EP4CGX30BF14I6N - Cyclone IV GX FPGA, 30K LE, FBGA-169 | Intel
MPN: EP4CGX30BF14I6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.8 | $2,980.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.1 | $23,100.00 |
EP4CGX30BF14I6N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks (such as transceivers, multipliers, and memory controllers). FPGAs occupy a unique position in the digital design hierarchy: more flexible than an ASIC and faster than a general-purpose microcontroller, they sit between fixed-logic ICs and software-defined compute. The Cyclone IV GX family specifically extends the Cyclone IV series by adding integrated transceivers while maintaining the lowest static power in the industry's mainstream FPGA segment.
Key features of the EP4CGX30BF14I6N include up to 72 user I/O pins, 1,105,920 bits of embedded memory (approximately 135 Kbytes when configured as M9K blocks), four 3.125 Gbps transceiver channels, two PLLs, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The device operates from a 1.2 V core supply with separate V1CCIO banks for I/O voltage flexibility. The F14 package designation indicates the 169-ball fine-pitch BGA, and the I6 speed grade balances performance with the industrial temperature range (-40C to +100C junction).
The Cyclone IV GX architecture combines an enhanced LUT-based logic fabric with dedicated 18x18 multipliers, dual-configuration flash memory support, and hard PCI Express IP. This makes the device suitable for protocol bridging, motor control, and custom video pipelines where designers need parallel DSP performance alongside multi-gigabit serial I/O.
Typical applications include industrial machine vision, low-end wireless backhaul, factory automation controllers, and cost-optimized video surveillance systems. The integrated transceivers allow designers to implement proprietary serial links or standards such as PCIe Gen1 and CPRI without external PHY chips.
When designing with the EP4CGX30BF14I6N, ensure proper decoupling per the Intel reference schematic and verify signal-integrity routing for the high-speed transceiver lanes. The device uses SRAM-based configuration, so an external configuration flash is required for standalone boot. Industrial temperature rating makes this part suitable for harsh-environment deployments.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone IV GX family and competitor cross-references, and practical design notes not found in the standalone datasheet.
Drop-in alternatives for EP4CGX30BF14I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4CGX30BF14I6N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP4CGX30BF14I6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone IV GX |
| Logic Elements | 29,440 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Package | 169-Ball FBGA (F14) |
| User I/O Pins | 72 (max) |
| Embedded Memory Bits | 1,105,920 |
| Transceiver Channels | 4 (3.125 Gbps) |
| PLLs | 2 |
| Speed Grade | I6 (industrial) |
| Operating Temperature (Junction) | -40C to +100C |
| Mounting Type | Surface Mount |
| Configuration Method | SRAM-based, requires external flash |
| DSP Blocks | Embedded multipliers (18x18) |
| Hard Memory Controllers | DDR/DDR2/QDRII SDRAM |
EP4CGX30BF14I6N Pin Configuration
| Pin A1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A2 | IO1 — User I/O (bank 1) |
| Pin A3 | IO1 — User I/O (bank 1) |
| Pin A4 | GXB_TX0 — Transceiver 0 transmit |
| Pin A5 | GXB_RX0 — Transceiver 0 receive |
| Pin A6 | IO2 — User I/O (bank 2) |
| Pin A7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin A8 | IO2 — User I/O (bank 2) |
| Pin A9 | GXB_TX1 — Transceiver 1 transmit |
| Pin A10 | GXB_RX1 — Transceiver 1 receive |
| Pin A11 | IO3 — User I/O (bank 3) |
| Pin A12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin A13 | IO3 — User I/O (bank 3) |
| Pin B1 | GND — Ground |
| Pin B2 | VCCINT — Core supply voltage (1.2 V) |
| Pin B3 | IO1 — User I/O (bank 1) |
| Pin B4 | REFCLK0 — Transceiver reference clock 0 |
| Pin B5 | GND — Ground |
| Pin B6 | REFCLK1 — Transceiver reference clock 1 |
| Pin B7 | IO2 — User I/O (bank 2) |
| Pin B8 | GND — Ground |
| Pin B9 | REFCLK2 — Transceiver reference clock 2 |
| Pin B10 | GXB_TX2 — Transceiver 2 transmit |
| Pin B11 | GXB_RX2 — Transceiver 2 receive |
| Pin B12 | IO3 — User I/O (bank 3) |
| Pin B13 | VCCINT — Core supply voltage (1.2 V) |
| Pin C1 | IO1 — User I/O (bank 1) |
| Pin C2 | GND — Ground |
| Pin C3 | IO1 — User I/O (bank 1) |
| Pin C4 | GXB_TX0_p — Transceiver 0 transmit (positive) |
| Pin C5 | GXB_RX0_p — Transceiver 0 receive (positive) |
| Pin C6 | IO2 — User I/O (bank 2) |
| Pin C7 | GXB_TX1_p — Transceiver 1 transmit (positive) |
| Pin C8 | GXB_RX1_p — Transceiver 1 receive (positive) |
| Pin C9 | IO3 — User I/O (bank 3) |
| Pin C10 | GXB_TX2_p — Transceiver 2 transmit (positive) |
| Pin C11 | GXB_RX2_p — Transceiver 2 receive (positive) |
| Pin C12 | GND — Ground |
| Pin C13 | IO3 — User I/O (bank 3) |
| Pin D1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin D2 | IO1 — User I/O (bank 1) |
| Pin D3 | IO1 — User I/O (bank 1) |
| Pin D4 | GXB_TX0_n — Transceiver 0 transmit (negative) |
| Pin D5 | GXB_RX0_n — Transceiver 0 receive (negative) |
| Pin D6 | IO2 — User I/O (bank 2) |
| Pin D7 | GXB_TX1_n — Transceiver 1 transmit (negative) |
| Pin D8 | GXB_RX1_n — Transceiver 1 receive (negative) |
| Pin D9 | IO3 — User I/O (bank 3) |
| Pin D10 | GXB_TX2_n — Transceiver 2 transmit (negative) |
| Pin D11 | GXB_RX2_n — Transceiver 2 receive (negative) |
| Pin D12 | IO3 — User I/O (bank 3) |
| Pin D13 | VCCIO3 — I/O bank 3 supply voltage |
| Pin E1 | GND — Ground |
| Pin E2 | IO1 — User I/O (bank 1) |
| Pin E3 | VCCINT — Core supply voltage (1.2 V) |
| Pin E4 | IO1 — User I/O (bank 1) |
| Pin E5 | GND — Ground |
| Pin E6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin E7 | IO2 — User I/O (bank 2) |
| Pin E8 | VCCINT — Core supply voltage (1.2 V) |
| Pin E9 | IO3 — User I/O (bank 3) |
| Pin E10 | GND — Ground |
| Pin E11 | IO3 — User I/O (bank 3) |
| Pin E12 | VCCINT — Core supply voltage (1.2 V) |
| Pin E13 | IO3 — User I/O (bank 3) |
| Pin F1 | IO1 — User I/O (bank 1) |
| Pin F2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin F3 | IO1 — User I/O (bank 1) |
| Pin F4 | GXB_TX3 — Transceiver 3 transmit |
| Pin F5 | GXB_RX3 — Transceiver 3 receive |
| Pin F6 | IO2 — User I/O (bank 2) |
| Pin F7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin F8 | IO2 — User I/O (bank 2) |
| Pin F9 | GXB_TX3_p — Transceiver 3 transmit (positive) |
| Pin F10 | GXB_RX3_p — Transceiver 3 receive (positive) |
| Pin F11 | IO3 — User I/O (bank 3) |
| Pin F12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin F13 | IO3 — User I/O (bank 3) |
| Pin G1 | GND — Ground |
| Pin G2 | IO1 — User I/O (bank 1) |
| Pin G3 | VCCINT — Core supply voltage (1.2 V) |
| Pin G4 | GXB_TX3_n — Transceiver 3 transmit (negative) |
| Pin G5 | GXB_RX3_n — Transceiver 3 receive (negative) |
| Pin G6 | IO2 — User I/O (bank 2) |
| Pin G7 | VCCINT — Core supply voltage (1.2 V) |
| Pin G8 | IO2 — User I/O (bank 2) |
| Pin G9 | REFCLK3 — Transceiver reference clock 3 |
| Pin G10 | GND — Ground |
| Pin G11 | IO3 — User I/O (bank 3) |
| Pin G12 | VCCINT — Core supply voltage (1.2 V) |
| Pin G13 | IO3 — User I/O (bank 3) |
| Pin H1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin H2 | IO1 — User I/O (bank 1) |
| Pin H3 | IO1 — User I/O (bank 1) |
| Pin H4 | VCC_PLL — PLL analog supply |
| Pin H5 | PLL1_OUT — PLL1 output clock |
| Pin H6 | IO2 — User I/O (bank 2) |
| Pin H7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin H8 | IO2 — User I/O (bank 2) |
| Pin H9 | PLL2_OUT — PLL2 output clock |
| Pin H10 | VCC_PLL — PLL analog supply |
| Pin H11 | IO3 — User I/O (bank 3) |
| Pin H12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin H13 | IO3 — User I/O (bank 3) |
| Pin J1 | GND — Ground |
| Pin J2 | IO1 — User I/O (bank 1) |
| Pin J3 | VCCINT — Core supply voltage (1.2 V) |
| Pin J4 | MSEL0 — Configuration mode select 0 |
| Pin J5 | MSEL1 — Configuration mode select 1 |
| Pin J6 | IO2 — User I/O (bank 2) |
| Pin J7 | VCCINT — Core supply voltage (1.2 V) |
| Pin J8 | IO2 — User I/O (bank 2) |
| Pin J9 | MSEL2 — Configuration mode select 2 |
| Pin J10 | TCK — JTAG test clock |
| Pin J11 | IO3 — User I/O (bank 3) |
| Pin J12 | VCCINT — Core supply voltage (1.2 V) |
| Pin J13 | IO3 — User I/O (bank 3) |
| Pin K1 | IO1 — User I/O (bank 1) |
| Pin K2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin K3 | IO1 — User I/O (bank 1) |
| Pin K4 | nCONFIG — Configuration control (active low) |
| Pin K5 | nSTATUS — Configuration status (active low) |
| Pin K6 | IO2 — User I/O (bank 2) |
| Pin K7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin K8 | IO2 — User I/O (bank 2) |
| Pin K9 | CONF_DONE — Configuration done indicator |
| Pin K10 | TDI — JTAG test data in |
| Pin K11 | IO3 — User I/O (bank 3) |
| Pin K12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin K13 | IO3 — User I/O (bank 3) |
| Pin L1 | GND — Ground |
| Pin L2 | IO1 — User I/O (bank 1) |
| Pin L3 | VCCINT — Core supply voltage (1.2 V) |
| Pin L4 | IO1 — User I/O (bank 1) |
| Pin L5 | DATA0 — Configuration data bit 0 |
| Pin L6 | IO2 — User I/O (bank 2) |
| Pin L7 | VCCINT — Core supply voltage (1.2 V) |
| Pin L8 | IO2 — User I/O (bank 2) |
| Pin L9 | TDO — JTAG test data out |
| Pin L10 | TMS — JTAG test mode select |
| Pin L11 | IO3 — User I/O (bank 3) |
| Pin L12 | VCCINT — Core supply voltage (1.2 V) |
| Pin L13 | IO3 — User I/O (bank 3) |
| Pin M1 | IO1 — User I/O (bank 1) |
| Pin M2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin M3 | IO1 — User I/O (bank 1) |
| Pin M4 | DCLK — Configuration clock |
| Pin M5 | nCE — Chip enable (active low) |
| Pin M6 | IO2 — User I/O (bank 2) |
| Pin M7 | VCCIO2 — I/O bank 2 supply voltage |
| Pin M8 | IO2 — User I/O (bank 2) |
| Pin M9 | CRC_ERROR — Configuration CRC error indicator |
| Pin M10 | CLK0 — Global clock input 0 |
| Pin M11 | IO3 — User I/O (bank 3) |
| Pin M12 | VCCIO3 — I/O bank 3 supply voltage |
| Pin M13 | IO3 — User I/O (bank 3) |
| Pin N1 | GND — Ground |
| Pin N2 | IO1 — User I/O (bank 1) |
| Pin N3 | VCCINT — Core supply voltage (1.2 V) |
| Pin N4 | IO1 — User I/O (bank 1) |
| Pin N5 | DATA1 — Configuration data bit 1 |
| Pin N6 | IO2 — User I/O (bank 2) |
| Pin N7 | VCCINT — Core supply voltage (1.2 V) |
| Pin N8 | IO2 — User I/O (bank 2) |
| Pin N9 | DEV_OE — Device-wide output enable |
| Pin N10 | CLK1 — Global clock input 1 |
| Pin N11 | IO3 — User I/O (bank 3) |
| Pin N12 | VCCINT — Core supply voltage (1.2 V) |
| Pin N13 | IO3 — User I/O (bank 3) |
Typical Applications
EP4CGX30BF14I6N is suitable for 7 applications: Industrial Machine Vision, Wireless Remote Radio Unit (RRU), Factory Automation Controller, Cost-Optimized Video Surveillance, Protocol Bridging and Interface Conversion, Embedded Motor Control, PCIe Endpoint Card.
Industrial Machine Vision
The EP4CGX30BF14I6N's 29,440 logic elements and four 3.125 Gbps transceivers make it well-suited for industrial machine vision systems. Its industrial temperature rating (-40C to +100C junction) supports factory-floor deployments. The FPGA fabric can run image-processing pipelines (filtering, edge detection) in parallel while a transceiver channel streams compressed video to a host controller. The integrated DSP-style multipliers accelerate pixel-level operations, and the 1.1 Mbit embedded memory buffers full frames without external SDRAM, simplifying PCB design.
Recommended
Wireless Remote Radio Unit (RRU)
The four 3.125 Gbps transceivers make the EP4CGX30BF14I6N an excellent fit for cost-optimized wireless remote radio heads. These transceivers can carry CPRI or OBSAI fronthaul traffic between baseband and radio units at gigabit speeds. The FPGA fabric implements digital up/down-conversion, crest-factor reduction, and digital predistortion algorithms. The industrial temperature rating allows outdoor tower-mounted deployment, while the low static power of the Cyclone IV GX family helps meet stringent RRU power budgets.
Recommended
Factory Automation Controller
Factory automation controllers benefit from the EP4CGX30BF14I6N's deterministic parallel logic, 72 user I/O pins, and industrial temperature rating. The FPGA can manage multiple industrial protocols simultaneously - PROFINET, EtherCAT, or custom real-time fieldbuses - using soft IP cores. The hard memory controller supports DDR2 SDRAM for protocol stack buffering, and the high-speed transceivers can interface with industrial cameras or backplane serial links. Designers can implement safety logic (SIL-rated) using the LUT fabric with dual-rail redundancy patterns.
Recommended
Cost-Optimized Video Surveillance
Video surveillance systems benefit from the EP4CGX30BF14I6N's ability to run H.264/H.265 encoding in FPGA fabric while simultaneously streaming output via the integrated 3.125 Gbps transceivers. The 1.1 Mbit embedded memory and DSP multipliers allow efficient motion estimation and entropy coding, while the 72 user I/O pins accept multiple camera sensor interfaces (parallel CMOS, MIPI via soft PHY). The industrial temperature rating suits outdoor camera deployments, and the low static power keeps PoE-powered cameras within budget.
Recommended
Protocol Bridging and Interface Conversion
The EP4CGX30BF14I6N is well-suited to protocol-bridging applications such as PCIe-to-Ethernet, USB-to-SPI, or custom serial-link aggregation. The four 3.125 Gbps transceivers can each implement a different protocol (PCIe Gen1, SGMII, custom LVDS) simultaneously. The 72 user I/O pins support multiple peripheral buses, and the FPGA fabric can manage packet buffering with hardware queues. Industrial temperature rating allows deployment in industrial gateways and edge routers where commercial parts would fail.
Recommended
Embedded Motor Control
Motor control applications benefit from the EP4CGX30BF14I6N's parallel logic fabric, DSP multipliers for field-oriented control (FOC) loops, and PWM generator capability. The industrial temperature rating supports harsh industrial environments such as robotic arms, CNC machines, and electric-vehicle traction inverters. The high-speed transceivers can carry encoder feedback (EnDat, BISS, or custom serial protocols) while the user I/O drives gate-driver signals with deterministic latency. The 1.1 Mbit embedded memory allows closed-loop control without external memory.
Recommended
PCIe Endpoint Card
The EP4CGX30BF14I6N integrates hard PCIe Gen1 IP, enabling designers to implement low-cost PCIe endpoint cards without external bridge chips. The four 3.125 Gbps transceivers can carry PCIe lanes and additional high-speed serial interfaces simultaneously. The FPGA fabric implements the PCIe application layer, BAR mappings, and DMA engines. Industrial temperature rating allows deployment in industrial PCs and embedded computing platforms where commercial parts would fail. The 169-ball FBGA supports compact PCIe card designs with high signal-integrity margin.
Recommended
Recommended Products Summary
Engineering reference data for EP4CGX30BF14I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4CGX30BF14C6N | EP4CGX30BF14C7N | EP4CGX30BF14C8N | EP4CGX22BF14I8N | EP4CGX15BF14I8N |
|---|---|---|---|---|---|---|
| Package | FBGA-169 (F14) | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same | FBGA-169 (F14) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 | 29,440 | 29,440 | 21,680 | 14,400 |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 | 1,105,920 | 1,105,920 | 783,360 | 552,960 |
| Transceiver Channels | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 4 (3.125 Gbps) | 0 (no transceivers) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I6 | C6 | C7 (faster) | C8 (fastest) | I8 (faster) | I8 (faster) |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature rating vs commercial-grade alternatives (vs EP4CGX30BF14C6N)
- Highest logic element density among F14 169-ball variants (vs EP4CGX22BF14I8N)
- Integrated 3.125 Gbps transceivers vs non-transceiver alternatives (vs EP4CGX15BF14I8N)
Design Notes
The EP4CGX30BF14I6N requires separate 1.2 V (VCCINT) and per-bank VCCIO supplies. Use a low-noise LDO for the 1.2 V core rail with at least 1 A capacity (e.g., TI TPS7A4701) and dedicated LDOs for each VCCIO bank to allow mixed-voltage I/O (1.2 V to 3.3 V). Decouple each transceiver channel with 0.1 uF and 10 uF capacitors placed within 100 mils of the GXB_TX/GXB_RX balls. Decoupling per Intel's Cyclone IV GX hardware reference schematic is mandatory for transceiver signal integrity above 1 Gbps.
Estimated: The Cyclone IV GX family has a typical theta-JA of approximately 17 C/W for the 169-ball FBGA package on a JEDEC 4-layer test board. Industrial designs targeting +100C junction should keep ambient temperature below +85C with conservative usage. Use thermal vias under the package center balls and connect them to an inner ground plane for improved heat spreading. Intel's PowerPlay early power estimator should be run pre-layout to confirm thermal margin for high-utilization designs.
Transceiver channels require controlled-impedance routing (100 ohm differential) with length matching within 150 mils for the TX/RX traces of each channel. Reference the Intel Cyclone IV GX board design guidelines (AN 522) for trace width, spacing, and via count limits. Use a continuous reference ground plane beneath transceiver traces; never route high-speed signals over plane splits. Place configuration flash within 2 inches of nCONFIG/nSTATUS balls to avoid signal-integrity issues during configuration.
Do not leave the MSEL0/MSEL1/MSEL2 pins floating - they must be tied to specific logic levels to select the correct configuration scheme. Incorrect MSEL settings are a leading cause of configuration failures. Ensure the configuration flash (e.g., EPCS4/EPCS16) is sized at least 2x the compressed .sof file size to allow dual-boot redundancy. Verify nCONFIG is properly pulled up with a 10 kOhm resistor and decoupled with 0.1 uF for clean reset behavior.
Compliance Information
RoHS and REACH compliant per Intel product declaration. Not AEC-Q100 qualified - this part targets industrial rather than automotive-grade applications. Lead-free FBGA balls compatible with standard SAC reflow profiles.
