EP4CE6F17I7N - Cyclone IV E FPGA, 6K LE, 256-FBGA | Intel / Altera
MPN: EP4CE6F17I7N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.92 | $23.92 |
| 10 | $22.5 | $225.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.1 | $15,100.00 |
EP4CE6F17I7N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that lets designers configure digital logic, memory blocks, and I/O after fabrication. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. Cyclone IV E belongs to Intel's mainstream low-power FPGA family, balancing logic density with low static and dynamic power consumption.
Key features include 15 total 18x18 multipliers (up to 230 MHz operation), two general-purpose PLLs for clock management, and support for external memory interfaces such as DDR2 SDRAM and QDRII+ SRAM. The device also integrates 10 global clock networks and 8 user I/O banks with support for LVDS, SSTL, HSTL, and LVCMOS I/O standards. Configuration is supported through JTAG, active serial, and passive serial modes.
The Cyclone IV E architecture is built on a low-power 60 nm process, providing static power reductions of up to 25 percent compared to the previous Cyclone III generation. The on-chip SRAM is organized in M9K blocks of 9 Kbits each, totaling 30 blocks, allowing flexible FIFO, ROM, and dual-port memory implementations.
Typical applications include industrial motor control and factory automation, video processing and image aggregation bridges, automotive infotainment subsystems, low-cost ASIC prototyping, and consumer electronics requiring custom glue logic or display controllers. The wide operating temperature range supports outdoor and industrial deployments.
When designing with this device, pay attention to BGA fanout and routing on the PCB: the 1.0 mm pitch FBGA requires microvia or via-in-pad technology for reliable escape routing. Use the Altera / Intel Quartus II design suite (or the newer Quartus Prime Lite Edition) for synthesis, place-and-route, and bitstream generation.
Drop-in alternatives for EP4CE6F17I7N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CE6F17I7N (same form factor and footprint) β differing in Package, Process Technology, Configuration Modes, Mounting Type, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP4CE6F17I7
β Drop-Inβ In Stock
$21.85 / Unit
View Datasheet βEP4CE10F17I7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE15F17I7N
β Drop-Inπ Reference alternative (not in catalog)
EP4CE22F17I7N
β Drop-Inβ In Stock
$43.4 / Unit
View Datasheet βEP4CE6F17C7N
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View Datasheet βEP4CE6F17I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV E |
| Logic Elements (LE) | 6,272 |
| Embedded Memory (bits) | 276,480 |
| Embedded Memory Blocks | 30 (M9K, 9 Kbits each) |
| Multipliers (18x18) | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| User I/O Pins | 179 |
| I/O Banks | 8 |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) |
| Operating Temperature | -40C to +100C (Industrial) |
| Process Technology | 60 nm low-power |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Memory Interface Support | DDR2, QDRII+, QDRII, SDR SDRAM |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, PCI |
| RoHS Status | Compliant |
EP4CE6F17I7N 256-fbga (17x17 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP4CE6F17I7N (256-fbga (17x17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CE6F17I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CE6F17I7N is suitable for 7 applications: Industrial Motor Control, Video Processing and Image Aggregation Bridge, ASIC Prototyping and Emulation, Automotive Infotainment Subsystems, Communications and Networking Equipment, Consumer Electronics Glue Logic, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CE6F17I7N's 6,272 logic elements, 15 dedicated 18x18 hardware multipliers, and 2 PLLs make it well suited for field-oriented control (FOC) of brushless DC and permanent-magnet motors. The 179 user I/Os handle quadrature encoder inputs, PWM outputs (up to 6 channels of three-phase), and isolated SPI/parallel links to motor-driver ICs. With the -40C to +100C industrial temperature range and 256-FBGA rugged package, the device operates reliably in factory-floor cabinets and outdoor pumps.
Recommended
Video Processing and Image Aggregation Bridge
With 30 M9K memory blocks totaling 276 Kbits of fast on-chip SRAM, the EP4CE6F17I7N works as a line-buffer / frame-stitching bridge between image sensors, MIPI-to-parallel converters, and HDMI transmitters. The 8 I/O banks allow simultaneous 24-bit RGB, LVDS-pair camera-LVDS, and DDR2 SDRAM data buffer operation. Designers use the Quartus II Video and Image Processing (VIP) suite to assemble scalers, color-space converters, and alpha-blenders on this Cyclone IV E device.
Recommended
ASIC Prototyping and Emulation
The EP4CE6F17I7N offers 6,272 LEs and 30 M9K blocks at a low unit cost, making it ideal for prototyping moderate-complexity ASIC RTL before tape-out. Engineers can map sub-modules of larger SoCs (UARTs, I2C controllers, custom peripherals, interrupt controllers) to the Cyclone IV E fabric, verify functional correctness, and measure gate-level timing. Quartus II synthesis and Chip Planner allow incremental compile, letting teams iterate on RTL and see gate-level utilization in minutes rather than weeks.
Recommended
Automotive Infotainment Subsystems
Automotive head-unit and instrument-cluster designers leverage the EP4CE6F17I7N's industrial temperature grade and rich I/O for connecting to TFT-LCD panels, CAN/LIN transceivers, and digital audio DACs. The 8 I/O banks support LVDS display panels and HSTL/SSTL memory, while the dedicated PLL section generates pixel clocks from a single 27 MHz reference. The 1.0 mm pitch FBGA is mechanically robust for vehicle vibration profiles when properly underfilled.
Recommended
Communications and Networking Equipment
The EP4CE6F17I7N's high I/O count (179 pins) and LVDS support suit small-port routers, industrial Ethernet switches, and protocol-converter designs. Its 2 PLLs synthesize multiple clock domains for PHY, CPU, and SERDES reference. The 30 M9K blocks implement packet buffers and FIFOs between MAC-layer controllers and PHY chips, while Quartus II IP cores for GMII/RGMII and SPI allow rapid hardware bring-up.
Recommended
Consumer Electronics Glue Logic
In consumer devices (set-top boxes, gaming peripherals, smart appliances, drones), the EP4CE6F17I7N replaces multiple discrete logic ICs (CPLDs, bus translators, PWM generators) by integrating all glue logic in one low-power BGA. Its 6,272 LEs and 179 I/Os handle user-interface scan, LED-matrix driving, audio-sample routing, and SD-card SPI bridges, all while staying under 1 W of typical dynamic power thanks to the Cyclone IV E low-power 60 nm process.
Recommended
Test and Measurement Instrumentation
Lab instruments (logic analyzers, protocol exercisers, custom ATE) benefit from the EP4CE6F17I7N's high I/O count and DDR2 memory support. Engineers implement trigger logic, pattern generation, and timing measurement on the FPGA fabric, while exporting captured data over USB 3.0 or Ethernet to a host PC. The 2 PLLs generate precisely-phased clocks for synchronous sampling, and the 30 M9K blocks hold deep sample buffers in real time.
Recommended
Recommended Products Summary
Engineering reference data for EP4CE6F17I7N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CE6F17I7 | EP4CE10F17I7N | EP4CE15F17I7N | EP4CE22F17I7N | EP4CE6F17C7N |
|---|---|---|---|---|---|---|
| Package | 256-FBGA 17x17 mm (F17) | 256-FBGA 17x17 mm (F17) - same | 256-FBGA 17x17 mm (F17) - same | 256-FBGA 17x17 mm (F17) - same | 256-FBGA 17x17 mm (F17) - same | 256-FBGA 17x17 mm (F17) - same |
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Logic Elements | 6,272 | 6,272 | 10,320 | 15,408 | 22,320 | 6,272 |
| Embedded Memory (bits) | 276,480 | 276,480 | 423,936 | 516,096 | 608,256 | 276,480 |
| Multipliers (18x18) | 15 | 15 | 23 | 56 | 66 | 15 |
| User I/O Pins | 179 | 179 | 179 | 179 | 179 | 179 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | -7 (fastest in family) | -7 | -7 | -7 | -7 | -7 |
| PLLs | 2 | 2 | 2 | 4 | 4 | 2 |
Key Differentiators
- Same-package in-family upgrade path (vs EP4CE6F17I7)
- In-package headroom to higher densities (vs EP4CE10F17I7N / EP4CE15F17I7N)
- Lower unit cost vs higher-density variants (vs EP4CE22F17I7N)
Design Notes
The 256-FBGA F17 package uses 1.0 mm ball pitch and requires microvia or via-in-pad technology for reliable escape routing. Standard 0.4 mm via-in-pad with copper-filled and planarized pads prevents solder wicking. Per Cyclone IV Hardware Design Guidelines, route signals on inner layers with 50 ohm controlled impedance for LVDS pairs. Place decoupling capacitors (100 nF + 10 uF) within 100 mils of each VCCIO/VCCINT ball.
Cyclone IV E requires separate VCCINT (core 1.2 V), VCCAUX (2.5 V), and VCCIO (per-bank 1.2/1.5/1.8/2.5/3.3 V) supplies. Power-on sequencing per Altera's Cyclone IV Device Handbook requires VCCAUX to ramp before or with VCCINT to prevent latch-up. Use a dedicated sequencer IC or TI's LM3880 sequencer to enforce order; each rail should ramp within 100 ms.
Estimated: at 100 percent resource utilization and 100 MHz internal clock, the EP4CE6F17I7N dissipates approximately 0.5 to 1.0 W of dynamic power plus static power. The 256-FBGA has a typical theta_JA around 25 C/W with adequate thermal vias. For industrial 100 C operation, the designer must keep junction temperature below 100 C - small 4-layer boards with 9 thermal vias under the central ground balls are usually sufficient.
Do not confuse the F17 256-FBGA package with the E22 256-FBGA package - both have 256 balls but use different sizes (17x17 mm vs 22x22 mm) and routing. PCB footprint footprints are not interchangeable. Also confirm MSEL[3:0] configuration mode pins are correctly strapped for the desired configuration scheme (AS, PS, JTAG) before board bring-up; misconfigured MSEL is the most common Cyclone IV E first-board failure.
Keep all 8 I/O banks at the same VCCIO if you only need one I/O standard (simplest) - splitting banks across multiple voltages complicates power plane routing. Place external memory on the same side of the package as the dedicated DQS pins to minimize trace skew. Differential pair routing for LVDS must match within 20 mils and be length-matched to within 100 mils of the source-synchronous clock per Intel's LVDS design guidelines.
Compliance Information
RoHS and lead-free per Altera / Intel product page. AEC-Q100 not applicable for FPGAs not marketed as automotive-qualified; for AEC-Q100 qualified Cyclone IV parts look at the EP4CExxF17I7N-Q100 suffix family. REACH compliance per EU regulations.
