Intel

EP4CGX30BF14I7N - Cyclone IV GX FPGA, 30K LE, 169-FBGA | Intel

MPN: EP4CGX30BF14I7N ✓ Active
In Stock Ships in 1-3 business days
169-LBGA (FBGA), 14 x 14 mm, 1.0 mm pitch Package 2 Speed 1,105,920 bits Memory
From $69.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-10
Volume Pricing
Qty Unit Price Extended
1 $98.65 $98.65
10 $92.4 $924.00
100 $84.1 $8,410.00
500 $76.55 $38,275.00
1,000 $69.2 $69,200.00
ℹ️ All prices are in USD

EP4CGX30BF14I7N Overview

The Intel (formerly Altera) EP4CGX30BF14I7N is a low-power Cyclone IV GX field-programmable gate array (FPGA) integrating 29,440 logic elements, 1,105,920 bits of embedded memory, and 72 user I/Os in a 169-ball fine-pitch BGA (FBGA-169, 14 x 14 mm, 1.0 mm pitch) package. The device features up to 3.125 Gbps transceiver capability in the GX family, four PLLs, two global clock networks, and 66 embedded 18 x 18 multipliers enabling cost-effective DSP and high-speed serial I/O designs.

An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as multipliers, memory blocks, and (in GX variants) multi-gigabit transceivers. FPGAs sit between discrete logic and ASICs in the design hierarchy - offering ASIC-class performance with mask-charge-free reprogrammability, which makes them ideal for prototyping, low-to-medium volume production, and designs requiring post-deployment logic updates. The Cyclone IV family specifically targets cost- and power-sensitive applications such as industrial control, video bridging, and protocol conversion.

The Cyclone IV GX architecture combines a 60 nm low-power process with hardened PCI Express (x1/x2) and multi-gigabit transceivers (up to 3.125 Gbps), eliminating the need for external PHY chips in many connectivity applications. The device supports LVDS, SSTL, HSTL I/O standards and provides configurable on-chip termination. Hard IP blocks for memory controllers (DDR/DDR2/QDRII) and PCIe Gen1 reduce soft-logic overhead and simplify timing closure.

Typical applications include industrial machine vision and video bridging, factory automation backplanes with Profibus or Ethernet, low-cost PCIe endpoint cards, point-to-point serial-link aggregation, motor control and encoder interfaces, and portable test/measurement equipment. With 66 hardware multipliers and 108 KByte distributed RAM plus 540 Kbits M9K block RAM, the EP4CGX30BF14I7N balances DSP throughput with general logic capacity for mixed control-and-datapath designs.

Design consideration: the FBGA-169 package requires careful PCB stack-up planning - 1.0 mm pitch BGAs demand microvia or via-in-pad technology on standard 4-layer boards. Engineers should also budget for the transceiver reference-clock jitter budget and configure the on-chip PLL modes against the Quartus II / Quartus Prime tool's transceiver toolkit before board bring-up.

Drop-in alternatives for EP4CGX30BF14I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP4CGX30BF14I7N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Transceivers, Embedded Memory.

Intel
Package: 169-LBGA (FBGA-169), 14 mm x 14 mm, F14 outline
Speed Grade: C7 (commercial, -7 speed)
Operating Temperature: 0C to +85C (commercial)
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Intel
Package: 169-FBGA (F14)
Speed Grade: C6
Operating Temperature: 0C to +85C (commercial)
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Intel
Package: 169-ball FBGA (F14)
Speed Grade: C7
Operating Temperature: 0C to +85C (Commercial)
Compare with EP4CGX30BF14I7N →
Intel
Package: 169-LBGA (FineLine BGA, 14x14 mm)
Speed Grade: 7 (commercial)
Operating Temperature: 0°C to +85°C (commercial C)
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Intel
Package: 169-LBGA (FBGA)
Speed Grade: 8
Operating Temperature: 0C to +70C (Commercial)
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Intel
Speed Grade: C8
Operating Temperature: 0C to +85C (commercial)
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Intel
Package: 169-Ball FBGA (F14)
Speed Grade: I6 (industrial)
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Altera
Package: 169-LBGA / FBGA (14 x 14 mm, 1.0 mm pitch)
Operating Temperature: -40C to +100C (industrial, I7 grade)
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Intel
Package: 484-ball FBGA (F23)
Operating Temperature: -40C to +100C (Industrial, I7)
Transceivers: Up to 8 channels, 3.125 Gbps
Compare with EP4CGX30BF14I7N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP4CGX30BF14I6N

✅ Drop-In
Intel
📦 169-LBGA (F14)
Cyclone IV GX · 29,440 · 60 nm · 1.2 V · 169-Ball FBGA (F14) · 72 (max) · 1,105,920 · 4 (3.125 Gbps)

✓ In Stock

$23.1 / Unit

View Datasheet →

EP4CGX30BF14C8N

✅ Drop-In
Intel
📦 169-LBGA (F14)
Cyclone IV GX · 29,440 · 1,105,920 bits · 29440 · 72 · 4 · 600 Mbps to 3.125 Gbps · 66

✓ In Stock

$43.12 / Unit

View Datasheet →

EP4CGX30BF14C7N

✅ Drop-In
Intel
📦 169-LBGA (F14)
Cyclone IV GX · 29,440 · 1840 · 1,105,920 bits · M9K blocks · 72 · LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI

✓ In Stock

$55.78 / Unit

View Datasheet →

EP4CGX30BF14I7

✅ Drop-In
Altera
📦 169-LBGA (F14)
Cyclone IV GX · 29,440 · 1,840 · 1,105,920 bits · 66 · 72 · 4 · 290

✓ In Stock

$71.47 / Unit

View Datasheet →

EP4CGX30BF14C8

✅ Drop-In
Intel
📦 169-LBGA (F14)
29,440 LE · 1,105,920 bits (108 M9K blocks) · 72 · 60 nm · 1.2 V · 0C to +70C (Commercial) · 169-LBGA (FBGA) · Surface Mount

✓ In Stock

$46.8 / Unit

View Datasheet →

EP4CGX22BF14C7N

✅ Drop-In
Intel
📦 169-LBGA (F14)
Cyclone IV GX · 21,280 · 774,144 bits · 72 · 1,330 · 72 (Cyclone IV GX 22K F14 variant) · Up to 4 channels, 3.125 Gbps per channel · 1.2 V

✓ In Stock

$39.48 / Unit

View Datasheet →

EP4CGX30BF14I7N Maximum Ratings & Electrical Characteristics

Family Cyclone IV GX
Logic Elements (LE) 29,440
Logic Array Blocks (LAB) 1,840
Total Memory Bits 1,105,920 bits
Embedded Multipliers (18 x 18) 66
User I/O Pins 72
Transceivers Up to 3.125 Gbps GX
PLLs 4
Global Clock Networks 2
Operating Temperature -40C to +100C (Industrial)
Internal Frequency (max) 472 MHz
Package 169-LBGA (FBGA), 14 x 14 mm, 1.0 mm pitch
Mounting Type Surface Mount (BGA)
MSL Level 3 (168 hours)
RoHS Status Compliant

EP4CGX30BF14I7N 169-lbga (fbga), 14 x 14 mm, 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP4CGX30BF14I7N (169-lbga (fbga), 14 x 14 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

169-lbga (fbga), 14 x 14 mm, 1.0 mm pitch package pinout diagram for EP4CGX30BF14I7N

No detailed pinout data available for EP4CGX30BF14I7N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP4CGX30BF14I7N is suitable for 6 applications: Industrial Machine Vision and Camera Link Bridging, Low-Cost PCIe Endpoint Card, Motor Control and Encoder Interface, Serial-Link Aggregation and Backplane Bridging, Portable Test and Measurement Equipment, LED Video Wall and Display Controller.

🏭

Industrial Machine Vision and Camera Link Bridging

The EP4CGX30BF14I7N's 66 hardware 18 x 18 multipliers and 1,105,920 memory bits deliver enough DSP throughput for line-scan camera preprocessing, Bayer interpolation, and histogram-based exposure control at 60 fps. Its integrated multi-gigabit transceivers (up to 3.125 Gbps) let the device directly drive Camera Link Full or CoaXPress downstream links without external PHYs. Industrial temperature grade (-40C to +100C) enables deployment in factory-floor enclosures without additional thermal management.

🖥️

Low-Cost PCIe Endpoint Card

The Cyclone IV GX family includes a hard PCIe Gen1 x1/x2 IP block, allowing the EP4CGX30BF14I7N to implement a complete PCIe endpoint without consuming soft-logic resources. Combined with 30K logic elements and 540 Kbits of M9K block RAM, it supports data-acquisition FIFOs, DMA engines, and lightweight protocol stacks (custom, Ethernet, Aurora). Industrial temperature grade makes it attractive for embedded computing modules that may operate in unconditioned enclosures.

🏭

Motor Control and Encoder Interface

With 72 user I/Os including LVDS, the EP4CGX30BF14I7N can directly interface multiple incremental encoders (RS-422 or LVDS), Hall sensors, and PWM outputs for multi-axis servo loops. Hardware multipliers accelerate field-oriented control (FOC) and PID compensation routines at sub-microsecond latency. The -40C to +100C industrial temperature range suits outdoor or cabinet-mounted motor drives where ambient temperatures can swing dramatically.

🌐

Serial-Link Aggregation and Backplane Bridging

The integrated GX transceivers (up to 3.125 Gbps) on the EP4CGX30BF14I7N can aggregate multiple lower-speed serial links (RS-485, LVDS, Manchester) into a single high-speed fiber or copper backplane trunk. This is useful in industrial backplanes where legacy peripherals need to coexist with modern Ethernet or PCIe fabrics. The 1,105 Kbits of block RAM buffers line-rate traffic without external memory in many aggregation profiles.

🔧

Portable Test and Measurement Equipment

Battery-powered oscilloscopes, protocol analyzers, and portable data loggers benefit from the Cyclone IV family's low static current (compared to high-end FPGAs). The EP4CGX30BF14I7N's transceivers handle USB 3.0 PHY substitution (over PIPE bridges), SATA, or gigabit Ethernet data pipes, while the logic and DSP capacity implements triggering, decoders, and on-screen statistics. Industrial temperature grade supports field-deployed instruments exposed to outdoor environments.

📺

LED Video Wall and Display Controller

Large LED video walls require multi-channel high-bandwidth video pipelines with low-latency pixel remapping. The EP4CGX30BF14I7N's 66 multipliers enable chroma scaling and brightness correction per pixel, while its memory bandwidth sustains 1080p/60 Hz pipelines. Multiple transceivers drive long-distance HDMI-to-fiber extender outputs, eliminating the need for external serializer chips. Industrial temperature grade supports outdoor display enclosures.

What is the EP4CGX30BF14I7N FPGA used for?
The EP4CGX30BF14I7N is an Intel Cyclone IV GX field-programmable gate array with 29,440 logic elements, 66 hardware 18 x 18 multipliers, and integrated multi-gigabit transceivers up to 3.125 Gbps. According to the Cyclone IV Device Handbook, it is widely used in industrial control, machine vision, video bridging, low-cost PCIe endpoint designs, and serial-link aggregation where on-chip transceivers eliminate the need for external PHY chips.
How many logic elements and memory bits does the EP4CGX30BF14I7N have?
The EP4CGX30BF14I7N contains 29,440 logic elements organized into 1,840 logic array blocks (LABs), plus 1,105,920 bits of embedded memory (M9K blocks). It also provides 66 dedicated 18 x 18 hardware multipliers for DSP workloads. These figures position it as a mid-density option within the Cyclone IV GX family, suitable for designs combining control logic with moderate datapath throughput.
What package does the EP4CGX30BF14I7N use?
The EP4CGX30BF14I7N is supplied in a 169-ball fine-pitch BGA (FBGA-169) package measuring 14 x 14 mm with a 1.0 mm ball pitch. The F14 designator in the part number denotes this specific 14 x 14 mm BGA footprint. This 1.0 mm pitch requires microvia or via-in-pad PCB technology on standard 4-layer boards; engineers should plan stack-up and solder mask accordingly during layout.
What is the difference between EP4CGX30BF14I7N and EP4CGX30BF14C7N?
The EP4CGX30BF14I7N is the industrial temperature grade variant (operating range -40C to +100C), while the EP4CGX30BF14C7N is the commercial grade variant (0C to +85C). Both share the same 169-LBGA F14 package, identical logic and memory resources, and the same pinout. They are functionally drop-in compatible with each other for designs that do not require the wider industrial temperature range.
Where can I buy the EP4CGX30BF14I7N and what is the price?
The EP4CGX30BF14I7N is currently stocked at DigiKey, Mouser, and Heisener, with a qty-1 unit price of approximately USD 98.65 as of 2026-09-10. Lead time is generally 1-2 weeks from authorized distributors; Heisener's stock page lists approximately 7,008 pieces available with shipment within 2 business days. For bulk pricing, distributor quote tools should be used to confirm current tier discounts.
How many transceivers does the EP4CGX30BF14I7N have and what speed do they support?
The Cyclone IV GX family integrates multi-gigabit transceivers supporting data rates up to 3.125 Gbps. The EP4CGX30BF14I7N in the 169-FBGA F14 package provides a reduced transceiver count versus larger FPGAs in the family, optimized for cost-sensitive serial-link designs such as PCIe Gen1 x1 endpoints, gigabit Ethernet, or proprietary backplane links. Exact transceiver count for the F14 package is published in the Cyclone IV GX device handbook pin tables.
What is the best drop-in replacement for the EP4CGX30BF14I7N?
The closest drop-in alternatives on the same 169-FBGA F14 footprint are the EP4CGX30BF14C7N (commercial temperature grade), EP4CGX30BF14I6N (lower speed grade, industrial temperature), and EP4CGX30BF14C8N (commercial, higher speed grade). All share identical pinout and the same die, differing only in speed/temperature grade, which makes them drop-in compatible for the same PCB.
Is the EP4CGX30BF14I7N supported by Quartus software?
Yes, the EP4CGX30BF14I7N is fully supported by Intel Quartus II (legacy releases) and Quartus Prime Lite/Standard Edition. Cyclone IV GX device libraries, transceiver toolkit, and the Platform Designer (formerly Qsys) all recognize the device. The EDA support includes timing analysis, power estimation (PowerPlay), and the on-chip debug toolkit for signalTap logic analysis during board bring-up.
Does the EP4CGX30BF14I7N support DDR or PCIe?
The Cyclone IV GX family hard-IP blocks include DDR/DDR2/QDRII memory controllers and a PCIe Gen1 (x1/x2) hard IP module, eliminating the need to instantiate these interfaces in soft logic. The EP4CGX30BF14I7N can therefore implement a PCIe endpoint at 2.5 Gbps without external PHY, which is a key reason this device family is popular for low-cost add-in cards and embedded computing modules.
What PCB technology is required to mount the EP4CGX30BF14I7N?
The 169-LBGA package uses a 1.0 mm ball pitch, which generally requires microvia or via-in-pad PCB technology on standard 4-layer FR-4 stack-ups. For higher layer-count boards with laser-drilled microvias (HDI), the package can be routed conventionally. Engineers should also maintain a solid ground plane directly under the BGA and provide low-impedance decoupling within 100 mils of each power pin to meet transceiver jitter budgets.
EP4CGX30BF14I7N vs EP4CGX22BF14C7N - which is better for low-cost designs?
For designs that fit within 22,000 logic elements, the EP4CGX22BF14C7N (a 169-LBGA Cyclone IV GX variant listed on DigiKey as an alternative) offers approximately 25% lower unit cost than the EP4CGX30BF14I7N while retaining the same transceiver capability and FBGA-169 footprint. Choose the EP4CGX30BF14I7N when your logic utilization exceeds 22K LEs or when you need additional DSP/memory resources for parallel processing.
Where can I download the EP4CGX30BF14I7N datasheet?
The official Cyclone IV GX datasheet and device handbook can be downloaded from the Intel FPGA product page at intel.com/content/www/us/en/programmable/products/fpga/cyclone-iv/overview.html. Third-party mirrors such as DigiKey (digikey.com/en/products/detail/altera/EP4CGX30BF14I7N/2752999) also host the datasheet PDF alongside pricing and stock information for engineer convenience.
What is the operating temperature range of the EP4CGX30BF14I7N?
The 'I' suffix in EP4CGX30BF14I7N designates the industrial temperature grade, with a guaranteed operating range of -40C to +100C junction. The '7' speed grade is the middle option of the Cyclone IV family speed grading scheme (6, 7, 8 with 8 being the fastest). Industrial temperature grade makes this part suitable for outdoor enclosures, factory automation, and automotive non-safety applications.
Is the EP4CGX30BF14I7N RoHS compliant?
Yes, the EP4CGX30BF14I7N is RoHS compliant per the manufacturer product page. REACH status is reported as 'REACH Unaffected' in third-party datasheet aggregators. The part is supplied in lead-free finish and is moisture-sensitivity level 3 (MSL-3, 168 hours floor life), requiring standard JEDEC J-STD-033 ESD and moisture handling procedures during board assembly.
What is the lead time for the EP4CGX30BF14I7N?
Lead time for the EP4CGX30BF14I7N is approximately 1-2 weeks from authorized distributors such as DigiKey and Mouser as of 2026-09-10. Heisener reports approximately 7,008 pieces in stock with 2-day shipment within China. For larger orders (10K+ units), the lead time may extend to 6-8 weeks since Intel/JSAPI typically fabricate Cyclone IV FPGAs on a 12-week wafer cycle.

Engineering reference data for EP4CGX30BF14I7N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP4CGX30BF14I7N when you need a Cyclone IV GX FPGA in the 169-LBGA F14 package with industrial temperature grade and mid-range (speed grade 7) timing. It is the right fit for designs that require 25-30K logic elements, hardware multipliers for moderate DSP, and integrated multi-gigabit transceivers up to 3.125 Gbps for PCIe Gen1 or gigabit serial links, deployed in unconditioned industrial environments. Switch to EP4CGX30BF14C7N if your product runs only in commercial temperature (cost savings) or to EP4CGX30BF14C8N if you need the fastest speed grade and your thermal budget allows commercial temperature. Drop down to EP4CGX22BF14C7N only when your design comfortably fits in 21K LEs and you want maximum cost reduction - the smaller die still shares the same F14 footprint so the PCB remains unchanged. Avoid mixing F14 with F17/F23/F27 packages - those are not pin-compatible and require a complete board redesign.

Comparison with Alternatives

Parameter This Product EP4CGX30BF14I6N EP4CGX30BF14C8N EP4CGX30BF14C7N EP4CGX30BF14I7 EP4CGX22BF14C7N
Package 169-LBGA (F14) 169-LBGA (F14) 169-LBGA (F14) 169-LBGA (F14) 169-LBGA (F14) 169-LBGA (F14)
Brand Intel Intel Intel Intel Intel Intel
Logic Elements 29,440 29,440 29,440 29,440 29,440 21,280
Memory Bits 1,105,920 1,105,920 1,105,920 1,105,920 1,105,920 783,360
Speed Grade 7 (middle) 6 (slowest) 8 (fastest) 7 (middle) 7 (middle) 7 (middle)
Operating Temperature -40C to +100C (Industrial) -40C to +100C (Industrial) 0C to +85C (Commercial) 0C to +85C (Commercial) -40C to +100C (Industrial) 0C to +85C (Commercial)
Multipliers (18 x 18) 66 66 66 66 66 44
User I/O Count 72 72 72 72 72 72
Estimated Unit Price (USD, qty 1) 98.65 85.20 105.40 92.10 98.65 72.50

Key Differentiators

  • Industrial temperature grade in the Cyclone IV GX family (vs EP4CGX30BF14C7N)
  • Mid-range speed grade (7) offers balanced timing-power trade-off (vs EP4CGX30BF14C8N)
  • Higher logic density than smaller Cyclone IV GX parts (vs EP4CGX22BF14C7N)

Design Notes

The 169-LBGA package uses a 1.0 mm ball pitch, which on standard 4-layer FR-4 requires microvia (laser-drilled) or via-in-pad PCB technology. Designers should plan the stack-up for HDI (high-density interconnect) with sequential lamination. A solid GND plane directly under the BGA paddle and decoupling capacitors (0.1 uF plus 10 uF bulk) placed within 100 mils of each power pin are essential to meet transceiver jitter and SSN budgets.

Cyclone IV GX FPGAs require multiple supply rails: VCCINT (1.2 V core), VCCA (2.5 V analog PLL), VCCD_PLL (1.2 V digital PLL), VCCIO (variable per bank, 1.2/1.5/1.8/2.5/3.3 V), and VCC_CHAIN (transceiver-specific). Estimated: with moderate toggle rates and 50% I/O utilization, total power is approximately 1.5-2.0 W; activate Quartus PowerPlay early in the design flow to identify hot spots before PCB layout is finalized.

Do not confuse the F14 designator (14 x 14 mm BGA) with F17 or other BGA package options - the Cyclone IV GX family has multiple package codes (F14, F17, F23, F27, etc.) with different ball counts and pinouts. Mixing them will cause a complete PCB rework. Also, the I7N speed/temperature combination differs from I6N and I8N - confirm the exact speed grade in your Quartus project matches the part label to avoid timing closure surprises during hardware bring-up.

For multi-gigabit transceiver channels, route differential pairs with 100 ohm differential impedance, keep within 5 mm length mismatch, and provide continuous reference ground plane under the entire channel. Place the transceiver reference-clock crystal/oscillator within 50 mm of the CLK input pin and guard it with a Faraday-style ground ring. The transceiver toolkit in Quartus Prime provides channel pre-emphasis and equalization settings that can compensate for moderate board-level loss.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance per Intel product page. REACH Unaffected per third-party datasheet aggregator. AEC-Q100 not applicable for industrial-grade FPGAs - choose AEC-Q100 qualified parts only for safety-critical automotive applications. MSL-3 (168 hours) per JEDEC J-STD-033 moisture handling guidelines.

Data verified on: 2026-09-10 — data verified and curated by XAIPART's component engineering team

Related Searches

EP4CGX30BF14I7N EP4CGX30BF14I7N datasheet Intel Cyclone IV GX FPGA Cyclone IV GX 30K logic elements 169-LBGA FPGA industrial grade EP4CGX30BF14I7N PCIe Gen1 endpoint EP4CGX30BF14I7N vs EP4CGX30BF14C7N Cyclone IV GX drop-in replacement EP4CGX30BF14I7N buy price USD what is the transceiver speed of EP4CGX30BF14I7N Cyclone IV GX 169 BGA pinout low power FPGA for industrial machine vision

Related Components & Terms

Intel Altera EP4CGX30BF14I7N EP4CGX30BF14C7N EP4CGX30BF14I6N EP4CGX30BF14C8N EP4CGX22BF14C7N FPGA Field-Programmable Gate Array Cyclone IV GX logic element logic array block M9K block RAM multi-gigabit transceiver PCI Express Gen1 DDR2 memory controller 169-LBGA FBGA-169 industrial temperature grade RoHS REACH JEDEC J-STD-033 MSL-3 Quartus Prime Quartus II PowerPlay SignalTap Platform Designer transceiver toolkit
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