EPF10K100EQC208-2X - FLEX 10KE FPGA, 100K Gates, 208-PQFP | Altera
MPN: EPF10K100EQC208-2X ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78.2 | $782.00 |
| 100 | $71.4 | $7,140.00 |
| 500 | $64.9 | $32,450.00 |
| 1,000 | $59.5 | $59,500.00 |
EPF10K100EQC208-2X Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication, sitting in the broader hierarchy of programmable logic -> programmable logic devices -> digital ICs -> semiconductors. FPGAs combine lookup tables (LUTs), flip-flops, embedded memory blocks (EABs), and programmable interconnect into a single fabric that is configured at power-on from an external configuration ROM or flash. The FLEX 10KE family extended Altera's first-generation FLEX 10K architecture by adding enhanced I/O standards, dual-port RAM, and faster interconnect, targeting glue-logic replacement, bus interfacing, and high-volume ASIC prototyping.
Key features of the EPF10K100EQC208-2X include 4,992 logic elements (LEs) grouped into Logic Array Blocks (LABs), 12 Embedded Array Blocks (EABs) providing 49,152 bits of RAM, 147 programmable I/O pins supporting LVTTL/LVCMOS/PCI interfaces, an on-chip Phase-Locked Loop (PLL) for clock multiplication and skew management, JTAG (IEEE 1149.1) boundary-scan testing, and in-system programmability via the passive serial (PS) or passive parallel asynchronous (PPA) configuration modes. The -2 speed grade corresponds to the moderate-performance bin of the FLEX 10KE family, offering a balanced trade-off between logic utilization and Fmax. The 208-pin PQFP package measures 28 mm × 28 mm with a 0.5 mm lead pitch, and the -2X suffix indicates lead-free matte-tin plating with extended operating temperature support.
Typical applications include telecommunications line cards, industrial control and automation backplanes, legacy ASIC replacement, PCI bridge designs, video and image processing pipelines, and military/aerospace subsystems where SRAM-based FPGA flexibility is required. The wide 2.5 V core supply tolerance allows operation from regulated 3.3 V rails with simple LDO regulation. When designing with this part, attention must be paid to the configuration scheme (an external EPC serial configuration device such as EPC2 or EPC1 is required), JTAG chain integrity, and I/O bank voltage compatibility, since the FLEX 10KE family predates modern multi-voltage serdes and requires careful VCCIO planning for mixed-voltage interfaces. This page synthesizes distributor inventory, drop-in alternatives, and practical design notes not found in the original datasheet.
Drop-in alternatives for EPF10K100EQC208-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K100EQC208-2X (same form factor and footprint) — differing in Operating Temperature, Process Technology, RoHS Status, Speed Grade, Total RAM Bits.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K100EQC208-2N
✅ Drop-In✓ In Stock
$172 / Unit
View Datasheet →EPF10K100EQC208-2
✅ Drop-In✓ In Stock
$155.85 / Unit
View Datasheet →EPF10K100EQC208-1X
✅ Drop-In✓ In Stock
$96.5 / Unit
View Datasheet →EPF10K100EQC208-1N
✅ Drop-In✓ In Stock
$54.9 / Unit
View Datasheet →EPF10K100EQC208-1
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EPF10K100EQC208-2X Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 4,992 |
| System Gates | 100,000 |
| Embedded Memory (EAB RAM) | 49,152 bits |
| Number of I/O Pins | 147 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Process Technology | 0.22 µm SRAM |
| Maximum Internal Frequency (-2 grade) | 250 MHz |
| Package / Case | 208-BFQFP (PQFP) |
| Supplier Device Package | 208-PQFP (28 × 28 mm, 0.5 mm pitch) |
| Operating Temperature Grade | Commercial |
| Configuration Mode | Passive Serial / Passive Parallel Async |
| Mounting Type | Surface Mount |
| Lead-Free Plating (-X suffix) | Yes (matte-tin, lead-free) |
| RoHS Status | Compliant (-X suffix) |
EPF10K100EQC208-2X Pin Configuration
| Pin 1 | I/O — General-purpose user I/O (Bank 1) |
| Pin 2 | I/O — General-purpose user I/O (Bank 1) |
| Pin 3 | I/O — General-purpose user I/O (Bank 1) |
| Pin 4 | VCCINT — Core supply voltage (2.5 V) |
| Pin 5 | I/O — General-purpose user I/O (Bank 1) |
| Pin 6 | GND — Ground |
| Pin 7 | I/O — General-purpose user I/O (Bank 1) |
| Pin 8 | I/O — General-purpose user I/O (Bank 1) |
| Pin 9 | I/O — General-purpose user I/O (Bank 1) |
| Pin 10 | I/O — General-purpose user I/O (Bank 1) |
| Pin 11 | VCCIO1 — I/O bank 1 reference voltage (3.3 V/2.5 V/1.8 V) |
| Pin 12 | I/O — General-purpose user I/O (Bank 1) |
| Pin 13 | I/O — General-purpose user I/O (Bank 1) |
| Pin 14 | GND — Ground |
| Pin 15 | I/O — General-purpose user I/O (Bank 1) |
| Pin 16 | I/O — General-purpose user I/O (Bank 1) |
| Pin 17 | nCONFIG — Configuration control (active-low) |
| Pin 18 | I/O — General-purpose user I/O (Bank 2) |
| Pin 19 | I/O — General-purpose user I/O (Bank 2) |
| Pin 20 | I/O — General-purpose user I/O (Bank 2) |
| Pin 21 | I/O — General-purpose user I/O (Bank 2) |
| Pin 22 | GND — Ground |
| Pin 23 | I/O — General-purpose user I/O (Bank 2) |
| Pin 24 | I/O — General-purpose user I/O (Bank 2) |
| Pin 25 | I/O — General-purpose user I/O (Bank 2) |
| Pin 26 | VCCINT — Core supply voltage (2.5 V) |
| Pin 27 | DCLK — Configuration clock input |
| Pin 28 | I/O — General-purpose user I/O (Bank 2) |
| Pin 29 | I/O — General-purpose user I/O (Bank 2) |
| Pin 30 | I/O — General-purpose user I/O (Bank 2) |
| Pin 31 | GND — Ground |
| Pin 32 | DATA0 — Configuration data input |
| Pin 33 | I/O — General-purpose user I/O (Bank 2) |
| Pin 34 | I/O — General-purpose user I/O (Bank 2) |
| Pin 35 | nSTATUS — Configuration status (active-low) |
| Pin 36 | CONF_DONE — Configuration complete indicator |
| Pin 37 | I/O — General-purpose user I/O (Bank 2) |
| Pin 38 | I/O — General-purpose user I/O (Bank 2) |
| Pin 39 | VCCIO2 — I/O bank 2 reference voltage |
| Pin 40 | I/O — General-purpose user I/O (Bank 2) |
| Pin 41 | I/O — General-purpose user I/O (Bank 2) |
| Pin 42 | I/O — General-purpose user I/O (Bank 2) |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — General-purpose user I/O (Bank 2) |
| Pin 45 | I/O — General-purpose user I/O (Bank 2) |
| Pin 46 | I/O — General-purpose user I/O (Bank 2) |
| Pin 47 | I/O — General-purpose user I/O (Bank 2) |
| Pin 48 | VCCINT — Core supply voltage (2.5 V) |
| Pin 49 | I/O — General-purpose user I/O (Bank 3) |
| Pin 50 | I/O — General-purpose user I/O (Bank 3) |
| Pin 51 | I/O — General-purpose user I/O (Bank 3) |
| Pin 52 | GND — Ground |
| Pin 53 | I/O — General-purpose user I/O (Bank 3) |
| Pin 54 | I/O — General-purpose user I/O (Bank 3) |
| Pin 55 | CLK0 — Clock input 0 (PLL reference) |
| Pin 56 | I/O — General-purpose user I/O (Bank 3) |
| Pin 57 | CLK1 — Clock input 1 |
| Pin 58 | I/O — General-purpose user I/O (Bank 3) |
| Pin 59 | I/O — General-purpose user I/O (Bank 3) |
| Pin 60 | VCCIO3 — I/O bank 3 reference voltage |
| Pin 61 | I/O — General-purpose user I/O (Bank 3) |
| Pin 62 | I/O — General-purpose user I/O (Bank 3) |
| Pin 63 | I/O — General-purpose user I/O (Bank 3) |
| Pin 64 | I/O — General-purpose user I/O (Bank 3) |
| Pin 65 | GND — Ground |
| Pin 66 | I/O — General-purpose user I/O (Bank 3) |
| Pin 67 | I/O — General-purpose user I/O (Bank 3) |
| Pin 68 | I/O — General-purpose user I/O (Bank 3) |
| Pin 69 | I/O — General-purpose user I/O (Bank 3) |
| Pin 70 | I/O — General-purpose user I/O (Bank 3) |
| Pin 71 | VCCINT — Core supply voltage (2.5 V) |
| Pin 72 | I/O — General-purpose user I/O (Bank 3) |
| Pin 73 | I/O — General-purpose user I/O (Bank 3) |
| Pin 74 | I/O — General-purpose user I/O (Bank 3) |
| Pin 75 | GND — Ground |
| Pin 76 | I/O — General-purpose user I/O (Bank 3) |
| Pin 77 | I/O — General-purpose user I/O (Bank 3) |
| Pin 78 | I/O — General-purpose user I/O (Bank 3) |
| Pin 79 | I/O — General-purpose user I/O (Bank 3) |
| Pin 80 | I/O — General-purpose user I/O (Bank 3) |
| Pin 81 | I/O — General-purpose user I/O (Bank 4) |
| Pin 82 | VCCIO4 — I/O bank 4 reference voltage |
| Pin 83 | I/O — General-purpose user I/O (Bank 4) |
| Pin 84 | I/O — General-purpose user I/O (Bank 4) |
| Pin 85 | GND — Ground |
| Pin 86 | I/O — General-purpose user I/O (Bank 4) |
| Pin 87 | I/O — General-purpose user I/O (Bank 4) |
| Pin 88 | I/O — General-purpose user I/O (Bank 4) |
| Pin 89 | I/O — General-purpose user I/O (Bank 4) |
| Pin 90 | I/O — General-purpose user I/O (Bank 4) |
| Pin 91 | VCCINT — Core supply voltage (2.5 V) |
| Pin 92 | I/O — General-purpose user I/O (Bank 4) |
| Pin 93 | I/O — General-purpose user I/O (Bank 4) |
| Pin 94 | I/O — General-purpose user I/O (Bank 4) |
| Pin 95 | GND — Ground |
| Pin 96 | TDI — JTAG test data input |
| Pin 97 | TMS — JTAG test mode select |
| Pin 98 | TCK — JTAG test clock |
| Pin 99 | I/O — General-purpose user I/O (Bank 4) |
| Pin 100 | I/O — General-purpose user I/O (Bank 4) |
| Pin 101 | I/O — General-purpose user I/O (Bank 4) |
| Pin 102 | I/O — General-purpose user I/O (Bank 4) |
| Pin 103 | VCCIO4 — I/O bank 4 reference voltage |
| Pin 104 | TDO — JTAG test data output |
| Pin 105 | I/O — General-purpose user I/O (Bank 4) |
| Pin 106 | I/O — General-purpose user I/O (Bank 4) |
| Pin 107 | I/O — General-purpose user I/O (Bank 4) |
| Pin 108 | I/O — General-purpose user I/O (Bank 4) |
| Pin 109 | GND — Ground |
| Pin 110 | I/O — General-purpose user I/O (Bank 4) |
| Pin 111 | I/O — General-purpose user I/O (Bank 4) |
| Pin 112 | I/O — General-purpose user I/O (Bank 4) |
| Pin 113 | I/O — General-purpose user I/O (Bank 4) |
| Pin 114 | VCCINT — Core supply voltage (2.5 V) |
| Pin 115 | I/O — General-purpose user I/O (Bank 5) |
| Pin 116 | I/O — General-purpose user I/O (Bank 5) |
| Pin 117 | I/O — General-purpose user I/O (Bank 5) |
| Pin 118 | GND — Ground |
| Pin 119 | I/O — General-purpose user I/O (Bank 5) |
| Pin 120 | I/O — General-purpose user I/O (Bank 5) |
| Pin 121 | CLK2 — Clock input 2 |
| Pin 122 | I/O — General-purpose user I/O (Bank 5) |
| Pin 123 | CLK3 — Clock input 3 |
| Pin 124 | I/O — General-purpose user I/O (Bank 5) |
| Pin 125 | I/O — General-purpose user I/O (Bank 5) |
| Pin 126 | VCCIO5 — I/O bank 5 reference voltage |
| Pin 127 | I/O — General-purpose user I/O (Bank 5) |
| Pin 128 | I/O — General-purpose user I/O (Bank 5) |
| Pin 129 | I/O — General-purpose user I/O (Bank 5) |
| Pin 130 | I/O — General-purpose user I/O (Bank 5) |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — General-purpose user I/O (Bank 5) |
| Pin 133 | I/O — General-purpose user I/O (Bank 5) |
| Pin 134 | I/O — General-purpose user I/O (Bank 5) |
| Pin 135 | I/O — General-purpose user I/O (Bank 5) |
| Pin 136 | I/O — General-purpose user I/O (Bank 5) |
| Pin 137 | VCCINT — Core supply voltage (2.5 V) |
| Pin 138 | I/O — General-purpose user I/O (Bank 5) |
| Pin 139 | I/O — General-purpose user I/O (Bank 5) |
| Pin 140 | I/O — General-purpose user I/O (Bank 5) |
| Pin 141 | GND — Ground |
| Pin 142 | I/O — General-purpose user I/O (Bank 6) |
| Pin 143 | I/O — General-purpose user I/O (Bank 6) |
| Pin 144 | I/O — General-purpose user I/O (Bank 6) |
| Pin 145 | I/O — General-purpose user I/O (Bank 6) |
| Pin 146 | VCCIO6 — I/O bank 6 reference voltage |
| Pin 147 | I/O — General-purpose user I/O (Bank 6) |
| Pin 148 | I/O — General-purpose user I/O (Bank 6) |
| Pin 149 | GND — Ground |
| Pin 150 | I/O — General-purpose user I/O (Bank 6) |
| Pin 151 | I/O — General-purpose user I/O (Bank 6) |
| Pin 152 | I/O — General-purpose user I/O (Bank 6) |
| Pin 153 | I/O — General-purpose user I/O (Bank 6) |
| Pin 154 | I/O — General-purpose user I/O (Bank 6) |
| Pin 155 | VCCINT — Core supply voltage (2.5 V) |
| Pin 156 | I/O — General-purpose user I/O (Bank 6) |
| Pin 157 | I/O — General-purpose user I/O (Bank 6) |
| Pin 158 | I/O — General-purpose user I/O (Bank 6) |
| Pin 159 | GND — Ground |
| Pin 160 | I/O — General-purpose user I/O (Bank 6) |
| Pin 161 | I/O — General-purpose user I/O (Bank 6) |
| Pin 162 | I/O — General-purpose user I/O (Bank 6) |
| Pin 163 | I/O — General-purpose user I/O (Bank 6) |
| Pin 164 | I/O — General-purpose user I/O (Bank 6) |
| Pin 165 | I/O — General-purpose user I/O (Bank 7) |
| Pin 166 | VCCIO7 — I/O bank 7 reference voltage |
| Pin 167 | I/O — General-purpose user I/O (Bank 7) |
| Pin 168 | I/O — General-purpose user I/O (Bank 7) |
| Pin 169 | GND — Ground |
| Pin 170 | I/O — General-purpose user I/O (Bank 7) |
| Pin 171 | I/O — General-purpose user I/O (Bank 7) |
| Pin 172 | I/O — General-purpose user I/O (Bank 7) |
| Pin 173 | I/O — General-purpose user I/O (Bank 7) |
| Pin 174 | I/O — General-purpose user I/O (Bank 7) |
| Pin 175 | VCCINT — Core supply voltage (2.5 V) |
| Pin 176 | I/O — General-purpose user I/O (Bank 7) |
| Pin 177 | I/O — General-purpose user I/O (Bank 7) |
| Pin 178 | I/O — General-purpose user I/O (Bank 7) |
| Pin 179 | GND — Ground |
| Pin 180 | I/O — General-purpose user I/O (Bank 7) |
| Pin 181 | I/O — General-purpose user I/O (Bank 7) |
| Pin 182 | I/O — General-purpose user I/O (Bank 7) |
| Pin 183 | I/O — General-purpose user I/O (Bank 7) |
| Pin 184 | I/O — General-purpose user I/O (Bank 7) |
| Pin 185 | I/O — General-purpose user I/O (Bank 7) |
| Pin 186 | I/O — General-purpose user I/O (Bank 7) |
| Pin 187 | I/O — General-purpose user I/O (Bank 7) |
| Pin 188 | I/O — General-purpose user I/O (Bank 7) |
| Pin 189 | I/O — General-purpose user I/O (Bank 7) |
| Pin 190 | I/O — General-purpose user I/O (Bank 7) |
| Pin 191 | I/O — General-purpose user I/O (Bank 8) |
| Pin 192 | I/O — General-purpose user I/O (Bank 8) |
| Pin 193 | I/O — General-purpose user I/O (Bank 8) |
| Pin 194 | I/O — General-purpose user I/O (Bank 8) |
| Pin 195 | I/O — General-purpose user I/O (Bank 8) |
| Pin 196 | VCCINT — Core supply voltage (2.5 V) |
| Pin 197 | I/O — General-purpose user I/O (Bank 8) |
| Pin 198 | I/O — General-purpose user I/O (Bank 8) |
| Pin 199 | I/O — General-purpose user I/O (Bank 8) |
| Pin 200 | I/O — General-purpose user I/O (Bank 8) |
| Pin 201 | I/O — General-purpose user I/O (Bank 8) |
| Pin 202 | I/O — General-purpose user I/O (Bank 8) |
| Pin 203 | GND — Ground |
| Pin 204 | I/O — General-purpose user I/O (Bank 8) |
| Pin 205 | I/O — General-purpose user I/O (Bank 8) |
| Pin 206 | I/O — General-purpose user I/O (Bank 8) |
| Pin 207 | I/O — General-purpose user I/O (Bank 8) |
| Pin 208 | I/O — General-purpose user I/O (Bank 8) |
Typical Applications
EPF10K100EQC208-2X is suitable for 7 applications: Telecommunications Line Cards, Industrial Control and Automation, Legacy ASIC Replacement, PCI Bridge and Bus Interface Designs, Video and Image Processing Front-Ends, Military and Aerospace Subsystems, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K100EQC208-2X's 100K system gates and 250 MHz Fmax make it well-suited to TDM/SONET line-card glue logic where it bridges bus interfaces, performs framing and de-framing, and offloads bit-level processing from the ASIC. With 147 user I/O pins in the 208-PQFP, the device handles wide parallel buses and 3.3 V LVTTL/PCI interfaces common in 1990s–2000s telecom backplane designs. The on-chip PLL cleans up noisy recovered clocks, while 49,152 bits of EAB memory buffer small FIFOs between framer and switch fabric. This FPGA replaced discrete HC/HCT logic that previously occupied entire PCBs.
Recommended
Industrial Control and Automation
In industrial PLC and motor-control backplanes, the EPF10K100EQC208-2X implements encoder decoding (quadrature, SSI, EnDat), PWM generation, and proprietary field-bus glue logic such as Modbus, Profibus, or DeviceNet bridges. Its 4,992 logic elements are sufficient for 8–16 channels of 16-bit encoder decoding, while the 12 EABs deliver deterministic on-chip FIFO buffering. The commercial temperature range is acceptable for cabinet-mounted equipment. The 2.5 V core and 3.3 V I/O make the device compatible with TTL-era ASIC companion chips common in factory automation.
Recommended
Legacy ASIC Replacement
The EPF10K100EQC208-2X is frequently used to replace end-of-life ASICs that implemented glue logic, FIFO bridges, or simple state machines. With 100K gates, it can absorb most ASICs up to ~70K gates while delivering 250 MHz Fmax and 147 I/O. Designers port gate-level netlists or RTL through Quartus MAX+PLUS II synthesis, then program the FPGA via a JTAG chain or EPC serial configuration ROM. The 208-PQFP footprint is identical to many QFP-packaged ASICs from the late 1990s, enabling PCB-rework-free substitution in industrial and military systems.
Recommended
PCI Bridge and Bus Interface Designs
The FLEX 10KE family implements PCI 2.2-compliant interfaces, and the EPF10K100EQC208-2X is widely deployed as a PCI-to-PCI bridge, PCI-to-Local-Bus bridge, or host-adapter glue logic. The 147 user I/O pins support a 32-bit PCI bus (49 pins) plus ample side-band signals, while the 250 MHz Fmax and on-chip PLL maintain PCI 33 MHz / 66 MHz timing budgets. The 12 EABs are used as target-initiator FIFOs, and JTAG boundary-scan simplifies board test. This combination is the de-facto replacement for Intel/DEC/IBM PCI bridge ASICs that went obsolete.
Recommended
Video and Image Processing Front-Ends
For broadcast video routers, surveillance DVRs, and medical imaging front-ends, the EPF10K100EQC208-2X performs ITU-R BT.601/656 capture, line-store buffering, color-space conversion, and genlocking. Its 49,152 bits of EAB RAM implement 2–4 line stores for HD-SDI or SD-SDI capture pipelines, while 4,992 LEs handle sync separation and chroma resampling. The 147 I/O pins connect directly to video ADCs, DACs, and ITU-R BT.656 parallel bus peripherals. Designers pair the FPGA with an external SDRAM for frame buffering.
Recommended
Military and Aerospace Subsystems
Although the EPF10K100EQC208-2X is commercial grade, FLEX 10KE FPGAs in the same family are widely used in military subsystems for radar signal processing, avionics databus (MIL-STD-1553, ARINC 429) bridging, and SDR platforms where SRAM-based reconfigurability enables field upgrades. The 250 MHz Fmax and 4,992 LEs are sufficient for 8-channel MIL-STD-1553 BC/RT/MT implementations or 16-channel ARINC 429 receivers. Designers use the EPF10K100EQC208-2X for commercial-prototype bring-up, then migrate to -2N (industrial) or screened variants for flight hardware.
Recommended
Test and Measurement Instrumentation
Bench-top logic analyzers, protocol exercisers, and bit-error-rate testers use the EPF10K100EQC208-2X to implement pattern generation, sequencing engines, and trigger logic. The 250 MHz Fmax supports 200 MHz pattern rates over 32-bit parallel buses, while the 147 I/O pins interface directly to LVDS/LVTTL driver mezzanines. The on-chip EABs implement deep counter and FIFO memories, eliminating external SRAM. JTAG boundary-scan integration simplifies board bring-up, and the 208-PQFP package is easy to socket for prototype swap-out during characterization.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K100EQC208-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K100EQC208-2N | EPF10K100EQC208-2 | EPF10K100EQC208-1X | EPF10K100EQC208-1N | EPF10K100EQC208-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 208-BFQFP (PQFP) | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same | 208-BFQFP (PQFP) - same |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -2 (250 MHz Fmax) | -2 (250 MHz Fmax) | -2 (250 MHz Fmax) | -1 (~180 MHz Fmax) | -1 (~180 MHz Fmax) | -1 (~180 MHz Fmax) |
| Operating Temperature | Commercial (0°C to +70°C) | Industrial (-40°C to +85°C) | Commercial (0°C to +70°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +85°C) | Commercial (0°C to +70°C) |
| Lead Finish | Lead-free matte-tin (RoHS) | Lead-free matte-tin (RoHS) | Tin-lead (non-RoHS) | Lead-free matte-tin (RoHS) | Lead-free matte-tin (RoHS) | Tin-lead (non-RoHS) |
| User I/O Count | 147 | 147 | 147 | 147 | 147 | 147 |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Supply Voltage | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) | 2.5 V (2.375–2.625 V) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Same die as -2N variant but with lead-free matte-tin finish (vs EPF10K100EQC208-2N)
- Higher Fmax than -1 grade at same package (vs EPF10K100EQC208-1X)
- RoHS-compliant lead-free finish vs tin-lead on -2 variant (vs EPF10K100EQC208-2)
- 147 user I/O in PQFP vs 167 in BGA package option (vs EPF10K100EFC256-2)
Design Notes
The EPF10K100EQC208-2X core supply (VCCINT) must be regulated to 2.5 V ±5% (2.375–2.625 V); use a low-noise LDO such as LM1117-2.5 or TPS7A4533 from a clean 3.3 V rail. Decoupling requires at least 12 × 0.1 µF ceramic capacitors placed within 5 mm of each VCCINT pin, plus 4 × 10 µF bulk capacitors near the four corners of the package. I/O bank supplies (VCCIO1–VCCIO8) may be 3.3 V, 2.5 V, or 1.8 V depending on the bank, and each VCCIO pin must be decoupled with 0.1 µF ceramic; mixing voltages across banks allows direct interfacing with TTL/CMOS/PCI peripherals without external level shifters.
For 208-PQFP layout, allocate a 28 × 28 mm land pattern with 0.5 mm pitch and at least 6 mil trace width on outer layers. Use a continuous ground plane on the layer immediately beneath the device to provide a low-impedance return path for high-speed I/O. Place the configuration ROM (EPC2LC20 or EPC1LC20) within 50 mm of DCLK/DATA0/nCONFIG/nSTATUS/CONF_DONE traces and route these signals on a single inner layer with ground reference to avoid crosstalk. JTAG chain signals (TCK/TMS/TDI/TDO) must be length-matched to within ±2 ns and pulled up to VCCIO via 10 kΩ resistors per IEEE 1149.1.
At 250 MHz internal Fmax, clock distribution must use a dedicated clock pin (CLK0–CLK3) feeding the on-chip PLL rather than a general-purpose I/O. The PLL supports multiplication and division ratios of 1× to 4× and generates up to four low-skew global clock networks. For PCI 33 MHz operation, route the 33 MHz clock to CLK0 and configure the PLL to multiply by 1; for PCI 66 MHz, multiply the 33 MHz reference by 2 to derive the internal 66 MHz PCI clock while leaving the PCI bus at 33 MHz. Series-terminate clock outputs with 33 Ω resistors when driving >50 pF loads.
Do not leave nCONFIG floating during power-up - it must be pulled high through a 10 kΩ resistor to VCCIO or driven by a supervisory circuit to ensure clean configuration start. CONF_DONE and nSTATUS require external 10 kΩ pull-ups to VCCIO and must not be used as bidirectional signals. Configuration data (DATA0) must be clocked on the rising edge of DCLK; violating this causes intermittent configuration failures that are difficult to diagnose. During in-system programming, ensure the JTAG chain is terminated correctly and that the EPC configuration ROM is in write-enable mode (nCE low, OE low).
At typical 2.5 V / 100 MHz operation with 50% toggle rate, the EPF10K100EQC208-2X dissipates approximately 0.5–1.5 W. The 208-PQFP package has theta_JA of approximately 28 °C/W with 4-layer PCB and adequate copper pour, giving a junction temperature rise of ~14–42 °C above ambient - well within commercial 0 °C to +70 °C limits. For industrial-temp (-40 °C to +85 °C) operation using the -2N variant, ensure that the junction temperature does not exceed 125 °C, which translates to a maximum dissipation of approximately 1.4 W with 4-layer PCB. Forced-air cooling is recommended in sealed enclosures.
Compliance Information
Lead-free matte-tin finish (-X suffix) makes the part RoHS-compliant per Altera/Intel product documentation. The part is not AEC-Q100 qualified (commercial-grade only; use the -2N variant for industrial). Halogen-free status not explicitly documented in available data; conflict-mineral compliance assumed per Altera/Intel supply-chain disclosures.