Altera

EP4CE6F17C8N - Cyclone IV E FPGA, 6.3K LE, 256-BGA | Altera

MPN: EP4CE6F17C8N βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 256-ball FBGA (F17, 17x17 mm) Package C8 Speed 270 Kbits Memory
From $13.75 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $22.5 $22.50
10 $20.25 $202.50
100 $17.85 $1,785.00
500 $15.5 $7,750.00
1,000 $13.75 $13,750.00
ℹ️ All prices are in USD

EP4CE6F17C8N Overview

The Altera (now Intel) EP4CE6F17C8N is a low-cost, low-power Cyclone IV E FPGA housed in a 256-ball FineLine BGA package (17x17 mm). It integrates 6,272 logic elements, 270 Kbits of embedded memory, and 15 embedded 18x18 multipliers, targeting high-volume cost-sensitive applications. Built on a 60 nm process, this Cyclone IV E variant supports up to 179 maximum user I/O pins with a 1.2 V core supply.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, I/O cells, and dedicated hard IP such as block RAM and DSP multipliers. FPGAs sit within the broader programmable logic device (PLD) hierarchy, occupying the same role as ASICs but offering post-fabrication re-programmability. Cyclone IV E belongs to Altera's low-cost FPGA family, optimized for volume production with the lowest power consumption in its class, typically below 1.5 W in static mode.

Key features include 6,272 logic elements, 270 Kbits embedded RAM, 15 dedicated 18x18 hardware multipliers, two PLLs, and 179 maximum user I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with on-chip termination (OCT). Configuration options include JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. The 256-ball FBGA package provides excellent signal integrity for high-speed designs while enabling compact PCB layouts.

Technically, the EP4CE6F17C8N uses a 60 nm low-k dielectric process with a 1.2 V core supply and 2.5 V/3.3 V/1.8 V/1.5 V I/O standards. The architecture separates logic, routing, and DSP blocks, enabling deterministic timing closure through Altera/Intel Quartus II design software. Built-in support for Nios II embedded processors allows soft-core CPU integration without external components. The Cyclone IV E family is widely used in industrial control, video processing, and communications infrastructure.

Typical applications include motor control and drive electronics, video surveillance and image processing, industrial Ethernet gateways, LED display controllers, and portable medical devices. Its low power consumption and high logic density make it ideal for portable instrumentation, automotive infotainment prototypes, and consumer electronics requiring flexible logic integration.

When designing with this FPGA, careful attention must be paid to power rail sequencing, decoupling capacitor placement near each power pin, and thermal management via the exposed pad of the FBGA package. Designers should use Intel Quartus Prime software for synthesis, place-and-route, and timing analysis. Verification of pinout compatibility against the FPGA's data sheet is essential before PCB fabrication.

This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone IV E family, application examples, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP4CE6F17C8N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CE6F17C8N (same form factor and footprint) β€” differing in Package, Process Technology, Speed Grade, PLLs, Configuration Modes.

Intel
Package: 484-FBGA (UBGA-484, 19x19 mm)
Process Technology: 60 nm low-power CMOS
Speed Grade: A7
Compare with EP4CE6F17C8N β†’
Altera
Package: 256-FBGA (F17), 17x17 mm
Process Technology: 60 nm low-power SRAM
PLLs: 4
Compare with EP4CE6F17C8N β†’
Intel
Package: 144-LQFP Exposed Pad (EQFP-144)
Speed Grade: 8 (commercial)
PLLs: 2 (up to 4 clock networks)
Compare with EP4CE6F17C8N β†’
Intel
Package: FBGA-256 (256-LBGA), 17 x 17 mm, 1.0 mm pitch
Process Technology: 60 nm, low-power
Speed Grade: 7 (fastest commercial for Cyclone IV E)
Compare with EP4CE6F17C8N β†’
Intel
Package: 256-FBGA 17x17 mm, 1.0 mm pitch
Speed Grade: C6 (commercial)
Compare with EP4CE6F17C8N β†’
Altera
Package: 256-FBGA (F17), 17x17 mm, 1.0 mm pitch
Speed Grade: C6 (commercial)
Configuration Modes: JTAG, Active Serial, Active Parallel
Compare with EP4CE6F17C8N β†’
Altera
Process Technology: 60 nm
Compare with EP4CE6F17C8N β†’
Altera
Package: 256-ball F17 FBGA (17x17 mm, 1.0 mm pitch)
Process Technology: 60 nm
Speed Grade: 8
Compare with EP4CE6F17C8N β†’
Intel
Package: 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch
Process Technology: 60 nm
Compare with EP4CE6F17C8N β†’
Intel
Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)
Process Technology: 60 nm low-k CMOS
Speed Grade: C9 (-N speed grade)
Compare with EP4CE6F17C8N β†’
Intel
Package: 256-LBGA (17 x 17 mm, 1 mm pitch, FBGA-256)
Process Technology: 60 nm low power
Compare with EP4CE6F17C8N β†’
Altera
Package: 256-FBGA (17x17 mm, 1.0 mm pitch)
Configuration Modes: JTAG, Active Serial, Passive Serial
Compare with EP4CE6F17C8N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP4CE6F17C7N

βœ… Drop-In
Altera
πŸ“¦ 256-ball FBGA (F17)
Altera / Intel Β· Cyclone IV E Β· FPGA - Field Programmable Gate Array Β· 6272 Β· 392 Β· 276480 bits Β· 179 Β· 256-LBGA (FBGA-256)

βœ“ In Stock

$3.6 / Unit

View Datasheet β†’

EP4CE6F17I7N

βœ… Drop-In
Altera
πŸ“¦ 256-ball FBGA (F17)
Cyclone IV E Β· 6,272 Β· 276,480 Β· 30 (M9K, 9 Kbits each) Β· 15 Β· 2 Β· 10 Β· 179

βœ“ In Stock

$15.1 / Unit

View Datasheet β†’

EP4CE6F17C8LN

βœ… Drop-In
Altera
πŸ“¦ 256-ball FBGA (F17)
Cyclone IV E Β· Cyclone IV E (EP4CE6) Β· 6,272 Β· 392 Β· 270 Β· 15 Β· 179 Β· 2

βœ“ In Stock

$17.25 / Unit

View Datasheet β†’

EP4CE6E22C8N

βœ… Drop-In
Intel
πŸ“¦ 256-ball FBGA (F17)
Cyclone IV E Β· EP4CE6 Β· 6,272 Β· 276,480 bits (270 Kbits) Β· 15 (18x18) Β· 2 (up to 4 clock networks) Β· 91 Β· 1.15 V to 1.25 V

βœ“ In Stock

$10.5 / Unit

View Datasheet β†’

EP4CE6F17C6N

βœ… Drop-In
Altera
πŸ“¦ 256-ball FBGA (F17)
Cyclone IV E Β· 6,272 Β· 392 Β· 270 Kbits Β· 179 Β· 256-FBGA (F17), 17x17 mm, 1.0 mm pitch Β· C6 (commercial) Β· 0C to +85C (commercial)

βœ“ In Stock

$17.95 / Unit

View Datasheet β†’

EP4CE10F17C8N

βœ… Drop-In
Altera
πŸ“¦ 256-ball FBGA (F17)
Cyclone IV E Β· 10320 Β· 423936 bits (414 Kbit) Β· 23 Β· 4 Β· 179 Β· 1.15 V to 1.25 V Β· 1.2 V to 3.3 V

βœ“ In Stock

$17.95 / Unit

View Datasheet β†’

EP4CE6F17C8N Maximum Ratings & Electrical Characteristics

Manufacturer Altera (Intel)
Series Cyclone IV E
Device Family Cyclone IV E (EP4CE6)
Logic Elements 6,272 LE
Embedded Memory 270 Kbits
Embedded 18x18 Multipliers 15
Maximum User I/Os 179
PLLs 2
Core Voltage 1.2 V
Process Technology 60 nm low-power
Package 256-ball FBGA (F17, 17x17 mm)
Mounting Type Surface Mount
Operating Temperature 0C to +85C (Commercial)
Speed Grade C8
Configuration Modes JTAG, AS, PS, FPP
RoHS Status Compliant

EP4CE6F17C8N 256-ball fbga (f17, 17x17 mm) Pin Configuration Guide

Pin configuration for EP4CE6F17C8N (256-ball fbga (f17, 17x17 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

256-ball fbga (f17, 17x17 mm) package pinout diagram for EP4CE6F17C8N

No detailed pinout data available for EP4CE6F17C8N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CE6F17C8N is suitable for 6 applications: Industrial Motor Control, Video Surveillance and Image Processing, Industrial Ethernet Gateway, LED Display Controller, Portable Medical Device Controller, Consumer Electronics Prototyping.

🏭

Industrial Motor Control

The EP4CE6F17C8N fits industrial motor control because its 15 dedicated 18x18 hardware multipliers execute field-oriented control (FOC) math in single clock cycles, while 270 Kbits of embedded RAM buffer ADC current samples and PWM duty tables. Designers implement SVPWM generation, encoder quadrature decoders, and PI controller loops in fabric for sub-microsecond loop periods. The 1.2 V core supply and 60 nm low-power process keep total power under 1.5 W even at full DSP utilization. The 256-ball FBGA exposes 179 user I/Os, sufficient for multi-axis drives connecting to power module gate drivers, Hall/encoder sensors, and isolated communication interfaces. Industrial-grade variants like EP4CE6F17I7N extend this to harsh environments.

πŸŽ₯

Video Surveillance and Image Processing

The EP4CE6F17C8N handles entry-level video processing pipelines such as motion detection, video scaling, and basic image enhancement. Its 6,272 logic elements implement Sobel edge detection, median filtering, and color space conversion in real time at common CIF/D1 resolutions. The 270 Kbits of block RAM holds line buffers for 2D convolution kernels without external SDRAM for moderate resolutions. LVDS I/O support enables direct connection to CMOS image sensor parallel interfaces. Cyclone IV E's low static power is critical in always-on PoE-powered cameras where thermal budgets are tight.

🌐

Industrial Ethernet Gateway

The EP4CE6F17C8N implements deterministic industrial Ethernet protocols such as EtherCAT, PROFINET, or EtherNet/IP slave stacks in fabric. Its 179 user I/Os accommodate dual MII/RGMII PHY interfaces plus SPI/UART host connections, while 270 Kbits of RAM buffer packet queues and process image memory. The two on-chip PLLs generate the precise clock frequencies required for PHY link timing and processor cores. Real-time operating system (RTOS) and protocol stack fit within the 6,272 LEs with room for application-specific custom logic on top.

πŸ’‘

LED Display Controller

The EP4CE6F17C8N drives multi-million-pixel LED video walls by handling high-speed pixel shifting, gamma correction, and refresh-rate conversion. Each FPGA channel outputs LVDS pairs to LED driver chips, and the 179 user I/Os support 60+ data channels at 24-bit color depth. The 15 hardware multipliers accelerate brightness compensation calculations while 270 Kbits of RAM buffers scan-line information. Its low power extends operating life in always-on digital signage installations.

πŸ’Š

Portable Medical Device Controller

Medical device prototypes leverage the EP4CE6F17C8N's low 1.2 V core power consumption for battery-powered designs like portable patient monitors or point-of-care diagnostics. The 6,272 LEs implement sensor fusion algorithms for pulse oximetry, ECG signal conditioning, and TFT display driving within a single chip. The 270 Kbits of embedded RAM stores waveform history without external memory. Industrial-temperature variants support clinical environments with strict reliability requirements.

πŸ“±

Consumer Electronics Prototyping

The EP4CE6F17C8N enables fast prototyping of consumer peripherals such as smart-home hubs, gaming accessories, and wearable controllers. Its Nios II soft-core processor support allows quick CPU integration for IoT control logic, while programmable fabric handles custom sensor interfaces (I2C, SPI, UART bridges). The 256-ball FBGA fits within space-constrained wearable form factors, and the C8 speed grade is sufficient for typical consumer clock rates below 100 MHz.

What is the logic element count of EP4CE6F17C8N?
The EP4CE6F17C8N contains 6,272 logic elements (LEs) per the Altera Cyclone IV E device handbook. This positions it as the lowest-density member of the Cyclone IV E family, suitable for glue logic, control functions, and modest DSP pipelines. The 60 nm low-power process keeps static consumption below 1.5 W typical.
How much embedded memory does EP4CE6F17C8N have?
The EP4CE6F17C8N integrates 270 Kbits (approximately 33.75 KB) of embedded block RAM (M9K blocks) for data buffering and FIFO applications. This memory is partitioned into multiple 9 Kbit blocks distributed across the fabric, accessible via dedicated routing to minimize timing variability in user designs.
What package does the EP4CE6F17C8N use?
The EP4CE6F17C8N ships in a 256-ball FineLine BGA package measuring 17x17 mm with 1.0 mm ball pitch. The F17 designation indicates this specific BGA geometry. The package supports up to 179 user I/O pins through the FBGA's perimeter and interior ball assignments.
Where can I buy the EP4CE6F17C8N online?
The EP4CE6F17C8N is available from authorized distributors including DigiKey (stock 2288245) and Mouser, both confirmed in the verified web data. As of 2026-09-10, distributor listings show active stock with same-day shipping options. XAIPART also offers quote-based ordering for production volumes.
What is the price of the EP4CE6F17C8N at quantity 1?
The EP4CE6F17C8N unit price at quantity 1 is approximately $22.50 USD as of 2026-09-10, based on DigiKey distributor data. Volume discounts reduce the price to roughly $17.85 at 100 pieces, $15.50 at 500 pieces, and $13.75 at 1,000 pieces for OEM production.
What is the lead time for EP4CE6F17C8N?
Lead time for the EP4CE6F17C8N is typically stock to 6 weeks as of 2026-09-10. Major distributors like DigiKey and Mouser list it as in-stock or with short factory lead time, reflecting the part's active production status and continued Cyclone IV E family support through Intel FPGA.
EP4CE6F17C8N vs EP4CE6F17C8 - what is the difference?
The EP4CE6F17C8N includes the 'N' suffix indicating lead-free (Pb-free) and RoHS-compliant packaging. The EP4CE6F17C8 (without N) may refer to a non-RoHS variant or tray packaging depending on the original ordering code. Both share the same 256-ball FBGA package, 6,272 LEs, and C8 speed grade.
EP4CE6F17C8N vs EP4CE6F17C7N - which is better?
The EP4CE6F17C8N and EP4CE6F17C7N share the same 256-ball FBGA package and 6,272 logic elements. The difference is the speed grade: C8 is slower than C7. Choose C8 for lower cost when timing margins are adequate; choose C7 for higher Fmax on critical paths. Both are drop-in compatible at the PCB level.
When should I choose EP4CE6F17C8N over EP4CE6F17C8L?
The EP4CE6F17C8L suffix denotes the industrial temperature range (-40C to +85C) variant, while the EP4CE6F17C8N targets commercial temperature (0C to +85C). Choose EP4CE6F17C8N for indoor, environmentally controlled products where cost matters; choose EP4CE6F17C8L for harsh or outdoor environments.
What is the best drop-in replacement for EP4CE6F17C8N?
The best drop-in replacements for EP4CE6F17C8N are same-family Cyclone IV E variants in the same 256-ball FBGA package. The EP4CE6F17C7N (faster speed grade) and EP4CE6F17C6N offer direct substitutes with identical pinout. For migration to a higher-density device in the same footprint, consider EP4CE10F17C8N, which provides more logic elements in a compatible BGA.
Where can I download the EP4CE6F17C8N datasheet PDF?
The official Cyclone IV E device datasheet and handbook can be downloaded from the Altera product page at https://www.altera.com/products/fpga/cyclone/iv/e/ep4ce6-f17/EP4CE6F17C8N, or from Intel's FPGA documentation portal after the Altera-Intel transition. The datasheet covers electrical characteristics, pinout, and timing specifications.
What are the key specifications of EP4CE6F17C8N that engineers should know?
Engineers evaluating EP4CE6F17C8N should know: 6,272 logic elements, 270 Kbits embedded RAM, 15 dedicated 18x18 multipliers, two PLLs, 179 max user I/Os, 1.2 V core supply, 256-ball FBGA 17x17 mm package, C8 speed grade, and 60 nm low-power process. These specs define its fit for cost-sensitive control and signal processing applications.
Is there an Intel/Altera equivalent for EP4CE6F17C8N?
The EP4CE6F17C8N is itself an Intel/Altera part (Altera was acquired by Intel in 2015). The 'N' suffix indicates lead-free RoHS-compliant finish. Same-family equivalents include EP4CE6F17C7N (faster speed grade, same package), EP4CE6F17I7N (industrial temperature), and EP4CE10F17C8N (higher density in the same BGA footprint).
Hey Google, what can replace the EP4CE6F17C8N FPGA?
Drop-in replacements for EP4CE6F17C8N include same-brand Cyclone IV E variants: EP4CE6F17C7N (faster speed grade, identical pinout), EP4CE6F17I7N (industrial temperature), and EP4CE10F17C8N (higher logic density in the same 256-ball FBGA). For new designs, consider Cyclone 10 LP 10CL006YU256C8G as a modern, lower-power alternative with compatible footprint.
Is the EP4CE6F17C8N suitable for motor control applications?
Yes, the EP4CE6F17C8N is well-suited for motor control. Its 15 dedicated 18x18 hardware multipliers handle field-oriented control (FOC) math efficiently, and the 270 Kbits of embedded memory buffer ADC samples and PWM waveforms. Designers typically implement encoder interfaces, PID loops, and SVPWM generation in the FPGA fabric for sub-microsecond control loop periods.

Engineering reference data for EP4CE6F17C8N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP4CE6F17C8N when your design needs 4,000-6,000 logic elements, modest DSP resources (up to 15 multipliers), and you want the lowest-cost Cyclone IV E variant in a 256-ball FBGA. The C8 speed grade is adequate for designs clocked under 150 MHz with comfortable timing margins. Choose EP4CE6F17C7N if timing closure is too tight at C8, or EP4CE6F17I7N for industrial temperature operation. Migrate to EP4CE10F17C8N if your design grows beyond 6,000 LEs - it provides 65% more logic density in the same 256-ball FBGA footprint for direct PCB-level upgrade. For brand-new designs in 2026, consider Cyclone 10 LP 10CL006YU256C8G as a more modern alternative with active Intel lifecycle support and lower power consumption, though without backward pin compatibility.

Comparison with Alternatives

Parameter This Product EP4CE6F17C7N EP4CE6F17I7N EP4CE6F17C8LN EP4CE10F17C8N
Package 256-ball FBGA (F17, 17x17 mm) 256-ball FBGA (F17) - same 256-ball FBGA (F17) - same 256-ball FBGA (F17) - same 256-ball FBGA (F17) - same
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 6,272 LE 6,272 LE 6,272 LE 6,272 LE 10,320 LE (+65%)
Embedded Memory 270 Kbits 270 Kbits 270 Kbits 270 Kbits 414 Kbits
18x18 Multipliers 15 15 15 15 23
Speed Grade C8 C7 (faster) I7 (industrial temp) C8L (industrial temp) C8
Operating Temperature 0C to +85C (Commercial) 0C to +85C -40C to +85C (Industrial) -40C to +85C (Industrial) 0C to +85C
PLLs 2 2 2 2 2
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • Lowest-density, lowest-cost member of Cyclone IV E with full package compatibility (vs EP4CE10F17C8N)
  • C8 speed grade optimizes cost vs performance tradeoff (vs EP4CE6F17C7N)
  • Commercial temperature rating for indoor consumer applications (vs EP4CE6F17I7N)

Design Notes

The EP4CE6F17C8N requires multiple power rails: 1.2 V core, 2.5 V analog PLL supply, and bank-specific VCCIO voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V). Use a power sequencing controller to ensure the core ramps before I/O supplies. Decoupling: place 0.1 uF X7R capacitors within 3 mm of every power pin, plus 10 uF bulk capacitors per power rail. Estimated: at typical 50% toggle activity with all 15 multipliers running, total core current reaches ~500 mA.

Although the Cyclone IV E is low-power (typically under 1.5 W static), thermal management matters for industrial designs. The 256-ball FBGA's exposed center balls provide thermal conduction; connect them to a large ground/power pour on inner PCB layers with thermal vias. Estimated: at 85C ambient and full DSP utilization, junction temperature may approach 95C - verify with the Quartus PowerPlay analyzer before finalizing layout.

FBGA routing requires microvia or via-in-pad technology for the 1.0 mm ball pitch. Use 4+ PCB layers with dedicated ground and power planes to maintain signal integrity on high-speed LVDS pairs. Length-match differential pairs to within 0.13 mm (5 mil) per the Altera pin connection guidelines. Place configuration flash (EPCS or compatible) within 25 mm of the FPGA for reliable Active Serial configuration.

Do not assume JTAG configuration without verifying MSEL pin settings - the EP4CE6F17C8N defaults to Active Serial mode at power-up. Confirm CONFIG_DONE and nSTATUS behavior with proper pull-up resistors. Lock configuration by tying nCE low and nCONFIG high at power-up. For multi-FPGA designs, daisy-chain JTAG correctly using TMS/TCK fanout.

Place clock input pins on dedicated CLK pins to access global clock networks. Differential clocks (LVDS) must enter on DIFFCLK-capable pins. Group high-speed I/O on adjacent banks to simplify length matching. Leave at least 1 mm clearance between FBGA perimeter and other components to allow rework. Reference the Cyclone IV E handbook pin connection guidelines for unused-pin termination requirements.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance indicated by 'N' suffix per Altera ordering code convention. AEC-Q100 not applicable for FPGAs (automotive grade variants have separate ordering codes). Halogen-free status not explicitly confirmed in retrieved data.

Data verified on: 2026-09-10 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP4CE6F17C8N EP4CE6F17C8N datasheet Altera Cyclone IV EP4CE6 Cyclone IV E 256 FBGA FPGA EP4CE6F17C8N pinout Cyclone IV E motor control FPGA EP4CE6F17C8N vs EP4CE6F17C7N EP4CE6F17C8N drop-in replacement buy EP4CE6F17C8N what is the logic element count of EP4CE6F17C8N low cost FPGA 6272 logic elements Altera FPGA 256-ball BGA package

Related Components & Terms

Altera Intel EP4CE6F17C8N EP4CE6F17C7N EP4CE6F17I7N EP4CE10F17C8N Cyclone IV E FPGA Field Programmable Gate Array Programmable Logic Device PLD logic element logic array block embedded memory block RAM M9K 18x18 multiplier DSP block PLL phase-locked loop LVDS 256-ball FBGA FineLine BGA JTAG Active Serial configuration Nios II soft-core processor Quartus 60 nm process RoHS industrial temperature range motor control industrial Ethernet LED display controller video processing
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