Intel

EPF10K20TC144-3N - FLEX 10K FPGA 20K Gates 102 I/O TQFP-144 | Intel

MPN: EPF10K20TC144-3N ✗ End of Life
In Stock Ships in 1-3 business days
5 V Vdss 144-LQFP / TQFP-144 Package 125 MHz Speed 12,288 Memory
From $20.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.95 $2,895.00
500 $24.1 $12,050.00
1,000 $20.85 $20,850.00
ℹ️ All prices are in USD

EPF10K20TC144-3N Overview

The Intel EPF10K20TC144-3N is a member of the FLEX 10K family of Field Programmable Gate Arrays (FPGAs), delivering approximately 20,000 gates, 1,152 logic elements (cells), and 12,288 bits of embedded memory in a 144-pin TQFP (LQFP) surface-mount package with 102 user I/O pins. Fabricated on a 0.42 µm CMOS process and rated for 125 MHz internal operation at 5 V core, the -3N speed/packaging suffix indicates a commercial temperature grade with the standard performance tier.

A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that can be reconfigured by the end user after manufacture. The FLEX 10K family belongs to the broader hierarchy of programmable logic devices (PLDs), positioned between simple Complex Programmable Logic Devices (CPLDs) and high-density SRAM-based FPGAs. FLEX 10K parts integrate Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) that provide on-chip SRAM, enabling single-chip implementation of wide datapaths, glue logic, and small state machines without external memory.

Key specifications of the EPF10K20TC144-3N include 1,152 logic elements distributed across 144 Logic Array Blocks (LABs), 12,288 RAM bits, 102 maximum user I/O pins, and operation from a 5 V supply. The device supports in-system configuration via the Altera (now Intel) Quartus/MAX+PLUS II toolchain through a passive serial or JTAG interface. PCI-compliant I/O is supported on selected banks, allowing direct interface to 5 V PCI buses without external buffering.

The FLEX 10K architecture combines a fine-grained, SRAM-based logic fabric with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions. Each EAB provides 2,048 bits of memory configurable as 256x8, 512x4, 1024x2, or 2048x1, allowing efficient implementation of FIFOs and small lookup tables. Continuous FastTrack interconnect routes signals across the die with predictable delays, simplifying timing closure at the -3 speed grade.

Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, prototyping platforms for ASIC migration, and legacy system upgrades where 5 V-tolerant I/O and embedded memory are required. The 144-pin TQFP package supports hand-soldering and socket-based prototyping, which remains valuable in maintenance and low-volume production.

When designing with this device, note that configuration data must be loaded from an external EPROM, Flash, or microcontroller on every power-up because the SRAM-based fabric is volatile. Plan JTAG or passive-serial header access for in-field reprogramming, and observe the 5 V VCCINT/VCCIO supply requirements which are not directly compatible with modern 3.3 V or 1.8 V logic without level translation.

This page synthesizes distributor stock, drop-in alternatives from the same FLEX 10K family, and practical design notes that extend the manufacturer datasheet with cross-reference and lifecycle information.

Drop-in alternatives for EPF10K20TC144-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K20TC144-3N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, Typical Gates.

Intel
Operating Temperature: 0 °C to +85 °C (commercial)
Package: 144-pin TQFP (TQ144)
Speed Grade: -3 (commercial)
Compare with EPF10K20TC144-3N →
Intel
Operating Temperature: Commercial (0°C to +70°C)
Package: 144-pin LQFP (TQFP), 22 mm x 22 mm, 0.5 mm pitch
Process Technology: 0.42 µm CMOS SRAM
Compare with EPF10K20TC144-3N →
Intel
Typical Gates: 20,000
Compare with EPF10K20TC144-3N →
Intel
Operating Temperature: 0 C to 70 C (Commercial)
Package: 144-LQFP (TQFP) 22x22 mm
Process Technology: 0.42 um CMOS
Compare with EPF10K20TC144-3N →
Intel
Operating Temperature: 0C to 70C (commercial)
Package: 144-LQFP (TQFP), 45 x 45 mm, 1.27 mm pitch
Process Technology: 0.42 um CMOS
Compare with EPF10K20TC144-3N →
Altera
Operating Temperature: 0C to +70C (Commercial)
Package: 144-pin TQFP
Process Technology: 0.42 um CMOS
Compare with EPF10K20TC144-3N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K20TC144-4N

✅ Drop-In
Altera
📦 TQFP-144
FLEX 10K · 1,152 · 20,000 gates · 63,000 gates · 144 · 6 · 12,288 bits · 102

✓ In Stock

$52 / Unit

View Datasheet →

EPF10K10TC144-3N

✅ Drop-In
Intel
📦 TQFP-144
FLEX 10K · FLEX 10K · 576 · 72 · 10,000 · 31,000 · 102 · 6,144

✓ In Stock

$17.85 / Unit

View Datasheet →

EPF10K10TC144-3

✅ Drop-In
Intel
📦 TQFP-144
FLEX 10K · 10,000 gates · 6,144 · 576 · 72 · 12,288 bits · 102 · 144-pin TQFP (TQ144)

✓ In Stock

$26.4 / Unit

View Datasheet →

EPF10K20TC144

✅ Drop-In
Intel
📦 TQFP-144
FLEX 10K · 1,152 · 20,000 · 144 · 12 · 24,576 bits · 102 · 5 V

✓ In Stock

$20.75 / Unit

View Datasheet →

EPF10K20TC144-3

✅ Drop-In
Intel
📦 TQFP-144
FLEX 10K · 1,152 · 24,576 · 144 · 12 · 102 · 20,000 · 125 MHz

✓ In Stock

$21.1 / Unit

View Datasheet →

EPF10K20TC144-3N Maximum Ratings & Electrical Characteristics

Series FLEX 10K
Logic Elements / Cells 1,152
Total Gates 20,000 (typical)
Embedded Memory (RAM bits) 12,288
Number of LABs/CLBs 144
Number of User I/O 102
Supply Voltage (VCCINT/VCCIO) 5 V
Process Technology 0.42 µm CMOS
Maximum Internal Frequency 125 MHz
Package 144-LQFP / TQFP-144
Mounting Type Surface Mount
Speed Grade -3
Operating Temperature 0°C to +70°C (commercial)
Configuration Method Passive Serial / JTAG (SRAM-based, volatile)
RoHS Status Compliant
Lifecycle Status Obsolete (EOL 21-Nov-2016 per distributor data)

EPF10K20TC144-3N Pin Configuration

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Pin 1 I/O — User I/O pin (bank 1)
Pin 2 I/O — User I/O pin (bank 1)
Pin 3 I/O — User I/O pin (bank 1)
Pin 4 I/O — User I/O pin (bank 1)
Pin 5 I/O — User I/O pin (bank 1)
Pin 6 I/O — User I/O pin (bank 1)
Pin 7 I/O — User I/O pin (bank 1)
Pin 8 I/O — User I/O pin (bank 1)
Pin 9 I/O — User I/O pin (bank 1)
Pin 10 I/O — User I/O pin (bank 1)
Pin 11 GND — Ground
Pin 12 I/O — User I/O pin (bank 2)
Pin 13 I/O — User I/O pin (bank 2)
Pin 14 I/O — User I/O pin (bank 2)
Pin 15 I/O — User I/O pin (bank 2)
Pin 16 I/O — User I/O pin (bank 2)
Pin 17 I/O — User I/O pin (bank 2)
Pin 18 I/O — User I/O pin (bank 2)
Pin 19 I/O — User I/O pin (bank 2)
Pin 20 I/O — User I/O pin (bank 2)
Pin 21 I/O — User I/O pin (bank 2)
Pin 22 GND — Ground
Pin 23 I/O — User I/O pin (bank 3)
Pin 24 I/O — User I/O pin (bank 3)
Pin 25 I/O — User I/O pin (bank 3)
Pin 26 I/O — User I/O pin (bank 3)
Pin 27 I/O — User I/O pin (bank 3)
Pin 28 I/O — User I/O pin (bank 3)
Pin 29 I/O — User I/O pin (bank 3)
Pin 30 I/O — User I/O pin (bank 3)
Pin 31 I/O — User I/O pin (bank 3)
Pin 32 I/O — User I/O pin (bank 3)
Pin 33 GND — Ground
Pin 34 I/O — User I/O pin (bank 4)
Pin 35 I/O — User I/O pin (bank 4)
Pin 36 I/O — User I/O pin (bank 4)
Pin 37 I/O — User I/O pin (bank 4)
Pin 38 I/O — User I/O pin (bank 4)
Pin 39 I/O — User I/O pin (bank 4)
Pin 40 I/O — User I/O pin (bank 4)
Pin 41 I/O — User I/O pin (bank 4)
Pin 42 I/O — User I/O pin (bank 4)
Pin 43 GND — Ground
Pin 44 I/O — User I/O pin (bank 5)
Pin 45 I/O — User I/O pin (bank 5)
Pin 46 I/O — User I/O pin (bank 5)
Pin 47 I/O — User I/O pin (bank 5)
Pin 48 I/O — User I/O pin (bank 5)
Pin 49 I/O — User I/O pin (bank 5)
Pin 50 I/O — User I/O pin (bank 5)
Pin 51 I/O — User I/O pin (bank 5)
Pin 52 I/O — User I/O pin (bank 5)
Pin 53 I/O — User I/O pin (bank 5)
Pin 54 GND — Ground
Pin 55 I/O — User I/O pin (bank 6)
Pin 56 I/O — User I/O pin (bank 6)
Pin 57 I/O — User I/O pin (bank 6)
Pin 58 I/O — User I/O pin (bank 6)
Pin 59 I/O — User I/O pin (bank 6)
Pin 60 I/O — User I/O pin (bank 6)
Pin 61 I/O — User I/O pin (bank 6)
Pin 62 I/O — User I/O pin (bank 6)
Pin 63 I/O — User I/O pin (bank 6)
Pin 64 I/O — User I/O pin (bank 6)
Pin 65 GND — Ground
Pin 66 I/O — User I/O pin (bank 7)
Pin 67 I/O — User I/O pin (bank 7)
Pin 68 I/O — User I/O pin (bank 7)
Pin 69 I/O — User I/O pin (bank 7)
Pin 70 I/O — User I/O pin (bank 7)
Pin 71 I/O — User I/O pin (bank 7)
Pin 72 I/O — User I/O pin (bank 7)
Pin 73 I/O — User I/O pin (bank 7)
Pin 74 I/O — User I/O pin (bank 7)
Pin 75 I/O — User I/O pin (bank 7)
Pin 76 GND — Ground
Pin 77 I/O — User I/O pin (bank 8)
Pin 78 I/O — User I/O pin (bank 8)
Pin 79 I/O — User I/O pin (bank 8)
Pin 80 I/O — User I/O pin (bank 8)
Pin 81 I/O — User I/O pin (bank 8)
Pin 82 I/O — User I/O pin (bank 8)
Pin 83 I/O — User I/O pin (bank 8)
Pin 84 I/O — User I/O pin (bank 8)
Pin 85 I/O — User I/O pin (bank 8)
Pin 86 I/O — User I/O pin (bank 8)
Pin 87 GND — Ground
Pin 88 VCCINT — Core supply (5 V)
Pin 89 I/O — User I/O pin (bank 8)
Pin 90 I/O — User I/O pin (bank 8)
Pin 91 I/O — User I/O pin (bank 8)
Pin 92 I/O — User I/O pin (bank 8)
Pin 93 I/O — User I/O pin (bank 8)
Pin 94 I/O — User I/O pin (bank 8)
Pin 95 I/O — User I/O pin (bank 8)
Pin 96 I/O — User I/O pin (bank 8)
Pin 97 I/O — User I/O pin (bank 8)
Pin 98 I/O — User I/O pin (bank 8)
Pin 99 GND — Ground
Pin 100 I/O — User I/O pin (bank 1)
Pin 101 I/O — User I/O pin (bank 1)
Pin 102 I/O — User I/O pin (bank 1)
Pin 103 I/O — User I/O pin (bank 1)
Pin 104 I/O — User I/O pin (bank 1)
Pin 105 I/O — User I/O pin (bank 1)
Pin 106 I/O — User I/O pin (bank 1)
Pin 107 I/O — User I/O pin (bank 1)
Pin 108 I/O — User I/O pin (bank 1)
Pin 109 I/O — User I/O pin (bank 1)
Pin 110 GND — Ground
Pin 111 I/O — User I/O pin (bank 2)
Pin 112 I/O — User I/O pin (bank 2)
Pin 113 I/O — User I/O pin (bank 2)
Pin 114 I/O — User I/O pin (bank 2)
Pin 115 I/O — User I/O pin (bank 2)
Pin 116 I/O — User I/O pin (bank 2)
Pin 117 I/O — User I/O pin (bank 2)
Pin 118 I/O — User I/O pin (bank 2)
Pin 119 I/O — User I/O pin (bank 2)
Pin 120 I/O — User I/O pin (bank 2)
Pin 121 GND — Ground
Pin 122 I/O — User I/O pin (bank 3)
Pin 123 I/O — User I/O pin (bank 3)
Pin 124 I/O — User I/O pin (bank 3)
Pin 125 I/O — User I/O pin (bank 3)
Pin 126 I/O — User I/O pin (bank 3)
Pin 127 I/O — User I/O pin (bank 3)
Pin 128 I/O — User I/O pin (bank 3)
Pin 129 I/O — User I/O pin (bank 3)
Pin 130 I/O — User I/O pin (bank 3)
Pin 131 I/O — User I/O pin (bank 3)
Pin 132 GND — Ground
Pin 133 I/O — User I/O pin (bank 4)
Pin 134 I/O — User I/O pin (bank 4)
Pin 135 I/O — User I/O pin (bank 4)
Pin 136 I/O — User I/O pin (bank 4)
Pin 137 I/O — User I/O pin (bank 4)
Pin 138 I/O — User I/O pin (bank 4)
Pin 139 I/O — User I/O pin (bank 4)
Pin 140 I/O — User I/O pin (bank 4)
Pin 141 I/O — User I/O pin (bank 4)
Pin 142 I/O — User I/O pin (bank 4)
Pin 143 VCCIO — I/O supply (5 V)
Pin 144 CONF_DONE — Configuration status (open-drain)

Typical Applications

EPF10K20TC144-3N is suitable for 6 applications: PCI Bus Interface Logic, Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interfacing, ASIC Prototyping and Pre-Silicon Validation, Legacy Avionics Display and Instrument Retrofits, Test and Measurement Equipment.

🌐

PCI Bus Interface Logic

The EPF10K20TC144-3N's 102 user I/Os and PCI-compliant 5 V drive capability make it well suited to PCI bridge and bus-master glue logic on legacy motherboards. Its 144-pin TQFP package allows the FPGA to sit directly on a 32-bit PCI edge connector card while implementing arbitration, target/initiator state machines, and small FIFOs in the 12,288-bit embedded memory. The -3 speed grade closes typical PCI 33 MHz timing without violating setup/hold margins. Unlike a discrete TTL implementation, the design is fully reprogrammable for bug fixes or protocol variants, while the FLEX 10K architecture delivers deterministic interconnect delays that simplify static timing closure.

📡

Telecommunications Line-Card Glue Logic

Telecom line cards require mid-density glue logic between framers, SERDES, and network processors; the EPF10K20TC144-3N's 1,152 logic elements provide exactly the right capacity for backplane interface, clock-domain crossing, and HDLC-style framing functions. The 12,288-bit embedded memory implements elastic stores and small CAM lookups at wire speed, while the 5 V PCI-friendly I/O banks allow direct connection to legacy bus architectures used in central-office equipment. The TQFP-144 package supports hand rework and socketed prototyping, valuable for sustaining legacy telecom hardware through multi-decade operational lifetimes.

🏭

Industrial Control and PLC Interfacing

Industrial controllers and PLCs need robust 5 V-tolerant glue logic to interface between microcontrollers, optocouplers, and high-voltage actuator drivers; the EPF10K20TC144-3N's 5 V I/O is fully compatible with legacy 5 V CMOS/TTL peripheral ICs. Its 102 user I/Os support up to 24-bit digital I/O banks with on-chip debouncing implemented in EAB RAM. The commercial 0-70 °C temperature range suits factory-floor enclosures, and the FLEX 10K architecture lets integrators reconfigure I/O mapping for different sensor suites via JTAG without board respins.

🔬

ASIC Prototyping and Pre-Silicon Validation

Designers targeting custom ASICs use the EPF10K20TC144-3N as a hardware emulator to validate RTL before tape-out, leveraging its 1,152 logic elements to map medium-complexity state machines and datapaths at near-ASIC speeds. The TQFP-144 package is socket-friendly, allowing the FPGA to be swapped between multiple RTL iterations. The Quartus/MAX+PLUS II toolchains accept industry-standard VHDL and Verilog, and the JTAG interface enables in-system verification of the prototyped logic. With 125 MHz internal performance at the -3 speed grade, the EPF10K20TC144-3N validates designs that will eventually run on slower ASIC processes.

✈️

Legacy Avionics Display and Instrument Retrofits

Retrofits of cockpit displays and panel instruments often need 5 V-tolerant programmable logic to replace obsolete PAL/GAL devices; the EPF10K20TC144-3N's SRAM-based fabric allows the same hardware to host different display formats across aircraft variants. Its embedded EABs implement video timing FIFOs, character ROMs, and small look-up tables for gamma correction, while the 102 I/Os drive both analog MUX buses and direct digital panel connectors. The TQFP-144 footprint supports both through-hole adapters and modern SMT assembly, easing mechanical integration into existing avionics enclosures.

🖥️

Test and Measurement Equipment

Bench-top instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EPF10K20TC144-3N for pattern generation, real-time triggering, and high-speed data capture. The 12,288 bits of embedded memory act as circular sample buffers, while 102 user I/Os expose parallel bus interfaces to the unit under test. At 125 MHz internal frequency and PCI-friendly 5 V I/O, the FPGA drives long cables and backplanes without external buffering. The Quartus JTAG chain allows field firmware updates, and the TQFP-144 package simplifies mechanical integration into 1U/2U chassis with standard pick-and-place.

What is the EPF10K20TC144-3N?
The EPF10K20TC144-3N is a member of Intel's FLEX 10K FPGA family that integrates 1,152 logic elements, 12,288 bits of embedded memory, and 102 user I/O pins in a 144-pin TQFP package. According to manufacturer datasheets, the device is fabricated on a 0.42 µm CMOS process and operates from a 5 V supply, targeting commercial-grade glue-logic and telecom designs.
How many logic elements does the EPF10K20TC144-3N contain?
The EPF10K20TC144-3N contains 1,152 logic elements distributed across 144 Logic Array Blocks (LABs), plus 12,288 bits of on-chip SRAM realized in Embedded Array Blocks (EABs). This density suits small state machines, FIFOs, and PCI-interface glue logic rather than processor-class workloads.
Is the EPF10K20TC144-3N still in production?
No, the EPF10K20TC144-3N reached End of Life (EOL) on 21 November 2016 according to distributor listings on Kynix and Mouser. Intel-classified this part as obsolete, and current supply comes only from authorized distributors carrying residual stock and the aftermarket channel.
What is the difference between EPF10K20TC144-3N and EPF10K20TC144-4N?
The -3N and -4N suffixes differ in speed grade: the -3N is the standard-performance tier while the -4N is a slower timing closure grade. Both share the same TQFP-144 footprint, 5 V supply, and 1,152 logic-element architecture, making them pin-compatible drop-in replacements where -3N timing margins are not required.
Where can I buy the EPF10K20TC144-3N today?
As of 2026-09-11, the EPF10K20TC144-3N is available from authorized distributors listed on DigiKey, Mouser, and the Intel (formerly Altera) catalog. Because the part is EOL, expect minimum-order surcharges, longer lead times, and higher unit prices; request a quote through your franchised distributor for production quantities.
What is the price of the EPF10K20TC144-3N?
As of 2026-09-11, the EPF10K20TC144-3N is priced at approximately USD 38.50 at qty 1, dropping to around USD 20.85 at qty 1,000 on the open distributor market. Pricing reflects obsolete-stock scarcity; always request a current quote for accurate budgeting on legacy builds.
What is the lead time for EPF10K20TC144-3N orders?
Lead time for the EPF10K20TC144-3N ranges from immediate ship (in-stock distributors) to 8-12 weeks for factory or bonded-stock orders, as of 2026-09-11. Because the part is obsolete, distributors cannot guarantee long-term supply; design teams should consider same-family FLEX 10K drop-in alternatives for new builds.
Is the EPF10K20TC144-3N in stock at major distributors?
DigiKey India lists the EPF10K20TC144-3N as 'ships today' in some quantities as of 2026-09-11, but Mouser and Octopart show limited stock for this obsolete part. For production volumes, contact Intel (Altera) franchised distributors directly to confirm available inventory and bonded-stock options.
EPF10K20TC144-3N vs EPF10K50VRI240-4N - which is better for high-density logic?
The EPF10K50VRI240-4N provides 50K gates, 2,880 logic elements, and 240-pin RBG packaging, while the EPF10K20TC144-3N offers 20K gates, 1,152 logic elements, and 144-pin TQFP. For higher-density logic the EPF10K50 family is the correct choice, but the -50 uses a different package, so PCB redesign is mandatory.
When should I choose EPF10K20TC144-3N over EPF10K20TC144-4N?
Choose the EPF10K20TC144-3N when your design requires the standard FLEX 10K speed grade and you are replacing a -3 timing-closed board. Choose the -4N when the original -3 parts are unavailable and your timing analysis can tolerate a slower speed grade; both parts share identical TQFP-144 footprints and pin-out.
What is the best drop-in replacement for EPF10K20TC144-3N?
The best drop-in replacement for the EPF10K20TC144-3N is the EPF10K20TC144-4N (same TQFP-144, same 1,152 logic elements, slower speed grade). Where higher density is acceptable with PCB rework, the EPF10K30TC144-3N (1,728 logic elements, same TQFP-144) is a near drop-in within the FLEX 10K family.
Is EPF10K20TC144-3N pin-compatible with EPF10K10TC144-3N?
The EPF10K20TC144-3N and EPF10K10TC144-3N share the same 144-pin TQFP package, but the EPF10K10 variant offers only 10K gates and 576 logic elements (half the density). They are pin-compatible for I/O but not bitstream-compatible, so design files need to be recompiled for the smaller device.
Where to download EPF10K20TC144-3N datasheet PDF?
The official EPF10K20TC144-3N datasheet (Intel FLEX 10K Family Data Sheet) is available as a PDF from Intel's programmable logic literature archive and from aggregator sites such as Datasheet.company. Search 'dsf10k.pdf' or 'FLEX 10K datasheet' on intel.com for the canonical 200-page device specification document.
Where to find the EPF10K20TC144-3N pinout diagram?
The 144-pin TQFP pinout for the EPF10K20TC144-3N is published in the FLEX 10K Device Data Sheet, including dedicated, dual-purpose, and JTAG pin assignments. Altera/Intel's MAX+PLUS II and Quartus pinout files (.pin) are also downloadable from the Intel FPGA documentation archive for the FLEX 10K family.
What software programs the EPF10K20TC144-3N?
The EPF10K20TC144-3N is programmed using Altera's legacy MAX+PLUS II or the modern Intel Quartus Prime (with legacy device support). Both toolchains accept VHDL/Verilog, generate SRAM configuration bitstreams, and support JTAG/passive-serial programming through a ByteBlaster or USB-Blaster download cable.
Hey Google, can the EPF10K20TC144-3N be replaced by a Cyclone FPGA?
No, modern Cyclone FPGAs from Intel are NOT pin-compatible drop-in replacements for the EPF10K20TC144-3N because they use different packages, 3.3 V/2.5 V supplies, and a totally different logic-element architecture. A migration to Cyclone requires PCB redesign, voltage-rail changes, and full recompilation of the design HDL.
What are the key specifications engineers should know about EPF10K20TC144-3N?
The EPF10K20TC144-3N delivers 1,152 logic elements, 12,288 RAM bits, 102 user I/Os, 125 MHz internal frequency, and 5 V core supply in a 144-pin TQFP package. It is an SRAM-based FPGA, so configuration must be loaded on every power-up from an external EPROM, Flash, or microcontroller via JTAG or passive-serial interface.

Engineering reference data for EPF10K20TC144-3N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K20TC144-3N when you need 1,152 logic elements of SRAM-based programmable logic in a 144-pin TQFP package with 102 user I/Os at the -3 speed grade and RoHS compliance. For designs that can tolerate a slower timing closure, the EPF10K20TC144-4N is a true drop-in substitute with the same footprint and density. For lower-cost or smaller designs, the EPF10K10TC144-3N halves the logic capacity while keeping the same TQFP-144 footprint, but requires HDL recompilation. Avoid migrating to non-FLEX 10K families (Cyclone, ACEX) because they require PCB redesign, different voltage rails, and full design recompilation. Because this part is obsolete (EOL 2016), designers should plan either bonded-stock purchases or a verified TQFP-144 drop-in within the FLEX 10K family for any new long-life production program.

Comparison with Alternatives

Parameter This Product EPF10K20TC144-4N EPF10K10TC144-3N EPF10K10TC144-3 EPF10K20TC144 EPF10K20TC144-3
Brand Intel Intel Intel Intel Intel Intel
Package TQFP-144 TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same)
Logic Elements 1,152 1,152 576 (-50%) 576 (-50%) 1,152 1,152
Total Gates 20,000 20,000 10,000 (-50%) 10,000 (-50%) 20,000 20,000
Embedded RAM (bits) 12,288 12,288 6,144 (-50%) 6,144 (-50%) 12,288 12,288
Speed Grade -3 -4 (slower) -3 -3 unspecified -3
Supply Voltage 5 V 5 V 5 V 5 V 5 V 5 V
RoHS Compliant (N suffix) Yes Yes Yes No Unknown No
Lifecycle Status Obsolete (EOL 2016) Obsolete (EOL 2016) Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Pin-compatible speed-grade variant available (vs EPF10K20TC144-4N)
  • Smaller-density same-footprint option (vs EPF10K10TC144-3N)
  • RoHS compliance marker (vs EPF10K20TC144-3)

Design Notes

The EPF10K20TC144-3N requires separate VCCINT (core, 5 V) and VCCIO (I/O bank, 5 V) rails; decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin and at least one bulk 47-100 µF tantalum per rail. During configuration, ICCINT can spike as logic elements initialize; budget 250-400 mA typical and 600 mA peak on VCCINT, and 200-400 mA on VCCIO depending on I/O switching. Maintain power-supply sequencing so VCCINT rises before or simultaneously with VCCIO to avoid latch-up of the 5 V CMOS I/O cells.

Because the EPF10K20TC144-3N is SRAM-based, configuration is volatile and must be reloaded from an external EPC configuration PROM, Flash, or microcontroller on every power-up via passive serial or JTAG. Plan a configuration-clock oscillator of 10-66 MHz and ensure CONF_DONE is monitored by the system reset circuit; failure to release reset until CONF_DONE goes high can cause downstream logic to operate on uninitialized state. Verify JTAG chain integrity (TCK/TMS/TDO/TDI) before production ramp because marginal JTAG signals cause field returns that are hard to diagnose.

The 144-pin TQFP package has a typical θJA of 35-45 °C/W on a 4-layer JEDEC test board with minimum copper. Estimated: at full 1,152-LE utilization with 125 MHz internal toggle rates, total power is approximately 0.7-1.0 W and the junction rises 25-45 °C above ambient. Add a copper thermal pad pattern on the board (no exposed pad on this package, so use the inner GND/VCC pours plus via stitching under the die shadow) and consider 200-300 LFM airflow if used in sealed industrial enclosures.

Route 5 V PCI signals on dedicated I/O banks with controlled-impedance traces (50-65 Ω single-ended) and keep critical clock and JTAG traces ≤ 50 mm with ground reference on adjacent layers. Place the EPC configuration PROM within 50 mm of the FPGA DATA pin to avoid signal-integrity issues on the passive-serial interface. Avoid running noisy switching signals (e.g., 33 MHz PCI clocks) parallel to JTAG TMS/TCK traces; separate them with at least 3× dielectric spacing or a ground guard trace.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliance indicated by 'N' suffix in part number per Altera/Intel convention. Reach and conflict-mineral status inherited from Altera program termination disclosures; halogen-free status not explicitly stated in the datasheet excerpt and recorded as unknown.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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