EPF10K30ATC144-3 - FLEX 10KA FPGA, 30K Gates, 144-TQFP | Intel
MPN: EPF10K30ATC144-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.95 | $249.50 |
| 100 | $21.5 | $2,150.00 |
| 250 | $19.25 | $4,812.50 |
| 500 | $17.8 | $8,900.00 |
EPF10K30ATC144-3 Overview
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized by the designer to implement arbitrary digital circuits. The FLEX 10KA family specifically pioneered embedded memory blocks within the FPGA fabric, combining lookup-table (LUT)-based logic with on-chip dual-port RAM, enabling system-on-chip integration without external memory components for many designs.
Key features of the EPF10K30ATC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), and operation from a 3.3V core supply. The device supports CMOS I/O standards and provides a maximum internal frequency of 80 MHz with a propagation delay of approximately 0.6 ns per logic element. The embedded array blocks (EABs) implement true dual-port RAM, ROM, or arithmetic functions, distinguishing FLEX 10KA from earlier FLEX 10K devices.
The device's SRAM-based configuration memory allows unlimited reconfiguration in-circuit. Its architecture is organized as rows and columns of LABs interconnected by a continuous, high-performance routing network. The 144-pin TQFP package with 0.5 mm pitch is suitable for surface-mount assembly in prototyping and low-to-medium volume production.
Typical applications include digital signal processing front-ends, telecommunications glue logic, industrial control interfaces, and embedded controller glue logic. The device is commonly used in legacy designs, retrofit boards, and as a flexible logic substitute for discrete SSI/MSI logic clusters.
When designing with this FPGA, ensure your configuration scheme (e.g., EPC configuration device or JTAG) is compatible with the FLEX 10KA bitstream format. Quartu II or MAX+PLUS II design tools are required; modern Intel Quartus software versions may not natively support FLEX 10KA, so legacy toolchain verification is recommended.
This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K30ATC144-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30ATC144-3 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Family, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30ATC144-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30ATC144-2N
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EPF10K30ATC144-1N
✅ Drop-In✓ In Stock
$16.5 / Unit
View Datasheet →EPF10K30ATI144-3
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30ATC144-2N
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EPF10K30ATC144-1N
✅ Drop-In✓ In Stock
$16.5 / Unit
View Datasheet →EPF10K30ATC144-3 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KA |
| Family | FLEX 10KA (Embedded Programmable Logic Device) |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 cells |
| Embedded Memory (RAM bits) | 12,288 bits |
| Logic Array Blocks (LABs) | 216 |
| User I/O Pins | 102 |
| Package | 144-LQFP / TQFP-144 |
| Mounting Type | Surface Mount |
| Process Technology | CMOS |
| Core Supply Voltage | 3.3 V |
| Internal Frequency (max) | 80 MHz |
| Propagation Delay | 0.6 ns (typical) |
| Operating Temperature | 0 C to 70 C (Commercial) |
| Speed Grade | -3 |
| Configuration | SRAM-based, in-circuit reconfigurable |
EPF10K30ATC144-3 Pin Configuration
| Pin 1 | I/O — User I/O (Bank 1) |
| Pin 2 | I/O — User I/O (Bank 1) |
| Pin 3 | I/O — User I/O (Bank 1) |
| Pin 4 | I/O — User I/O (Bank 1) |
| Pin 5 | I/O — User I/O (Bank 1) |
| Pin 6 | I/O — User I/O (Bank 1) |
| Pin 7 | I/O — User I/O (Bank 1) |
| Pin 8 | I/O — User I/O (Bank 1) |
| Pin 9 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 10 | I/O — User I/O (Bank 1) |
| Pin 11 | I/O — User I/O (Bank 1) |
| Pin 12 | GND — Ground |
| Pin 13 | I/O — User I/O (Bank 1) |
| Pin 14 | I/O — User I/O (Bank 1) |
| Pin 15 | I/O — User I/O (Bank 1) |
| Pin 16 | I/O — User I/O (Bank 1) |
| Pin 17 | I/O — User I/O (Bank 1) |
| Pin 18 | I/O — User I/O (Bank 1) |
| Pin 19 | I/O — User I/O (Bank 1) |
| Pin 20 | I/O — User I/O (Bank 1) |
| Pin 21 | I/O — User I/O (Bank 1) |
| Pin 22 | VCCINT — Core supply voltage (3.3V) |
| Pin 23 | I/O — User I/O (Bank 1) |
| Pin 24 | I/O — User I/O (Bank 1) |
| Pin 25 | I/O — User I/O (Bank 1) |
| Pin 26 | I/O — User I/O (Bank 1) |
| Pin 27 | I/O — User I/O (Bank 1) |
| Pin 28 | I/O — User I/O (Bank 1) |
| Pin 29 | I/O — User I/O (Bank 1) |
| Pin 30 | I/O — User I/O (Bank 1) |
| Pin 31 | I/O — User I/O (Bank 1) |
| Pin 32 | I/O — User I/O (Bank 1) |
| Pin 33 | VCCIO1 — I/O Bank 1 supply voltage |
| Pin 34 | GND — Ground |
| Pin 35 | I/O — User I/O (Bank 1) |
| Pin 36 | I/O — User I/O (Bank 1) |
| Pin 37 | I/O — User I/O (Bank 2) |
| Pin 38 | I/O — User I/O (Bank 2) |
| Pin 39 | I/O — User I/O (Bank 2) |
| Pin 40 | I/O — User I/O (Bank 2) |
| Pin 41 | I/O — User I/O (Bank 2) |
| Pin 42 | I/O — User I/O (Bank 2) |
| Pin 43 | I/O — User I/O (Bank 2) |
| Pin 44 | I/O — User I/O (Bank 2) |
| Pin 45 | VCCIO2 — I/O Bank 2 supply voltage |
| Pin 46 | I/O — User I/O (Bank 2) |
| Pin 47 | I/O — User I/O (Bank 2) |
| Pin 48 | GND — Ground |
| Pin 49 | I/O — User I/O (Bank 2) |
| Pin 50 | I/O — User I/O (Bank 2) |
| Pin 51 | I/O — User I/O (Bank 2) |
| Pin 52 | I/O — User I/O (Bank 2) |
| Pin 53 | I/O — User I/O (Bank 2) |
| Pin 54 | I/O — User I/O (Bank 2) |
| Pin 55 | CLK0 — Global clock input 0 |
| Pin 56 | I/O — User I/O (Bank 2) |
| Pin 57 | I/O — User I/O (Bank 2) |
| Pin 58 | I/O — User I/O (Bank 2) |
| Pin 59 | VCCINT — Core supply voltage (3.3V) |
| Pin 60 | I/O — User I/O (Bank 2) |
| Pin 61 | I/O — User I/O (Bank 2) |
| Pin 62 | I/O — User I/O (Bank 2) |
| Pin 63 | I/O — User I/O (Bank 2) |
| Pin 64 | I/O — User I/O (Bank 2) |
| Pin 65 | I/O — User I/O (Bank 2) |
| Pin 66 | I/O — User I/O (Bank 2) |
| Pin 67 | I/O — User I/O (Bank 2) |
| Pin 68 | I/O — User I/O (Bank 2) |
| Pin 69 | VCCIO2 — I/O Bank 2 supply voltage |
| Pin 70 | GND — Ground |
| Pin 71 | I/O — User I/O (Bank 2) |
| Pin 72 | I/O — User I/O (Bank 2) |
| Pin 73 | I/O — User I/O (Bank 3) |
| Pin 74 | I/O — User I/O (Bank 3) |
| Pin 75 | I/O — User I/O (Bank 3) |
| Pin 76 | I/O — User I/O (Bank 3) |
| Pin 77 | I/O — User I/O (Bank 3) |
| Pin 78 | I/O — User I/O (Bank 3) |
| Pin 79 | I/O — User I/O (Bank 3) |
| Pin 80 | I/O — User I/O (Bank 3) |
| Pin 81 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 82 | I/O — User I/O (Bank 3) |
| Pin 83 | I/O — User I/O (Bank 3) |
| Pin 84 | GND — Ground |
| Pin 85 | TDI — JTAG Test Data In |
| Pin 86 | TRST — JTAG Test Reset |
| Pin 87 | TCK — JTAG Test Clock |
| Pin 88 | TMS — JTAG Test Mode Select |
| Pin 89 | I/O — User I/O (Bank 3) |
| Pin 90 | I/O — User I/O (Bank 3) |
| Pin 91 | I/O — User I/O (Bank 3) |
| Pin 92 | I/O — User I/O (Bank 3) |
| Pin 93 | nCONFIG — Configuration start (active-low) |
| Pin 94 | nSTATUS — Configuration status (active-low) |
| Pin 95 | CONF_DONE — Configuration complete |
| Pin 96 | DCLK — Configuration clock |
| Pin 97 | DATA0 — Configuration data input 0 |
| Pin 98 | VCCINT — Core supply voltage (3.3V) |
| Pin 99 | I/O — User I/O (Bank 3) |
| Pin 100 | I/O — User I/O (Bank 3) |
| Pin 101 | I/O — User I/O (Bank 3) |
| Pin 102 | I/O — User I/O (Bank 3) |
| Pin 103 | I/O — User I/O (Bank 3) |
| Pin 104 | I/O — User I/O (Bank 3) |
| Pin 105 | I/O — User I/O (Bank 3) |
| Pin 106 | I/O — User I/O (Bank 3) |
| Pin 107 | I/O — User I/O (Bank 3) |
| Pin 108 | VCCIO3 — I/O Bank 3 supply voltage |
| Pin 109 | I/O — User I/O (Bank 4) |
| Pin 110 | I/O — User I/O (Bank 4) |
| Pin 111 | I/O — User I/O (Bank 4) |
| Pin 112 | GND — Ground |
| Pin 113 | I/O — User I/O (Bank 4) |
| Pin 114 | I/O — User I/O (Bank 4) |
| Pin 115 | I/O — User I/O (Bank 4) |
| Pin 116 | I/O — User I/O (Bank 4) |
| Pin 117 | I/O — User I/O (Bank 4) |
| Pin 118 | I/O — User I/O (Bank 4) |
| Pin 119 | I/O — User I/O (Bank 4) |
| Pin 120 | I/O — User I/O (Bank 4) |
| Pin 121 | VCCIO4 — I/O Bank 4 supply voltage |
| Pin 122 | I/O — User I/O (Bank 4) |
| Pin 123 | I/O — User I/O (Bank 4) |
| Pin 124 | GND — Ground |
| Pin 125 | I/O — User I/O (Bank 4) |
| Pin 126 | I/O — User I/O (Bank 4) |
| Pin 127 | I/O — User I/O (Bank 4) |
| Pin 128 | I/O — User I/O (Bank 4) |
| Pin 129 | I/O — User I/O (Bank 4) |
| Pin 130 | I/O — User I/O (Bank 4) |
| Pin 131 | I/O — User I/O (Bank 4) |
| Pin 132 | I/O — User I/O (Bank 4) |
| Pin 133 | I/O — User I/O (Bank 4) |
| Pin 134 | I/O — User I/O (Bank 4) |
| Pin 135 | I/O — User I/O (Bank 4) |
| Pin 136 | VCCINT — Core supply voltage (3.3V) |
| Pin 137 | I/O — User I/O (Bank 4) |
| Pin 138 | I/O — User I/O (Bank 4) |
| Pin 139 | I/O — User I/O (Bank 4) |
| Pin 140 | I/O — User I/O (Bank 4) |
| Pin 141 | I/O — User I/O (Bank 4) |
| Pin 142 | I/O — User I/O (Bank 4) |
| Pin 143 | I/O — User I/O (Bank 4) |
| Pin 144 | VCCIO4 — I/O Bank 4 supply voltage |
Typical Applications
EPF10K30ATC144-3 is suitable for 6 applications: Industrial Control Glue Logic, Telecommunications Backplane Interface, Embedded DSP Front-End, Test & Measurement Instrumentation, Medical Device Interface Logic, Legacy Retrofit & Form-Fit Replacement.
Industrial Control Glue Logic
The EPF10K30ATC144-3's 1,728 logic cells and 102 user I/Os make it a flexible substitute for dozens of SSI/MSI logic chips on legacy industrial control boards. With 12,288 bits of on-chip EAB-based RAM, designers can integrate custom state machines, encoder/decoder logic, and motor-control timing blocks without external memory. The 3.3V core supply is compatible with legacy 3.3V industrial backplanes, and the 80 MHz internal frequency easily handles real-time I/O scan rates up to 5 MHz.
Recommended
Telecommunications Backplane Interface
Legacy telecom systems use the EPF10K30ATC144-3 as a protocol-conversion bridge between proprietary backplane buses and standard interfaces. The 102 I/Os are sufficient for parallel bus bridging up to 16-bit data plus control, while the embedded RAM blocks implement elastic FIFOs and CRC/HDLC engines. Its 0.6 ns propagation delay supports 100+ MHz backplane signaling on the same TQFP-144 footprint, and the JTAG boundary-scan chain simplifies in-system field testing and remote diagnostics.
Recommended
Embedded DSP Front-End
The EPF10K30ATC144-3 implements the front-end DSP pipeline (filtering, decimation, FFT pre-processing) ahead of a host microcontroller or DSP chip. Its 12,288 embedded RAM bits provide data buffering for moving-window filters, while the 1,728 logic cells implement multiplier-accumulator (MAC) arrays and address generators. The 80 MHz internal frequency yields 40 MIPS of DSP throughput - sufficient for audio-bandwidth processing at 16-bit precision. The TQFP-144 footprint mates directly to standard prototyping boards.
Recommended
Test & Measurement Instrumentation
Bench-top instrument designs leverage the EPF10K30ATC144-3 for arbitrary waveform generation, pattern recognition, and stimulus/response capture. The 102 user I/Os support direct drive of up to 50 MHz logic analyzer probes without external drivers, while the 12,288-bit embedded RAM stores 64x192-bit waveform samples per channel. The 0.6 ns propagation delay enables 200 MHz event timing resolution when used in conjunction with external comparators, and the JTAG chain provides field firmware updates.
Recommended
Medical Device Interface Logic
The EPF10K30ATC144-3 is used in legacy medical imaging and patient monitoring equipment as a flexible interface controller between analog front-ends and embedded processors. Its 102 I/Os handle multiple 12-bit ADC/DAC channels plus timing strobes, while the embedded EABs implement data FIFOs for image line buffering. The 3.3V core supply simplifies mixed-signal PCB layout, and the 80 MHz operating frequency supports real-time video-bandwidth processing for ultrasound or endoscopy front-ends.
Recommended
Legacy Retrofit & Form-Fit Replacement
When obsolescence strikes, the EPF10K30ATC144-3 is the FLEX 10KA drop-in part that preserves the original PCB layout, JTAG chain, and MAX+PLUS II / Quartus II bitstream. Engineering teams retrofit production boards with the same TQFP-144 footprint, identical pinout, and SRAM-based configuration that boots from the existing EPC configuration device. No HDL re-synthesis or PCB rework is required - the new bitstream is regenerated from the same VHDL/Verilog source as the original.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30ATC144-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30ATC144-3N | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATI144-3 |
|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Speed Grade | -3 (0.6 ns prop delay) | -3 (same) | -2 (faster) | -1 (fastest) | -3 (same speed, industrial temp) |
| Temperature Grade | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) | Industrial (-40 C to +85 C) |
| RoHS / Pb-free | Non-RoHS (leaded) | RoHS (Pb-free) | RoHS (Pb-free) | RoHS (Pb-free) | Non-RoHS (leaded) |
| User I/O | 102 | 102 | 102 | 102 | 102 |
| Embedded RAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
Key Differentiators
- TQFP-144 footprint with 102 user I/Os - maximum I/O density in the FLEX 10KA family (vs EPF10K30AQC208-3)
- Speed grade -3 (standard timing) - cost-optimized for legacy retrofit (vs EPF10K30ATC144-2N)
- Embedded Array Block (EAB) dual-port RAM - first FLEX family with on-chip memory (vs EPF10K10ATC144-3N)
Design Notes
The EPF10K30ATC144-3 is SRAM-based and loses configuration on power-down. A non-volatile configuration device (EPC8QC100, EPC2LC20) must be present on the board to load the bitstream at POR. Missing or unprogrammed configuration memory is the most common first-power-up failure mode for legacy FLEX 10KA designs - verify the EPC device is socketed and accessible for JTAG in-system programming during board bring-up.
The FLEX 10KA core requires a stable 3.3V VCCINT with no more than 60 mV peak-to-peak ripple during configuration. Decouple VCCINT with at least one 0.1 uF ceramic capacitor per VCCINT pin and one bulk 33 uF tantalum/ceramic per device. Each VCCIO bank must be independently decoupled. Power-supply ramp time should be monotonic between 1 ms and 100 ms; out-of-spec ramp times cause CONF_DONE to latch low.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 4-wire daisy-chain with 10K pull-ups to VCCIO unless the host programmer provides drive. Keep JTAG traces under 150 mm or insert a JTAG buffer for longer chains. The CLK0-CLK3 global clock pins should receive matched-length traces to minimize clock skew across LAB rows - critical for designs using two or more global clocks at >50 MHz.
Compliance Information
EPF10K30ATC144-3 (no N suffix) is non-RoHS, leaded (SnPb). EPF10K30ATC144-3N is the RoHS / Pb-free drop-in variant. Per FLEX 10KA family documentation, no AEC-Q100 qualification. REACH compliance per original Altera/Intel material declaration.
