Intel

EP4CE15F23C7N - Cyclone IV E FPGA, 15K LE, 484-FBGA | Intel

MPN: EP4CE15F23C7N βœ“ Active
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1.2 V Vdss LVTTL, LVCMOS (1.0/1.5/1.8/2.5/3.0/3.3 V), SSTL, HSTL, PCI, PCI-X Rds(on) 484-ball FBGA (F23) Package 20 Speed 516,096 bits (56 M9K blocks) Memory
From $12.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $22.94 $22.94
10 $20.65 $206.50
100 $17.4 $1,740.00
500 $14.95 $7,475.00
1,000 $12.85 $12,850.00
ℹ️ All prices are in USD

EP4CE15F23C7N Overview

The Intel (Altera) EP4CE15F23C7N is a Cyclone IV E field-programmable gate array (FPGA) integrating 15,408 logic elements, 516,096 bits of embedded memory, and 343 user I/Os into a 484-ball fine-pitch BGA (FBGA) package. Built on a low-power 60 nm process, it operates from a 1.2 V core supply with 1.0 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, and 3.3 V LVCMOS/LVTTL I/O standards supported through independent bank voltages. The device is offered in a commercial 0C to 85C temperature grade with an I7 speed grade that still meets all C8 timing specifications when operated up to 125C.

An FPGA is a programmable logic device built from an array of configurable logic blocks (LBs), programmable interconnect, and embedded memory/DSP blocks. Compared with a CPLD, an FPGA offers far higher logic density and dedicated multiplier/M9K memory blocks. The Cyclone IV E family sits in the hierarchy: programmable logic device -> FPGA -> low-cost FPGA -> SRAM-based FPGA, and is widely used as a glue-logic and DSP co-processor alongside microcontrollers and ASICs.

Key features include 56 embedded 18 x 18 multipliers, four general-purpose PLLs, 20 global clock networks, and 343 user I/Os distributed across eight I/O banks. The 484-FBGA package offers high-density interconnect for multi-lane parallel designs, while the 60 nm process keeps typical static power below 150 mW, making the part attractive for power-constrained industrial designs.

Architecturally, the Cyclone IV E uses a 4-input look-up table (LUT) logic element, M9K memory blocks (each 9 Kbit), and DSP blocks for 18 x 18 signed multiplication. Configuration is loaded through passive serial (PS), fast passive parallel (FPP), or Altera-compatible JTAG, with built-in decompression and encryption support via AES-128. The I7 speed grade offers the second-fastest -7 timing within the Cyclone IV E family, suitable for 100 MHz+ system buses.

Typical applications include industrial motor control, video processing pipelines, machine vision pre-processors, telecom interface cards, and low-cost prototyping platforms. The Cyclone IV E family is also popular as a PCIe endpoint bridge, sensor-fusion pre-processor, and educational logic-lab FPGA.

When designing, ensure that the Quartus II (13.0sp1 or later) pin assignments match the 484-FBGA ball map, since the FBGA footprint differs from the larger 484-pin BGA used on some competitor parts. Decoupling: place 100 nF X7R 0402 capacitors within 3 mm of each VCCINT/VCCA pin, with 10 uF bulk capacitors on each supply rail.

This page combines distributor pricing, drop-in same-package alternatives, and Quartus-aware design notes that go beyond the manufacturer datasheet itself.

Drop-in alternatives for EP4CE15F23C7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE15F23C7N (same form factor and footprint) β€” differing in Speed Grade, Process Technology, Package, Configuration Modes, Operating Temperature.

Intel
Speed Grade: -7
Process Technology: 60 nm low-power CMOS
Configuration Modes: AS, PS, JTAG, Fast Passive Parallel
Compare with EP4CE15F23C7N β†’
Intel
Speed Grade: 8
Process Technology: 60 nm low-power CMOS
Package: 144-pin EQFP (Enhanced QFP) with Exposed Pad
Compare with EP4CE15F23C7N β†’
Intel
Speed Grade: 6
Process Technology: 60 nm
Compare with EP4CE15F23C7N β†’
Intel
Speed Grade: C8 (commercial, 8 ns internal timing)
Process Technology: 60 nm low-leakage CMOS
Package: 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch)
Compare with EP4CE15F23C7N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE15F23C8N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 15,408 Β· 516,096 bits (63 KBytes) Β· 343 Β· 4 Β· 343 Β· 484-BGA (FineLine BGA, F23, 23x23 mm, 1.0 mm pitch) Β· 60 nm low-leakage CMOS

βœ“ In Stock

$33.1 / Unit

View Datasheet β†’

EP4CE15F23C6N

βœ… Drop-In
πŸ“¦ 484-FBGA (F23)
Same 484-FBGA F23 footprint, 15,408 LEs, faster C6 speed grade (vs C7); pin-compatible, faster timing

πŸ“‹ Reference alternative (not in catalog)

EP4CE15E22C7N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 15,408 Β· 516,096 Β· 81 Β· 1.2 V Β· 0 Β°C to +85 Β°C (commercial) Β· -7 Β· 144-pin EQFP with exposed pad

βœ“ In Stock

$105.4 / Unit

View Datasheet β†’

EP4CE15E22C8N

βœ… Drop-In
Intel
πŸ“¦ 484-FBGA (F23)
Cyclone IV E Β· 15,408 Β· 516,096 Β· 504 Β· 56 Β· 4 Β· 81 Β· 1.2 V

βœ“ In Stock

$15.95 / Unit

View Datasheet β†’

EP4CE30F23C8N

βœ… Drop-In
πŸ“¦ 484-FBGA (F23)
Same 484-FBGA F23 footprint, 28,848 LEs (+87% density vs 15,408), 66 multipliers, 532 Kbit RAM, C8 speed grade; full pin-compatible upgrade

πŸ“‹ Reference alternative (not in catalog)

EP4CE10F23C8N

βœ… Drop-In
πŸ“¦ 484-FBGA (F23)
Same 484-FBGA F23 footprint, 10,320 LEs (-33% vs 15,408), same C8 speed grade; pin-compatible down-grade for cost-sensitive designs

πŸ“‹ Reference alternative (not in catalog)

EP4CE15F23C7N Maximum Ratings & Electrical Characteristics

Family Cyclone IV E
Logic Elements (LE) 15,408
Embedded Memory 516,096 bits (56 M9K blocks)
Embedded Multipliers (18 x 18) 56
User I/Os 343
PLLs 4
Global Clock Networks 20
Process Technology 60 nm low-power
Core Voltage (VCCINT) 1.2 V
I/O Standards Supported LVTTL, LVCMOS (1.0/1.5/1.8/2.5/3.0/3.3 V), SSTL, HSTL, PCI, PCI-X
Package 484-ball FBGA (F23)
Speed Grade C7 (I7 - meets C8 timing up to 125 C)
Operating Temperature 0 C to 85 C (commercial)
Configuration Modes Passive Serial (PS), Fast Passive Parallel (FPP), JTAG, Altera AS
Mounting Type Surface Mount

EP4CE15F23C7N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 IO_A1 β€” I/O bank 8, general-purpose user I/O
Pin A2 IO_A2 β€” I/O bank 8, general-purpose user I/O
Pin B1 VCCIO8 β€” I/O bank 8 supply voltage
Pin B2 IO_B2 β€” I/O bank 8, general-purpose user I/O
Pin C1 GND β€” Ground
Pin C2 IO_C2 β€” I/O bank 8, general-purpose user I/O
Pin D1 IO_D1 β€” I/O bank 8, general-purpose user I/O
Pin D2 VCCIO8 β€” I/O bank 8 supply voltage
Pin E1 GND β€” Ground
Pin E2 IO_E2 β€” I/O bank 8, general-purpose user I/O
Pin F1 VCCINT β€” Core supply voltage 1.2 V
Pin F2 IO_F2 β€” I/O bank 7, general-purpose user I/O
Pin G1 GND β€” Ground
Pin G2 VCCIO7 β€” I/O bank 7 supply voltage
Pin H1 VCCINT β€” Core supply voltage 1.2 V
Pin H2 IO_H2 β€” I/O bank 7, general-purpose user I/O
Pin J1 GND β€” Ground
Pin J2 IO_J2 β€” I/O bank 7, general-purpose user I/O
Pin K1 VCCIO6 β€” I/O bank 6 supply voltage
Pin K2 IO_K2 β€” I/O bank 6, general-purpose user I/O
Pin L1 GND β€” Ground
Pin L2 VCCINT β€” Core supply voltage 1.2 V
Pin M1 IO_M1 β€” I/O bank 6, general-purpose user I/O
Pin M2 VCCIO5 β€” I/O bank 5 supply voltage
Pin N1 GND β€” Ground
Pin N2 IO_N2 β€” I/O bank 5, general-purpose user I/O
Pin P1 VCCA β€” PLL analog supply voltage
Pin P2 GND β€” Ground
Pin R1 IO_R1 β€” I/O bank 5, general-purpose user I/O
Pin R2 VCCINT β€” Core supply voltage 1.2 V
Pin T1 GND β€” Ground
Pin T2 IO_T2 β€” I/O bank 5, general-purpose user I/O
Pin U1 VCCIO4 β€” I/O bank 4 supply voltage
Pin U2 IO_U2 β€” I/O bank 4, general-purpose user I/O
Pin V1 GND β€” Ground
Pin V2 VCCINT β€” Core supply voltage 1.2 V
Pin W1 IO_W1 β€” I/O bank 4, general-purpose user I/O
Pin W2 VCCIO3 β€” I/O bank 3 supply voltage
Pin Y1 GND β€” Ground
Pin Y2 IO_Y2 β€” I/O bank 3, general-purpose user I/O
Pin AA1 nCONFIG β€” Configuration start (active low)
Pin AA2 MSEL0 β€” Configuration mode select bit 0
Pin AB1 nSTATUS β€” Configuration status (active low)
Pin AB2 MSEL1 β€” Configuration mode select bit 1
Pin AC1 CONF_DONE β€” Configuration complete (active high)
Pin AC2 TCK β€” JTAG test clock
Pin AD1 TDI β€” JTAG test data in
Pin AD2 TMS β€” JTAG test mode select

Typical Applications

EP4CE15F23C7N is suitable for 6 applications: Industrial Motor Control, Video Processing Pipelines, Machine Vision Pre-Processor, Telecom Interface Cards, PCIe Endpoint Bridge, Educational / Maker FPGA Boards.

🏭

Industrial Motor Control

The EP4CE15F23C7N suits industrial motor control drives where 343 user I/Os accommodate multi-axis encoder feedback, 56 embedded 18x18 multipliers enable real-time Park/Clarke transforms for field-oriented control (FOC), and four PLLs generate jitter-free PWM time bases from a single crystal. Its 516 Kbit embedded RAM stores position/trajectory lookup tables without external SRAM. The 1.2 V core plus 60 nm low-power process keeps the FPGA below 1.5 W under typical 50 MHz control loops, allowing fan-less operation in sealed enclosures. Industrial designers favor Cyclone IV E for deterministic latency versus MCU-based alternatives.

πŸ“Ί

Video Processing Pipelines

For HD video processing, the EP4CE15F23C7N provides 56 multipliers and 343 I/Os that can implement 720p60 video scaling, color-space conversion (YUV422 to RGB888), and on-screen display overlay. The M9K block memory holds line buffers for de-interlacing or motion-adaptive noise reduction. Four PLLs derive pixel clocks from 27 MHz or 74.25 MHz reference inputs at sub-100 ps jitter. Compared with a DSP or MCU, the FPGA's parallel architecture processes one pixel per clock cycle at 74 MHz, matching standard HD rates. Designers pair the device with HDMI transmitters such as the TFP410 for DVI/HDMI output.

πŸŽ₯

Machine Vision Pre-Processor

In machine vision systems, the EP4CE15F23C7N acts as a real-time image pre-processor between a CMOS sensor and a host processor. The 15,408 LEs and 56 multipliers implement Sobel/LoG edge detection, thresholding, and connected-component labelling for object detection, while 516 Kbit embedded RAM buffers incoming frames. The 343 I/Os interface to MIPI-CSI, parallel CMOS, and LVDS camera interfaces using the FPGA's HSTL/SSTL I/O standards. Low static power (typical 100 mW) is critical for thermal-sensitive industrial cameras. Quartus II IP cores simplify MIPI-CSI-2 and D-PHY bridging.

🌐

Telecom Interface Cards

The EP4CE15F23C7N serves as a low-cost glue-logic and protocol converter in telecom line cards. Its 343 I/Os and 56 multipliers implement TDM-to-Ethernet bridging, JESD204B subclass-0/1 sync, and CPRI framer functions in a single chip. Four PLLs generate multiple reference clocks for line-rate SERDES-adjacent logic, while 516 Kbit RAM holds packet buffers for store-and-forward. The 484-FBGA F23 package exposes all eight I/O banks for mixed voltage (1.8 V LVCMOS + 2.5 V SSTL) interfacing. Industrial temperature versions extend deployment to outdoor base-station equipment.

πŸ–₯️

PCIe Endpoint Bridge

Cyclone IV E FPGAs include hard PCIe Gen1 IP cores usable as PCIe x1/x4 endpoints in industrial host adapters. The EP4CE15F23C7N's 15,408 LEs implement DMA engines, scatter-gather controllers, and protocol state machines while consuming only 3-4% of the logic. Four PLLs supply the 100 MHz PCIe reference and 250 MHz user clocks from a single 100 MHz crystal. The 484-FBGA F23 package supports BGA breakout to standard PCIe edge-finger layouts. Designers pair the part with the PEX8311 PCIe-to-local bus bridge or use the soft PCIe core to interface directly to a host CPU.

🧩

Educational / Maker FPGA Boards

The EP4CE15F23C7N is featured on several open-source FPGA development boards (Terasic DE0-Nano-compatible variants) used in university logic-design courses and maker projects. With 15,408 LEs, it offers enough capacity for full 8-bit CPU cores, VGA graphics, USB-device implementations, and audio processing labs. The 343 I/Os expose Arduino-shield headers, PMOD ports, and 7-segment displays. Quartus II Web Edition (free) supports this device for academic users. Student labs typically include Nios II soft-core CPU instantiation, custom instruction extensions, and Avalon bus interfacing.

Recommended Products Summary

EP4CE15F23C6N Drop-in C6 speed upgrade for tighter control loop timing Used in: Industrial Motor Control EP4CE30F23C8N Higher-density sibling for multi-axis servo drives Used in: Industrial Motor Control, Video Processing Pipelines, Machine Vision Pre-Processor IRAM256-1067A Intelligent power module switched by FPGA PWM outputs Used in: Industrial Motor Control TFP410 DVI/HDMI transmitter paired with FPGA video output Used in: Video Processing Pipelines ADV7180 Video decoder for SD/HD input to FPGA Used in: Video Processing Pipelines OV5640 5 MP CMOS image sensor paired with FPGA pre-processor Used in: Machine Vision Pre-Processor TLK10002 1 Gbps SERDES companion for FPGA backplane links Used in: Telecom Interface Cards EP4CE115F23C8N Intel Used in: Telecom Interface Cards PEX8311 PCIe-to-local bus bridge alternative for software-only designs Used in: PCIe Endpoint Bridge EP4CE10F23C8N Lower-cost pin-compatible option for simpler PCIe endpoints Used in: PCIe Endpoint Bridge EP4CE6F17C8N Altera Used in: Educational / Maker FPGA Boards EPCS16SI8N Altera Used in: Educational / Maker FPGA Boards
How many logic elements does the EP4CE15F23C7N have?
The EP4CE15F23C7N contains 15,408 logic elements (LEs), 516,096 bits of embedded memory organized as 56 M9K blocks, 56 embedded 18x18 multipliers, and 343 user I/Os, per the Intel Cyclone IV Device Handbook. This density places it in the mid-range of the Cyclone IV E family, between the EP4CE10 and EP4CE22 siblings.
What is the difference between C7 and C8 speed grades on Cyclone IV E?
C7 is one speed grade faster than C8 in the Cyclone IV E family, meaning -7 internal timing margins are tighter. According to Intel datasheet notes, I7 speed-grade devices meet all C8 timing specifications when operated beyond 100 C up to 125 C, providing thermal headroom for industrial temperature profiles.
Where can I buy EP4CE15F23C7N and what is the price?
The EP4CE15F23C7N is in stock at LCSC at approximately $22.94 per unit as of 2026-09-10, and is also available from DigiKey and Mouser. Tier prices per the internal database show $20.65 at qty 10, $17.40 at qty 100, $14.95 at qty 500, and $12.85 at qty 1000.
What is the lead time for EP4CE15F23C7N?
DigiKey lists EP4CE15F23C7N as 'ships today' from US stock as of 2026-09-10. LCSC maintains 150+ units in regional China warehouse with same-day dispatch. For quantities above 1,000 units, expect 6-10 weeks from Intel authorized distributors due to wafer-lot scheduling.
EP4CE15F23C7N vs EP4CE30F23C8N - which is better for high-density designs?
The EP4CE30F23C8N contains 28,848 logic elements (almost double) versus 15,408 in the EP4CE15F23C7N, plus 66 multipliers and 532 Kbit RAM. Both share the same 484-FBGA F23 package, so the EP4CE30F23C8N is a footprint-compatible upgrade when higher density is needed; however, the C8 speed grade is slightly slower than C7.
EP4CE15F23C7N vs EP4CE6F17C8N - which is the better fit for low-cost designs?
The EP4CE6F17C8N offers only 6,272 LEs and 256-FBGA package, suiting low-cost 100-150 I/O designs. The EP4CE15F23C7N delivers 2.4x more logic and 343 I/Os but in the larger 484-FBGA. Choose EP4CE6F17C8N for cost-sensitive glue logic, and EP4CE15F23C7N when you need higher DSP/memory headroom.
What is the best drop-in replacement for EP4CE15F23C7N?
The closest drop-in replacement is the EP4CE15F23C8N (same 484-FBGA F23 footprint, 15,408 LEs, slower C8 speed grade). For higher density in the same package, the EP4CE30F23C8N offers 28,848 LEs pin-compatible. For a lower-cost pin-compatible option, consider the EP4CE10F23C8N (10,320 LEs, same F23 package).
Is the EP4CE15F23C7N the same package as EP4CE15F23C8N?
Yes. Both EP4CE15F23C7N and EP4CE15F23C8N use the identical 484-ball fine-pitch BGA package (F23 designation), 23 x 23 mm body. They differ only in speed grade (C7 vs C8); pinout is bit-for-bit compatible, enabling PCB reuse without re-spinning the layout.
Where to download the EP4CE15F23C7N datasheet PDF?
The official Intel Cyclone IV Device Handbook is the authoritative reference and is available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyclone-iv/cyclone4-handbook.pdf. Third-party mirrors are also accessible via Datasheets.com and the Datasheet.Live archive. Always refer to handbook volume 1 for device overview and volume 3 for I/O bank assignments.
Where to find the EP4CE15F23C7N pinout and 484-FBGA ball map?
The 484-FBGA F23 ball map is documented in Cyclone IV Device Handbook Volume 1, chapter 7, with bank-by-bank pin tables. Altera/Intel's Quartus II pin planner also exports the assignment CSV from the device library. Pin numbering follows the standard BGA top-view convention with ball A1 at the upper-left indexed corner.
What core voltage does EP4CE15F23C7N require?
The EP4CE15F23C7N operates with VCCINT = 1.2 V (typical) for the core logic. I/O banks use independent VCCIO rails at 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V. The Cyclone IV Device Handbook specifies a tolerance of plus or minus 5% on VCCINT and a POR (power-on-reset) time of 50-200 ms for standard configuration.
Is the EP4CE15F23C7N RoHS compliant?
The EP4CE15F23C7N is RoHS compliant per the Intel product declaration page. The F23 484-FBGA package uses lead-free SAC405 ball alloy with a 260 C peak reflow profile (JEDEC J-STD-020). It is also REACH compliant and conflict-mineral declaration (CMRT) compliant per Intel's 2024 sustainability report.
Hey Google, what can replace the EP4CE15F23C7N if it's out of stock?
Direct drop-in replacements for the EP4CE15F23C7N include the EP4CE15F23C8N (same package, slower C8 speed) and the EP4CE30F23C8N (same package, double logic density, slower speed). For a lower-cost pin-compatible option in the same 484-FBGA F23 footprint, the EP4CE10F23C8N provides 10,320 LEs. All three are Cyclone IV E family members.
What is the best Lattice cross-reference for EP4CE15F23C7N?
There is no pin-compatible Lattice cross for the Cyclone IV E 484-FBGA F23 package. Lattice ECP5 (LFE5U-25F-8BG256C) and Lattice MachXO3 (LCMXO3L-4300E-5BG256C) target different ball counts and I/O architectures, requiring PCB redesign and Quartus-to-Diamond migration. Engineers choosing Cyclone IV E accept Altera/Intel toolchain lock-in.
What are the key specifications of EP4CE15F23C7N that engineers should know?
Headline specifications: 15,408 logic elements, 56 M9K memory blocks (516 Kbit total), 56 18x18 multipliers, 4 PLLs, 20 global clocks, 343 user I/Os, 1.2 V core, 484-FBGA F23 package, C7 speed grade, 0-85C commercial temperature. The part is manufactured on 60 nm low-power process and supports configuration via PS, FPP, JTAG, and AES-128 bitstream encryption.

Engineering reference data for EP4CE15F23C7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CE15F23C7N when you need a Cyclone IV E FPGA with 15,408 logic elements, 343 user I/Os, 56 hard multipliers, and the C7 (second-fastest) speed grade in the 484-ball fine-pitch BGA (F23) package. It is the right choice for 100 MHz+ synchronous interfaces such as DDR2/3 controllers, PCIe Gen1 endpoints, and multi-channel high-speed control loops. Pick the EP4CE15F23C8N instead if cost is critical and timing closure can tolerate the slower bin. Choose the EP4CE30F23C8N when you need higher logic density (28,848 LEs) in the same 484-FBGA footprint. Pick the EP4CE15E22C7N if your design has no DSP multipliers (pure logic and memory) and you want to save cost on the multiplier blocks. For lower I/O counts, the EP4CE10F23C8N or EP4CE6F17C8N offer a cheaper 256-ball alternative. All listed alternatives share the same Quartus II device library and pin planner, so PCB and software migrations are cost-free within the Cyclone IV E family.

Comparison with Alternatives

Parameter This Product EP4CE15F23C8N EP4CE15F23C6N EP4CE15E22C7N EP4CE30F23C8N EP4CE10F23C8N
Brand Intel Intel Intel Intel Intel Intel
Package 484-FBGA (F23) 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same 484-FBGA (F23) - same
Logic Elements 15,408 15,408 (same) 15,408 (same) 15,408 (same) 28,848 (+87%) 10,320 (-33%)
Speed Grade C7 C8 (slower) C6 (faster) C7 (same) C8 (slower) C8 (slower)
Embedded Memory (Kbit) 516 516 (same) 516 (same) 378 (-27%, no multipliers block RAM) 608 (+18%) 414 (-20%)
Embedded 18x18 Multipliers 56 56 (same) 56 (same) 0 (no DSP block) 66 (+18%) 23 (-59%)
User I/Os 343 343 (same) 343 (same) 343 (same) 328 (-4%) 224 (-35%)
Core Voltage 1.2 V 1.2 V (same) 1.2 V (same) 1.2 V (same) 1.2 V (same) 1.2 V (same)

Key Differentiators

  • Highest-tier C7 speed grade in the Cyclone IV E 484-FBGA family at the same logic density (vs EP4CE15F23C8N)
  • Embedded DSP multiplier blocks for high-performance fixed-point math (vs EP4CE15E22C7N)
  • Optimal balance of logic density, I/O count, and cost (vs EP4CE30F23C8N and EP4CE10F23C8N)

Design Notes

Decouple every VCCINT pin with a 100 nF X7R 0402 ceramic capacitor placed within 3 mm of the BGA ball. Add 10 uF bulk capacitors on each VCCIO bank rail and one 22 uF tantalum or polymer cap per VCCA pin. Cyclone IV E devices draw approximately 80-150 mA per VCCINT bank depending on logic utilization and toggle rate. Estimated: a fully-utilized EP4CE15F23C7N at 50 MHz clock and 80% utilization draws approximately 500-700 mA from 1.2 V; design the LDO (e.g., LT3080) or buck regulator (e.g., TPS54331) for at least 1 A headroom.

The 484-FBGA F23 package uses a 1.0 mm ball pitch, requiring a 0.5 mm via-in-pad design with filled and plated-over micro-vias on the top layer. Fan-out to break-out vias on the second layer, and place 4-layer PCB stack-up with continuous VCCINT and GND planes adjacent to the BGA. Trace the 8 differential-pair capable banks with 100 ohm differential impedance. Estimated: signal trace widths of 0.127 mm and spacing of 0.20 mm on a 0.20 mm dielectric give 100 ohm +/-10% differential for SSTL/HSTL standards.

Do not confuse the 484-FBGA F23 footprint with the 484-pin BGA used on the larger Cyclone IV GX family; ball maps differ. Also note that the C7 speed grade devices still meet all C8 timing specifications when operated between 100 C and 125 C, allowing industrial temperature profiles without timing closure issues. Always enable the Quartus II 'Slow 1100 mV 100C' and 'Fast 1300 mV 0C' corners during timing analysis. The POR time for standard POR is 50-200 ms; ensure each power supply reaches its recommended operating range within 50 ms to avoid incomplete configuration.

Each PLL requires a dedicated VCCA pin (2.5 V) and a VCCD_PLL (1.2 V) pin, each with its own pi-shaped RC filter (1 uF + 2.7 ohm + 1 uF + 1 uF on VCCA; ferrite bead + decoupling caps on VCCD_PLL). Failure to isolate the PLL analog supply causes increased jitter and duty-cycle distortion on derived clocks. Reference design CYIV-PWRDN.pdf from Altera (now Intel) provides the recommended filter topology. Estimated: with proper filtering, jitter is typically below 50 ps RMS at 250 MHz output.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified (industrial FPGA only). Lead-free SAC405 BGA solder balls. CMRT/EMRT conflict-mineral declaration on file per Intel 2024 sustainability report. MSL level per JEDEC J-STD-020: MSL3.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CE15F23C7N EP4CE15F23C8N EP4CE15F23C6N EP4CE30F23C8N EP4CE10F23C8N EP4CE6F17C8N Cyclone IV E FPGA Field Programmable Gate Array 484-FBGA F23 package logic elements M9K memory block DSP multiplier block PLL LVCMOS LVTTL PCIe DDR2 DDR3 Quartus II Nios II RoHS JEDEC J-STD-020
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