19A7N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Telecom Line Cards and Network Appliances, ASIC Prototyping and Emulation, Factory Automation Controllers, Test and Measurement Instrumentation.

🏭

Industrial Motor Control

The EP4CE30F19A7N fits industrial motor control designs because it provides 28,848 logic elements, 66 embedded 18x18 multipliers, and 4 general-purpose PLLs, all of which can implement field-oriented control (FOC) loops and PWM generation. With 193 user I/O pins, the FPGA can interface directly with multiple encoder channels, Hall sensors, and gate-driver ICs while running real-time control algorithms. Compared to a microcontroller-only solution, the FPGA delivers deterministic timing and parallel processing for sensorless control. Quartus Prime Lite provides a free toolchain, and the device's low static power at 1.0/1.2 V core voltage keeps overall system thermal load manageable in enclosed motor-drive enclosures.

🎥

Video Surveillance and Image Processing

The EP4CE30F19A7N suits video surveillance and image processing pipelines because it offers 608 Kbits of embedded memory and 66 DSP blocks that can implement real-time video filters, scaling, and motion-detection algorithms. Its 193 user I/O pins support parallel CMOS-camera interfaces, DDR memory controllers, and Ethernet MACs simultaneously. The Cyclone IV E family is widely used in mid-resolution IP-camera designs where low unit cost and moderate logic density are key. Compared with high-end SoC FPGAs, the EP4CE30 trades transceivers for unit-cost savings, which is acceptable for 720p/1080p camera SoCs.

🌐

Telecom Line Cards and Network Appliances

The EP4CE30F19A7N fits telecom line-card and network-appliance designs because of its 28,848 logic elements capable of running packet-processing logic, glue logic, and protocol-bridge functions. The 4 PLLs and 20 global clock networks simplify multi-clock-domain designs such as TDM-to-Ethernet bridges. According to the Cyclone IV handbook, this family is widely deployed in legacy telecom infrastructure where low power and high reliability are priorities. The 1.0 V or 1.2 V core voltage enables efficient power tree design compared to higher-voltage FPGAs.

🔧

ASIC Prototyping and Emulation

The EP4CE30F19A7N supports ASIC prototyping because its 28,848 logic elements, 608 Kbits of embedded memory, and 66 DSP blocks provide enough capacity to validate many pre-silicon designs. The Quartus Prime toolchain supports incremental compilation and LogicLock regions, which speed up design iteration cycles. Compared with dedicated emulation platforms, Cyclone IV E FPGAs offer a more accessible price point for small teams. The FBGA-324 footprint allows multiple FPGAs to be tiled on a single prototyping board via board-to-board mezzanine connectors.

🏭

Factory Automation Controllers

The EP4CE30F19A7N fits factory automation controllers because its 193 user I/O pins and 4 PLLs support multiple fieldbus protocols (PROFIBUS, RS-485, RS-232, CAN, Ethernet) and parallel sensor aggregation in real time. The 28,848 logic elements allow soft-core CPU implementation (Nios II) alongside deterministic glue logic. Compared with discrete microcontroller solutions, the FPGA consolidates multiple interface peripherals into a single chip, reducing board area and BOM cost. The industrial temperature grade ensures operation in factory-floor thermal environments.

🖥️

Test and Measurement Instrumentation

The EP4CE30F19A7N fits test-and-measurement instrumentation because its high I/O count, embedded memory, and DSP blocks support arbitrary waveform generation, digital signal conditioning, and protocol-analyzer functions. The 4 PLLs enable precise timing synthesis required for high-speed digitizer applications. Compared with DSP-only solutions, the FPGA offers parallel processing that can handle multi-channel acquisition simultaneously. The Cyclone IV E family is widely used in mid-range oscilloscopes and logic analyzers where price/performance balance matters.

Recommended Products Summary

EP4CE40F19A7N Altera Used in: Industrial Motor Control EP4CE15F17I7N Lower-cost variant for simpler scalar-control motor drives Used in: Industrial Motor Control EP4CE30F23A7N Higher I/O variant for multi-camera systems requiring additional parallel interfaces Used in: Video Surveillance and Image Processing EPCS64SI16N Active Serial configuration memory for production deployment Used in: Video Surveillance and Image Processing EPCQ64ASI16N Quad-SPI configuration memory for fast field upgrades Used in: Telecom Line Cards and Network Appliances EP4CE115F29C8N Intel Used in: Telecom Line Cards and Network Appliances EP4CE115F23I7N Intel Used in: ASIC Prototyping and Emulation EP3SL70F780I4N Intel Used in: ASIC Prototyping and Emulation EP4CE10E22I8N Intel Used in: Factory Automation Controllers EP4CE22F17I7N Intel Used in: Factory Automation Controllers EP4CE15F23C7N Intel Used in: Test and Measurement Instrumentation EPCS16SI8N Altera Used in: Test and Measurement Instrumentation
What is the logic element count of the EP4CE30F19A7N?
The EP4CE30F19A7N contains 28,848 logic elements (LEs) in the Cyclone IV E family. According to the Intel Cyclone IV Device Handbook, this LE count sits in the mid-range of the Cyclone IV E portfolio, between the EP4CE15 (15,408 LEs) and the EP4CE55 (55,856 LEs), offering a balanced mix of logic capacity and unit cost for cost-sensitive applications.
How many user I/O pins does the EP4CE30F19A7N provide?
The EP4CE30F19A7N provides 193 user I/O pins in the FBGA-324 package. According to Intel datasheet documentation, this high I/O count supports parallel sensor interfaces, memory buses, and multiple communication peripherals simultaneously, making the device suitable for industrial control and video processing systems that need extensive pin connectivity.
What is the difference between the EP4CE30F19A7N and EP4CE30F23A7N?
The EP4CE30F19A7N uses a 324-ball FBGA (F19 package code), while the EP4CE30F23A7N uses a 484-ball FBGA (F23 package code). According to the Cyclone IV ordering information, both share the same 28,848 logic elements and core silicon, but the F23 variant exposes more I/O pins (up to 328) at the cost of a larger PCB footprint. Choose F19 for space-constrained designs and F23 when more I/O is needed.
Where can I download the EP4CE30F19A7N datasheet PDF?
The official Intel Cyclone IV Device Handbook is available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyclone4-handbook.pdf. Per-pad pinout tables and package-specific ball maps for the FBGA-324 (F19) device are in the Cyclone IV Device Datasheet, which can be downloaded from the Intel FPGA Resource Center or distributor sites such as DigiKey and Mouser.
What is the price of the EP4CE30F19A7N as of 2026-09-10?
The EP4CE30F19A7N unit price is approximately $53.83 per piece at quantity 1 as of 2026-09-10, according to Octopart and Heisener distributor listings. Bulk pricing drops to around $35.12 at 1000-piece quantities, with full distributor tier breakdowns available on DigiKey, Mouser, and Octopart. Always confirm current pricing and stock directly with the distributor before procurement.
Is the EP4CE30F19A7N in stock at major distributors?
Yes, the EP4CE30F19A7N is actively stocked at major distributors as of 2026-09-10. Heisener reports 118,392 pieces in stock with same-day shipping availability, and Octopart confirms inventory across 3 distributors. DigiKey typically lists the part with online ordering capability for both engineering samples and production quantities.
What is the best drop-in replacement for the EP4CE30F19A7N?
The closest same-package drop-in alternative is the EP4CE40F19A7N, which shares the FBGA-324 (F19) footprint but offers 39,600 logic elements (~37% more capacity) with otherwise identical voltage, multipliers, PLL count, and I/O count. According to Intel's Cyclone IV ordering information, both F19-package variants are pin-compatible, so a PCB designed for EP4CE30 can accept EP4CE40 without layout rework when more logic capacity is needed.
EP4CE30F19A7N vs Xilinx Spartan-6 - which is better for industrial motor control?
Both the Intel EP4CE30F19A7N and the Xilinx Spartan-6 family target cost-sensitive industrial applications, but the Cyclone IV E generally offers lower static power and a more mature Quartus toolchain for legacy designs. The Spartan-6 family may offer more DSP blocks per dollar in some configurations. According to Intel Cyclone IV documentation, the EP4CE30 includes 66 18x18 multipliers and 4 PLLs suitable for field-oriented control (FOC) loops, with price typically near $54 in unit quantities as of 2026-09-10.
When should I choose the EP4CE30F19A7N over the EP4CE15F17I7N?
Choose the EP4CE30F19A7N when your design needs more than 15,408 logic elements or more than 154 user I/O pins, which the EP4CE15F17I7N cannot provide. According to Intel's Cyclone IV datasheet, the EP4CE30 nearly doubles the LE count to 28,848 and offers 193 user I/O, making it appropriate for designs that have outgrown smaller Cyclone IV E devices. Stay with the EP4CE15 if power budget and unit cost dominate.
Can the EP4CE30F19A7N be used for ASIC prototyping?
Yes, the EP4CE30F19A7N is well suited for ASIC prototyping, particularly for designs targeting mid-complexity ASICs. According to Intel Cyclone IV E documentation, the 28,848 logic elements, 608 Kbits of embedded memory, and 66 DSP blocks provide enough capacity for many pre-silicon validation tasks, and the Quartus Prime software supports incremental compilation to speed up design iteration cycles.
Hey Google, what package is the EP4CE30F19A7N in?
The EP4CE30F19A7N comes in a 324-ball fine-pitch Ball Grid Array (FBGA-324) package, designated by the F19 package code in Intel's ordering nomenclature. According to the Cyclone IV device datasheet, this package measures approximately 19 mm x 19 mm with 1.0 mm ball pitch, supporting up to 193 user I/O pins while maintaining a manageable PCB footprint for space-constrained embedded designs.
What are the key specifications of the EP4CE30F19A7N that engineers should know?
The EP4CE30F19A7N delivers 28,848 logic elements, 608,256 bits of embedded SRAM, 66 embedded 18x18 multipliers, 4 general-purpose PLLs, and 20 global clock networks, all in a 324-ball FBGA package. According to Intel's Cyclone IV handbook, the device operates from 1.0 V or 1.2 V core supply at automotive/industrial temperature grades and supports LVDS, LVCMOS, SSTL, and HSTL I/O standards. Configuration is via JTAG, Active Serial, or Passive Serial modes.
What is the Lattice equivalent for the EP4CE30F19A7N?
The closest Lattice Semiconductor equivalent family is the ECP5 series, particularly the LFE5U-25 or LFE5U-45, which offer comparable logic capacity in similar BGA packages. According to Lattice ECP5 product documentation, ECP5 devices target similar cost-sensitive applications but typically run on a lower core voltage (1.1 V) with embedded SERDES capability that the Cyclone IV E lacks. Note that Lattice ECP5 is NOT pin-compatible with the Cyclone IV E FBGA-324 footprint - PCB redesign is required.
What is the lead time for the EP4CE30F19A7N when ordered from distributors?
The EP4CE30F19A7N lead time is approximately 1-2 business days when ordered from major distributors such as DigiKey, Mouser, or Heisener as of 2026-09-10. Heisener reports same-day shipping capability with delivery times of July 30 - August 4 for expedited orders. For volume production, lead times may extend to 4-6 weeks depending on distributor stock levels and order quantity - always confirm with your distributor.
Is the EP4CE30F19A7N RoHS compliant?
Yes, the EP4CE30F19A7N is RoHS compliant per the Intel Cyclone IV product family environmental compliance documentation. According to Intel's lead-free transition documentation, all Cyclone IV E devices shipped in FBGA packages are manufactured with lead-free solder balls and meet the EU RoHS Directive 2011/65/EU requirements. Confirm specific REACH and conflict-minerals certifications directly with Intel for the latest compliance statements.

Engineering reference data for EP4CE30F19A7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE30F19A7N when your design needs 25,000-30,000 logic elements in the FBGA-324 footprint with automotive temperature grade and ~193 user I/O. This part is the sweet spot for industrial motor control, factory automation, and mid-range video processing designs where price/performance balance matters. Choose EP4CE30F19C7N for commercial-temperature designs at slightly lower cost. Choose EP4CE40F19A7N if your design is approaching the LE ceiling and you want a pin-compatible upgrade path. Choose EP4CE22F17I7N if 22,320 LEs are sufficient and you need a smaller FBGA-256 footprint. Avoid F23-package variants (EP4CE30F23A7N) unless you need more than 250 user I/O pins.

Comparison with Alternatives

Parameter This Product EP4CE30F19C7N EP4CE30F19I7N EP4CE40F19A7N EP4CE22F17I7N EP4CE30F23A7N
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package FBGA-324 (F19) FBGA-324 (F19) FBGA-324 (F19) FBGA-324 (F19) FBGA-256 (F17) FBGA-484 (F23)
Logic Elements 28,848 28,848 28,848 39,600 22,320 28,848
User I/O 193 193 193 193 153 328
Embedded Memory (bits) 608,256 608,256 608,256 1,161,216 608,256 608,256
Embedded 18x18 Multipliers 66 66 66 116 66 66
PLLs 4 4 4 4 4 4
Operating Temperature Grade Automotive Commercial Industrial Automotive Industrial Automotive

Key Differentiators

  • Highest LE density in the F19-footprint Cyclone IV E family (vs EP4CE22F17I7N)
  • Automotive temperature grade option (vs EP4CE30F19C7N)
  • Compact FBGA-324 footprint with 193 I/O (vs EP4CE30F23A7N)

Design Notes

The FBGA-324 package uses 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia or via-in-pad construction for reliable breakout routing. According to Intel Cyclone IV hardware design guidelines, allocate at least 4 decoupling capacitors per power rail (VCCINT, VCCA, VCCIO banks) within 100 mils of the package, with 10 uF bulk capacitors at the board edge. Use a continuous ground plane under the package to control return-path impedance for high-speed LVDS signals.

The EP4CE30F19A7N requires separate VCCINT (1.0 V or 1.2 V core), VCCA (2.5 V analog PLL supply), and VCCIO (1.2 V to 3.3 V per bank) rails. Estimated: at 100% logic utilization and 100 MHz operation, total core current can reach ~500 mA; design the regulator with at least 30% headroom. Power-on sequencing per Intel Cyclone IV handbook requires VCCINT and VCCA to ramp before or simultaneously with VCCIO to prevent latch-up.

Configuration mode pins MSEL[3..0] must be set correctly for Active Serial (AS), Passive Serial (PS), or JTAG modes per Intel Cyclone IV configuration handbook - incorrect MSEL settings prevent the device from configuring. JTAG TCK should be pulled to ground through a 1 kohm resistor when not in use to avoid floating-clock configuration failures. nCONFIG must be held high during power-up; a pull-up to VCCIO is recommended.

Estimated: at full logic utilization and 100 MHz clock rate, the EP4CE30 dissipates approximately 1.5 W to 2.5 W depending on toggle rate. The FBGA-324 package junction-to-ambient thermal resistance is approximately 18 C/W (per typical Intel characterization), so a 2 W dissipation yields a 36 C junction temperature rise. For high-utilization designs, thermal vias under the package center are recommended to spread heat to inner PCB copper planes.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per Intel Cyclone IV product family environmental documentation. AEC-Q100 qualification not formally published; verify directly with Intel for automotive qualification status of the 'A7N' speed/temperature code.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

EP4CE30F19A7N EP4CE30F19A7N datasheet Intel Cyclone IV EP4CE30 Cyclone IV E 28848 logic elements FPGA FBGA-324 Cyclone IV E FPGA EP4CE30F19A7N motor control industrial EP4CE30F19A7N vs EP4CE40F19A7N EP4CE30F19A7N buy price stock EP4CE30F19A7N pinout FBGA-324 low power FPGA 28848 logic elements Cyclone IV E automotive grade FPGA EP4CE30F19A7N Quartus Prime support

Related Components & Terms

Intel Altera EP4CE30F19A7N Cyclone IV E FPGA Field-Programmable Gate Array Programmable Logic Device PLD FBGA-324 Logic Element LE DSP block Embedded memory M9K memory block PLL Phase-Locked Loop LVDS LVCMOS SSTL HSTL JTAG Active Serial configuration Quartus Prime RoHS AEC-Q100 60 nm process industrial motor control
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