Altera

EP4CE6F17C7N - Cyclone IV E FPGA 6272 LE, 256-FBGA | Altera

MPN: EP4CE6F17C7N βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 256-LBGA (FBGA-256) Package 472.5 MHz Speed
From $3.6 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $5.19 $5.19
10 $4.9 $49.00
100 $4.55 $455.00
500 $4.1 $2,050.00
1,000 $3.85 $3,850.00
3,000 $3.6 $10,800.00
ℹ️ All prices are in USD

EP4CE6F17C7N Overview

The Altera EP4CE6F17C7N is a Cyclone IV E Field Programmable Gate Array (FPGA) with 6,272 logic elements, 179 user I/O pins, and 276,480 RAM bits, delivered in a 256-ball FineLine BGA (FBGA-256) package measuring 17 mm x 17 mm with 1 mm ball pitch. The N suffix indicates a lead-free finish, and the device uses a 60 nm, 1.2 V core architecture. Distributor search results list the part as active and available for ordering, with the DigiKey product page noting that it ships today.

An FPGA is an integrated circuit whose logic fabric can be programmed after manufacturing to perform arbitrary digital functions. FPGAs sit above CPLDs in capacity and below ASICs in design-fixed cost, making them common for prototyping, parallel processing, interface bridging, and low-to-mid-volume products. Within the broader taxonomy, an FPGA is a programmable logic device under integrated circuits, and the Cyclone IV E family is Altera/Intel's cost-optimized, low-power 60 nm product line. Understanding this hierarchy helps engineers compare FPGAs by logic elements, RAM bits, I/O count, package, voltage rails, and configuration method.

The device provides 392 CLBs/lab-style logic blocks according to distributor specifications, along with 276,480 RAM bits for FIFOs, line buffers, or small memory structures. Its 179 user I/O pins support multi-purpose digital interfaces, and the quoted maximum internal clock frequency is 472.5 MHz. The 1.2 V core voltage and low-cost FBGA package make it suitable for designs that need programmable parallelism without the expense of transceiver-rich FPGAs.

The EP4CE6F17C7N uses SRAM-based, volatile configuration technology, meaning it must be configured at power-up from a host, external memory, or a serial configuration device. Its logic fabric is organized into Cyclone IV E architecture with embedded memory blocks and phase-locked-loop-based clock management, although not all peripheral counts are listed in the verified distributor snippets. The commercial temperature suffix C and speed grade 7 are encoded in the part number, and the N suffix indicates lead-free processing.

Typical applications include industrial motor-control PWM generation, video and image preprocessing, wired-network packet FIFO or PHY bridging, high-speed data acquisition front-end glue logic, and automotive infotainment prototyping. The 179 user I/O and 276,480 RAM bits are particularly useful where parallel capture and reformatting are required, such as converting an ADC or image sensor bus into a memory or processor interface.

For production designs, plan for a separate 1.2 V core supply, appropriate I/O bank voltages, and FPGA configuration storage. Because the FPGA is SRAM-based, confirm that the configuration device or host interface is included in the boot sequence. For harsh-temperature environments, use the industrial or automotive suffix variants rather than the standard commercial-grade device.

This page combines distributor pricing references, drop-in Cyclone IV E F17-package alternatives, comparison tables, and practical design guidance that are not all present in one manufacturer datasheet, helping engineers evaluate the EP4CE6F17C7N faster.

Drop-in alternatives for EP4CE6F17C7N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE6F17C7N (same form factor and footprint) β€” differing in Package, Process Technology, Configuration Modes, Operating Temperature, Speed Grade.

Intel
Package: FBGA-256 (256-LBGA), 17 x 17 mm, 1.0 mm pitch
Process Technology: 60 nm, low-power
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS)
Compare with EP4CE6F17C7N β†’
Altera
Package: 256-FBGA (F17), 17x17 mm, 1.0 mm pitch
Process Technology: 60 nm low-power
Configuration Modes: JTAG, Active Serial, Active Parallel
Compare with EP4CE6F17C7N β†’
Altera
Process Technology: 60 nm
Compare with EP4CE6F17C7N β†’
Intel
Package: 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm
Process Technology: 60 nm low-power SRAM
Configuration Modes: JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP)
Compare with EP4CE6F17C7N β†’
Intel
Operating Temperature: 0C to +85C (commercial, L grade)
Speed Grade: C8 (commercial speed grade 8)
Compare with EP4CE6F17C7N β†’
Altera
Package: 256-ball F17 FBGA (17x17 mm, 1.0 mm pitch)
Configuration Modes: JTAG, Active Serial, Passive Serial
Speed Grade: 8
Compare with EP4CE6F17C7N β†’
Altera
Package: 256-ball FBGA (F17, 17x17 mm)
Process Technology: 60 nm low-power
Configuration Modes: JTAG, AS, PS, FPP
Compare with EP4CE6F17C7N β†’
Intel
Package: 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch
Compare with EP4CE6F17C7N β†’
Intel
Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)
Process Technology: 60 nm low-k CMOS
Configuration Modes: JTAG, AS, AP, PS
Compare with EP4CE6F17C7N β†’
Intel
Package: 256-LBGA (17 x 17 mm, 1 mm pitch, FBGA-256)
Process Technology: 60 nm low power
Operating Temperature: -40C to +85C (Industrial grade)
Compare with EP4CE6F17C7N β†’
Altera
Package: 256-FBGA (17x17 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power
Configuration Modes: JTAG, Active Serial, Passive Serial
Compare with EP4CE6F17C7N β†’
Altera
Package: 256-LBGA (FBGA-256, 17x17 mm, 1.0 mm pitch)
Process Technology: 60 nm low-power CMOS
Compare with EP4CE6F17C7N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE6F17C6N

βœ… Drop-In
Altera
πŸ“¦ 256-LBGA (FBGA-256)
Cyclone IV E Β· 6,272 Β· 392 Β· 270 Kbits Β· 179 Β· 256-FBGA (F17), 17x17 mm, 1.0 mm pitch Β· C6 (commercial) Β· 0C to +85C (commercial)

βœ“ In Stock

$17.95 / Unit

View Datasheet β†’

EP4CE6F17C8N

βœ… Drop-In
Altera
πŸ“¦ 256-LBGA (FBGA-256)
Altera (Intel) Β· Cyclone IV E Β· Cyclone IV E (EP4CE6) Β· 6,272 LE Β· 270 Kbits Β· 15 Β· 179

βœ“ In Stock

$13.75 / Unit

View Datasheet β†’

EP4CE6F17C7

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Altera
πŸ“¦ 256-LBGA (FBGA-256)
Field Programmable Gate Array (FPGA) Β· Cyclone IV E Β· 6,272 cells Β· 392 CLBs Β· 472.5 MHz Β· 60 nm Β· 1.2 V Β· 179 I/O

βœ“ In Stock

$17.49 / Unit

View Datasheet β†’

EP4CE6F17I7N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Altera
πŸ“¦ 256-LBGA (FBGA-256)
Cyclone IV E Β· 6,272 Β· 276,480 Β· 30 (M9K, 9 Kbits each) Β· 15 Β· 2 Β· 10 Β· 179

βœ“ In Stock

$15.1 / Unit

View Datasheet β†’

EP4CE6F17A7N

βœ… Drop-In
Intel
πŸ“¦ 256-LBGA (FBGA-256)
Cyclone IV E Β· 6,272 Β· 276,480 bits Β· 392 Β· 179 Β· 15 Β· 2 (general-purpose) Β· FBGA-256 (256-LBGA), 17 x 17 mm, 1.0 mm pitch

βœ“ In Stock

$24.5 / Unit

View Datasheet β†’

EP4CE6F17C7N Maximum Ratings & Electrical Characteristics

Manufacturer Altera / Intel
Series Cyclone IV E
Product Category FPGA - Field Programmable Gate Array
Number of Logic Elements / Cells 6272
Number of CLBs / LABs 392
Total RAM Bits 276480 bits
Number of User I/O 179
Package / Case 256-LBGA (FBGA-256)
Package Body Size 17 mm x 17 mm
Ball Pitch 1 mm
Core Supply Voltage 1.2 V
Process Technology 60 nm
Maximum Internal Clock Frequency 472.5 MHz
Lead-Free Finish Yes (N suffix)
Number of Terminations 256
Mounting Type Surface Mount
RoHS Compliance Compliant
Lifecycle Status Active production

EP4CE6F17C7N 17 mm x 17 mm Pin Configuration Guide

Pin configuration for EP4CE6F17C7N (17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

17 mm x 17 mm package pinout diagram for EP4CE6F17C7N

No detailed pinout data available for EP4CE6F17C7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE6F17C7N is suitable for 6 applications: Industrial Motor Control, Video and Display Processing, Wired Networking Infrastructure, High-Speed Data Acquisition and Instrumentation, Automotive Infotainment and Telematics Prototyping, IoT Edge and Smart Factory Connectivity.

🏭

Industrial Motor Control

The EP4CE6F17C7N is well suited to industrial motor control because its 6,272 logic elements can implement multiple PWM-generation channels, encoder quadrature decoding, fault logic, and dead-time insertion in parallel. 179 user I/O pins provide enough connections for three-phase inverter gate signals, current-sense ADC inputs, encoder interfaces, and HMI pushbuttons or LEDs. The 276,480 RAM bits can store small speed-reference or diagnostic FIFOs. The -7 speed grade supports the 472.5 MHz internal clock capability quoted by distributors, which allows current-loop tasks to execute with short timer periods and low comparator latency. In a typical servo-drive design, an FPGA offloads real-time timing from the host MCU/DSP, improving deterministic response. If the final product must operate inside an uncontrolled industrial cabinet, an industrial-temperature Cyclone IV E variant should be selected instead of the commercial C7N part.

πŸ“Ί

Video and Display Processing

For video and display applications, the EP4CE6F17C7N provides enough logic and RAM for pixel-format conversion, simple 2D filtering, timing generation, and small-line FIFOs. The 179 user I/O pins can carry 24-bit RGB, separate horizontal/vertical sync, pixel clock, and I2C or SPI control signals. The 276,480 RAM bits equal roughly 34,560 bytes, which is practical for line-buffered operations or small image-processing kernels. Because the device is an SRAM FPGA, the parallel pixel pipeline is implemented in hardware rather than executed as software, giving predictable latency and low processor overhead. A common system places an image sensor or receiver in front of the FPGA and an HDMI or LVDS transmitter after it. The internal clock frequency up to 472.5 MHz gives ample margin for 1080p-class pixel clocks, although the exact bandwidth depends on the I/O standard and external memory architecture used.

🌐

Wired Networking Infrastructure

The EP4CE6F17C7N is a practical FPGA for low-port-count networking infrastructure such as managed Ethernet switches, industrial fieldbus gateways, and small packet-processing systems. Its 179 user I/O pins can connect to MII, RMII, GMII, or RGMII PHYs, and 6,272 logic elements are sufficient for MAC soft-cores, packet FIFOs, VLAN tag insertion/removal, and simple classification engines. The 276,480 RAM bits provide packet buffering and queue descriptors without requiring an external SRAM in many low-throughput designs. The commercial C7N variant is suitable for indoor networking equipment; industrial-temperature variants should be used for rugged Ethernet switches or factory-floor protocol converters. Because Cyclone IV E does not include hard Ethernet MACs, the networking protocol stack is implemented in programmable logic or with a companion processor, giving designers flexibility to support custom frame formats and legacy industrial protocols.

πŸ”§

High-Speed Data Acquisition and Instrumentation

The EP4CE6F17C7N fits high-speed data acquisition front ends that require parallel capture from ADCs, digital down-conversion, FIFO buffering, and trigger logic. 179 user I/O pins can connect multiple parallel-output ADCs or high-speed serial LVDS pairs depending on the I/O bank implementation. The 6,272 logic elements can implement digital decimation filters, threshold detectors, and address generators, while the 276,480 RAM bits store pre-trigger samples or temporary blocks before transfer to a host. The -7 speed grade supports 472.5 MHz internal clock rates for oversampling or high-speed state machines, though external LVDS rates depend on the device I/O standard. In an oscilloscope, spectrum analyzer, or vibration monitoring system, the FPGA creates a deterministic data path from the converter to the DMA interface, reducing the CPU burden and preserving trigger accuracy. Use appropriate signal-conditioning front-end components around the FPGA for sensor scaling and protection.

πŸš—

Automotive Infotainment and Telematics Prototyping

Although the commercial EP4CE6F17C7N is intended for standard temperature environments, it is commonly used in automotive infotainment and telematics prototyping to implement display timing, audio I/O bridging, camera sensor aggregation, or CAN/LIN protocol preprocessing. The 179 user I/O pins can connect to touch controllers, LVDS display links, audio codecs, and microcontroller SoCs. The 6,272 logic elements are enough for flexible interface translation and small control state machines, and the 276,480 RAM bits support data FIFOs between non-clocked domains. For production automotive designs, engineers should migrate to the automotive-specified A7N variant or another AEC-qualified platform if required by the program. The main engineering advantage is reconfigurability: during vehicle development, timing and pin assignments can be updated in the lab before the ASIC or SoC interface is finalized.

🧩

IoT Edge and Smart Factory Connectivity

In IoT edge systems and smart-factory gateways, the EP4CE6F17C7N can serve as a deterministic I/O coprocessor that aggregates sensors, drives actuators, and communicates with a Linux-based host or cloud module. Its 179 I/O pins can read parallel encoders, temperature ADC buses, limit switches, and serial sensor streams. The 6,272 logic elements implement real-time control loops and simple protocol framing, while the 276,480 RAM bits buffer telemetry before transmission. Because the FPGA is reconfigurable, a single PCB can support multiple sensor protocols by loading different bitstreams, reducing hardware variants. The low-cost FBGA-256 package is compatible with four-to-six-layer PCB design used in many edge gateways. Commercial temperature grade is adequate for indoor smart building or utility room installations; industrial variants are preferred when the IoT node is mounted near motors, ovens, or outdoor enclosures.

Recommended Products Summary

EPCS4SI8N Serial configuration device used to load the Cyclone IV bitstream at power-up Used in: Industrial Motor Control, Wired Networking Infrastructure, IoT Edge and Smart Factory Connectivity IR2104S High-side/low-side gate driver interfacing to FPGA PWM outputs Used in: Industrial Motor Control ADV7513KSTZ HDMI transmitter receiving parallel pixel data from the FPGA Used in: Video and Display Processing EPCS16SI8N Altera Used in: Video and Display Processing, High-Speed Data Acquisition and Instrumentation KSZ9031RNX 10/100/1000 Ethernet PHY connected to the FPGA via RGMII Used in: Wired Networking Infrastructure AD9226ARSZ 12-bit parallel ADC feeding digitized samples into FPGA logic Used in: High-Speed Data Acquisition and Instrumentation EP4CE6F17A7N Intel Used in: Automotive Infotainment and Telematics Prototyping TJA1042T CAN transceiver interfacing with soft-core CAN logic in the FPGA Used in: Automotive Infotainment and Telematics Prototyping ATWINC1500 Wi-Fi network controller interfacing to the FPGA host or SPI bus Used in: IoT Edge and Smart Factory Connectivity
What are the key specifications of EP4CE6F17C7N that engineers should know?
The EP4CE6F17C7N is a Cyclone IV E FPGA from Altera/Intel with 6,272 logic elements, 392 CLBs/LABs, 276,480 RAM bits, 179 user I/O pins, and a maximum internal clock frequency of 472.5 MHz. It operates from a 1.2 V core supply, is manufactured on a 60 nm process, and is supplied in a 256-ball FBGA-256 package with 17 mm x 17 mm body size and 1 mm pitch. The N suffix indicates a lead-free finish. According to distributor listings, this speed-grade 7 commercial-temperature part is active and available.
What is EP4CE6F17C7N?
The EP4CE6F17C7N is an Altera Cyclone IV E Field Programmable Gate Array, not a fixed-function processor or ASIC. It contains 6,272 reprogrammable logic elements and 276,480 RAM bits, allowing engineers to implement custom digital logic, state machines, interface bridges, and parallel processing chains. With 179 user I/O pins in a 256-LBGA package, it is designed for low-cost, low-power applications such as motor control, video preprocessing, and data acquisition. The part is SRAM-based, so it must be configured at power-up from a configuration device or host.
What is the difference between EP4CE6F17C7N and EP4CE6F17C8N?
The primary difference is speed grade: EP4CE6F17C7N is a -7 speed grade device, while EP4CE6F17C8N is a -8 speed grade device. Both use the same Cyclone IV E fabric with 6,272 logic elements, 179 user I/O pins, 276,480 RAM bits, and the same 256-LBGA package. The -7 part supports faster timing performance, as reflected by the 472.5 MHz quoted frequency for the -7 variant. The -8 part may be suitable for lower-cost, lower-speed applications but your design must be retimed and re-verified for the lower maximum frequency.
Is EP4CE6F17C8N a drop-in replacement for EP4CE6F17C7N?
Yes, EP4CE6F17C8N is a drop-in replacement for EP4CE6F17C7N because it shares the same 256-LBGA package, the same 179-pin user I/O count, the same 6,272 logic elements, and the same Cyclone IV E configuration architecture. The engineering difference is speed grade: -7 versus -8. If your design was timed for -7, moving to -8 requires re-running timing analysis and possibly lowering the clock frequency. No PCB footprint change is needed, and the pin-to-pin compatibility is preserved because the package and die family are the same.
EP4CE6F17C7N vs EP4CE6F17C6N: which is better for high-speed logic?
For high-speed logic, EP4CE6F17C6N is better because the -6 speed grade is faster than the -7 speed grade in the Cyclone IV E ordering code. Both devices have the same 6,272 logic elements, 179 user I/O pins, 276,480 RAM bits, and 256-LBGA package, but -6 provides more timing margin when implementing state machines, arithmetic pipelines, or high-frequency interfaces. EP4CE6F17C7N is still capable of up to 472.5 MHz internal operation according to distributor data, so choose -6 only when your design fails timing closure at the available -7 performance or needs additional margin for temperature and voltage variation.
Where can I buy EP4CE6F17C7N online?
You can buy EP4CE6F17C7N from major distributors including DigiKey, Mouser, LCSC, Heisener, Xecor, and XAIPART. The DigiKey product page shows the part as available with a buy-now option, and LCSC lists it as an in-stock component. Octopart also compares live pricing from multiple distributors. For fast procurement, check the current distributor stock and quote because pricing and lead time change with order quantity. XAIPART can provide a quotation and datasheet access for engineering teams that prefer a direct source.
What is the price of EP4CE6F17C7N?
As of 2026-09-10, EP4CE6F17C7N pricing varies by distributor and quantity. LCSC lists a unit price from approximately $5.19, while Heisener lists a reference unit price of approximately $19.64. The large spread reflects distributor stocking, markup, and order terms. For a production quantity, request a quote from XAIPART or use Octopart to compare bulk price breaks. Prices should always be confirmed before ordering because FPGA market pricing is volatile and depends on lead time and authorized-source options.
Is EP4CE6F17C7N in stock?
Yes, EP4CE6F17C7N is in stock at several distributors according to the verified search data. LCSC explicitly lists the component as an in-stock item, and DigiKey shows a 'ships today' availability message. Heisener reports 13,374 pieces in stock in its search snippet, although that should be re-confirmed before placing an order. Because FPGA inventory changes quickly, check the distributor product page at the time of purchase. XAIPART can also confirm current availability and lead time for the quantity you need.
What is the lead time for EP4CE6F17C7N?
Lead time for EP4CE6F17C7N depends on the distributor and quantity. In the verified Heisener listing, lead time is described as 'to be confirmed' with a sample delivery estimate around August 6-11, while DigiKey shows an in-stock/ships-today state. If you are ordering large quantities, lead time may increase because authorized distributors do not always hold deep FPGA inventory on hand. For current lead time, request a quote from XAIPART or contact the distributor directly; lead time should always be confirmed on the order date.
What does the N suffix in EP4CE6F17C7N mean?
The N suffix in EP4CE6F17C7N indicates a lead-free, RoHS-compliant finish. Distributor snippets for this part mention 'LEAD FREE' and the part is commonly described as lead-free/moisture-sensitive for modern reflow assembly. The rest of the part number encodes the Cyclone IV E family, the 6K logic density, the F17/256-FBGA package, the C commercial temperature grade, and the 7 speed grade. If a design must use SnPb solder assembly, an engineer may instead evaluate the non-N leaded-finish variant such as EP4CE6F17C7, but confirm availability and RoHS policy with the manufacturer.
When should I choose EP4CE6F17C7N over EP4CE6F17I7N?
Choose EP4CE6F17C7N over EP4CE6F17I7N when your operating environment is within the standard commercial temperature range and you are not designing for industrial or extended-temperature operation. The C7N variant is the commercial speed-grade 7 part; the I7N variant is the industrial-grade version of the same FPGA family. Both share the same package and logic resources, but I7N has a wider rated temperature range and is usually specified for factory, outdoor, or uncontrolled environments. For a cost-sensitive commercial product that stays in a controlled environment, C7N offers the expected lower-cost commercial grade.
Can EP4CE6F17C7N be used in industrial temperature applications?
The standard EP4CE6F17C7N is a commercial temperature grade device, so it is not the best choice for an industrial temperature range requirement. For industrial environments, select an industrial-suffix Cyclone IV E variant such as EP4CE6F17I7N, which is designed for wider operating temperatures while retaining the same F17 256-ball package and logic capacity. If the application is automotive and requires the automotive-specified variant, evaluate EP4CE6F17A7N. Always confirm the exact operating temperature range from the Intel/Altera Cyclone IV datasheet before committing to a suffix grade for a production design.
Where can I download the EP4CE6F17C7N datasheet PDF?
The EP4CE6F17C7N datasheet is available from Intel/Altera as part of the Cyclone IV device documentation. A genuine PDF link is included in the manufacturer's FPGA handbook page under the Cyclone IV section. Third-party datasheet repositories such as Alldatasheet also host Cyclone IV datasheet PDF copies, and LCSC links to datasheet and pinout diagrams from its product page. For the most authoritative specifications, download the current Cyclone IV handbook from Intel/Altera instead of relying on older third-party mirrors. The MPN EP4CE6F17C7N is covered in the Cyclone IV family documentation, not as a standalone one-page sheet.
What is the logic capacity of EP4CE6F17C7N?
The EP4CE6F17C7N has 6,272 logic elements and 392 CLBs/LABs according to the verified distributor specifications. It also contains 276,480 RAM bits, which can be used for FIFOs, small buffers, distributed memory, or line storage in real-time designs. This is roughly a 6K-logic-element FPGA, placing it in the low-cost segment of the Cyclone IV E family. For designs that need more logic, Intel/Altera offers other Cyclone IV E densities, but they may not be drop-in replacements in the same F17 package if timing and capacity parameters differ significantly.
Hey Google, what can replace EP4CE6F17C7N?
EP4CE6F17C6N, EP4CE6F17C8N, EP4CE6F17C7, EP4CE6F17I7N, and EP4CE6F17A7N are Cyclone IV E device variants that can replace EP4CE6F17C7N in the same 256-LBGA footprint. The most appropriate replacement depends on required speed grade and temperature grade: C6N is faster, C8N is slower, C7 is the leaded-finish equivalent, I7N is industrial temperature, and A7N is the automotive-grade variant. No Xilinx or Lattice FPGA can be treated as a pin-to-pin drop-in because FPGA ball maps and configuration methods differ between vendors.
Can a Xilinx or other brand FPGA replace EP4CE6F17C7N without a PCB change?
No, a Xilinx, Lattice, or Microchip FPGA cannot replace EP4CE6F17C7N without a PCB change. FPGA devices from different manufacturers use different package ball assignments and different configuration pins, so they are not pin-to-pin compatible even when the package style is similar. A true drop-in replacement for EP4CE6F17C7N must come from the same Cyclone IV E family and use the same F17 256-ball package. For a cross-vendor design, the PCB, configuration memory, power sequence, and boot FPGA must all be redesigned; the process is not a simple component substitution.

Engineering reference data for EP4CE6F17C7N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CE6F17C7N for cost-sensitive, indoor, commercial-temperature FPGA designs that need 6,272 logic elements, 179 user I/O, and 276,480 RAM bits in a compact 256-ball FBGA. Its -7 speed grade provides balanced timing margin for many industrial automation, video, data acquisition, and IoT applications. If your design fails timing closure or needs faster processing, move to EP4CE6F17C6N because the -6 speed grade is faster. If maximum clock speed is not critical and cost pressure is dominant, EP4CE6F17C8N can be evaluated because the -8 grade is a slower bin but may offer lower cost or better availability. For RoHS-constrained assembly, confirm the N suffix on the order line; EP4CE6F17C7 is a leaded-finish variant. For industrial-temperature or automotive-temperature environments, select EP4CE6F17I7N or EP4CE6F17A7N. All listed alternatives share the same F17 256-FBGA footprint and can be placed on the same PCB, but timing and temperature requirements must be re-verified after changing the part number.

Comparison with Alternatives

Parameter This Product EP4CE6F17C6N EP4CE6F17C8N EP4CE6F17C7 EP4CE6F17I7N EP4CE6F17A7N
Package 256-LBGA (FBGA-256) 256-LBGA (FBGA-256) 256-LBGA (FBGA-256) 256-LBGA (FBGA-256) 256-LBGA (FBGA-256) 256-LBGA (FBGA-256)
Brand Altera Altera Altera Altera Altera Altera
Number of Logic Elements 6272 6272 6272 6272 6272 6272
Total RAM Bits 276480 bits 276480 bits 276480 bits 276480 bits 276480 bits 276480 bits
Number of User I/O 179 179 179 179 179 179
Core Supply Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Speed Grade from Part Number -7 (C7N) -6 (C6N) -8 (C8N) -7 (C7) -7 (I7N) -7 (A7N)
Temperature Grade Commercial (C) Commercial (C) Commercial (C) Commercial (C) Industrial (I) Automotive (A)
Lead-Free Finish Yes (N suffix) Yes (N suffix) Yes (N suffix) No (non-N leaded finish) Yes (N suffix) Yes (N suffix)

Key Differentiators

  • Mainstream -7 speed grade balances timing margin and cost (vs EP4CE6F17C8N)
  • Lead-free N finish supports modern RoHS-compliant assembly (vs EP4CE6F17C7)
  • Standard commercial grade is cost-optimized for indoor equipment (vs EP4CE6F17I7N)

Design Notes

The EP4CE6F17C7N core is a 1.2 V supply design on a 60 nm process. Use a dedicated switching regulator or low-dropout regulator for VCCINT and keep the power path separate from I/O bank supplies. At a 472.5 MHz maximum internal clock quoted in distributor data, high logic utilization can increase core current substantially. Use the Intel/Altera PowerPlay Early Power Estimator during the design phase rather than assuming a fixed power number. Estimated decoupling: place at least one 100 nF ceramic capacitor near each VCC ball or at regular intervals across the 256-ball BGA, plus bulk capacitance in the 10-47 uF range per power rail. Confirm exact values with the Cyclone IV power-rail decoupling recommendations.

The 256-LBGA package has a 17 mm x 17 mm body and 1 mm ball pitch. For a low-cost commercial product, use a four-layer PCB with a solid ground plane and a dedicated 1.2 V plane if routing density permits. Fan out the outer BGA ball rows with standard via-in-pad or dogbone vias, and assign inner-row signal escapes carefully to preserve signal integrity. Avoid placing vias directly under the package center unless your assembly partner supports via-in-pad and cap-plating. The N suffix means the device is lead-free, so use a lead-free reflow profile. Since no pinout table was encoded in this page, download the official Cyclone IV pinout files before finalizing the FPGA symbol and footprint.

The EP4CE6F17C7N is an SRAM-based FPGA and loses its configuration when power is removed. A common design mistake is omitting a configuration device or controller, which leaves the FPGA unconfigured after every power cycle. In production, include a serial configuration device or connect the FPGA to a host that can load a bitstream over a supported configuration scheme. Also remember that C7N is the commercial temperature grade, not industrial or automotive; if the end product must operate at wide temperature, use the I7N or A7N Cyclone IV E variant. Before board fabrication, check voltage sequencing, I/O bank voltages, and any pull-up requirements on configuration pins.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

The N suffix and distributor snippets indicate a lead-free, RoHS-compliant finish. REACH, halogen-free, and conflict-minerals status were not explicitly present in the verified web data and should be confirmed with the Intel/Altera documentation.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

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Altera Intel Cyclone IV Cyclone IV E EP4CE6F17C7N EP4CE6F17C6N EP4CE6F17C8N EP4CE6F17I7N EP4CE6F17A7N FPGA Field Programmable Gate Array CLB LAB logic element FBGA-256 BGA 276480 RAM bits 179 user I/O 472.5 MHz 60 nm 1.2 V core voltage RoHS lead-free
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