EP4CGX150DF31C8N - Cyclone IV GX FPGA, 150K LEs, 8 Transceivers | Intel
MPN: EP4CGX150DF31C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $210 | $210,000.00 |
EP4CGX150DF31C8N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as memory, DSP slices, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices (PLDs) within the semiconductor hierarchy (PLD -> FPGA -> SRAM-based FPGA -> Cyclone series). Unlike fixed-function ASICs, FPGAs are reprogrammed in the field to implement custom digital logic, parallel processing pipelines, or hardware-accelerated functions. The Cyclone IV GX family specifically targets applications that need integrated transceivers without the power or cost of higher-end Stratix-class devices.
Key features of the EP4CGX150DF31C8N include 8 transceiver channels supporting data rates up to 3.125 Gbps, 360 multipliers (18x18) for DSP operations, 8 PLLs for clock management, and support for external memory interfaces including DDR2, DDR3, LPDDR2, and QDRII+. The device operates from a 1.2 V core supply with hot-socketing capability, allowing board-level insertion into a live backplane without damage.
Architecturally, the EP4CGX150DF31C8N uses a 60 nm SRAM-based logic fabric with 8-input ALMs (Adaptive Logic Modules), 9 Kbit M9K memory blocks, and dedicated transceiver physical coding sublayer (PCS) and physical medium attachment (PMA) blocks. This combination allows simultaneous implementation of parallel DSP dataplanes and high-speed serial links such as PCIe Gen1, SATA, GigE, CPRI, or custom serial protocols.
Typical applications include industrial video processing, motor control and drive interfaces, low-cost wireless backhaul baseband, PCI Express endpoint designs, and industrial control planes with deterministic timing. The 8 transceiver channels make this device particularly attractive for designs requiring multiple high-speed serial links without an external PHY.
When designing with this FPGA, account for the FBGA-672 ball pitch (1.0 mm) and use at least 6 PCB layers with microvia or via-in-pad technology to break out the inner balls. Power sequencing between the 1.2 V core, 2.5 V/3.3 V aux, and 1.2 V/3.3 V transceiver supplies must follow the Intel Cyclone IV GX handbook to avoid latch-up.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB/thermal design notes that are not aggregated on the manufacturer datasheet alone.
Drop-in alternatives for EP4CGX150DF31C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX150DF31C8N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, RoHS Status, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4CGX150DF31C8
✅ Drop-In✓ In Stock
$102 / Unit
View Datasheet →EP4CGX150DF31C7N
✅ Drop-In✓ In Stock
$198.45 / Unit
View Datasheet →EP4CGX150DF31C7
✅ Drop-In✓ In Stock
$218.4 / Unit
View Datasheet →EP4CGX150DF31C8N Maximum Ratings & Electrical Characteristics
| Device Family | Cyclone IV GX |
| Logic Elements | 149,760 |
| Embedded Memory | 6,635,520 bits |
| Number of Logic Array Blocks (LABs) | 11,735 |
| User I/O Pins | 475 |
| Transceiver Channels | 8 |
| Max Transceiver Data Rate | 3.125 Gbps |
| Multipliers (18x18) | 360 |
| PLLs | 8 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package | FBGA-672 (F31) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP4CGX150DF31C8N fbga-672 (f31) Pin Configuration Guide
Pin configuration for EP4CGX150DF31C8N (fbga-672 (f31) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4CGX150DF31C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4CGX150DF31C8N is suitable for 6 applications: Industrial Video Processing Pipeline, PCI Express Gen1 Endpoint, Motor Control and Servo Drive Interface, Low-Cost Wireless Baseband / Backhaul, Test and Measurement Instrumentation, Industrial Control Plane / Protocol Bridging.
Industrial Video Processing Pipeline
The EP4CGX150DF31C8N fits industrial video processing pipelines because its 149,760 logic elements and 360 18x18 multipliers provide the parallel throughput required for HD or multi-stream SD video scaling, deinterlacing, and color-space conversion. Its 6,635,520 bits of embedded M9K memory serve as line buffers and frame caches, while the 8 integrated transceiver channels support Camera Link HS or coaxial HD-SDI transport. Placed on a multi-layer PCB with DDR2/DDR3 external memory, the FPGA can implement a complete multi-channel video processing engine at lower cost than Stratix-class devices, while staying within the 0C to +85C commercial operating range.
Recommended
PCI Express Gen1 Endpoint
The EP4CGX150DF31C8N is well-suited to implement a PCIe Gen1 endpoint (x1, x2, or x4) using its integrated 3.125 Gbps transceivers and Cyclone IV GX hard IP block. With 149,760 logic elements and 360 multipliers, the device can implement a PCIe protocol engine plus application logic such as DMA, protocol bridging, or protocol-aware acceleration. The FBGA-672 package exposes all required PCIe lanes, reference clocks, and sideband signals needed for a Gen1 root-complex or endpoint design, while the 1.2 V core keeps total power well below comparable Stratix implementations.
Recommended
Motor Control and Servo Drive Interface
The EP4CGX150DF31C8N is a strong fit for industrial motor control and servo drives because its 360 18x18 multipliers and parallel fabric accelerate Field-Oriented Control (FOC) math, space-vector PWM, and encoder feedback decoding. The 475 user I/Os handle multiple encoder inputs (incremental, SSI, EnDat, Hiperface), GPIO, and gate-driver interfaces, while the 8 transceivers support industrial backplane protocols such as SERCOS or EtherCAT on the same board. The 1.0 mm-pitch FBGA-672 package fits a compact drive module PCB, and the 0C to +85C commercial temperature grade covers most factory-floor environments.
Recommended
Low-Cost Wireless Baseband / Backhaul
The EP4CGX150DF31C8N targets small-cell, picocell, and microwave-backhaul baseband where 8 integrated 3.125 Gbps transceivers drive CPRI, OBSAI, or custom digital-IF links to the radio unit. Its 149,760 logic elements and 360 DSP multipliers implement the PHY-layer baseband processing (channelization, pulse shaping, crest-factor reduction) for LTE or proprietary waveforms. The 6,635,520-bit embedded memory buffers I/Q samples between antenna and modem chipsets, while the 8 PLLs generate the multiple clock domains required by RF front-end converters.
Recommended
Test and Measurement Instrumentation
The EP4CGX150DF31C8N suits bench-top and modular test equipment where its 8 transceivers drive high-speed digitizer-to-processor links, and its 149,760 logic elements implement real-time DSP such as FFTs, digital filtering, and trigger logic. The 6,635,520 bits of M9K memory buffer ADC sample streams and reference waveforms, while the 360 multipliers accelerate FIR/IIR filter taps. The 1.2 V core voltage keeps thermal design manageable in dense instrument enclosures, and the FBGA-672 package supports integration with DDR2/DDR3 sample storage and LVDS/LVPECL trigger interfaces.
Recommended
Industrial Control Plane / Protocol Bridging
The EP4CGX150DF31C8N is a strong choice for protocol bridging between industrial networks such as PROFINET, EtherNet/IP, EtherCAT, Modbus TCP, and CAN, leveraging its 8 transceivers for multi-port industrial Ethernet switches and its rich fabric for deterministic protocol stacks. The 475 user I/Os accommodate multiple isolated fieldbus ports, while the embedded memory supports buffering of telegrams and distributed clock synchronization. The 0C to +85C operating temperature and 1.0 mm-pitch FBGA package enable integration into DIN-rail or modular I/O controllers without requiring external PHYs.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX150DF31C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX150DF31C8 | EP4CGX150DF31C7N | EP4CGX150DF31C7 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-672 (F31) | FBGA-672 (F31) - same | FBGA-672 (F31) - same | FBGA-672 (F31) - same |
| Logic Elements | 149,760 | 149,760 (same die) | 149,760 (same die) | 149,760 (same die) |
| Embedded Memory | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits |
| User I/Os | 475 | 475 | 475 | 475 |
| Transceivers | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps |
| Multipliers (18x18) | 360 | 360 | 360 | 360 |
| Speed Grade | C8 | C8 | C7 (~12% lower Fmax) | C7 (~12% lower Fmax) |
Key Differentiators
- Same F31 FBGA-672 footprint, lower speed grade (vs EP4CGX150DF31C7N)
- Same die, finish/lead-free designation difference (vs EP4CGX150DF31C8)
- Cyclone IV GX family with 8 integrated transceivers (vs EP4CE75F29C8N (Cyclone IV E, no transceivers))
Design Notes
The FBGA-672 (F31) package uses a 1.0 mm ball pitch with staggered rows, requiring at least 6 PCB layers and microvia technology (laser-drilled vias) for clean fan-out of inner balls. Use via-in-pad with filled-and-capped vias for transceiver and high-speed clock balls to reduce inductance. Maintain continuous reference planes under the device for all transceiver and DDR signals, and follow the Cyclone IV GX PCB layout guidelines for 100-ohm differential transceiver routing.
The EP4CGX150DF31C8N requires multiple supply rails (1.2 V core, 2.5 V/3.3 V auxiliary, 1.2 V/3.3 V transceiver, plus VCC_PLL and VCC_CLKIN). Power sequencing per the Cyclone IV GX device handbook is required to avoid latch-up: VCCINT must ramp before or with VCCAUX. Use the Altera/Intel PowerPlay Early Power Estimator (EPE) to budget decaps and regulator current before schematic freeze; typical designs draw 1.5-3 A from the 1.2 V core at full utilization.
At high utilization the EP4CGX150DF31C8N can dissipate 3-6 W, which on the FBGA-672 package translates to a theta_JA around 14-17 C/W with adequate PCB copper. Provide at least 1 square inch of unbroken top-side copper connected to the central ground balls to keep junction temperature below 85C at 70C ambient. Forced airflow is recommended for closed industrial enclosures.
Cyclone IV GX transceivers are specified at 3.125 Gbps with strict AC-coupling requirements: a 0.1 uF AC-coupling capacitor must be placed within 0.5 inches of each serial link ball, with the cap tied to the transmitter side of the channel. Match differential impedance to 100 ohms with intra-pair skew under 5 ps and reference plane continuity across the entire link. Per the device handbook, reference clocks to the transceivers must be AC-coupled if sourced from an oscillator above 100 MHz.
Compliance Information
RoHS and lead-free compliant per the 'N' suffix in the OPN and the Altera/Intel product page. Cyclone IV GX is not AEC-Q100 qualified; for automotive applications consult the Intel FPGA automotive qualification list. Halogen-free status not explicitly stated in the verified data.
