EPF10K10QC208-3 - 10K Gates FLEX 10K FPGA, 134 I/O, 208-PQFP | Intel
MPN: EPF10K10QC208-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75.98 | $75.98 |
| 10 | $68.5 | $685.00 |
| 100 | $60.25 | $6,025.00 |
| 500 | $52.1 | $26,050.00 |
| 1,000 | $45.75 | $45,750.00 |
EPF10K10QC208-3 Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O cells that can be rewired after manufacturing to implement arbitrary digital functions. The FLEX 10K family pioneered the embedded array block concept, where each EAB provides up to 2,048 bits of RAM that can be used as memory, lookup tables, or glue logic - effectively giving the designer a small ASIC plus reconfigurable fabric on one die. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), alongside CPLDs and PROMs, and represent the highest-density tier of programmable logic.
Key features include 10,000 typical gates (up to ~31,000 maximum), 6,144 flip-flops distributed across 72 LABs, embedded FastTrack interconnect for continuous routing, and 100% functional test coverage. The device supports both 3.3 V and 5.0 V I/O operation depending on bank configuration, includes JTAG boundary-scan, and offers tri-state emulation for ASIC prototyping. The 208-pin PQFP package provides 134 usable I/O pins plus dedicated configuration, clock, and power pins.
Typical applications include glue logic and ASIC prototyping, telecommunications interface bridging, industrial control and instrumentation, glue logic between microprocessors and peripherals, and parallel bus interfacing. The EAB blocks also make the EPF10K10QC208-3 well-suited to small FIFOs, register files, and DSP datapath elements in cost-sensitive embedded designs.
When designing with this device, ensure proper decoupling (0.1 µF + 10 µF per supply pin) and follow Altera's configuration guidelines for JTAG or EPC configuration memory. Note that the FLEX 10K family has been EOL since the early 2000s; verify lifecycle status and consider Cyclone or MAX series for new designs.
This page synthesizes current distributor pricing, drop-in same-brand Intel/Altera FLEX 10K alternatives, and practical design notes not consolidated in the original datasheet.
Drop-in alternatives for EPF10K10QC208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K10QC208-3 (same form factor and footprint) — differing in Package, Family, Process Technology, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K10AQC208-3
✅ Drop-In✓ In Stock
$31.4 / Unit
View Datasheet →EPF10K10AQC208-3N
✅ Drop-In✓ In Stock
$49.9 / Unit
View Datasheet →EPF10K10QC208-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K10AQC208-2
✅ Drop-In✓ In Stock
$22 / Unit
View Datasheet →EPF10K10QC208-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Logic Elements | 576 |
| Typical Gates | 10,000 |
| Maximum Gates | 31,000 |
| Logic Array Blocks (LABs) | 72 |
| Embedded Array Blocks (EABs) | 3 |
| Total RAM Bits | 6,144 |
| User I/Os | 134 |
| Package | 208-pin PQFP / BFQFP |
| Mounting Type | Surface Mount |
| Supply Voltage | 5 V (core), 3.3 V or 5 V I/O |
| Process Technology | 0.42 µm CMOS |
| Propagation Delay | 0.6 ns |
| Maximum Frequency | 125 MHz |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Speed Grade | -3 |
| Configuration Method | JTAG / EPC serial |
| RoHS Status | Non-compliant (legacy PQFP) |
EPF10K10QC208-3 208-pin pqfp / bfqfp Pin Configuration Guide
Pin configuration for EPF10K10QC208-3 (208-pin pqfp / bfqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K10QC208-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K10QC208-3 is suitable for 6 applications: ASIC Prototyping and Emulation, Industrial Control and Instrumentation, Telecommunications Interface Bridging, Glue Logic and Bus Interface Bridging, Legacy Computing and Peripheral Interface, Educational and Development Platforms.
ASIC Prototyping and Emulation
The EPF10K10QC208-3 fits ASIC prototyping with 576 logic elements and 3 EABs providing 6,144 bits of RAM, allowing designers to map medium-complexity ASICs into a programmable fabric before committing to mask costs. The -3 speed grade offers ~125 MHz operation and 0.6 ns propagation delay, sufficient for most glue logic, state machines, and bus-interface emulation. FastTrack continuous routing ensures predictable interconnect delays, critical for ASIC-to-FPGA timing correlation. The 134 I/O pins accommodate multi-bus architectures including processor interfaces, memory buses, and peripheral channels common in emulation scenarios.
Recommended
Industrial Control and Instrumentation
The EPF10K10QC208-3 suits industrial control with 134 user I/Os that can be segmented into multiple voltage banks (3.3 V or 5 V) for direct interface to legacy 5 V sensors, actuators, and opto-isolators common in factory-floor equipment. The 5 V core supply tolerates industrial power-rail noise when paired with proper decoupling (0.1 µF + 10 µF per VCC). The 72 LABs and EAB-based memory enable deterministic state machines for PID control loops, encoder decoding, and serial-protocol bridges (RS-232/485, SPI, I²C). The commercial 0–70 °C operating range is acceptable for enclosed industrial cabinets with controlled airflow.
Recommended
Telecommunications Interface Bridging
The EPF10K10QC208-3 enables telecom interface bridging with 134 I/Os and built-in low-skew clock distribution trees that simplify multi-channel synchronous designs such as T1/E1 framer interfaces, HDLC controllers, and protocol converters. The EAB-based RAM supports small FIFOs and elastic buffers for clock-domain crossing between TDM backplanes and packet processors. The -3 speed grade easily meets typical 8–52 Mbps telecom line rates. Mixed-voltage I/O banks allow direct connection to 3.3 V framers and 5 V backplane logic without external level translation.
Recommended
Glue Logic and Bus Interface Bridging
The EPF10K10QC208-3 is widely deployed as glue logic between microprocessors, memory, and peripherals, replacing dozens of 74-series TTL chips with a single programmable device. The FastTrack interconnect and 72 LABs implement wide multiplexers, address decoders, wait-state generators, and bus-arbitration logic efficiently. EAB-based RAM supports dual-port or FIFO buffers for inter-processor communication. The 134 I/Os accommodate 32-bit data buses plus full address and control channels, with selectable 3.3 V/5 V banks for mixed-voltage processor and peripheral interfacing common in legacy embedded designs.
Recommended
Legacy Computing and Peripheral Interface
The EPF10K10QC208-3 supports legacy computing applications including ISA/PCI bridge logic, floppy/hard-disk controllers, and parallel-port emulation where the 5 V I/O and PQFP package are required for drop-in compatibility with vintage motherboards and backplanes. The 576 logic elements handle register-transfer-level designs at clock rates up to 125 MHz, sufficient for ISA-bus DMA engines and PIO controllers. The commercial 0–70 °C range is acceptable for indoor equipment enclosures. The EAB blocks enable small cache-tag RAMs, lookup tables, and microcoded control stores in legacy CPU emulators.
Recommended
Educational and Development Platforms
The EPF10K10QC208-3 is used in university FPGA courses and Altera/Intel development kits from the late 1990s and early 2000s, where its 576 logic elements provide enough capacity for meaningful Verilog/VHDL exercises including UART cores, PWM generators, simple CPUs, and VGA controllers. The 208-pin PQFP package is easy to breadboard with breakout adapters, and the JTAG configuration interface integrates with Altera's MAX+PLUS II and Quartus toolchains (legacy versions). EAB-based RAM demonstrates memory-mapped I/O concepts. For modern coursework, the Cyclone or MAX10 series is preferred, but vintage EPF10K10 boards remain in many lab inventories.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K10QC208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K10AQC208-3 | EPF10K10AQC208-3N | EPF10K10QC208-3N | EPF10K10AQC208-2 |
|---|---|---|---|---|---|
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| User I/Os | 134 | 134 | 134 | 134 | 134 |
| Speed Grade | -3 | -3 | -3 | -3 | -2 (faster) |
| Lead-Free / RoHS | No (legacy PQFP) | No | Yes (lead-free) | Yes (lead-free) | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Same-brand revision-A silicon available as drop-in upgrade (vs EPF10K10AQC208-3)
- Lead-free variant available without layout changes (vs EPF10K10AQC208-3N)
- Faster speed-grade drop-in option (vs EPF10K10AQC208-2)
Design Notes
The EPF10K10QC208-3 requires a clean 5 V core supply with extensive decoupling: 0.1 µF ceramic + 10 µF tantalum per VCC pin pair, placed within 5 mm of the package. The 208-pin PQFP has multiple VCC and GND pins distributed around the perimeter; route each to a low-impedance power plane. Use a ferrite bead or LC filter on the 5 V supply to suppress switching noise from neighboring digital circuits. Power sequencing is not required, but ensure VCCIO is not applied before VCCINT to prevent I/O latch-up.
The 208-pin PQFP has 0.5 mm pitch leads and requires careful PCB layout. Use 4-layer stackup with continuous VCC and GND planes to minimize lead inductance. Route all signals on outer layers with microstrip geometry (50 Ω controlled impedance for clocks). Keep clock traces short and away from I/O switching signals; use a ground guard trace between CLK0 and adjacent high-speed signals. Exposed die-attach pad on the bottom of the PQFP must be soldered to a thermal pad connected to GND for heat dissipation.
Common pitfalls with the EPF10K10QC208-3 include: (1) forgetting JTAG pull-ups on TCK/TMS/TDI per the datasheet - causes configuration failures; (2) leaving CONFIG_DONE floating - must be pulled up to VCCIO with a 10 kΩ resistor; (3) using wrong configuration memory (EPC2 vs EPC1) - verify the configuration file size against the EPC device capacity; (4) ignoring I/O bank voltage compatibility - mixing 3.3 V and 5 V peripherals in the same bank can damage the FPGA; (5) neglecting the nCONFIG reset sequence during in-system programming.
Compliance Information
Legacy 208-pin PQFP package is non-RoHS due to lead content. Choose EPF10K10AQC208-3N for lead-free / RoHS-compliant equivalent. AEC-Q100 not applicable for commercial-grade FPGAs.
