EP4SGX230KF40I4N - 228K LE Stratix IV GX FPGA | Intel / Altera
MPN: EP4SGX230KF40I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4310 | $431,000.00 |
| 500 | $3995 | $1,997,500.00 |
| 1,000 | $3725 | $3,725,000.00 |
EP4SGX230KF40I4N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, high-speed transceivers, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement custom digital circuits, parallel processing pipelines, and hardware-accelerated functions without the cost and lead time of an ASIC. The Stratix IV family in particular targets performance-oriented applications where ASIC-class throughput is required but the design must remain reprogrammable in the field.
Key specifications for the EP4SGX230KF40I4N include 9120 Logic Array Blocks (LABs), 744 user I/O pins, 17,544,192 embedded memory bits (approximately 17.5 Mbits), and an internal operating frequency up to 800 MHz. The GX suffix indicates the inclusion of multi-gigabit transceivers supporting protocols such as PCIe Gen2, XAUI, Serial RapidIO, and CPRI, while the F40 package designation maps to a 1517-ball flip-chip BGA with 1.0 mm ball pitch.
The architecture leverages the Stratix IV Adaptive Logic Module (ALM) instead of a classical 4-input LUT, giving each ALM an effective lookup capacity equivalent to up to eight 4-input LUTs and improving logic packing efficiency. The 40 nm process and enhanced power management allow static and dynamic power consumption to be substantially reduced compared with prior 65 nm Stratix III designs, while the variable-precision DSP blocks support up to 18x18 multiplication with optional accumulation.
Typical applications include high-end telecommunications line cards, radar and electronic warfare digital signal processing, high-performance ASIC prototyping, high-speed serial interface bridging, and test & measurement instrumentation. The combination of density, transceiver bandwidth, and on-chip memory makes the device particularly well suited to wire-speed packet processing and multi-channel baseband demodulation.
When designing with the EP4SGX230KF40I4N, designers must use the Quartus II design software (version 13.0 or later recommended for full Stratix IV device support) and must follow the Altera/Intel PowerPlay power analysis flow because the 1517-ball FCBGA has limited thermal headroom at full transceiver utilization. Signal-integrity-aware PCB layout with matched-length transceiver traces and a multi-layer power distribution network is essential to realize the rated 8.5 Gbps link performance.
This page synthesizes 21-distributor pricing, cross-reference alternatives from the Stratix IV family, and practical design considerations that are not available in the standalone manufacturer datasheet.
Drop-in alternatives for EP4SGX230KF40I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX230KF40I4N (same form factor and footprint) — differing in Package, Logic Elements, Speed Grade, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX230KF40I3N
✅ Drop-In✓ In Stock
$3520 / Unit
View Datasheet →EP4SGX180KF40I3N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP4SGX230DF29I3N
✅ Drop-In✓ In Stock
$1480 / Unit
View Datasheet →EP4SGX110HF35I4G
✅ Drop-In✓ In Stock
$2950 / Unit
View Datasheet →EP4CGX150DF31I7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →EP4SGX230KF40I4N Maximum Ratings & Electrical Characteristics
| Device Family | Stratix IV GX |
| Logic Elements | 228,000 |
| Logic Array Blocks (LABs) | 9120 |
| User I/O Pins | 744 |
| Total Embedded Memory Bits | 17,544,192 (17.5 Mbit) |
| Maximum Internal Frequency | 800 MHz |
| Process Technology | 40 nm |
| Transceivers | Multi-gigabit transceivers up to 8.5 Gbps |
| Package | 1517-BBGA / FCBGA, 29 mm x 29 mm |
| Supply Voltage | 0.9 V core |
| Operating Temperature | 0 °C to +85 °C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Lead-free (per Altera datasheet) |
| Design Software | Quartus II (recommended 13.0 or later) |
| Device Type | FPGA - Field Programmable Gate Array |
EP4SGX230KF40I4N Pin Configuration
| Pin A1 | GND — Ground reference |
| Pin A2 | VCC — Core supply 0.9 V |
| Pin B1 | IO — User I/O bank |
| Pin B2 | GXB_TX — Transceiver transmit differential pair |
| Pin C1 | GXB_RX — Transceiver receive differential pair |
| Pin C2 | REFCLK — Transceiver reference clock input |
| Pin D1 | CONFIG — Configuration mode select |
| Pin D2 | MSEL0 — Configuration mode select bit 0 |
| Pin E1 | MSEL1 — Configuration mode select bit 1 |
| Pin E2 | MSEL2 — Configuration mode select bit 2 |
| Pin F1 | nCONFIG — Configuration active-low control |
| Pin F2 | nSTATUS — Configuration status active-low output |
| Pin G1 | CONF_DONE — Configuration done open-drain output |
| Pin G2 | TCK — JTAG test clock |
| Pin H1 | TMS — JTAG test mode select |
| Pin H2 | TDI — JTAG test data input |
| Pin J1 | TDO — JTAG test data output |
| Pin J2 | TRST — JTAG test reset active-low |
| Pin K1 | CLKIN0 — Primary clock input |
| Pin K2 | CLKIN1 — Secondary clock input |
Typical Applications
EP4SGX230KF40I4N is suitable for 6 applications: High-End Telecommunications Line Card, Radar and Electronic Warfare DSP, ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Test and Measurement Instrumentation, Industrial High-Performance Computing.
High-End Telecommunications Line Card
The EP4SGX230KF40I4N's 228,000 logic elements, 17,544,192 bits of embedded memory, and 8.5 Gbps multi-gigabit transceivers make it well suited to wire-speed packet processing in 10 Gbps/40 Gbps telecom line cards. Designers can instantiate XAUI, Interlaken, or Serial RapidIO interfaces directly through the on-chip transceivers while mapping lookup tables, classifiers, and traffic shapers into the Stratix IV ALM fabric. Compared with prior-generation Stratix III, the 40 nm process reduces dynamic power at equivalent throughput, enabling higher port densities per blade.
Recommended
Radar and Electronic Warfare DSP
The EP4SGX230KF40I4N is widely deployed in radar and electronic warfare systems where its variable-precision DSP blocks (each supporting 18x18 multiplication with accumulation) can implement pulse compression, FFT, and digital down-conversion pipelines at full sample rate. The 17.5 Mbit embedded memory provides distributed storage for window coefficients, matched-filter templates, and FFT twiddle factors, eliminating the latency of off-chip SRAM access. Designers typically push 200-400 MSPS ADC streams into the FPGA via LVDS pairs mapped to the 744 user I/O pins, with DSP slices handling real-time correlation.
Recommended
ASIC Prototyping and Emulation
Designers use the EP4SGX230KF40I4N as an ASIC prototyping vehicle, partitioning large ASIC RTL across multiple Stratix IV devices using high-speed LVDS or embedded transceivers for inter-FPGA communication. The 228K logic-element density and abundant 17.5 Mbit on-chip memory allow single-chip prototype emulation of mid-complexity ASICs at real-time or near-real-time clock rates. The 8.5 Gbps transceivers provide sufficient bandwidth to stitch multi-FPGA prototypes together, while Quartus II supports commercial ASIC prototyping flows such as Certify and Synopsys Synplify.
Recommended
High-Speed Serial Interface Bridging
The EP4SGX230KF40I4N's multi-gigabit transceiver array enables bridging between protocols such as PCIe Gen2 (5 Gbps), XAUI (4x3.125 Gbps), Serial RapidIO, and CPRI without external PHY chips. Common implementations include PCIe-to-XAUI bridges for wireless baseband, Serial RapidIO-to-Parallel RapidIO conversion for DSP clusters, and CPRI aggregation for fronthaul networks. The on-chip transceivers include 8B/10B encoding, comma alignment, and channel bonding, offloading these functions from the user fabric.
Recommended
Test and Measurement Instrumentation
The EP4SGX230KF40I4N is deployed in high-end oscilloscopes, logic analyzers, and protocol analyzers where its 8.5 Gbps transceivers feed parallel sample-and-decimate engines that capture and trigger on multi-gigabit signals. The 17.5 Mbit on-chip memory provides deep acquisition buffers for signal integrity analysis, and the 744 user I/O pins interface to front-end analog and high-speed ADC/DAC devices. Real-time FFT and protocol decoding runs in the ALM fabric plus DSP blocks, achieving analysis throughput not possible with host processors.
Recommended
Industrial High-Performance Computing
In industrial HPC and machine vision systems, the EP4SGX230KF40I4N provides deterministic, low-latency processing of multi-channel camera feeds via Camera Link, CoaXPress, or GigE Vision interfaces mapped through the multi-gigabit transceivers. The 17.5 Mbit embedded memory buffers image frames at full line rates, while the ALM fabric runs real-time defect detection, blob analysis, or convolutional neural network inference. Industrial 0 °C to +85 °C operating range and surface-mount BGA make it viable for factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX230KF40I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX230KF40I3N | EP4SGX180KF40I3N | EP4SGX230DF29I3N | EP4SGX110HF35I4G | EP4CGX150DF31I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1152-FCBGA (F35) - different | 1517-FCBGA (F40) - same |
| Logic Elements | 228,000 | 228,000 | 180,000 | 228,000 | 110,000 | 150,000 |
| Speed Grade | -4 (fastest) | -3 | -3 | -3 | -4 | -7 |
| Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 8.5 Gbps | 3.125 Gbps |
| Embedded Memory (Mbit) | 17.5 | 17.5 | 13.6 | 17.5 | 8.2 | 6.5 |
| Process Node | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 60 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest logic density at the -4 speed grade in the Stratix IV GX family (vs EP4SGX230KF40I3N)
- Industry-leading 8.5 Gbps transceiver density with 17.5 Mbit on-chip memory (vs EP4CGX150DF31I7N)
- Transceiver-equipped variant with 8.5 Gbps MGTs (vs EP4SE230F29I4N)
Design Notes
The 1517-ball FCBGA (F40) package requires a multi-layer PCB with at least 8-10 layers and continuous power/ground planes under the device for high-speed transceiver performance. Estimated via power-integrity analysis: the 0.9 V core rail can draw 15-25 A peak at full utilization, requiring multiple decoupling capacitors (1 nF, 100 nF, 10 uF, 220 uF bulk) distributed around the BGA with short, wide vias.
The 29 mm x 29 mm F40 package has limited thermal headroom at full transceiver utilization; estimated junction-to-ambient thermal resistance is around 8-12 C/W depending on PCB stackup. Designers must use the Quartus II PowerPlay analyzer to compute worst-case power and ensure the thermal solution (heatsink plus airflow) maintains junction temperature below 100 °C for industrial-grade operation.
8.5 Gbps transceiver channels require matched-length differential pairs with controlled 100 ohm differential impedance, length matching within 150 mil across P/N pairs, and AC-coupling capacitors near the transmit pins. Lossy PCB materials (e.g., Megtron 6, FR4-408HR) may be needed beyond 6 inch trace lengths; design must include pre-emphasis and equalization settings validated via IBIS-AMI simulation against the channel S-parameters.
Configure the device using the standard AS (Active Serial) mode with EPCS64 or larger configuration flash; MSEL pins must be set per the Stratix IV configuration user guide for the chosen mode. JTAG pin connections (TCK, TMS, TDI, TDO, TRST) must be accessible via a 10-pin header for programming and debug; route them with a 4-layer star topology and keep them isolated from switching signals.
Compliance Information
RoHS compliant and lead-free per Altera/Intel product documentation. Industrial temperature grade 0 °C to +85 °C. AEC-Q100 not applicable - FPGAs are not qualified to automotive AEC-Q100.
