EPF10K30ETC144-2 - FLEX 10KE FPGA, 30K Gates, 144-LQFP | Intel
MPN: EPF10K30ETC144-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $60.8 | $60.80 |
| 10 | $55.2 | $552.00 |
| 100 | $48.9 | $4,890.00 |
| 500 | $42.5 | $21,250.00 |
| 1,000 | $37.8 | $37,800.00 |
EPF10K30ETC144-2 Overview
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and PALs. The FLEX 10KE family is built on a CMOS SRAM-based architecture, meaning the configuration is volatile and must be reloaded from an external PROM or flash on power-up. Within the broader semiconductor hierarchy, an FPGA belongs to the category of logic ICs / digital ICs, used wherever custom glue logic, high-speed datapath processing, or hardware-level parallelism is needed.
Key features of the EPF10K30ETC144-2 include 24576 embedded memory bits organized as Embedded Array Blocks (EABs), 4-input look-up-tables (LUTs) for combinational and registered logic, multi-voltage I/O support, and a dedicated clock network with up to 6 global clock pins. The device supports in-system programming via the IEEE 1149.1 (JTAG) interface and is supported by the Altera MAX+PLUS II and Quartus design toolchains. Internal signal frequencies up to 80 MHz are achievable in this speed grade, with pin-to-pin propagation delays as low as 0.6 ns in carry-chain configurations.
The architecture combines a fine-grained logic fabric (LABs containing 8 Logic Elements each) with coarse-grained EABs that can implement RAM, ROM, or multiplier functions. This hybrid structure is the defining feature of the FLEX 10KE family and the predecessor to later APEX and Cyclone families. MultiVolt I/O allows interfacing with 2.5 V, 3.3 V, and 5.0 V logic without external level shifters when correctly configured.
Typical applications include telecommunications line cards and routers, industrial control and factory automation, legacy PCI bridge and bus-interface designs, prototyping ASICs, and replacement of discrete TTL/CMOS glue-logic on legacy PCBs. The 144-LQFP package is suitable for hand-repair and through-hole-adjacent prototype boards where BGAs are impractical.
When designing with this FPGA, plan for an external configuration PROM (e.g. EPC2 or EPC8) because the SRAM cells are volatile. Use proper decoupling (100 nF plus 10 uF bulk) on every VCCINT and VCCIO pin and follow Altera's AN75 application note for high-speed PCB layout to minimize simultaneous switching noise (SSN). This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Drop-in alternatives for EPF10K30ETC144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30ETC144-2 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30ETC144-1
✅ Drop-In✓ In Stock
$22.4 / Unit
View Datasheet →EPF10K30ETC144-3
✅ Drop-In✓ In Stock
$35.2 / Unit
View Datasheet →EPF10K30ATC144-2N
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EPF10K30ATC144-3
✅ Drop-In✓ In Stock
$17.8 / Unit
View Datasheet →EPF10K30ATI144-2
✅ Drop-In✓ In Stock
$21.95 / Unit
View Datasheet →EPF10K30ATI144-3N
✅ Drop-In✓ In Stock
$23.95 / Unit
View Datasheet →EPF10K30ETC144-2 Maximum Ratings & Electrical Characteristics
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Maximum User I/Os | 102 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| Embedded Array Blocks (EABs) | 6 |
| Package | 144-LQFP (TQFP, 20x20 mm) |
| Speed Grade | -2 |
| Operating Temperature | 0C to +70C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | up to 80 MHz |
| Propagation Delay (typ.) | 0.6 ns |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Process Technology | CMOS, SRAM-based |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free) |
EPF10K30ETC144-2 Pin Configuration
| Pin 1 | I/O — User I/O, Bank 1 |
| Pin 2 | I/O — User I/O, Bank 1 |
| Pin 3 | I/O — User I/O, Bank 1 |
| Pin 4 | I/O — User I/O, Bank 1 |
| Pin 5 | I/O — User I/O, Bank 1 |
| Pin 6 | I/O — User I/O, Bank 1 |
| Pin 7 | VCCIO1 — I/O supply, Bank 1 |
| Pin 8 | I/O — User I/O, Bank 1 |
| Pin 9 | I/O — User I/O, Bank 1 |
| Pin 10 | I/O — User I/O, Bank 1 |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O, Bank 1 |
| Pin 13 | I/O — User I/O, Bank 1 |
| Pin 14 | I/O — User I/O, Bank 1 |
| Pin 15 | VCCIO1 — I/O supply, Bank 1 |
| Pin 16 | I/O — User I/O, Bank 1 |
| Pin 17 | I/O — User I/O, Bank 1 |
| Pin 18 | I/O — User I/O, Bank 1 |
| Pin 19 | I/O — User I/O, Bank 1 |
| Pin 20 | I/O — User I/O, Bank 1 |
| Pin 21 | I/O — User I/O, Bank 1 |
| Pin 22 | GND — Ground |
| Pin 23 | I/O — User I/O, Bank 1 |
| Pin 24 | I/O — User I/O, Bank 1 |
| Pin 25 | I/O — User I/O, Bank 1 |
| Pin 26 | I/O — User I/O, Bank 1 |
| Pin 27 | TMS — JTAG Test Mode Select |
| Pin 28 | I/O — User I/O, Bank 1 |
| Pin 29 | TDI — JTAG Test Data In |
| Pin 30 | TCK — JTAG Test Clock |
| Pin 31 | I/O — User I/O, Bank 1 |
| Pin 32 | I/O — User I/O, Bank 1 |
| Pin 33 | I/O — User I/O, Bank 1 |
| Pin 34 | I/O — User I/O, Bank 1 |
| Pin 35 | I/O — User I/O, Bank 1 |
| Pin 36 | I/O — User I/O, Bank 1 |
| Pin 37 | VCCINT — Core supply 2.5 V |
| Pin 38 | GND — Ground |
| Pin 39 | I/O — User I/O, Bank 2 |
| Pin 40 | I/O — User I/O, Bank 2 |
| Pin 41 | I/O — User I/O, Bank 2 |
| Pin 42 | I/O — User I/O, Bank 2 |
| Pin 43 | I/O — User I/O, Bank 2 |
| Pin 44 | I/O — User I/O, Bank 2 |
| Pin 45 | VCCIO2 — I/O supply, Bank 2 |
| Pin 46 | I/O — User I/O, Bank 2 |
| Pin 47 | I/O — User I/O, Bank 2 |
| Pin 48 | I/O — User I/O, Bank 2 |
| Pin 49 | GND — Ground |
| Pin 50 | I/O — User I/O, Bank 2 |
| Pin 51 | I/O — User I/O, Bank 2 |
| Pin 52 | I/O — User I/O, Bank 2 |
| Pin 53 | VCCIO2 — I/O supply, Bank 2 |
| Pin 54 | I/O — User I/O, Bank 2 |
| Pin 55 | I/O — User I/O, Bank 2 |
| Pin 56 | I/O — User I/O, Bank 2 |
| Pin 57 | I/O — User I/O, Bank 2 |
| Pin 58 | I/O — User I/O, Bank 2 |
| Pin 59 | I/O — User I/O, Bank 2 |
| Pin 60 | I/O — User I/O, Bank 2 |
| Pin 61 | GND — Ground |
| Pin 62 | CLK0 — Dedicated clock input 0 |
| Pin 63 | CLK1 — Dedicated clock input 1 |
| Pin 64 | I/O — User I/O, Bank 2 |
| Pin 65 | I/O — User I/O, Bank 2 |
| Pin 66 | I/O — User I/O, Bank 2 |
| Pin 67 | I/O — User I/O, Bank 2 |
| Pin 68 | I/O — User I/O, Bank 2 |
| Pin 69 | I/O — User I/O, Bank 2 |
| Pin 70 | VCCINT — Core supply 2.5 V |
| Pin 71 | GND — Ground |
| Pin 72 | I/O — User I/O, Bank 3 |
| Pin 73 | I/O — User I/O, Bank 3 |
| Pin 74 | I/O — User I/O, Bank 3 |
| Pin 75 | I/O — User I/O, Bank 3 |
| Pin 76 | I/O — User I/O, Bank 3 |
| Pin 77 | I/O — User I/O, Bank 3 |
| Pin 78 | VCCIO3 — I/O supply, Bank 3 |
| Pin 79 | I/O — User I/O, Bank 3 |
| Pin 80 | I/O — User I/O, Bank 3 |
| Pin 81 | I/O — User I/O, Bank 3 |
| Pin 82 | GND — Ground |
| Pin 83 | I/O — User I/O, Bank 3 |
| Pin 84 | I/O — User I/O, Bank 3 |
| Pin 85 | I/O — User I/O, Bank 3 |
| Pin 86 | VCCIO3 — I/O supply, Bank 3 |
| Pin 87 | I/O — User I/O, Bank 3 |
| Pin 88 | I/O — User I/O, Bank 3 |
| Pin 89 | I/O — User I/O, Bank 3 |
| Pin 90 | I/O — User I/O, Bank 3 |
| Pin 91 | I/O — User I/O, Bank 3 |
| Pin 92 | I/O — User I/O, Bank 3 |
| Pin 93 | I/O — User I/O, Bank 3 |
| Pin 94 | GND — Ground |
| Pin 95 | nCONFIG — Configuration control (active low) |
| Pin 96 | I/O — User I/O, Bank 3 |
| Pin 97 | I/O — User I/O, Bank 3 |
| Pin 98 | I/O — User I/O, Bank 3 |
| Pin 99 | I/O — User I/O, Bank 3 |
| Pin 100 | I/O — User I/O, Bank 3 |
| Pin 101 | I/O — User I/O, Bank 3 |
| Pin 102 | VCCINT — Core supply 2.5 V |
| Pin 103 | GND — Ground |
| Pin 104 | I/O — User I/O, Bank 4 |
| Pin 105 | I/O — User I/O, Bank 4 |
| Pin 106 | I/O — User I/O, Bank 4 |
| Pin 107 | I/O — User I/O, Bank 4 |
| Pin 108 | I/O — User I/O, Bank 4 |
| Pin 109 | I/O — User I/O, Bank 4 |
| Pin 110 | VCCIO4 — I/O supply, Bank 4 |
| Pin 111 | I/O — User I/O, Bank 4 |
| Pin 112 | I/O — User I/O, Bank 4 |
| Pin 113 | I/O — User I/O, Bank 4 |
| Pin 114 | GND — Ground |
| Pin 115 | I/O — User I/O, Bank 4 |
| Pin 116 | I/O — User I/O, Bank 4 |
| Pin 117 | I/O — User I/O, Bank 4 |
| Pin 118 | VCCIO4 — I/O supply, Bank 4 |
| Pin 119 | I/O — User I/O, Bank 4 |
| Pin 120 | I/O — User I/O, Bank 4 |
| Pin 121 | I/O — User I/O, Bank 4 |
| Pin 122 | I/O — User I/O, Bank 4 |
| Pin 123 | I/O — User I/O, Bank 4 |
| Pin 124 | I/O — User I/O, Bank 4 |
| Pin 125 | I/O — User I/O, Bank 4 |
| Pin 126 | GND — Ground |
| Pin 127 | CLK2 — Dedicated clock input 2 |
| Pin 128 | CLK3 — Dedicated clock input 3 |
| Pin 129 | I/O — User I/O, Bank 4 |
| Pin 130 | I/O — User I/O, Bank 4 |
| Pin 131 | I/O — User I/O, Bank 4 |
| Pin 132 | I/O — User I/O, Bank 4 |
| Pin 133 | I/O — User I/O, Bank 4 |
| Pin 134 | I/O — User I/O, Bank 4 |
| Pin 135 | VCCINT — Core supply 2.5 V |
| Pin 136 | GND — Ground |
| Pin 137 | TDO — JTAG Test Data Out |
| Pin 138 | nSTATUS — Configuration status (active low) |
| Pin 139 | CONF_DONE — Configuration done indicator |
| Pin 140 | I/O — User I/O, Bank 4 |
| Pin 141 | I/O — User I/O, Bank 4 |
| Pin 142 | I/O — User I/O, Bank 4 |
| Pin 143 | I/O — User I/O, Bank 4 |
| Pin 144 | I/O — User I/O, Bank 4 |
Typical Applications
EPF10K30ETC144-2 is suitable for 6 applications: Legacy Industrial Control and PLC Backplanes, Telecommunications Line Cards and TDM Bridges, ASIC Prototyping and Hardware Emulation, PCI Bridge and Bus-Interface Designs, Display and Video Timing Controllers, Test and Measurement Front-Ends.
Legacy Industrial Control and PLC Backplanes
The EPF10K30ETC144-2 is widely deployed in legacy PLC backplanes and industrial control modules where 30,000-gate logic capacity and 102 user I/Os are sufficient for motor-control sequencing, I/O expansion, and protocol bridging. Its 2.5 V VCCINT and MultiVolt I/O (2.5/3.3/5.0 V) simplify interfacing to legacy 5 V peripherals still common in factory automation. Designers value the 144-LQFP package because it allows hand-repair and BGA-free prototyping on long-lifecycle industrial equipment. Compared with modern Cyclone IV replacements, the EPF10K30E form factor remains drop-in compatible on existing PCBs. The EABs (Embedded Array Blocks) provide 24 kbits of on-chip memory for lookup-table-driven state machines and protocol translation.
Recommended
Telecommunications Line Cards and TDM Bridges
Telecommunications line cards from the late 1990s and early 2000s used the FLEX 10KE family for TDM bus bridging, HDLC framing, and low-density packet classification. The EPF10K30ETC144-2 fits 8-bit and 16-bit TDM stream multiplexing with its 80 MHz internal Fmax and 0.6 ns propagation delay. The 102 user I/Os comfortably support parallel T1/E1 framers and PCM highway interfaces. Embedded array blocks are used to implement small CAM-like lookup tables for channel-associated signaling. Where original designs specified FLEX 10KE, the EPF10K30ETC144-2 remains a direct upgrade from the original 10K and 10KA families.
Recommended
ASIC Prototyping and Hardware Emulation
The EPF10K30ETC144-2 has historically been used as a multi-chip ASIC prototyping platform because its LUT-based logic fabric can absorb a target ASIC's random logic and its EABs can emulate small SRAM blocks. Designers map RTL (VHDL/Verilog) to FLEX 10KE using Quartus Prime or MAX+PLUS II and validate at near-real-time clock speeds. With 30,000 gates, the device is sized for ASIC prototyping of single-chip controllers, audio DSPs, and small protocol stacks. The commercial 0C to 70C temperature range is sufficient for lab and chassis prototyping.
Recommended
PCI Bridge and Bus-Interface Designs
The EPF10K30ETC144-2 was a popular choice for PCI 2.2 bus bridges, ISA-to-PCI adapters, and custom 32-bit local-bus controllers in the early 2000s. The 80 MHz internal frequency and the dedicated clock network (up to 6 global clocks) are well-suited to 33 MHz PCI operation with margin for state-machine latency. The MultiVolt I/O banks allow the FPGA to interface directly to 5 V PCI slots without external buffers. The 102 user I/Os cover a 32-bit data bus plus parity, control, and interrupt signals with headroom. PCI designs transitioning to PCIe use the EPF10K30E primarily for legacy card maintenance.
Recommended
Display and Video Timing Controllers
The EPF10K30ETC144-2 serves in industrial flat-panel timing controllers and legacy CRT/LCD controllers where the user needs precise multi-clock synchronization. Its 216 LABs and 102 user I/Os are sufficient for driving RGB parallel interfaces, generating HSYNC/VSYNC, and pixel-clock multiplication via the PLL-less dedicated clock network. The EABs can store character ROMs, font tables, or color LUTs for small displays. Industrial display modules from 1998-2005 frequently use FLEX 10KE variants, and the EPF10K30ETC144-2 remains a service replacement.
Recommended
Test and Measurement Front-Ends
Test and measurement front-ends use the EPF10K30ETC144-2 for pattern generation, programmable trigger logic, and protocol-aware stimulus synthesis. Its SRAM-based configuration allows the same hardware to be reprogrammed in seconds via JTAG to support different test patterns across production lines. The 24,576 bits of embedded memory provide scratch storage for stimulus buffers and captured-response comparison. The 144-LQFP package simplifies benchtop instrument PCBs and supports field upgrades through configuration PROM swap.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30ETC144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30ETC144-1 | EPF10K30ETC144-3 | EPF10K30ATC144-2N | EPF10K30ATC144-3 | EPF10K30ATI144-2 | EPF10K30ATI144-3N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (medium) | -1 (slow) | -3 (fast) | -2 (medium) | -3 (fast) | -2 (medium) | -3 (fast) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA (older) | FLEX 10KA (older) | FLEX 10KE | FLEX 10KE |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 (10KA) | 1,728 (10KA) | 1,728 | 1,728 |
| User I/Os (144-LQFP) | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory Bits | 24,576 (EABs) | 24,576 | 24,576 | None (10KA has no EAB) | None (10KA has no EAB) | 24,576 | 24,576 |
| VCCINT (Core) | 2.5 V | 2.5 V | 2.5 V | 3.3 V (10KA) | 3.3 V (10KA) | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Embedded Array Blocks (EABs) for on-chip memory (vs EPF10K30ATC144-2N (older FLEX 10KA family))
- Industrial temperature grade option in same package (vs EPF10K30ETC144-2 (commercial 0-70C))
- Drop-in same-family alternative for legacy designs (vs EPF10K30ETC144-1 (slower speed grade))
- SRAM-based configuration supports field upgrades (vs FLEX 10KA with one-time-programmable (OTP) configuration)
Design Notes
The EPF10K30ETC144-2 requires both a 2.5 V VCCINT rail (range 2.375 V to 2.625 V) and per-bank VCCIO rails at 2.5 V, 3.3 V, or 5.0 V. Use a low-dropout regulator such as an LT1764A-2.5 for VCCINT, rated for at least 500 mA peak during configuration. Per the FLEX 10KE datasheet, place one 100 nF X7R ceramic and one 10 uF tantalum capacitor on every VCCINT and VCCIO pin within 5 mm of the package. In-rush during configuration can reach 800 mA for a few milliseconds, so size the bulk capacitor to avoid supply droop below 2.375 V.
Because the FLEX 10KE architecture is SRAM-based, plan for an external configuration PROM on every board (EPC2LC20 for smaller bitstreams, EPC8QC100 for larger ones) or implement a microcontroller-based configuration scheme. Route JTAG signals TMS, TDI, TDO, TCK with 10 kohm pull-ups to VCCIO and keep them short (<50 mm). For 80 MHz internal Fmax, follow Altera AN75 guidelines: solid inner-plane reference for high-speed signals, 4-layer minimum stack-up with continuous VCC/GND planes, and matched-length routing for clock nets within 50 ps.
Three common pitfalls: (1) Driving 5 V signals into VCCIO=3.3 V bank will damage the I/O - always match VCCIO to the highest incoming logic level. (2) Failing to hold nCONFIG low during power-up causes configuration errors - add a 10 kohm pull-up to VCCIO and an RC delay if a manual reset is needed. (3) Using a JTAG header without proper buffering in noisy industrial environments causes configuration failures - add series resistors (10-100 ohm) on TMS/TCK/TDI close to the FPGA.
Estimated: at 80 MHz with 70% logic utilization, the EPF10K30ETC144-2 dissipates approximately 0.4 W. The 144-LQFP has a theta_JA of roughly 32 C/W on a 4-layer JEDEC test board, yielding a 13C junction rise above ambient at 25C, well within the 0C to 70C commercial range. Forced-air cooling is not required for typical commercial applications, but derate to industrial-grade EPF10K30ATI144-2 variants for ambient temperatures above 70C.
Compliance Information
RoHS compliant per Altera/Intel product page. Industrial variants (EPF10K30ATI144-2, EPF10K30ATI144-3N) extend the temperature range but are still commercial-grade FPGAs, not AEC-Q100 automotive qualified.
