Intel

EP4CGX110DF31C7 - Cyclone IV GX FPGA, 109K LEs, 896-FBGA | Intel

MPN: EP4CGX110DF31C7 ✓ Active
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1.2 V Vdss 896-FBGA Package 7 Speed 5490 Kbits (M9K blocks) Memory
From $264.01 USD / Unit
MOQ: 1 |
Price updated: 2026-09-09
Volume Pricing
Qty Unit Price Extended
1 $440.02 $440.02
10 $396.02 $3,960.20
50 $352.02 $17,601.00
100 $308.01 $30,801.00
500 $264.01 $132,005.00
ℹ️ All prices are in USD

EP4CGX110DF31C7 Overview

The Intel EP4CGX110DF31C7 is a Cyclone IV GX Field Programmable Gate Array delivering 109,424 logic elements, 5,621,760 system gates, and 475 user I/O pins in a 896-ball FineLine BGA (FBGA) package. Built on a 60 nm low-power process, it integrates up to 8 transceiver channels at 3.125 Gbps, embedded multipliers, and 5490 Kbits of embedded memory.

An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the engineer can re-program in-system to implement custom digital logic. Within the broader taxonomy, FPGAs sit under programmable logic devices (PLDs) -> logic ICs -> integrated circuits. Cyclone IV GX devices specifically target cost-sensitive, transceiver-equipped applications, sitting in the low-to-mid density tier below Cyclone V and Stratix families.

Key features include 56 (18x18) embedded multipliers for DSP acceleration, 4 PLLs for clock management, and 8 high-speed transceivers supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and other serial protocols up to 3.125 Gbps. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, allowing live insertion into backplanes.

Architecturally, the Cyclone IV GX family uses a 4-input LUT-based logic element fabric with column- and row-based interconnect, dedicated memory blocks (M9K) of 9 Kbits each, and dedicated DSP blocks. The 60 nm process and 1.2 V core operation deliver low static and dynamic power compared to the prior Cyclone III generation, making this family suitable for power-budgeted designs.

Typical applications include industrial video processing and machine vision, motor control and factory automation, wireline communication line cards, PCIe Gen1 endpoint cards, low-cost software-defined radio, and automotive driver assistance. The combination of transceivers, DSP blocks, and a rich logic fabric makes the EP4CGX110DF31C7 a versatile workhorse for cost-sensitive mid-density designs.

When designing with this FPGA, plan power sequencing for the 1.2 V core, 2.5 V/3.3 V analog PLL, and I/O bank supplies separately. Use Quartus II / Quartus Prime for synthesis and place-and-route. Provide adequate thermal relief on the FBGA land pattern and follow Intel's PCB layout guidelines for transceiver channel integrity.

This page synthesizes distributor pricing, same-family alternatives (EP4CGX110DF27C7, EP4CGX110CF23C7), cross-brand pin-compatible parts, and practical Quartus design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for EP4CGX110DF31C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX110DF31C7 (same form factor and footprint) — differing in Speed Grade, Package, Embedded Memory, Family, Logic Elements.

Intel
Speed Grade: C6
Package: 896-ball FBGA (F31)
Embedded Memory: 5,621,760 bits
Compare with EP4CGX110DF31C7 →
Intel
Speed Grade: C7 (commercial)
Package: 896-ball FBGA (F31)
Logic Elements: 109,424
Compare with EP4CGX110DF31C7 →
Intel
Package: 896-FBGA, 31 mm x 31 mm, 1 mm pitch
Embedded Memory: 5,621,760 bits (M9K blocks)
Family: Cyclone IV GX (EP4CGX110)
Compare with EP4CGX110DF31C7 →
Intel
Speed Grade: 8 (commercial)
Logic Elements: 149,760
Compare with EP4CGX110DF31C7 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX110DF31C6N

✅ Drop-In
Intel
📦 896-FBGA (F31)
Cyclone IV GX · 109,424 · 5,621,760 bits · 475 · 156 · 4 · Up to 8 · Up to 3.125 Gbps

✓ In Stock

$175 / Unit

View Datasheet →
ℹ️ 3 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP4CGX110DF31C7 Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Series EP4CGX110
Logic Elements (LEs) 109,424
System Gates 5,621,760
User I/O Pins 475
Embedded Memory 5490 Kbits (M9K blocks)
Embedded Multipliers (18x18) 56
Transceiver Channels 8
Max Transceiver Data Rate 3.125 Gbps
PLLs 4
Core Voltage 1.2 V
Process Technology 60 nm
Package 896-FBGA
Mounting Type Surface Mount
Speed Grade 7

EP4CGX110DF31C7 896-fbga Pin Configuration Guide

Pin configuration for EP4CGX110DF31C7 (896-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

896-fbga package pinout diagram for EP4CGX110DF31C7

No detailed pinout data available for EP4CGX110DF31C7.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX110DF31C7 is suitable for 6 applications: Industrial Machine Vision & Video Processing, PCI Express Gen1 Endpoint Cards, Motor Control & Factory Automation, Wireline Communication Line Cards, Software-Defined Radio Baseband, Automotive Driver Assistance (ADAS) Pre-Processing.

🎥

Industrial Machine Vision & Video Processing

The EP4CGX110DF31C7 fits industrial machine vision because 109,424 LEs and 56 (18x18) hardware multipliers sustain real-time pixel pipelines for GigE Vision, CoaXPress, and Camera Link HS aggregation. The 5490 Kbits of M9K embedded memory buffer line-scan and area-scan frames without external SRAM, while 475 user I/O accommodate parallel CMOS sensors, LVDS serializer/deserializer interfaces, and HDMI/DVI outputs. Performance consideration: at typical 148.5 MHz pixel clock on a 1080p60 pipeline, the FPGA consumes ~2-3 W dynamic power with the 1.2 V core; the FBGA package theta-JA of approximately 12 C/W keeps the junction well below 100 C in normal factory-floor ambient.

🖥️

PCI Express Gen1 Endpoint Cards

The EP4CGX110DF31C7 is widely used in PCIe Gen1 endpoint cards because it includes 8 built-in transceiver channels up to 3.125 Gbps with hard PCIe IP blocks per the Cyclone IV GX datasheet. The 109K LEs implement custom endpoint logic, DMA engines, and protocol accelerators while the hard PCIe block handles the PHY and link layer with minimal soft logic overhead. Performance consideration: a x1 Gen1 link delivers 250 MB/s in each direction; a x4 Gen1 link delivers ~1 GB/s aggregate. The 475 user I/O are sufficient for downstream local bus interfaces (parallel DDR2, LVDS, GPIO) to companion ASICs or FPGAs.

🏭

Motor Control & Factory Automation

The EP4CGX110DF31C7 fits motor control and factory automation because its 4 PLLs generate precise PWM frequencies for multi-axis servo drives, while 475 user I/O connect to encoder feedback (QEP), Hall sensors, and resolver-to-digital converters. The hardware multipliers accelerate field-oriented control (FOC) and Park/Clarke transforms in the current loop at sub-microsecond latency. Performance consideration: at 100 MHz system clock with 4 axes of FOC at 32 kHz PWM, the FPGA core draws ~1.5 W. The industrial temperature-grade variant (suffix I7N) operates from -40 C to +100 C ambient suitable for cabinet-mounted drives.

🌐

Wireline Communication Line Cards

The EP4CGX110DF31C7 supports wireline line cards because its 8 transceivers handle 1G/2.5G Ethernet, Serial RapidIO, and CPRI links to baseband or framer ASICs. The 109K LEs implement link-layer aggregation, packet classification, and traffic management while the 5490 Kbits of embedded memory serves as on-chip buffer for packet scheduling. Performance consideration: the 896-FBGA exposes the full transceiver count and all I/O banks required for redundant SFP/SFP+ cage interfaces plus backplane SERDES links. Hard PCS and PMA blocks minimize soft logic and timing closure risk on multi-lane designs.

📡

Software-Defined Radio Baseband

The EP4CGX110DF31C7 fits software-defined radio baseband because 56 (18x18) hardware multipliers accelerate FFT/iFFT and channelization filters, while 8 transceivers digitize IF signals up to 3.125 Gbps from ADC/DAC front-ends. The 5490 Kbits of M9K memory hold FFT twiddle tables and channelizer coefficient banks on-chip. Performance consideration: a 64-point complex FFT at 200 MHz sample rate fits in ~30K LEs and runs in ~3 us latency. The 1.2 V core at 60 nm keeps dynamic power under 3 W for typical SDR waveforms.

🚗

Automotive Driver Assistance (ADAS) Pre-Processing

The EP4CGX110DF31C7 suits ADAS pre-processing because it aggregates multiple camera streams via LVDS, performs object detection pre-filters in hardware, and forwards annotated frames to a downstream processor via PCIe. The 475 user I/O accommodate 4-6 parallel camera interfaces plus automotive Ethernet MAC interfaces. Performance consideration: AEC-Q100 qualification is NOT specified for this commercial-speed-grade part; for AEC-Q100-qualified applications, choose an automotive-qualified Cyclone IV GX variant (EP4CGX110 part numbers with automotive suffix per Intel's product family ordering guide). The 1.2 V core and 60 nm process deliver low standby current suitable for always-on ADAS subsystems.

What is the logic element count of EP4CGX110DF31C7?
The EP4CGX110DF31C7 contains 109,424 logic elements per the DigiKey listing. According to Intel's Cyclone IV GX datasheet, this corresponds to a system gate count of approximately 5.6 million, placing the part in the mid-density Cyclone IV tier between EP4CGX75 and EP4CGX150. The LEs are organized into logic array blocks (LABs) of 16 LEs each, connected by a multi-level interconnect network.
How many transceivers does EP4CGX110DF31C7 have?
The EP4CGX110DF31C7 integrates 8 high-speed transceiver channels operating up to 3.125 Gbps per the Intel Cyclone IV GX family datasheet. These transceivers support PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, SDI, and CPRI protocols. Channel placement is fixed per package; the 896-FBGA exposes the maximum transceiver count in this family.
What package does EP4CGX110DF31C7 use?
The EP4CGX110DF31C7 ships in a 896-ball FineLine BGA (FBGA) package per the DigiKey catalog. The FBGA provides 475 user I/O pins plus the high-speed transceiver balls and configuration pins. Designers should follow Intel's thermal and PCB layout guidelines for large BGA packages, including microvia stack-ups and via-in-pad recommended practices.
Where can I buy EP4CGX110DF31C7 online?
The EP4CGX110DF31C7 can be purchased through authorized distributors including DigiKey (SKU 2288455-1-ND), Mouser, Heisener, and LCSC, with current unit pricing of approximately $440.02 (qty 1) as of 2026-09-10. Heisener reports 2,832 pieces in stock with lead time to be confirmed. Intel's official product page lists the part under the Cyclone IV GX EP4CGX110 family.
What is the price of EP4CGX110DF31C7?
The EP4CGX110DF31C7 is priced at $440.02 per unit at qty 1 as of 2026-09-10, per Heisener listing. Octopart aggregates pricing across 1 active distributor for this part. Volume discounts apply at 10+ units (~$396), 50+ (~$352), and 100+ (~$308). Pricing is quote-only for high-volume orders; contact distributors for OEM contracts.
What is the lead time for EP4CGX110DF31C7?
The lead time for EP4CGX110DF31C7 is listed as "To be Confirmed" by Heisener with estimated delivery of Jul 20 - Jul 25 from order date as of 2026-09-10. DigiKey and Mouser typically quote shorter lead times for stocked parts. Lead times can extend during allocation periods; request a firm quote before committing to a production schedule.
Is EP4CGX110DF31C7 in stock right now?
Heisener reports 2,832 pieces in stock of EP4CGX110DF31C7 as of 2026-09-10. DigiKey, Mouser, and LCSC maintain distribution stock with real-time availability check recommended before placing a purchase order. For high-volume production needs (1000+ units), contact Intel authorized distributors for direct allocation rather than depending on distributor shelf stock.
EP4CGX110DF31C7 vs EP4CGX110DF27C7 - which is better?
The EP4CGX110DF31C7 (896-FBGA, F31 package) and EP4CGX110DF27C7 (672-FBGA, F27 package) share the same Cyclone IV GX EP4CGX110 die with identical 109,424 LEs and 8 transceivers. The DF31 variant exposes more user I/O (475 vs ~310) and is the larger-package option; the DF27 trades I/O count for a smaller PCB footprint. Choose DF31 for I/O-rich designs and DF27 for space-constrained boards.
EP4CGX110DF31C7 vs EP4CGX110CF23C7 - what is the difference?
The EP4CGX110DF31C7 is the F31-package (896-FBGA) speed grade 7 industrial variant, while the EP4CGX110CF23C7 is the F23-package (484-FBGA) speed grade 7 commercial variant. Both share the same EP4CGX110 silicon die with 109K LEs and 8 transceivers. The F23 package exposes fewer user I/O pins (around 290) but offers a smaller PCB area, while F31 maximizes I/O. Both are drop-in on the same logic fabric and software model.
What is the best drop-in replacement for EP4CGX110DF31C7?
The best drop-in replacement for EP4CGX110DF31C7 is EP4CGX110DF31C6N or EP4CGX110DF27C7N from the same Cyclone IV GX EP4CGX110 family, sharing the same logic, memory, multiplier, and transceiver resources. Both use the same Quartus Prime software flow with no IP recompile required. For I/O-rich 896-ball designs, the DF31 variant is preferred; for footprint-constrained designs, the DF27 variant is the canonical alternative.
Can EP4CGX110DF31C7 replace EP4CGX110DF27C7 in my design?
Yes, the EP4CGX110DF31C7 can functionally replace the EP4CGX110DF27C7 with the same 109,424 LEs and 8 transceivers, but the package is larger (896-FBGA vs 672-FBGA) so PCB land-pattern rework is required. Both parts share the same Quartus Prime design flow and pinout within shared I/O banks. This is a software-compatible but not board-compatible migration - choose the package based on PCB capacity, not pure silicon equivalence.
Where to download EP4CGX110DF31C7 datasheet PDF?
The EP4CGX110DF31C7 datasheet PDF can be downloaded from Intel's official product page at https://www.altera.com/products/fpga/cyclone/iv/gx/ep4cgx110-f31/EP4CGX110DF31C7, or from the LCSC datasheet mirror at https://www.lcsc.com/datasheet/C1553601.pdf. The Cyclone IV GX device family datasheet covers all density/package/speed-grade combinations and is the canonical reference document.
Where can I find the EP4CGX110DF31C7 pinout?
The EP4CGX110DF31C7 pinout (896-ball FBGA ball map with transceiver and I/O bank assignments) is documented in chapter 6 of the Cyclone IV GX device handbook PDF on Intel's website. Use the Pin-Out File (.pin) and CSV exports in Quartus Prime's Pin Planner for software-driven pin assignment. The 896-FBGA ball pitch and ball matrix dimensions are specified in the package specifications chapter.
Hey Google, what can replace EP4CGX110DF31C7?
The EP4CGX110DF31C7 can be replaced by the same-family EP4CGX110DF31C6N (speed grade 6), EP4CGX110DF27C7N (smaller package), or EP4CGX110CF23C7N (smaller FBGA, fewer I/O) per the Intel Cyclone IV GX datasheet. Cross-brand equivalents in the same density tier include Xilinx Spartan-6 LX150T and Lattice ECP3-150, which require new PCB design due to package and pinout differences - not drop-in replacements.
What are the key specifications of EP4CGX110DF31C7 that engineers should know?
The EP4CGX110DF31C7 key specifications include 109,424 logic elements, 5.6 M system gates, 475 user I/O, 8 transceiver channels at 3.125 Gbps, 5490 Kbits embedded memory, 56 (18x18) multipliers, 4 PLLs, 60 nm process, 1.2 V core, and 896-FBGA package per the Intel Cyclone IV GX datasheet. Speed grade is 7 (commercial); industrial variants share the same part number prefix.
Is EP4CGX110DF31C7 suitable for industrial video processing?
Yes, the EP4CGX110DF31C7 is well-suited for industrial video processing: the 56 (18x18) hardware multipliers and 5490 Kbits of M9K memory support real-time pixel pipelines, while 8 transceivers at 3.125 Gbps handle Camera Link HS, CoaXPress, or GigE Vision aggregation. The 475 user I/O pins accommodate parallel CMOS image sensor interfaces and HDMI/DVI output channels.

Engineering reference data for EP4CGX110DF31C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CGX110DF31C7 when your design requires the maximum user I/O (475 pins) and full 8-channel 3.125 Gbps transceiver exposure in the Cyclone IV GX EP4CGX110 family - it is the I/O-richest member of its density tier and the only package that exposes every transceiver channel. Select EP4CGX110DF31C6N instead for cost-sensitive designs where ~10% lower Fmax is acceptable. For PCB-area-constrained designs, migrate to EP4CGX110DF27C7N (672-FBGA, ~310 I/O) or EP4CGX110CF23C7N (484-FBGA, ~290 I/O) - same silicon die and Quartus Prime flow, but smaller ball grid. For higher-density needs, step up to the EP4CGX150 family; for non-transceiver applications, drop to the lower-cost Cyclone IV E EP4CE series.

Comparison with Alternatives

Parameter This Product EP4CGX110DF31C6N EP4CGX110DF27C7N EP4CGX110CF23C7N EP4CGX110DF27C8N
Brand Intel Intel Intel Intel Intel
Package 896-FBGA (F31) 896-FBGA (F31) - same 672-FBGA (F27) - smaller 484-FBGA (F23) - smaller 672-FBGA (F27) - smaller
Logic Elements 109,424 109,424 - same 109,424 - same 109,424 - same 109,424 - same
User I/O Pins 475 475 - same ~310 - smaller package ~290 - smaller package ~310 - smaller package
Transceiver Channels 8 8 - same 8 - same 8 (limited package balls) 8 - same
Embedded Multipliers 56 (18x18) 56 - same 56 - same 56 - same 56 - same
Speed Grade 7 6 (slower) 7 - same 7 - same 8 (faster)
Core Voltage 1.2 V 1.2 V - same 1.2 V - same 1.2 V - same 1.2 V - same

Key Differentiators

  • Maximum user I/O count in the EP4CGX110 family (vs EP4CGX110DF27C7N)
  • Maximum transceiver count exposed (vs EP4CGX110CF23C7N)
  • Speed grade 7 sweet spot for cost/performance (vs EP4CGX110DF31C8N)

Design Notes

Cyclone IV GX EP4CGX110 devices require four separate supply rails: 1.2 V core (VCCINT), 2.5 V analog PLL (VCCA_PLL), 1.2 V transceiver supply (VCCH_GXB), and per-bank I/O voltages (VCCIO) typically 1.2 V-3.3 V. Power sequencing must follow Intel's reference: VCCINT must rise before VCCA_PLL and VCCH_GXB by no more than 200 ms per the Cyclone IV GX handbook. Estimated: a fully-utilized EP4CGX110 with all 8 transceivers active at 3.125 Gbps draws ~3-4 W total power; derate for industrial temperature envelope. Use Intel's PowerPlay Early Power Estimator (EPE) spreadsheet before finalizing the power tree.

The 896-FBGA FineLine BGA package requires a microvia PCB stack-up (e.g., 1+N+1 with 4-mil laser vias and 8-mil capture pads) to fan out the 1.0 mm pitch balls. Estimated: trace escape routing requires at least 6 routing layers for the BGA plus 2-4 additional layers for high-speed transceiver channels. Place AC-coupling capacitors within 200 mils of each transceiver TX/RX ball pair per Intel's Cyclone IV GX PCB layout guidelines. Use 100-ohm differential routing for all 8 transceiver channels with length matching to within 5 mils intra-pair and 50 mils inter-pair.

Do NOT use EP4CGX110DF31C7 (commercial speed grade) in automotive applications without AEC-Q100 qualification - the part does not carry automotive-grade certification per Intel's product ordering guide. For AEC-Q100 needs, select the industrial temperature variant (EP4CGX110DF31I7N) only as a prototype step and confirm AEC-Q100 status with Intel FAE before production. Common configuration pitfall: failing to drive nCONFIG high after power-up completion leaves the FPGA in reset state with all I/O tri-stated. Verify CONF_DONE signal behavior in your schematic review.

Estimated: the 896-FBGA package has a typical theta-JA of approximately 12 C/W with standard 1 oz copper and adequate airflow. At 3 W total power dissipation, the junction temperature rises ~36 C above ambient, giving a 100 C junction at 64 C ambient. For industrial enclosures without forced airflow, drop to speed grade 6 (EP4CGX110DF31C6N) to reduce dynamic power by 20-30% or implement thermal throttling in firmware via temperature-sense diodes built into the FPGA.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS, REACH, lead-free, and halogen-free status not in verified web data and marked unknown. AEC-Q100 NOT qualified per commercial speed-grade designation; for automotive applications consult Intel FAE for AEC-Q100-qualified part numbers.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP4CGX110DF31C7 EP4CGX110DF31C6N EP4CGX110DF27C7N EP4CGX110CF23C7N EP4CGX110DF27C8N Cyclone IV GX FPGA Field Programmable Gate Array PLD Programmable Logic Device logic element LE LAB logic array block embedded multiplier DSP block M9K memory PLL transceiver PCI Express Gen1 Gigabit Ethernet Serial RapidIO CPRI 896-FBGA FineLine BGA FBGA BGA package 60 nm process 1.2 V core AEC-Q100 RoHS REACH Quartus Prime Quartus II Pin Planner PowerPlay EPE industrial machine vision GigE Vision Camera Link HS software-defined radio motor control factory automation PCIe endpoint card
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