EP4SGX110HF35I4G - Stratix IV GX FPGA, 105.6K LE, 1152-FBGA | Intel
MPN: EP4SGX110HF35I4G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4539.93 | $4,539.93 |
| 10 | $4085.94 | $40,859.40 |
| 100 | $3631.95 | $363,195.00 |
| 500 | $3270 | $1,635,000.00 |
| 1,000 | $2950 | $2,950,000.00 |
EP4SGX110HF35I4G Overview
What is a Stratix IV GX FPGA? The Stratix IV GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGAs (field programmable gate arrays) -> high-performance transceivers -> programmable logic semiconductors. An FPGA is a semiconductor device whose digital logic function is defined after manufacturing via configuration bitstream loading, in contrast to ASICs whose function is fixed at fabrication. The GX variant adds multi-gigabit transceivers and physical coding sublayer (PCS) hard IP, enabling protocol bridging for PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G without external PHY chips.
Key features include 105,600 logic elements (LEs) and 3,888 embedded 18x18 multipliers (105,600 equivalent LEs for DSP), a 488 user I/O count, eight PLLs, and embedded transceiver capability that supports data rates up to 8.5 Gbps per channel. The device also includes dedicated memory controller blocks, PCI Express hard IP, and dynamic reconfiguration support. The HF35 speed grade and I4 industrial temperature rating make it appropriate for moderate-performance industrial systems requiring long-term availability.
The 40 nm process technology gives the device a favorable ratio of performance to power consumption compared with older 65 nm and 90 nm FPGA generations. Hard IP blocks (PCIe, memory controllers, transceivers, PLLs) free general-purpose logic fabric for application-specific functions. The 1152-ball FCBGA package provides a high pin count with controlled-impedance differential routing, essential for multi-gigabit transceiver performance.
Typical applications include high-end test and measurement equipment, military/aerospace signal processing, high-speed data acquisition, communications infrastructure line cards, ASIC prototyping, and medical imaging. The combination of dense logic, embedded transceivers, and PCI Express hard IP also makes it well suited for broadcast video processing and high-performance DSP cards.
When designing with this FPGA, plan board layout around controlled-impedance differential pairs for transceiver channels and assign separate power rails for transceiver (VCCH_GXB), core (VCC), and I/O banks (VCCIO). A minimum of 0.1 uF decoupling capacitors per power pin plus bulk capacitors is essential. Use the Altera/Intel Quartus II design software for compilation, place-and-route, timing closure, and bitstream generation.
This page synthesizes distributor pricing, Stratix IV family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single reference for sourcing, replacement, and PCB-level integration.
Drop-in alternatives for EP4SGX110HF35I4G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP4SGX110HF35I4G (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP4SGX110HF35I3G
✅ Drop-In✓ In Stock
$7900 / Unit
View Datasheet →EP4SGX110HF35C4G
✅ Drop-In✓ In Stock
$5000 / Unit
View Datasheet →EP4SGX110HF35C3G
✅ Drop-In✓ In Stock
$3128.75 / Unit
View Datasheet →EP4SGX110HF35C2G
✅ Drop-In✓ In Stock
$3700 / Unit
View Datasheet →EP4SGX110FF35I4G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1395 / Unit
View Datasheet →EP4SGX110HF35I4G Maximum Ratings & Electrical Characteristics
| Series | Stratix IV GX |
| Family | Stratix IV |
| Logic Elements (LE) | 105,600 |
| Total Memory Bits | 9,793,536 |
| Number of Logic Array Blocks (LAB) | 4400 |
| Number of I/O | 488 |
| Voltage - Supply | 0.87 V to 0.93 V core, 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V I/O |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount |
| Package / Case | 1152-BBGA, FCBGA |
| Package Dimensions | 35 mm x 35 mm FCBGA |
| Process Technology | 40 nm |
| Speed Grade | HF35 (high-performance, transceiver optimized) |
| Temperature Grade | I4 (Industrial, -40C to +100C) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Lead-Free | Yes |
EP4SGX110HF35I4G 35 mm x 35 mm fcbga Pin Configuration Guide
Pin configuration for EP4SGX110HF35I4G (35 mm x 35 mm fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP4SGX110HF35I4G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP4SGX110HF35I4G is suitable for 6 applications: High-Speed Data Acquisition Systems, Communications Infrastructure Line Cards, Military and Aerospace Signal Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, Medical Imaging Equipment.
High-Speed Data Acquisition Systems
The EP4SGX110HF35I4G fits high-speed data acquisition systems thanks to its 105,600 logic elements and 9,793,536 bits of embedded memory, which absorb wide data buses from high-rate ADCs without off-chip buffering. The integrated multi-gigabit transceivers (per Stratix IV GX family) link to backplane SERDES at line rates up to several Gbps per channel, eliminating external PHY chips. Placed on the main signal-processing card, the FPGA performs real-time channel calibration and decimation. Unlike a discrete logic + external SERDES design, this FPGA reduces BOM by 30-40% while delivering deterministic latency for phased-array or radar applications.
Recommended
Communications Infrastructure Line Cards
The EP4SGX110HF35I4G is well-suited for communications line cards because its hard PCI Express Gen1/Gen2 IP and multi-grip transceivers (per Stratix IV GX family datasheet) handle backplane connectivity, framer, and MAC functions on a single device. With 105,600 logic elements and 488 user I/Os, it can replace an ASSP plus companion FPGA combination. Placed as the main processor between the network PHY and switch fabric ASIC, it absorbs protocol bridging and traffic management. A key consideration: transceiver reference clock jitter must be below the Stratix IV GX jitter spec to avoid bit-error-rate degradation at the highest data rates.
Recommended
Military and Aerospace Signal Processing
The EP4SGX110HF35I4G's industrial temperature rating of -40C to +100C and high logic density make it appropriate for ruggedized military and aerospace signal-processing boards. Its 9,793,536 bits of embedded memory support channel-matched FIR filter banks, and the 40 nm process provides reasonable radiation tolerance for non-space applications. Integrated transceivers enable direct interface to fiber-optic data links without external SERDES. Compared with older 65 nm FPGAs, the 40 nm process cuts dynamic power by ~30%, important for SWaP-constrained platforms.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP4SGX110HF35I4G for ASIC prototyping because its 105,600 logic elements and abundant memory can map mid-complexity ASICs at full operating speed. The 488 user I/O pins expose wide buses and protocol interfaces, while the integrated PCI Express hard IP accelerates bring-up of PCIe-based ASIC prototypes. Placed on a daughter card or backplane, the FPGA runs real-world traffic to validate ASIC RTL before tape-out. Compared with software simulation, this hardware prototype runs 1000x faster and exposes timing bugs that pure RTL simulation misses.
Recommended
Broadcast Video Processing
The EP4SGX110HF35I4G handles broadcast video processing tasks including SD/HD/3G-SDI multiplexing, color-space conversion, and on-screen graphics overlay. Its 105,600 logic elements and 9,793,536 bits of embedded memory provide the line buffers and pixel processing pipelines for multi-stream video. The integrated transceivers accept SDI over coax at 3 Gbps without external cable equalizers. A practical design note: use a dedicated PLL for the SDI reference clock to meet the 27 MHz jitter tolerance required by SMPTE 424M.
Recommended
Medical Imaging Equipment
The EP4SGX110HF35I4G fits medical imaging platforms such as ultrasound, CT, and MRI front-end processing because of its high logic density, embedded memory for image line buffers, and deterministic latency DSP paths. The 105,600 logic elements support beamforming algorithms and image reconstruction pipelines, while 488 user I/O pins connect to high-channel-count ADC arrays. Industrial temperature range supports imaging cart and operating-room environments. Designers should validate IEC 60601-1 compliance at the system level since this device is not itself a medical-grade part.
Recommended
Recommended Products Summary
Engineering reference data for EP4SGX110HF35I4G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP4SGX110HF35I3G | EP4SGX110HF35C4G | EP4SGX110HF35C3G | EP4SGX110HF35C2G | EP4SGX110FF35I4G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 | 105,600 |
| Total Memory Bits | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 | 9,793,536 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | I4 (HF35, high-performance transceiver optimized) | I3 (-1 speed grade) | C4 (-1 speed and -1 temp) | C3 | C2 (-2 speed grade) | I4 (different package code FF35) |
Key Differentiators
- Higher speed grade (I4) than I3 and C-grade variants (vs EP4SGX110HF35I3G)
- Industrial temperature rating covers rugged deployments (vs EP4SGX110HF35C4G)
- Transceiver-optimized HF35 speed grade (vs EP4SGX110FF35I4G)
- High logic density with embedded memory (vs Lower-density Cyclone IV (e.g. EP4CGX110DF31I7N))
Design Notes
Estimated: Stratix IV GX devices require separate power rails for core (VCC, 0.87-0.93 V), I/O banks (VCCIO, configurable 1.2 V to 3.3 V), and transceiver supply (VCCH_GXB). Decoupling per the Stratix IV handbook recommends at least one 0.1 uF capacitor per power pin plus bulk capacitors per rail. A linear or high-efficiency buck regulator should provide VCCH_GXB with tight tolerance to minimize transceiver jitter. Power sequencing is critical: VCCH_GXB and VCC must ramp together within the Stratix IV specified window to avoid latch-up.
Place transceiver channels on the outside of the BGA to minimize via stubs and keep differential pair length mismatch under 150 mil per the Stratix IV device datasheet. Use 100-ohm differential impedance with a reference ground plane on layer 2 for all GXB lanes. Add AC-coupling capacitors (typically 100 nF) in series with each high-speed serial channel, placed close to the transmitter side. Route reference clocks with controlled impedance and isolate from switching noise sources.
Estimated: at 105,600 logic elements running at typical Stratix IV utilization (~70%), worst-case junction temperature can approach 100C without airflow or a heatsink. The 35 mm x 35 mm FCBGA package has a theta_JA of approximately 8-12 C/W with adequate PCB copper, per Stratix IV thermal models. For sealed enclosures, a heatsink attached to the package lid or a thermal pad connecting to chassis is recommended. Validate thermal design with the Altera/Intel PowerPlay early power estimator before PCB fabrication.
Common pitfalls when designing with the EP4SGX110HF35I4G include: (1) failing to lock the reference clock PLL before releasing reset to the transceiver PCS; (2) using the wrong MSL3 handling procedure for the FCBGA, which requires dry-bag storage and reflow within 168 hours; (3) omitting the configuration flash memory design - the EP4SGX110 series requires an external EPCS or EPCQ configuration device per Stratix IV configuration user guide; (4) not enabling the CRC error check in Quartus II, which masks bitstream corruption during production programming.
Compliance Information
RoHS compliance and lead-free status per distributor listing on DigiKey/Mouser for EP4SGX110HF35I4G. REACH, halogen-free, and conflict-mineral status were not explicitly stated in the Verified Web Data and are marked 'unknown'. AEC-Q100 is not applicable for FPGAs - this is not an automotive-qualified logic device.
