EP4CGX150DF31C8 - Cyclone IV GX FPGA, 149760 LE, 896-BGA | Intel
MPN: EP4CGX150DF31C8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $138 | $13,800.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $102 | $102,000.00 |
EP4CGX150DF31C8 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic, interconnect, and I/O behaviour can be reconfigured after manufacture by the end user. FPGAs sit within the programmable logic family of devices and are widely used to implement glue logic, custom compute engines, DSP pipelines, and high-speed serial interfaces that would otherwise require several discrete ASICs. The Cyclone IV GX family specifically targets low-power, cost-sensitive applications that still require multi-gigabit transceivers.
Key features of the EP4CGX150DF31C8 include 149,760 logic elements, 720 Kbits of embedded SRAM distributed as M9K blocks, up to eight 3.125 Gbps transceiver channels, 475 user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL and HSTL standards, and hardware multipliers for DSP operations. The device supports 8B/10B encoding, PCI Express (PIPE) hard IP, and a wide range of memory interfaces including DDR2/DDR3/LPDDR2 controllers via soft IP. Configuration is handled through JTAG, passive serial, or fast passive parallel modes.
The Cyclone IV architecture uses 60 nm logic and 8-channel transceiver tiles with on-chip termination, PLLs, and per-channel pre-emphasis and equalisation. This combination delivers 3.125 Gbps serial bandwidth at substantially lower static and dynamic power than the previous Cyclone III generation, which makes the EP4CGX150DF31C8 attractive for industrial video, motor control and broadband backplane designs.
Typical applications include industrial video broadcast equipment, motor control and servo drives, PCIe Gen1 endpoint cards, low-cost broadband aggregation, and any system that requires 8-channel serial I/O with mid-density programmable logic. The wide temperature range and high I/O count make it suitable for industrial-grade base platforms.
When designing with this device, ensure the PCB footprint matches the F31 896-ball BGA land pattern with appropriate via-in-pad or dog-bone fan-out, and provide sufficient decoupling capacitance around all transceiver power pins to meet signal-integrity requirements. Reference Altera/Intel Cyclone IV GX device handbook for transceiver channel placement and PCB stack-up recommendations.
This page synthesizes distributor pricing, drop-in alternative pin-compatible parts from the same Cyclone IV GX family, and practical design notes not found in a single datasheet chapter.
Drop-in alternatives for EP4CGX150DF31C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX150DF31C8 (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, Operating Temperature, Configuration.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX150DF31C7
✅ Drop-In✓ In Stock
$218.4 / Unit
View Datasheet →EP4CGX150DF31C7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP4CGX150DF31C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$210 / Unit
View Datasheet →EP4CGX110DF31C8
✅ Drop-In✓ In Stock
$235.8 / Unit
View Datasheet →EP4CGX110DF31C7
✅ Drop-In✓ In Stock
$264.01 / Unit
View Datasheet →EP4CGX150DF31C8 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Family | Cyclone IV GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 149,760 |
| Number of Logic Array Blocks (LABs) | 11820 |
| Embedded Memory Bits | 6,635,520 (6480 Kbits / ~810 Kbytes) |
| Number of M9K Memory Blocks | 720 |
| Number of I/O Pins | 475 |
| Number of Transceivers | 8 channels (up to 3.125 Gbps) |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package Type | 896-ball FineLine BGA (FBGA) |
| PCB Footprint Code | F31 (31 mm) |
| Operating Temperature | Commercial (0C to +85C) - C8 grade |
| Speed Grade | 8 (commercial) |
| RoHS Status | Compliant |
| Configuration Modes | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
EP4CGX150DF31C8 896-ball fineline bga (fbga) Pin Configuration Guide
Pin configuration for EP4CGX150DF31C8 (896-ball fineline bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX150DF31C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX150DF31C8 is suitable for 6 applications: Industrial Video Broadcast Equipment, PCIe Endpoint Cards and Embedded Computing, Motor Control and Servo Drives, Low-Cost Broadband Aggregation and Backplanes, Test and Measurement Instrumentation, Automotive Infotainment and Driver Assistance (non-safety).
Industrial Video Broadcast Equipment
The EP4CGX150DF31C8 is well suited to industrial-grade video broadcast and processing equipment where multi-channel high-speed serial links coexist with substantial DSP and glue logic. The device delivers 149,760 logic elements plus 132 18x18 hardware multipliers, enough to implement multi-channel SDI/HD-SDI colour-space conversion or basic H.264 preprocessing in a single chip. Eight 3.125 Gbps transceiver channels handle SDI, HDMI or DisplayPort bridging without external serializer chips. The 475 user I/O accept LVDS video buses from companion decoders and feed memory controllers for DDR2/DDR3 frame buffers. According to the Cyclone IV GX handbook, the lower static and dynamic power relative to Cyclone III cuts thermal budget in 1U rack-mount broadcast chassis.
Recommended
PCIe Endpoint Cards and Embedded Computing
Embedded PCIe Gen1 endpoint cards and industrial computing modules use the EP4CGX150DF31C8 because it integrates a hard PCI Express IP block supported by the on-chip transceivers at 2.5 Gbps. The hard IP delivers x1 and x4 Gen1 endpoints without consuming FPGA fabric, freeing 149,760 logic elements for custom register interfaces, DMA engines, and protocol bridges to local buses. Eight transceiver lanes give headroom for one x4 PCIe plus one SFP or SATA link from the same device. According to the Cyclone IV GX device handbook, the PIPE interface lets designers pair the FPGA with external PHY clock generators for PCIe Gen2 up-conversion. Designers benefit from a known-good PCIe stack and a mature Quartus reference flow.
Recommended
Motor Control and Servo Drives
High-end industrial servo drives, CNC controllers and robotics platforms use the EP4CGX150DF31C8 to consolidate multiple PWM generators, encoder interfaces, EtherCAT or SERCOS slave controllers, and safety logic in a single chip. The 149,760 logic elements plus 132 hardware 18x18 multipliers support field-oriented control loops on three-phase motors with sub-microsecond cycle times. With 475 user I/O the device can sink encoders from many axes while eight transceivers drive industrial Ethernet uplinks at 100 Mbit or 1 Gbit. The commercial 0C to +85C temperature range covers most factory-floor enclosures; for harsher environments the I7 industrial variant extends the range to -40C to +100C on the same F31 footprint.
Recommended
Low-Cost Broadband Aggregation and Backplanes
Telecom-equipment OEMs use the EP4CGX150DF31C8 in low-cost broadband aggregation shelves and base-station backhaul where eight 3.125 Gbps transceiver lanes provide ample uplink bandwidth at minimal BOM cost. The FPGA fabric implements CPRI, OBSAI, or proprietary serial backplane protocols while 149,760 logic elements handle packet classification and traffic shaping. Embedded 6,635,520 memory bits allow line-rate buffering for small Ethernet frames without external SRAM. Compared to ASIC solutions, the Cyclone IV GX cuts NRE cost and supports field upgrades via JTAG. Lower dynamic power than Cyclone III enables fan-less 1U designs in sealed enclosures.
Recommended
Test and Measurement Instrumentation
Modular test instruments, protocol analysers and logic-analyser probe heads use the EP4CGX150DF31C8 to combine high-speed serial capture, deep trace memory and user-defined trigger logic on a single device. Eight transceiver channels acquire multi-gigabit serial data into 6480 Kbits of embedded memory while 149,760 logic elements implement custom trigger state machines. The 475 user I/O allow direct connection to high-pin-count probes and front-panel displays. Designers leverage the Quartus II design environment and Altera/Intel IP cores for PCIe, JTAG, and DDR memory interfaces, accelerating time-to-market for new instrument platforms.
Recommended
Automotive Infotainment and Driver Assistance (non-safety)
Automotive infotainment head units, premium audio amplifiers, surround-view displays and non-safety driver-assistance ECUs use the EP4CGX150DF31C8 for image aggregation and display pipelines. Eight transceivers accept MIPI-CSI or FPD-Link serial camera inputs while 132 18x18 hardware multipliers perform image scaling, blending and colour conversion in real time. The 475 user I/O drive large LVDS or OpenLDI display panels without external bridge chips. For non-safety automotive subsystems the commercial 0C to +85C grade is acceptable; for harsher cabin locations designers choose the I7 industrial variant which remains on the same F31 footprint and supports -40C to +100C. Safety-critical functions require dedicated ASIL-rated MCUs or FPGAs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX150DF31C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150DF31C7 | EP4CGX150DF31C7N | EP4CGX110DF31C8 | EP4CGX110DF31C7 | EP4CGX150DF31C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (F31, 31 mm) | 896-ball FBGA (F31, 31 mm) - same | 896-ball FBGA (F31, 31 mm) - same | 896-ball FBGA (F31, 31 mm) - same | 896-ball FBGA (F31, 31 mm) - same | 896-ball FBGA (F31, 31 mm) - same |
| Logic Elements | 149,760 | 149,760 (identical) | 149,760 (identical) | 109,424 (-27%) | 109,424 (-27%) | 149,760 (identical) |
| Speed Grade | C8 (commercial, fast) | C7 (commercial, slower) | C7 (commercial, slower) | C8 (commercial, fast) | C7 (commercial, slower) | C8 (commercial, fast) |
| Transceivers | 8 ch @ up to 3.125 Gbps | 8 ch @ up to 3.125 Gbps | 8 ch @ up to 3.125 Gbps | 8 ch @ up to 3.125 Gbps | 8 ch @ up to 3.125 Gbps | 8 ch @ up to 3.125 Gbps |
| Embedded Memory (bits) | 6,635,520 | 6,635,520 | 6,635,520 | 4,838,400 (-27%) | 4,838,400 (-27%) | 6,635,520 |
| User I/O | 475 | 475 | 475 | 475 (same) | 475 (same) | 475 |
| Lead-Free / RoHS | RoHS compliant | RoHS compliant | RoHS / Pb-free (N suffix) | RoHS compliant | RoHS compliant | RoHS / Pb-free (N suffix) |
| Approx Unit Price (qty 1, USD) | 185.00 | 160.00 - 170.00 (est., ~10% lower) | 165.00 - 175.00 (est.) | 130.00 - 145.00 (est., lower density) | 115.00 - 130.00 (est.) | 190.00 - 200.00 (est.) |
Key Differentiators
- Higher density than EP4CGX110 within the same F31 footprint (vs EP4CGX110DF31C8)
- Faster C8 speed grade over C7 alternatives (vs EP4CGX150DF31C7)
- Eight 3.125 Gbps transceiver channels in the F31 package (vs EP4CGX150CF23C8)
- Hard PCI Express Gen1 IP block (vs Cyclone IV E family (EP4CE115F29C8N))
Design Notes
The F31 896-ball FineLine BGA requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for reliable assembly. Use microvia-in-pad or dog-bone fan-out to escape the inner balls; full-stack microvia-in-pad is preferred for transceiver signal integrity. Reference Intel Cyclone IV GX device handbook chapter 5 for the recommended footprint, ball-to-pad mapping and PCB stack-up guidance. Maintain a continuous ground plane under the BGA and stitch vias around the outer ring for impedance continuity.
Cyclone IV GX transceivers require dedicated VCC_PLL, VCCA_PLL, VCC_TX_PLL and VCC_RX_PLL rails with separate ferrite-bead isolation from the digital 1.2 V VCCINT supply. Provide bulk 220 uF tantalum or polymer capacitors near each transceiver bank and 0.1 uF + 0.01 uF ceramic decoupling within 2 mm of every supply pin. Power sequencing must follow the order documented in the device handbook or inrush current can exceed the recommended 100 mA/us slew rate.
Estimated: at full utilization of 8 transceiver channels plus 75% logic toggling on the 60 nm die, the EP4CGX150DF31C8 dissipates approximately 2.5-3.5 W in commercial ambient. The 31 mm FBGA has a typical theta_JA of 14-16 C/W with a 4-layer JEDEC test board, giving a junction-to-ambient rise of roughly 35-50 C. A small copper heat-spreader or 4-layer PCB with stitched thermal vias under the central BGA balls is recommended for fan-less enclosures. For industrial variants operating up to +100C ambient, derate by 25% on transceiver utilization.
Transceiver channel placement is constrained - consult the Cyclone IV GX handbook channel map before committing pin assignments. Maintain 100 ohm differential impedance on the AC-coupled transceiver pairs and avoid routing them across plane splits. Use IBIS-AMI models from Intel for channel simulation; pre-emphasis and equalisation settings are tuned in Quartus via the Transceiver Toolkit. DC blocking capacitors of 100 nF are required on every transceiver TX/RX pair and should be placed within 2 mm of the FPGA ball.
Do not confuse the F31 896-ball BGA with the smaller F23 484-ball BGA when ordering - they are NOT pin-compatible. The C8 speed grade suffix is mandatory if your design relies on the published Fmax figures; the cheaper C7 grade has roughly 10% lower Fmax. Always specify the N suffix (e.g. EP4CGX150DF31C8N) for new designs to ensure lead-free / RoHS compliance with EU directives. Confirm configuration mode (AS, PS, FPP, JTAG) is correctly jumpered on the board before first power-up to avoid bricking the configuration flash.
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - this is a commercial-grade FPGA; industrial variants are available with I-suffix temperature grades but are not automotive-qualified. Halogen-free status not explicitly stated in the verified data and is marked unknown.
