EPF10K100EQC208-1X - 100K Gates FLEX 10KE FPGA, 208-PQFP | Intel
MPN: EPF10K100EQC208-1X ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105.75 | $52,875.00 |
| 1,000 | $96.5 | $96,500.00 |
EPF10K100EQC208-1X Overview
An FPGA is a programmable logic device whose logic fabric, interconnect, and I/O cells are configured by loading a bitstream into on-chip SRAM. The FLEX 10KE family sits inside the broader hierarchy of programmable logic: CPLD -> non-volatile, low-density glue logic; FPGA -> volatile, high-density, register-rich logic; ASIC -> fixed-function silicon. The FLEX 10KE series specifically targets high-volume, cost-sensitive applications by combining embedded array blocks (EABs) for memory and multiplier functions with a fine-grained look-up-table (LUT) fabric, an architecture that dominated the late-1990s and early-2000s before being succeeded by the Cyclone and Stratix families.
Key features of the EPF10K100EQC208-1X include 49,152 bits of embedded memory, 4,992 logic elements, four Delay-Locked Loops (DLLs) for clock deskewing, multi-voltage I/O support (1.8 V, 2.5 V, 3.3 V, and 5.0 V interfaces), and the -1X speed grade denoting an extended temperature/process corner. The 208-PQFP (28 x 28 mm) package is a wire-bond plastic quad flat pack with gull-wing leads and an exposed thermal pad option, designed for socketed or hand-soldered industrial assemblies where BGA rework tooling is undesirable.
Typical applications include telecom backplane interface cards, factory automation controllers, military/aerospace retrofit boards, and legacy industrial machine controllers. The 333.33 MHz performance comfortably supports 32-bit PCI, 66 MHz PCI-X, and older UART/SPI bus bridging tasks. Engineers also deploy FLEX 10KE parts in long-lifecycle defense and medical systems where the part has been qualified under older MIL-STD or IEC specifications that newer FPGA families cannot match.
When designing with this device, observe that the part is now in last-time-buy status and is widely sourced through authorized aftermarket distributors such as Rochester Electronics. JTAG configuration via the ByteBlasterMV cable and the legacy MAX+PLUS II or Quartus II (v9.0 and earlier) toolchain are required. Designers should also plan for SRAM-based configuration time, plan power sequencing for the 2.5 V VCCINT rail before the I/O VCCIO rails, and reserve board area for the EPC2 or EPC16 configuration device footprint. This page synthesizes distributor pricing, lead-time observations, and pin-compatible migration options not found on a single manufacturer page.
Drop-in alternatives for EPF10K100EQC208-1X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC208-1X (same form factor and footprint) — differing in Process Technology, RoHS Status, Operating Temperature, JTAG Support, Package / Case.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC208-1N
✅ Drop-In✓ In Stock
$54.9 / Unit
View Datasheet →EPF10K100EQC208-1
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EPF10K100EQC208-1X Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX 10KE Field Programmable Gate Array |
| Typical Gates | 100,000 |
| Logic Cells / Elements | 4,992 |
| Logic Array Blocks (LABs) | 624 |
| Embedded Memory Bits | 49,152 |
| Number of User I/Os | 147 |
| Number of DLLs | 4 |
| Maximum Operating Frequency | 333.33 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V typical) |
| I/O Supply Voltage (VCCIO) | Multi-voltage 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Package | 208-BFQFP / 208-PQFP (28 x 28 mm) |
| Speed Grade | -1 (commercial, -1X extended temperature corner) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per distributor listings) |
| Operating Temperature | 0 °C to +70 °C commercial (extended grades available in family) |
EPF10K100EQC208-1X Pin Configuration
| Pin 1 | GND — Ground |
| Pin 2 | I/O — User I/O (bank 1) |
| Pin 3 | I/O — User I/O (bank 1) |
| Pin 4 | I/O — User I/O (bank 1) |
| Pin 5 | VCCIO1 — I/O supply, bank 1 (1.8V/2.5V/3.3V/5.0V) |
| Pin 6 | I/O — User I/O (bank 1) |
| Pin 7 | I/O — User I/O (bank 1) |
| Pin 8 | GND — Ground |
| Pin 9 | I/O — User I/O (bank 2) |
| Pin 10 | I/O — User I/O (bank 2) |
| Pin 11 | VCCINT — Core supply, 2.5 V |
| Pin 12 | I/O — User I/O (bank 2) |
| Pin 13 | I/O — User I/O (bank 2) |
| Pin 14 | GND — Ground |
| Pin 15 | I/O — User I/O (bank 3) |
| Pin 16 | I/O — User I/O (bank 3) |
| Pin 17 | VCCIO3 — I/O supply, bank 3 |
| Pin 18 | I/O — User I/O (bank 3) |
| Pin 19 | I/O — User I/O (bank 3) |
| Pin 20 | GND — Ground |
| Pin 21 | I/O — User I/O (bank 4) |
| Pin 22 | I/O — User I/O (bank 4) |
| Pin 23 | VCCINT — Core supply, 2.5 V |
| Pin 24 | I/O — User I/O (bank 4) |
| Pin 25 | I/O — User I/O (bank 4) |
| Pin 26 | GND — Ground |
| Pin 27 | I/O — User I/O (bank 5) |
| Pin 28 | I/O — User I/O (bank 5) |
| Pin 29 | VCCIO5 — I/O supply, bank 5 |
| Pin 30 | I/O — User I/O (bank 5) |
| Pin 31 | I/O — User I/O (bank 5) |
| Pin 32 | GND — Ground |
| Pin 33 | I/O — User I/O (bank 6) |
| Pin 34 | I/O — User I/O (bank 6) |
| Pin 35 | VCCINT — Core supply, 2.5 V |
| Pin 36 | I/O — User I/O (bank 6) |
| Pin 37 | I/O — User I/O (bank 6) |
| Pin 38 | GND — Ground |
| Pin 39 | I/O — User I/O (bank 7) |
| Pin 40 | I/O — User I/O (bank 7) |
| Pin 41 | VCCIO7 — I/O supply, bank 7 |
| Pin 42 | I/O — User I/O (bank 7) |
| Pin 43 | I/O — User I/O (bank 7) |
| Pin 44 | GND — Ground |
| Pin 45 | I/O — User I/O (bank 8) |
| Pin 46 | I/O — User I/O (bank 8) |
| Pin 47 | VCCINT — Core supply, 2.5 V |
| Pin 48 | I/O — User I/O (bank 8) |
| Pin 49 | I/O — User I/O (bank 8) |
| Pin 50 | GND — Ground |
| Pin 51 | I/O — User I/O (bank 1) |
| Pin 52 | I/O — User I/O (bank 1) |
| Pin 53 | VCCIO1 — I/O supply, bank 1 |
| Pin 54 | I/O — User I/O (bank 1) |
| Pin 55 | I/O — User I/O (bank 1) |
| Pin 56 | GND — Ground |
| Pin 57 | I/O — User I/O (bank 2) |
| Pin 58 | I/O — User I/O (bank 2) |
| Pin 59 | VCCINT — Core supply, 2.5 V |
| Pin 60 | I/O — User I/O (bank 2) |
| Pin 61 | I/O — User I/O (bank 2) |
| Pin 62 | GND — Ground |
| Pin 63 | I/O — User I/O (bank 3) |
| Pin 64 | I/O — User I/O (bank 3) |
| Pin 65 | VCCIO3 — I/O supply, bank 3 |
| Pin 66 | I/O — User I/O (bank 3) |
| Pin 67 | I/O — User I/O (bank 3) |
| Pin 68 | GND — Ground |
| Pin 69 | I/O — User I/O (bank 4) |
| Pin 70 | I/O — User I/O (bank 4) |
| Pin 71 | VCCINT — Core supply, 2.5 V |
| Pin 72 | I/O — User I/O (bank 4) |
| Pin 73 | I/O — User I/O (bank 4) |
| Pin 74 | GND — Ground |
| Pin 75 | I/O — User I/O (bank 5) |
| Pin 76 | I/O — User I/O (bank 5) |
| Pin 77 | VCCIO5 — I/O supply, bank 5 |
| Pin 78 | I/O — User I/O (bank 5) |
| Pin 79 | I/O — User I/O (bank 5) |
| Pin 80 | GND — Ground |
| Pin 81 | I/O — User I/O (bank 6) |
| Pin 82 | I/O — User I/O (bank 6) |
| Pin 83 | VCCINT — Core supply, 2.5 V |
| Pin 84 | I/O — User I/O (bank 6) |
| Pin 85 | I/O — User I/O (bank 6) |
| Pin 86 | GND — Ground |
| Pin 87 | I/O — User I/O (bank 7) |
| Pin 88 | I/O — User I/O (bank 7) |
| Pin 89 | VCCIO7 — I/O supply, bank 7 |
| Pin 90 | I/O — User I/O (bank 7) |
| Pin 91 | I/O — User I/O (bank 7) |
| Pin 92 | GND — Ground |
| Pin 93 | I/O — User I/O (bank 8) |
| Pin 94 | I/O — User I/O (bank 8) |
| Pin 95 | VCCINT — Core supply, 2.5 V |
| Pin 96 | I/O — User I/O (bank 8) |
| Pin 97 | I/O — User I/O (bank 8) |
| Pin 98 | GND — Ground |
| Pin 99 | I/O — User I/O (bank 1) |
| Pin 100 | I/O — User I/O (bank 1) |
| Pin 101 | VCCIO1 — I/O supply, bank 1 |
| Pin 102 | I/O — User I/O (bank 1) |
| Pin 103 | I/O — User I/O (bank 1) |
| Pin 104 | GND — Ground |
| Pin 105 | nSTATUS — Configuration status (open-drain, pull-up required) |
| Pin 106 | nCONFIG — Configuration control input (active low) |
| Pin 107 | DCLK — Configuration clock input |
| Pin 108 | DATA0 — Configuration data input |
| Pin 109 | CONF_DONE — Configuration complete (open-drain, pull-up required) |
| Pin 110 | VCCINT — Core supply, 2.5 V |
| Pin 111 | GND — Ground |
| Pin 112 | TDI — JTAG test data input |
| Pin 113 | TDO — JTAG test data output |
| Pin 114 | TMS — JTAG test mode select |
| Pin 115 | TCK — JTAG test clock |
| Pin 116 | VCCIO8 — I/O supply, bank 8 (JTAG bank) |
| Pin 117 | I/O — User I/O (bank 8) |
| Pin 118 | I/O — User I/O (bank 8) |
| Pin 119 | GND — Ground |
| Pin 120 | I/O — User I/O (bank 8) |
| Pin 121 | I/O — User I/O (bank 8) |
| Pin 122 | VCCINT — Core supply, 2.5 V |
| Pin 123 | I/O — User I/O (bank 7) |
| Pin 124 | I/O — User I/O (bank 7) |
| Pin 125 | VCCIO7 — I/O supply, bank 7 |
| Pin 126 | I/O — User I/O (bank 7) |
| Pin 127 | I/O — User I/O (bank 7) |
| Pin 128 | GND — Ground |
| Pin 129 | I/O — User I/O (bank 6) |
| Pin 130 | I/O — User I/O (bank 6) |
| Pin 131 | VCCINT — Core supply, 2.5 V |
| Pin 132 | I/O — User I/O (bank 6) |
| Pin 133 | I/O — User I/O (bank 6) |
| Pin 134 | GND — Ground |
| Pin 135 | I/O — User I/O (bank 5) |
| Pin 136 | I/O — User I/O (bank 5) |
| Pin 137 | VCCIO5 — I/O supply, bank 5 |
| Pin 138 | I/O — User I/O (bank 5) |
| Pin 139 | I/O — User I/O (bank 5) |
| Pin 140 | GND — Ground |
| Pin 141 | I/O — User I/O (bank 4) |
| Pin 142 | I/O — User I/O (bank 4) |
| Pin 143 | VCCINT — Core supply, 2.5 V |
| Pin 144 | I/O — User I/O (bank 4) |
| Pin 145 | I/O — User I/O (bank 4) |
| Pin 146 | GND — Ground |
| Pin 147 | I/O — User I/O (bank 3) |
| Pin 148 | I/O — User I/O (bank 3) |
| Pin 149 | VCCIO3 — I/O supply, bank 3 |
| Pin 150 | I/O — User I/O (bank 3) |
| Pin 151 | I/O — User I/O (bank 3) |
| Pin 152 | GND — Ground |
| Pin 153 | I/O — User I/O (bank 2) |
| Pin 154 | I/O — User I/O (bank 2) |
| Pin 155 | VCCINT — Core supply, 2.5 V |
| Pin 156 | I/O — User I/O (bank 2) |
| Pin 157 | I/O — User I/O (bank 2) |
| Pin 158 | GND — Ground |
| Pin 159 | I/O — User I/O (bank 1) |
| Pin 160 | I/O — User I/O (bank 1) |
| Pin 161 | VCCIO1 — I/O supply, bank 1 |
| Pin 162 | I/O — User I/O (bank 1) |
| Pin 163 | I/O — User I/O (bank 1) |
| Pin 164 | GND — Ground |
| Pin 165 | CLK0 — Dedicated clock input, DLL reference |
| Pin 166 | CLK1 — Dedicated clock input |
| Pin 167 | CLK2 — Dedicated clock input |
| Pin 168 | CLK3 — Dedicated clock input |
| Pin 169 | VCCIO2 — I/O supply, bank 2 |
| Pin 170 | I/O — User I/O (bank 2) |
| Pin 171 | I/O — User I/O (bank 2) |
| Pin 172 | GND — Ground |
| Pin 173 | I/O — User I/O (bank 2) |
| Pin 174 | I/O — User I/O (bank 2) |
| Pin 175 | VCCINT — Core supply, 2.5 V |
| Pin 176 | I/O — User I/O (bank 2) |
| Pin 177 | I/O — User I/O (bank 2) |
| Pin 178 | GND — Ground |
| Pin 179 | I/O — User I/O (bank 3) |
| Pin 180 | I/O — User I/O (bank 3) |
| Pin 181 | VCCIO3 — I/O supply, bank 3 |
| Pin 182 | I/O — User I/O (bank 3) |
| Pin 183 | I/O — User I/O (bank 3) |
| Pin 184 | GND — Ground |
| Pin 185 | I/O — User I/O (bank 4) |
| Pin 186 | I/O — User I/O (bank 4) |
| Pin 187 | VCCINT — Core supply, 2.5 V |
| Pin 188 | I/O — User I/O (bank 4) |
| Pin 189 | I/O — User I/O (bank 4) |
| Pin 190 | GND — Ground |
| Pin 191 | I/O — User I/O (bank 5) |
| Pin 192 | I/O — User I/O (bank 5) |
| Pin 193 | VCCIO5 — I/O supply, bank 5 |
| Pin 194 | I/O — User I/O (bank 5) |
| Pin 195 | I/O — User I/O (bank 5) |
| Pin 196 | GND — Ground |
| Pin 197 | I/O — User I/O (bank 6) |
| Pin 198 | I/O — User I/O (bank 6) |
| Pin 199 | VCCINT — Core supply, 2.5 V |
| Pin 200 | I/O — User I/O (bank 6) |
| Pin 201 | I/O — User I/O (bank 6) |
| Pin 202 | GND — Ground |
| Pin 203 | I/O — User I/O (bank 7) |
| Pin 204 | I/O — User I/O (bank 7) |
| Pin 205 | VCCIO7 — I/O supply, bank 7 |
| Pin 206 | I/O — User I/O (bank 7) |
| Pin 207 | I/O — User I/O (bank 7) |
| Pin 208 | GND — Ground |
Typical Applications
EPF10K100EQC208-1X is suitable for 7 applications: Telecom Backplane Interface Cards, Industrial Machine Controllers (Legacy Long-Lifecycle), Military and Aerospace Retrofit Boards, Medical Imaging Subsystem Glue Logic, Test & Measurement Instrumentation Backplanes, Legacy Industrial Display and Video Controllers, Networking Line Card Bus Bridges.
Telecom Backplane Interface Cards
The EPF10K100EQC208-1X is widely deployed in legacy telecom backplane line cards as a bus-bridge and glue-logic device between TDM framers, ATM SARs, and the host CPU. The 333.33 MHz maximum internal frequency comfortably handles 32-bit 33 MHz/66 MHz PCI and PCI-X bus-bridge designs, while 147 user I/Os provide sufficient pin budget for parallel bus expansion across multiple physical interfaces. Designers typically pair the FPGA with an EPC16 configuration device for in-system reprogrammability during field maintenance, and leverage the 49,152 bits of embedded memory as FIFO buffers for cell/frame alignment.
Recommended
Industrial Machine Controllers (Legacy Long-Lifecycle)
Long-lifecycle industrial systems such as CNC controllers, programmable logic controllers (PLCs), and factory automation I/O cards frequently specify the EPF10K100EQC208-1X because it was qualified under IEC 61131 and various MIL-STD specifications in the late 1990s and 2000s, and these certifications remain valid for retrofit programs. The 2.5 V core, multi-voltage I/O (1.8 V to 5.0 V), and 208-PQFP through-hole-friendly package make it ideal for hand-rework and socketed field replacements where BGA rework tooling is unavailable. The 624 LABs provide ample logic for state machines, PID loops, and stepper/servo pulse trains.
Recommended
Military and Aerospace Retrofit Boards
Defense and aerospace retrofit programs often target the EPF10K100EQC208-1X because of its long qualification history, MIL-STD-883 burn-in processing availability, and the relative ease of replacing through-hole PQFP packages in older systems. The device's 0.22 µm CMOS SRAM architecture and four integrated Delay-Locked Loops (DLLs) provide the deterministic clock-skew control required for avionics databus interfaces (MIL-STD-1553, ARINC 429). Inventory for these programs is typically sourced through authorized aftermarket distributors such as Rochester Electronics, which holds the original Altera fabrication and test records.
Recommended
Medical Imaging Subsystem Glue Logic
In ultrasound and CT scanner subsystems, the EPF10K100EQC208-1X serves as the channel-count expansion glue logic between the analog front end (AFE), beamformer ASICs, and the host image-processing DSP. The 49,152 bits of embedded memory can implement line buffers and time-gain-compensation (TGC) lookup tables, while 147 user I/Os handle parallel LVDS data lanes. Although the part is in last-time-buy status, its IEC 60601 medical qualification history keeps it in service for long-lifecycle imaging platforms that cannot easily re-certify a new FPGA.
Recommended
Test & Measurement Instrumentation Backplanes
Bench-top and ATE (Automated Test Equipment) instruments use the EPF10K100EQC208-1X to implement instrument-side protocol bridges, trigger generators, and timing sequencers. The 333.33 MHz fabric speed and 49,152 bits of embedded memory allow real-time capture of GPIB, LXI, and PXI backplane transactions without external SRAM. Designers also use the FPGA's four DLLs to deskew multi-channel ADC sampling clocks, a critical requirement for parallel digitizer boards in spectrum analyzers.
Recommended
Legacy Industrial Display and Video Controllers
Older industrial flat-panel displays, video walls, and medical monitors used the EPF10K100EQC208-1X as a low-cost timing controller (TCON) replacement and as a bridge between LVDS/TTL display panels and the host graphics processor. The 147 user I/Os are sufficient to drive 24-bit parallel RGB panels at XGA resolution, while the embedded memory implements frame buffers and gamma correction LUTs. Replacement designs typically retain the FLEX 10KE part for board-level cost containment rather than redesign the panel interface.
Recommended
Networking Line Card Bus Bridges
Enterprise and carrier-grade networking line cards built before 2010 often used the EPF10K100EQC208-1X to bridge between PHY chips, switch fabrics, and management processors running PowerPC or MIPS. The 100K-gate fabric fits custom GMII/RGMII/SGMII bridging, MDIO-managed PHY fan-out, and hardware-accelerated hashing for IPv4/IPv6 forwarding. Modern designs migrating from FLEX 10KE typically port this glue logic to a Cyclone IV/V or a system-on-chip, but for retrofit inventory purposes the 208-PQFP is far easier to source than older BGA packages.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC208-1X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC208-1N | EPF10K100EQC208-1 |
|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE |
| Logic Cells | 4,992 | 4,992 | 4,992 |
| Logic Array Blocks (LABs) | 624 | 624 | 624 |
| User I/Os | 147 | 147 | 147 |
| Speed Grade | -1X (extended commercial corner) | -1N (standard commercial) | -1 (base commercial) |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lifecycle Status | Last-time-buy / mature | Last-time-buy / mature | Last-time-buy / mature |
Key Differentiators
- Extended commercial speed grade for tougher timing margins (vs EPF10K100EQC208-1N)
- Drop-in compatible with same 208-PQFP footprint (vs EPF10K100EQC208-1)
- Through-hole-friendly PQFP package for legacy rework (vs Cyclone IV EP4CE75F484 (BGA))
Design Notes
Power sequencing is critical for FLEX 10KE: apply VCCINT (2.5 V) before any VCCIO rail (1.8/2.5/3.3/5.0 V) to avoid I/O latch-up that can permanently damage the device. Place a 100 µF bulk + 0.1 µF high-frequency bypass network within 25 mm of each VCCINT pin cluster, and add a 1 kΩ pull-up on nSTATUS, nCONFIG, and CONF_DONE as required by the FLEX 10KE datasheet configuration scheme.
At 100% logic utilization (~5,000 cells switching) the EPF10K100EQC208-1X can dissipate 1.5-2.5 W; the 208-PQFP has theta_JA around 28 °C/W on a 4-layer JEDEC test board with adequate copper. Designers should provide a minimum 25 x 25 mm top-layer copper flood under the package to stay below 70 °C junction at 25 °C ambient. Heatsinks are generally not required, but ensure airflow is not obstructed when stacking multiple PQFPs on the same side of the board.
Do not migrate a Quartus II 9.0 design to Quartus Prime 13.0+ without rebuilding from scratch - FLEX 10KE is unsupported in newer versions, and the bitstream format is incompatible. Ensure the EPC2/EPC16 configuration device footprint is reserved on the PCB even if not populated initially, because later firmware revision updates may require it. Finally, verify that VCCIO banks are not driven above 5.0 V, as the FLEX 10KE I/O ring tolerates up to 5.0 V only on specific bank configurations per datasheet pin tables.
Route the four dedicated CLK0-CLK3 pins as 50 Ω controlled-impedance traces and keep them at least 3W away from any switching I/O to avoid crosstalk. Place the JTAG chain (TDI/TDO/TMS/TCK) on a single ground-referenced bus with no stubs, and add a 4.7 kΩ pull-up on TCK to prevent spurious JTAG entry during power-up. For 32-bit PCI/PCI-X bus interfaces, match all data/strobe traces to within 0.5 mm to avoid bus-skew violations.
Compliance Information
RoHS compliance and lead-free status confirmed via distributor listings (DigiKey, Mouser). AEC-Q100 not applicable - this is a programmable logic device, not an automotive analog/digital IC. Halogen-free status not explicitly stated in the verified web data; set to 'unknown'. Original Altera FLEX 10KE family was fabricated at 0.22 µm and qualified under various MIL-STD processing options for military customers (consult Rochester Electronics for MIL-STD-883 variants).
