EP4CE40U19I7N - 39.6K LE Cyclone IV E FPGA, 484-FBGA | Altera
MPN: EP4CE40U19I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $96.97 | $96.97 |
| 10 | $87.27 | $872.70 |
| 100 | $72.73 | $7,273.00 |
| 500 | $63.03 | $31,515.00 |
| 1,000 | $53.33 | $53,330.00 |
EP4CE40U19I7N Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic IC that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, and PLLs. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs as the workhorse class for parallel, high-throughput digital signal processing. Cyclone IV E specifically targets cost-sensitive, volume-driven applications where designers need ASIC-like density and DSP performance but with FPGA flexibility and faster time-to-market.
Key features of the EP4CE40U19I7N include 4 PLLs for clock management, 116 embedded multipliers (18x18), 4 configurable LVDS channels (depending on speed grade), 1.0 V/1.2 V core voltage, 1.2 V/2.5 V/3.0 V/3.3 V LVCMOS/LVTTL I/O standards, and industrial-grade (-40 °C to +100 °C junction) operating range. The device supports up to ~200 MHz internal operation across common logic paths and includes dedicated hardware for DDR/DDR2/QDRII memory interfaces, which is critical for video buffering and high-bandwidth data acquisition.
Architecturally, the EP4CE40U19I7N uses Altera's classic LAB (Logic Array Block) structure with 16 logic elements per LAB, an interconnect hierarchy of row/column routing, and a configuration scheme based on SRAM cells (volatile, requiring an external configuration flash such as EPCS16/EPCS64). The 7th-order speed grade ('7') plus industrial temperature range ('I') make this specific OPN suited for industrial temperature environments while preserving timing margin for cost-sensitive designs.
Typical applications include industrial motor control, factory automation controllers, video surveillance and image processing pipelines, low-cost software-defined radio (SDR) baseband, medical instrumentation front-ends, and telecom line-card glue logic. The Cyclone IV E series is widely used as a bridge between MCU/CPU hosts and high-speed analog front ends, particularly where parallel LVDS or DDR memory interfaces are required.
When designing with this device, plan a 4-layer PCB with continuous ground and power planes beneath the U19 BGA, follow Altera's power distribution network guidance for the 1.0 V VCCINT rail (typically a discrete switching regulator followed by LDO post-regulation), and route all LVDS pairs with 100 Ω differential impedance and matched skew. The U19 BGA uses 1.0 mm pitch, so via-in-pad with epoxy-filled planarization is recommended for clean signal return paths.
This page consolidates distributor pricing, verified drop-in alternatives in the same 484-FBGA (U19) footprint, and practical design notes that go beyond the manufacturer datasheet alone.
Drop-in alternatives for EP4CE40U19I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40U19I7N (same form factor and footprint) — differing in Package, Maximum User I/O, Process Technology, Family, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40U19A7N
✅ Drop-In✓ In Stock
$112.2 / Unit
View Datasheet →EP4CE40U19I7
✅ Drop-In📋 Reference alternative (not in catalog)
EP4CE40U19C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE40U19I8N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP4CE40F29I8LN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$150 / Unit
View Datasheet →EP4CE40U19I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory Bits | 1,161,216 bits (~144 Kbytes) |
| Embedded Multipliers (18x18) | 116 |
| PLLs | 4 |
| Maximum User I/O | 328 |
| Process Technology | 60 nm low-k |
| Core Voltage (VCCINT) | 1.0 V / 1.2 V |
| I/O Standards | LVCMOS/LVTTL 1.2 V - 3.3 V, LVDS, SSTL, HSTL |
| Package | 484-ball FBGA (U19), 19x19 mm, 1.0 mm pitch |
| Operating Temperature | -40 °C to +100 °C (Industrial, junction) |
| Speed Grade | 7 |
| Configuration | SRAM-based (volatile); external EPCS flash required |
| Memory Interface Support | DDR/DDR2/QDRII via dedicated PHY |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EP4CE40U19I7N 484-ball fbga (u19), 19x19 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP4CE40U19I7N (484-ball fbga (u19), 19x19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40U19I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40U19I7N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / Image Processing, Software-Defined Radio (SDR) Baseband, Medical Instrumentation Front-End, Telecom Line-Card Glue Logic, Factory Automation / PLC Backplane.
Industrial Motor Control
The EP4CE40U19I7N's 39,600 logic elements and 116 embedded 18x18 multipliers are well matched to industrial servo and stepper motor control loops running field-oriented control (FOC) algorithms. The 4 PLLs generate the high-resolution PWM carrier clocks and quadrature encoder sample clocks, while the dedicated DDR/DDR2 PHY interfaces to external position-feedback buffers. Industrial temperature grade (-40 to +100 °C junction) and 328 user I/Os let designers connect directly to multi-axis gate drivers, encoders, and safety I/O without external bus expanders. Typical FOC implementations achieve 20-50 kHz loop rates on this device, with the EP4CE40U19I7N offering ~30% headroom over the EP4CE30 for parallel multi-axis control.
Recommended
Video Surveillance / Image Processing
For HD-SDI or MIPI-bridged surveillance pipelines, the EP4CE40U19I7N provides the parallel logic capacity to perform real-time motion detection, edge enhancement, and H.264 pre-processing on 720p60 streams. The 1.16 Mbit embedded SRAM serves as line buffers for deinterlacing and motion-vector caching, while the LVDS I/O banks accept direct sensor data without external deserializers. Industrial temperature support enables outdoor PoE camera deployments where ambient temperatures swing through -30 to +70 °C. Designers typically pair this FPGA with a DDR2 SDRAM for frame buffering and a HiSPI/parallel image sensor interface, fitting within ~70% of the device's logic resources at 60 fps.
Recommended
Software-Defined Radio (SDR) Baseband
Low-cost SDR platforms such as amateur-radio transceivers and university research kits frequently use the EP4CE40U19I7N for the digital down-conversion (DDC) and digital up-conversion (DUC) baseband stages. The 116 18x18 multipliers implement CIC and FIR filter banks at IF sample rates up to ~100 MHz, while the 4 PLLs synthesize the quadrature LO clocks from a single reference oscillator. The 328 I/Os route 16-bit parallel ADC/DAC buses plus USB/Ethernet MAC interfaces to a host CPU. Compared to DSP-only solutions, the parallel architecture achieves 5-10x higher channel counts at the same clock rate, which is critical for wideband spectrum analyzers.
Recommended
Medical Instrumentation Front-End
Patient-monitoring front-ends (ECG, pulse oximetry, ultrasound receive beamforming) benefit from the EP4CE40U19I7N's parallel DSP capacity for real-time FIR filtering, baseline wander removal, and envelope detection. The 4 PLLs generate multiple sample clocks for synchronized multi-channel acquisition, and the industrial temperature grade ensures stable operation in warm clinical environments. The dedicated DDR PHY enables connection to deep sample buffers for waveform capture and trending, while the LVCMOS/LVDS I/Os interface directly to multi-MHz ADCs. This FPGA delivers ~3x the throughput of typical ARM Cortex-M4 microcontrollers for the same multi-channel DSP workload.
Recommended
Telecom Line-Card Glue Logic
In legacy TDM/E1/T1 and CPRI fronthaul line cards, the EP4CE40U19I7N replaces multiple CPLDs and bus-switch ASICs with a single programmable platform that handles HDLC framing, bit-error-rate testing (BERT), and clock-crossing between system-side and line-side clocks. The 328 user I/Os are ample for ~32 T1/E1 framers plus SPI/I2C management buses, and the embedded multipliers accelerate PRBS pattern generation for BERT. Industrial temperature grade supports outdoor cabinet deployments. Compared to multi-CPLD solutions, this FPGA reduces PCB area by ~60% and simplifies firmware versioning.
Recommended
Factory Automation / PLC Backplane
Modular PLC racks and distributed I/O backplanes use the EP4CE40U19I7N to implement high-speed deterministic fieldbus bridges (EtherCAT, PROFINET IRT, Modbus TCP) and multi-axis I/O expansion. The 4 PLLs generate cycle-synchronized clocks for sub-100 µs EtherCAT jitter, while the 328 I/Os fan out to 16+ digital input modules and 16+ digital output modules with safety isolation. The 39.6K LEs support protocol stacks and additional custom logic, while the 1.16 Mbit SRAM buffers diagnostic logs and process alarms. Industrial temperature grade is mandatory for cabinet environments where ambient can reach +70 °C with passive cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40U19I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40U19A7N | EP4CE40U19C7N | EP4CE40U19I8N | EP4CE40F29I8LN | LFE5UM-85F-8BG554C |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Lattice Semiconductor |
| Package | FBGA-484 (U19) 19x19 mm | FBGA-484 (U19) 19x19 mm - same | FBGA-484 (U19) 19x19 mm - same | FBGA-484 (U19) 19x19 mm - same | FBGA-484 (F29) 29x29 mm - different footprint | BGA-554 - different footprint, PCB rework required |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | ~84,000 LUTs (Lattice ECP5UM) |
| Embedded SRAM | 1,161,216 bits (~144 Kbytes) | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 1,161,216 bits | 3,686,400 bits (~3.7 Mbit) |
| Embedded Multipliers (18x18) | 116 | 116 | 116 | 116 | 116 | 156 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 2 PLLs + DLLs |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 | 365 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| Speed Grade | -7 | -7 | -7 | -8 (faster) | -8 (faster) | -8 (faster Lattice speed grade) |
Key Differentiators
- Highest LE density in Cyclone IV E with 19x19 mm BGA (vs EP4CE30F23C8N)
- Industrial temperature grade at -7 speed (vs EP4CE40U19A7N)
- Lower static leakage on the 60 nm process vs 28/40 nm competitors (vs LFE5UM-85F-8BG554C)
Design Notes
The U19 FineLine BGA uses 1.0 mm ball pitch on a 19x19 mm body. For reliable assembly, use via-in-pad with epoxy-filled and planarized vias, and follow Altera's Cyclone IV E handbook power-plane recommendations: dedicate one solid ground plane directly under the BGA and split power planes for VCCINT (1.0/1.2 V), VCCA (2.5 V), and VCCIO banks. A 4-layer stack-up with 1 oz copper on outer layers is typical for 100 MHz operation.
Estimated: at 100% logic utilization, 100 MHz toggle rate, and 25% DSP utilization, the EP4CE40U19I7N consumes approximately 1.5-2.0 W from VCCINT (1.0/1.2 V) plus ~0.5 W from VCCA and VCCIO. Use a switching regulator such as the TPS54331 (3-A) for VCCINT with a low-noise LDO post-regulator for VCCA. Decouple each VCCINT ball with a 0.1 µF + 4.7 µF pair placed within 100 mils of the ball.
The U19 BGA has a θJA around 12-15 °C/W with proper via-in-pad thermal arrays. Estimated: at 2.5 W total dissipation, junction temperature rises ~30-40 °C above ambient, which is well within the 100 °C industrial ceiling. For >3 W designs, add a 1 mm thermal pad under the BGA exposed pad region and connect it to the inner ground plane with 0.3 mm thermal vias.
Never assume U19 and F29 BGA ball maps are interchangeable - they share 484 balls but pin assignments differ between packages. Always re-run the Quartus Fitter pin assignment when migrating. Also, do not skip the external configuration flash: Cyclone IV E uses volatile SRAM, so without an EPCS device the FPGA will not retain its bitstream on power-up. For JTAG programming during development, add a 10-pin header with TCK/TMS/TDO/TDI lines.
Compliance Information
RoHS compliant per Altera product page. Not AEC-Q100 qualified (industrial-grade only); halogen-free status not specified in verified data. Lead-free SAC405 ball finish compatible with JEDEC J-STD-020 reflow profiles.
