EP4CE40F29I8LN - 39.6K LE Cyclone IV E FPGA, 780-FBGA | Intel
MPN: EP4CE40F29I8LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $220 | $220.00 |
| 10 | $205 | $2,050.00 |
| 100 | $185 | $18,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $150 | $150,000.00 |
EP4CE40F29I8LN Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit in the programmable-logic tier of the broader digital IC hierarchy between ASICs (higher NRE, higher performance) and microcontrollers (lower performance, software-driven), enabling hardware-level parallelism, deterministic latency, and field upgradability for applications where general-purpose processors cannot meet throughput or timing requirements.
Key features of the EP4CE40F29I8LN include 4 input look-up tables (LUTs), 113 18x18 hardware multipliers, four general-purpose PLLs, 116 Kbits of distributed RAM, and 532 maximum user I/O pins routed through eight I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates dedicated configuration logic supporting passive serial (PS), active serial (AS), and JTAG configuration modes.
The Cyclone IV E architecture balances logic density, embedded memory, and DSP capability with low static and dynamic power, achieved through the 60 nm process and per-bank I/O voltage scaling. The 780-FBGA package exposes the maximum I/O count of the EP4CE40 device family, enabling high-bandwidth parallel interfaces to external memory and high-speed peripherals.
Typical applications include industrial motor control and drive systems, factory automation controllers, video processing and display pipelines, telecommunications line cards, and military/aerospace avionics subsystems. The wide industrial temperature range and robust logic capacity make the EP4CE40F29I8LN well-suited to designs that require deterministic real-time performance with hardware parallelism.
When designing with this device, plan I/O bank assignments carefully to avoid VCCIO bank supply conflicts, and follow the Quartus II / Quartus Prime power-up and configuration sequencing recommendations. Because the 780-FBGA package is large and BGA-routed, PCB stack-up, microvia design, and thermal management must be addressed in the early schematic/layout phase.
Drop-in alternatives for EP4CE40F29I8LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE40F29I8LN (same form factor and footprint) — differing in Package, Process Technology, Core Voltage (VCCINT), Embedded Multipliers (18x18), Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CE40F29I8L
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$91.74 / Unit
View Datasheet →EP4CE40F29I7N
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View Datasheet →EP4CE40F29C8LN
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View Datasheet →EP4CE40F29C9LN
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Contact for price
View Datasheet →EP4CE30F29I8LN
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View Datasheet →EP4CE40F23I8LN
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View Datasheet →EP4CE40F29I8LN Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 39,600 |
| Embedded Memory Bits | 1,161,216 bits |
| Maximum User I/O | 532 |
| Operating Supply Voltage (Core) | 1.2 V |
| Number of PLLs | 4 |
| 18x18 Hardware Multipliers | 113 |
| Process Technology | 60 nm |
| Package | 780-FBGA |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 8 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Modes | PS, AS, JTAG |
| Lead-Free | Yes |
EP4CE40F29I8LN 780-fbga Pin Configuration Guide
Pin configuration for EP4CE40F29I8LN (780-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE40F29I8LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE40F29I8LN is suitable for 6 applications: Industrial Motor Control & Drives, Factory Automation Controllers (PLC / PAC), Video Processing & Display Pipelines, Telecommunications Line Cards & Backplanes, Military & Aerospace Avionics Subsystems, Test & Measurement Instrumentation.
Industrial Motor Control & Drives
The EP4CE40F29I8LN is a strong fit for industrial motor control and AC/servo drive designs because it combines 39,600 logic elements with 113 hardware 18x18 multipliers and 4 PLLs, enabling field-oriented control (FOC), space-vector PWM, and encoder interfaces in deterministic hardware. Its industrial -40 °C to 100 °C temperature rating suits factory-floor enclosures and outdoor cabinet installations, while the 780-FBGA exposes 532 user I/Os for parallel ADC feedback, multiple resolver/Hall channels, and isolated communication links. Compared with running motor control on a microcontroller, the FPGA delivers deterministic sub-microsecond loop times critical for high-RPM servo performance. Typically the FPGA sits alongside the MCU/DSP, offloading PWM generation, current sampling windows, and safety interlocks.
Recommended
Factory Automation Controllers (PLC / PAC)
For PLC, PAC, and distributed I/O designs, the EP4CE40F29I8LN offers the logic density to implement custom industrial protocols (Modbus TCP, EtherCAT, PROFINET slave stacks), multiple high-speed counters, and PID loops in parallel hardware. The 60 nm process and 1.2 V core keep dynamic power low enough for fan-less DIN-rail enclosures, while 532 I/Os accommodate multi-axis control and dense digital I/O banks. The industrial temperature grade (-40 °C to 100 °C) supports deployment in unheated shop-floor cabinets. Compared with discrete MCU + ASIC designs, this FPGA allows late-stage customization for protocol and I/O mix without re-spinning the PCB.
Recommended
Video Processing & Display Pipelines
The EP4CE40F29I8LN suits mid-range video bridging, scaling, and overlay designs where its 39,600 LEs and 113 hardware multipliers implement color-space conversion, deinterlacing, and chroma resampling at pixel-clock rates. Its 532 I/Os enable wide parallel RGB/YCbCr buses, BT.656/1120 video ports, and LCD timing interfaces without external bus switches. The 1.2 V core and per-bank VCCIO scaling allow direct connection to 1.8 V, 2.5 V, and 3.3 V video ADCs/DACs. Typical placements include surveillance video walls, medical imaging preview stages, and broadcast up/down-converters where deterministic latency is more important than raw pixel throughput.
Recommended
Telecommunications Line Cards & Backplanes
Telecom line-card and backplane designers value the EP4CE40F29I8LN's 532 I/Os for parallel LVDS-based switching fabrics, framer/HDLC interfaces, and TDM bus aggregation. With 4 PLLs the FPGA generates multiple independent clocks for backplane SERDES-equivalent links, T1/E1 framers, and SyncE timing. The 60 nm process keeps static leakage low enough for hot-aisle deployments, and the industrial temperature range tolerates forced-air cooled chassis. Pair with external PHYs/transceivers for full CPRI/OBSAI or Ethernet MAC front ends. Compared with an ASIC, the FPGA allows last-minute protocol updates without respin.
Recommended
Military & Aerospace Avionics Subsystems
The EP4CE40F29I8LN is widely used in defense and avionics subsystems where deterministic real-time behavior, radiation-tolerant design practices, and mid-density logic capacity are required. Its industrial temperature range (-40 °C to 100 °C) covers most cockpit and ground-vehicle environments, and the 780-FBGA provides high I/O density for MIL-STD-1553, ARINC 429, and discrete avionics I/O. The hardware DSP blocks accelerate radar signal conditioning, and 4 PLLs support multiple synchronized clocks for sensor fusion. Typical deployments include flight control peripherals, data recorders, and ruggedized mission computers.
Recommended
Test & Measurement Instrumentation
For bench and ATE instrumentation, the EP4CE40F29I8LN implements custom timing engines, parallel stimulus/response capture, and protocol decoding in deterministic hardware. The 532 I/Os accommodate dense pogo-pin beds and multiple serial bus analyzers, while the 1,161,216 bits of block RAM capture deep waveform traces without external memory. The 4 PLLs let engineers synthesize jitter-cleaning clocks for high-precision ADC interfaces. Compared with discrete logic, this FPGA shortens development cycles by replacing ASIC design spins with programmable logic.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE40F29I8LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE40F29I8L | EP4CE40F29I7N | EP4CE40F29C8LN | EP4CE40F29C9LN | EP4CE30F29I8LN |
|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA | 780-FBGA |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 28,848 |
| Speed Grade | 8 | 8 | 7 (faster) | 8 | 9 (slower) | 8 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 608,256 |
| Max User I/O | 532 | 532 | 532 | 532 | 532 | 532 |
| 18x18 Multipliers | 113 | 113 | 113 | 113 | 113 | 66 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest-density 780-FBGA EP4CE40 with industrial temperature range (vs EP4CE40F29C8LN)
- Faster speed grade available in same package (vs EP4CE40F29C9LN)
- Full-density logic + DSP for high-end motor control (vs EP4CE30F29I8LN)
Design Notes
The 780-FBGA package requires a PCB stack-up with sub-0.5 mm pitch escape routing. Use microvia (laser-drilled) technology in HDI builds rather than through-hole fan-out, and provide continuous ground/power planes under the BGA to control impedance and reduce return-path inductance. Estimate: a 4-6 layer HDI stack-up with 0.4 mm BGA pitch is typical for production designs.
Estimated: at maximum toggle rate with all 532 I/Os switching, the EP4CE40F29I8LN can dissipate 1.5-2.5 W. Without forced airflow, the 780-FBGA theta_JA of approximately 15-20 C/W will allow a junction rise well within the 100 C industrial limit, but in enclosed cabinets add thermal vias under the central BGA grid and consider a small heatsink for sustained industrial operation.
Cyclone IV E devices require proper power sequencing: VCCINT (1.2 V) must ramp before or simultaneously with VCCIO, and configuration pins (nCONFIG, nSTATUS, CONF_DONE) must be valid before the device releases into user mode. Failing to sequence correctly produces intermittent configuration failures. Also, the LVDS I/O requires a 100 ohm differential termination near the receiver; absent termination will distort high-speed signals at >400 Mbps.
Compliance Information
Per Intel/Altera product page, EP4CE40F29I8LN is RoHS compliant and lead-free (N suffix). AEC-Q100 not applicable for FPGAs. Conflict-minerals CMRT filed by Intel.
