EPF10K10ATC100-3N - 10K Gates FLEX-10KA FPGA, 100-TQFP | Intel
MPN: EPF10K10ATC100-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $9.95 | $9,950.00 |
EPF10K10ATC100-3N Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be rewired after manufacture to implement arbitrary digital functions. Within the broader taxonomy, the EPF10K10ATC100-3N belongs to the SRAM-based programmable logic family, sitting between simple Complex Programmable Logic Devices (CPLDs) and modern high-density FPGAs. The FLEX-10KA family pioneered the embedded array block (EAB) concept, allowing on-chip memory and logic-rich functions to be instantiated without external components, which made it a System-on-a-Programmable-Chip (SOPC) for its era.
Key features include a 0.3 micron CMOS SRAM process, 0.6 ns propagation delay through the FastTrack interconnect, in-system programmability via an external configuration EPROM, multiVolt I/O support, and joint Test Action Group (JTAG) boundary-scan test. The 100-pin TQFP footprint provides easy hand-soldering and breadboard-friendly prototyping compared with fine-pitch BGA packages in the same generation.
Typical applications include glue logic replacement, bus-interface bridging, custom state-machine controllers, prototype ASIC validation, legacy industrial control retrofits, and educational digital-design platforms. With 10K gates of logic and 12 Kbits of block RAM, the part can host small to medium state machines, FIFO buffers, and parallel peripheral interfaces.
When designing with this device, plan for an external configuration memory (such as the EPC2 or EPC8 family) and a JTAG header for in-system programming. The commercial temperature grade limits deployment to indoor equipment; for industrial or automotive environments, an I-grade or A-grade variant from the FLEX-10KA family should be selected. This page synthesizes distributor pricing, verified FLEX-10KA family drop-in alternatives, and practical design notes not collected in a single location on the manufacturer datasheet.
Drop-in alternatives for EPF10K10ATC100-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K10ATC100-3N (same form factor and footprint) — differing in Family, Operating Temperature, Package, Series, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K10ATC100-2
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF10K10ATC100-1
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →EPF10K10ATC100-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K10ATC100-3N Maximum Ratings & Electrical Characteristics
| Series | FLEX-10KA |
| Family | FLEX 10K |
| Typical Gates | 10,000 |
| Logic Elements | 576 |
| Logic Array Blocks (LABs) | 72 |
| Embedded Memory (RAM bits) | 12,288 |
| User I/Os | 66 |
| Maximum Frequency | 125 MHz |
| Propagation Delay | 0.6 ns |
| Supply Voltage | 3.3 V |
| Process Technology | 0.3 um CMOS |
| Package | 100-TQFP |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 C to 70 C |
| Configuration Method | SRAM, external configuration EPROM |
| Programmable Logic Type | FPGA (in-system programmable) |
EPF10K10ATC100-3N 100-tqfp Pin Configuration Guide
Pin configuration for EPF10K10ATC100-3N (100-tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K10ATC100-3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K10ATC100-3N is suitable for 6 applications: Glue Logic and Bus Interface Bridging, Custom State Machine Controllers, Prototype ASIC Validation and Emulation, Legacy Industrial Control Retrofits, Educational Digital Design Platforms, FIFO Buffer and Protocol Converter.
Glue Logic and Bus Interface Bridging
The EPF10K10ATC100-3N is a strong fit for glue-logic and bus-interface bridging because its 10K-gate capacity and 66 user I/Os comfortably host parallel-to-parallel converters and protocol adapters in legacy industrial systems. The 100-TQFP package exposes four I/O banks, which lets the FPGA bridge 5 V and 3.3 V domains simultaneously using the multiVolt I/O feature, a critical requirement when connecting modern peripherals to legacy ISA or VME backplanes. With a 0.6 ns propagation delay through the FastTrack interconnect and 125 MHz Fmax at the -3 speed grade, the device adds minimal latency to bus cycles, making it suitable for transparent memory and peripheral bridges in telecom backplane equipment. Designers typically instantiate FIFO buffers in the embedded EABs to absorb clock-domain crossings between the host bus and the peripheral side.
Recommended
Custom State Machine Controllers
The 576 logic elements and 72 LABs in the EPF10K10ATC100-3N provide ample headroom for implementing multi-state Moore and Mealy controllers that previously required discrete 22V10/26V12 PALs or GALs. The 12,288 bits of embedded memory in the EABs can hold next-state encodings and conditional branch tables, enabling controllers with hundreds of states while still leaving room for I/O glue. The 125 MHz internal Fmax at -3 grade gives designers comfortable timing margin for state-transition decoding at industrial bus speeds (ISA, I2C, SPI). Compared with PAL alternatives, the FPGA-based state machine is in-system reprogrammable, so firmware revisions can be pushed via JTAG without reworking the PCB.
Recommended
Prototype ASIC Validation and Emulation
Engineers historically used the EPF10K10ATC100-3N as a pre-silicon validation platform for ASIC designs in the 5K to 15K gate range. The FPGA's deterministic timing, JTAG boundary-scan, and rich register-level debugging in MAX+PLUS II allowed engineers to iterate on RTL code months before mask sets were committed. The 100-TQFP package is breadboard-friendly, making it ideal for laboratory emulation benches where ASIC prototypes are exercised against real-world peripherals. With 12 Kbits of embedded memory, the FPGA can also emulate simple SRAM blocks and FIFOs that would otherwise require discrete parts on the validation board.
Recommended
Legacy Industrial Control Retrofits
Many factory-floor controllers and CNC machines built in the late 1990s and early 2000s use FLEX-10KA FPGAs that are now obsolete. The EPF10K10ATC100-3N, sourced from verified distributor stock, allows maintenance teams to replace failed legacy silicon on existing 100-TQFP footprints without re-spinning the entire controller board. The 0 C to 70 C commercial temperature range covers most indoor industrial cabinets, and the 3.3 V supply aligns with the surrounding digital logic. Because the part is bitstream-compatible with the broader FLEX-10KA family, the existing configuration PROM can often be reused or simply reprogrammed for the replacement device.
Recommended
Educational Digital Design Platforms
Universities and training institutes adopted the EPF10K10ATC100-3N as a teaching platform for digital-logic courses because the 100-TQFP package is hand-solderable on through-hole adapter boards, and the MAX+PLUS II student-edition toolchain was freely available. The 66 I/Os and 12 Kbits of RAM are sufficient for laboratory projects ranging from seven-segment display controllers to UART implementations and VGA signal generators. Each student can program the device via JTAG and observe their design in real hardware, reinforcing RTL concepts learned in lecture. The part remains a popular choice for legacy lab kits even though the FLEX-10KA family is no longer recommended for new commercial designs.
Recommended
FIFO Buffer and Protocol Converter
The embedded array blocks (EABs) in the EPF10K10ATC100-3N can be configured as dual-port or FIFO RAM with widths up to 32 bits and depths up to 256 words, making the part a natural fit for clock-domain crossing buffers and protocol converters. Engineers commonly use the device to bridge synchronous peripherals to asynchronous legacy buses, or to convert between UART, SPI, I2C, and parallel interfaces in embedded systems. The 125 MHz Fmax supports serial protocols well above 10 Mbaud, and the 66 user I/Os allow several channels to be multiplexed through a single device. Compared with discrete FIFO chips, the FPGA approach is reconfigurable, so the same hardware can serve multiple product variants by simply changing the bitstream.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K10ATC100-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K10ATC100-2 | EPF10K10ATC100-1 | EPF10K10ATC100-3 | EPF10K10AQC208-3N | EPF10K10AQC208-3 |
|---|---|---|---|---|---|---|
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 208-PQFP - different | 208-PQFP - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA |
| Speed Grade | -3 (125 MHz) | -2 (~100 MHz) | -1 (~80 MHz) | -3 (125 MHz) | -3 (125 MHz) | -3 (125 MHz) |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| User I/Os | 66 | 66 | 66 | 66 | 134 (208-pin package) | 134 (208-pin package) |
| Embedded Memory | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade in the EPF10K10A 100-TQFP family (vs EPF10K10ATC100-2)
- Drop-in pin-compatible 100-TQFP footprint across all speed grades (vs EPF10K10AQC208-3N)
- Pb-free terminal finish option (vs EPF10K10ATC100-3)
Design Notes
The EPF10K10ATC100-3N requires a clean 3.3 V supply; per the manufacturer datasheet, place a 100 uF bulk tantalum capacitor and a 0.1 uF ceramic decoupling cap within 25 mm of each VCC pin pair. The I/O banks can be powered independently at 2.5 V, 3.3 V, or 5 V using the multiVolt I/O feature, but each bank requires its own decoupling network. During configuration, ICC can spike to 500 mA as the SRAM cells are loaded; ensure the regulator has at least 1 A of headroom. Power sequencing is not strictly required, but holding nCONFIG low until all rails are stable prevents in-rush glitches.
Use a 4-layer PCB with a continuous ground plane beneath the 100-TQFP footprint to provide a low-impedance return path for the high-speed configuration clock (DCLK). Route the JTAG signals (TCK, TMS, TDI, TDO) as a short daisy-chain if multiple devices share the bus, with 10 kohm pull-ups on TCK, TMS, and TDI. Keep the DATA and DCLK traces away from noisy switching signals and length-match them within 50 mils. Expose nCONFIG, nSTATUS, and CONF_DONE to test points so engineers can manually trigger reconfiguration during bring-up.
Do not assume any I/O pin is 5 V tolerant - verify the specific bank voltage and reference the datasheet's absolute maximum ratings before interfacing to legacy 5 V logic. The configuration PROM must be sized for the compressed bitstream; using an EPC1 on a design that requires EPC2 capacity will fail to configure. The FLEX-10KA silicon is SRAM-based, so the bitstream is lost on power-down; for non-volatile behavior, pair the FPGA with a configuration PROM and consider a battery-backed option for critical applications. Finally, the Quartus Prime toolchain dropped FLEX-10KA support after version 13.0sp1, so legacy maintenance workflows must retain a virtual machine with that exact version installed.
Compliance Information
The "N" suffix in EPF10K10ATC100-3N indicates a Pb-free terminal finish per Altera/Intel legacy naming conventions. RoHS, REACH, and halogen-free status were not explicitly confirmed in the verified distributor data reviewed on 2026-09-11; engineers should request the manufacturer's material declaration before assuming compliance for European Union markets.
