EPF10K20TC144-3N - FLEX 10K FPGA 20K Gates 102 I/O TQFP-144 | Intel
MPN: EPF10K20TC144-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $24.1 | $12,050.00 |
| 1,000 | $20.85 | $20,850.00 |
EPF10K20TC144-3N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells that can be reconfigured by the end user after manufacture. The FLEX 10K family belongs to the broader hierarchy of programmable logic devices (PLDs), positioned between simple Complex Programmable Logic Devices (CPLDs) and high-density SRAM-based FPGAs. FLEX 10K parts integrate Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) that provide on-chip SRAM, enabling single-chip implementation of wide datapaths, glue logic, and small state machines without external memory.
Key specifications of the EPF10K20TC144-3N include 1,152 logic elements distributed across 144 Logic Array Blocks (LABs), 12,288 RAM bits, 102 maximum user I/O pins, and operation from a 5 V supply. The device supports in-system configuration via the Altera (now Intel) Quartus/MAX+PLUS II toolchain through a passive serial or JTAG interface. PCI-compliant I/O is supported on selected banks, allowing direct interface to 5 V PCI buses without external buffering.
The FLEX 10K architecture combines a fine-grained, SRAM-based logic fabric with Embedded Array Blocks (EABs) that can implement RAM, ROM, or multiplier functions. Each EAB provides 2,048 bits of memory configurable as 256x8, 512x4, 1024x2, or 2048x1, allowing efficient implementation of FIFOs and small lookup tables. Continuous FastTrack interconnect routes signals across the die with predictable delays, simplifying timing closure at the -3 speed grade.
Typical applications include telecommunications line cards, industrial control glue logic, PCI bus interfaces, prototyping platforms for ASIC migration, and legacy system upgrades where 5 V-tolerant I/O and embedded memory are required. The 144-pin TQFP package supports hand-soldering and socket-based prototyping, which remains valuable in maintenance and low-volume production.
When designing with this device, note that configuration data must be loaded from an external EPROM, Flash, or microcontroller on every power-up because the SRAM-based fabric is volatile. Plan JTAG or passive-serial header access for in-field reprogramming, and observe the 5 V VCCINT/VCCIO supply requirements which are not directly compatible with modern 3.3 V or 1.8 V logic without level translation.
This page synthesizes distributor stock, drop-in alternatives from the same FLEX 10K family, and practical design notes that extend the manufacturer datasheet with cross-reference and lifecycle information.
Drop-in alternatives for EPF10K20TC144-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K20TC144-3N (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, Typical Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K20TC144-4N
✅ Drop-In✓ In Stock
$52 / Unit
View Datasheet →EPF10K10TC144-3N
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EPF10K10TC144-3
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EPF10K20TC144
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →EPF10K20TC144-3
✅ Drop-In✓ In Stock
$21.1 / Unit
View Datasheet →EPF10K20TC144-3N Maximum Ratings & Electrical Characteristics
| Series | FLEX 10K |
| Logic Elements / Cells | 1,152 |
| Total Gates | 20,000 (typical) |
| Embedded Memory (RAM bits) | 12,288 |
| Number of LABs/CLBs | 144 |
| Number of User I/O | 102 |
| Supply Voltage (VCCINT/VCCIO) | 5 V |
| Process Technology | 0.42 µm CMOS |
| Maximum Internal Frequency | 125 MHz |
| Package | 144-LQFP / TQFP-144 |
| Mounting Type | Surface Mount |
| Speed Grade | -3 |
| Operating Temperature | 0°C to +70°C (commercial) |
| Configuration Method | Passive Serial / JTAG (SRAM-based, volatile) |
| RoHS Status | Compliant |
| Lifecycle Status | Obsolete (EOL 21-Nov-2016 per distributor data) |
EPF10K20TC144-3N Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | GND — Ground |
| Pin 12 | I/O — User I/O pin (bank 2) |
| Pin 13 | I/O — User I/O pin (bank 2) |
| Pin 14 | I/O — User I/O pin (bank 2) |
| Pin 15 | I/O — User I/O pin (bank 2) |
| Pin 16 | I/O — User I/O pin (bank 2) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | I/O — User I/O pin (bank 2) |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | I/O — User I/O pin (bank 2) |
| Pin 22 | GND — Ground |
| Pin 23 | I/O — User I/O pin (bank 3) |
| Pin 24 | I/O — User I/O pin (bank 3) |
| Pin 25 | I/O — User I/O pin (bank 3) |
| Pin 26 | I/O — User I/O pin (bank 3) |
| Pin 27 | I/O — User I/O pin (bank 3) |
| Pin 28 | I/O — User I/O pin (bank 3) |
| Pin 29 | I/O — User I/O pin (bank 3) |
| Pin 30 | I/O — User I/O pin (bank 3) |
| Pin 31 | I/O — User I/O pin (bank 3) |
| Pin 32 | I/O — User I/O pin (bank 3) |
| Pin 33 | GND — Ground |
| Pin 34 | I/O — User I/O pin (bank 4) |
| Pin 35 | I/O — User I/O pin (bank 4) |
| Pin 36 | I/O — User I/O pin (bank 4) |
| Pin 37 | I/O — User I/O pin (bank 4) |
| Pin 38 | I/O — User I/O pin (bank 4) |
| Pin 39 | I/O — User I/O pin (bank 4) |
| Pin 40 | I/O — User I/O pin (bank 4) |
| Pin 41 | I/O — User I/O pin (bank 4) |
| Pin 42 | I/O — User I/O pin (bank 4) |
| Pin 43 | GND — Ground |
| Pin 44 | I/O — User I/O pin (bank 5) |
| Pin 45 | I/O — User I/O pin (bank 5) |
| Pin 46 | I/O — User I/O pin (bank 5) |
| Pin 47 | I/O — User I/O pin (bank 5) |
| Pin 48 | I/O — User I/O pin (bank 5) |
| Pin 49 | I/O — User I/O pin (bank 5) |
| Pin 50 | I/O — User I/O pin (bank 5) |
| Pin 51 | I/O — User I/O pin (bank 5) |
| Pin 52 | I/O — User I/O pin (bank 5) |
| Pin 53 | I/O — User I/O pin (bank 5) |
| Pin 54 | GND — Ground |
| Pin 55 | I/O — User I/O pin (bank 6) |
| Pin 56 | I/O — User I/O pin (bank 6) |
| Pin 57 | I/O — User I/O pin (bank 6) |
| Pin 58 | I/O — User I/O pin (bank 6) |
| Pin 59 | I/O — User I/O pin (bank 6) |
| Pin 60 | I/O — User I/O pin (bank 6) |
| Pin 61 | I/O — User I/O pin (bank 6) |
| Pin 62 | I/O — User I/O pin (bank 6) |
| Pin 63 | I/O — User I/O pin (bank 6) |
| Pin 64 | I/O — User I/O pin (bank 6) |
| Pin 65 | GND — Ground |
| Pin 66 | I/O — User I/O pin (bank 7) |
| Pin 67 | I/O — User I/O pin (bank 7) |
| Pin 68 | I/O — User I/O pin (bank 7) |
| Pin 69 | I/O — User I/O pin (bank 7) |
| Pin 70 | I/O — User I/O pin (bank 7) |
| Pin 71 | I/O — User I/O pin (bank 7) |
| Pin 72 | I/O — User I/O pin (bank 7) |
| Pin 73 | I/O — User I/O pin (bank 7) |
| Pin 74 | I/O — User I/O pin (bank 7) |
| Pin 75 | I/O — User I/O pin (bank 7) |
| Pin 76 | GND — Ground |
| Pin 77 | I/O — User I/O pin (bank 8) |
| Pin 78 | I/O — User I/O pin (bank 8) |
| Pin 79 | I/O — User I/O pin (bank 8) |
| Pin 80 | I/O — User I/O pin (bank 8) |
| Pin 81 | I/O — User I/O pin (bank 8) |
| Pin 82 | I/O — User I/O pin (bank 8) |
| Pin 83 | I/O — User I/O pin (bank 8) |
| Pin 84 | I/O — User I/O pin (bank 8) |
| Pin 85 | I/O — User I/O pin (bank 8) |
| Pin 86 | I/O — User I/O pin (bank 8) |
| Pin 87 | GND — Ground |
| Pin 88 | VCCINT — Core supply (5 V) |
| Pin 89 | I/O — User I/O pin (bank 8) |
| Pin 90 | I/O — User I/O pin (bank 8) |
| Pin 91 | I/O — User I/O pin (bank 8) |
| Pin 92 | I/O — User I/O pin (bank 8) |
| Pin 93 | I/O — User I/O pin (bank 8) |
| Pin 94 | I/O — User I/O pin (bank 8) |
| Pin 95 | I/O — User I/O pin (bank 8) |
| Pin 96 | I/O — User I/O pin (bank 8) |
| Pin 97 | I/O — User I/O pin (bank 8) |
| Pin 98 | I/O — User I/O pin (bank 8) |
| Pin 99 | GND — Ground |
| Pin 100 | I/O — User I/O pin (bank 1) |
| Pin 101 | I/O — User I/O pin (bank 1) |
| Pin 102 | I/O — User I/O pin (bank 1) |
| Pin 103 | I/O — User I/O pin (bank 1) |
| Pin 104 | I/O — User I/O pin (bank 1) |
| Pin 105 | I/O — User I/O pin (bank 1) |
| Pin 106 | I/O — User I/O pin (bank 1) |
| Pin 107 | I/O — User I/O pin (bank 1) |
| Pin 108 | I/O — User I/O pin (bank 1) |
| Pin 109 | I/O — User I/O pin (bank 1) |
| Pin 110 | GND — Ground |
| Pin 111 | I/O — User I/O pin (bank 2) |
| Pin 112 | I/O — User I/O pin (bank 2) |
| Pin 113 | I/O — User I/O pin (bank 2) |
| Pin 114 | I/O — User I/O pin (bank 2) |
| Pin 115 | I/O — User I/O pin (bank 2) |
| Pin 116 | I/O — User I/O pin (bank 2) |
| Pin 117 | I/O — User I/O pin (bank 2) |
| Pin 118 | I/O — User I/O pin (bank 2) |
| Pin 119 | I/O — User I/O pin (bank 2) |
| Pin 120 | I/O — User I/O pin (bank 2) |
| Pin 121 | GND — Ground |
| Pin 122 | I/O — User I/O pin (bank 3) |
| Pin 123 | I/O — User I/O pin (bank 3) |
| Pin 124 | I/O — User I/O pin (bank 3) |
| Pin 125 | I/O — User I/O pin (bank 3) |
| Pin 126 | I/O — User I/O pin (bank 3) |
| Pin 127 | I/O — User I/O pin (bank 3) |
| Pin 128 | I/O — User I/O pin (bank 3) |
| Pin 129 | I/O — User I/O pin (bank 3) |
| Pin 130 | I/O — User I/O pin (bank 3) |
| Pin 131 | I/O — User I/O pin (bank 3) |
| Pin 132 | GND — Ground |
| Pin 133 | I/O — User I/O pin (bank 4) |
| Pin 134 | I/O — User I/O pin (bank 4) |
| Pin 135 | I/O — User I/O pin (bank 4) |
| Pin 136 | I/O — User I/O pin (bank 4) |
| Pin 137 | I/O — User I/O pin (bank 4) |
| Pin 138 | I/O — User I/O pin (bank 4) |
| Pin 139 | I/O — User I/O pin (bank 4) |
| Pin 140 | I/O — User I/O pin (bank 4) |
| Pin 141 | I/O — User I/O pin (bank 4) |
| Pin 142 | I/O — User I/O pin (bank 4) |
| Pin 143 | VCCIO — I/O supply (5 V) |
| Pin 144 | CONF_DONE — Configuration status (open-drain) |
Typical Applications
EPF10K20TC144-3N is suitable for 6 applications: PCI Bus Interface Logic, Telecommunications Line-Card Glue Logic, Industrial Control and PLC Interfacing, ASIC Prototyping and Pre-Silicon Validation, Legacy Avionics Display and Instrument Retrofits, Test and Measurement Equipment.
PCI Bus Interface Logic
The EPF10K20TC144-3N's 102 user I/Os and PCI-compliant 5 V drive capability make it well suited to PCI bridge and bus-master glue logic on legacy motherboards. Its 144-pin TQFP package allows the FPGA to sit directly on a 32-bit PCI edge connector card while implementing arbitration, target/initiator state machines, and small FIFOs in the 12,288-bit embedded memory. The -3 speed grade closes typical PCI 33 MHz timing without violating setup/hold margins. Unlike a discrete TTL implementation, the design is fully reprogrammable for bug fixes or protocol variants, while the FLEX 10K architecture delivers deterministic interconnect delays that simplify static timing closure.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards require mid-density glue logic between framers, SERDES, and network processors; the EPF10K20TC144-3N's 1,152 logic elements provide exactly the right capacity for backplane interface, clock-domain crossing, and HDLC-style framing functions. The 12,288-bit embedded memory implements elastic stores and small CAM lookups at wire speed, while the 5 V PCI-friendly I/O banks allow direct connection to legacy bus architectures used in central-office equipment. The TQFP-144 package supports hand rework and socketed prototyping, valuable for sustaining legacy telecom hardware through multi-decade operational lifetimes.
Recommended
Industrial Control and PLC Interfacing
Industrial controllers and PLCs need robust 5 V-tolerant glue logic to interface between microcontrollers, optocouplers, and high-voltage actuator drivers; the EPF10K20TC144-3N's 5 V I/O is fully compatible with legacy 5 V CMOS/TTL peripheral ICs. Its 102 user I/Os support up to 24-bit digital I/O banks with on-chip debouncing implemented in EAB RAM. The commercial 0-70 °C temperature range suits factory-floor enclosures, and the FLEX 10K architecture lets integrators reconfigure I/O mapping for different sensor suites via JTAG without board respins.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Designers targeting custom ASICs use the EPF10K20TC144-3N as a hardware emulator to validate RTL before tape-out, leveraging its 1,152 logic elements to map medium-complexity state machines and datapaths at near-ASIC speeds. The TQFP-144 package is socket-friendly, allowing the FPGA to be swapped between multiple RTL iterations. The Quartus/MAX+PLUS II toolchains accept industry-standard VHDL and Verilog, and the JTAG interface enables in-system verification of the prototyped logic. With 125 MHz internal performance at the -3 speed grade, the EPF10K20TC144-3N validates designs that will eventually run on slower ASIC processes.
Recommended
Legacy Avionics Display and Instrument Retrofits
Retrofits of cockpit displays and panel instruments often need 5 V-tolerant programmable logic to replace obsolete PAL/GAL devices; the EPF10K20TC144-3N's SRAM-based fabric allows the same hardware to host different display formats across aircraft variants. Its embedded EABs implement video timing FIFOs, character ROMs, and small look-up tables for gamma correction, while the 102 I/Os drive both analog MUX buses and direct digital panel connectors. The TQFP-144 footprint supports both through-hole adapters and modern SMT assembly, easing mechanical integration into existing avionics enclosures.
Recommended
Test and Measurement Equipment
Bench-top instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EPF10K20TC144-3N for pattern generation, real-time triggering, and high-speed data capture. The 12,288 bits of embedded memory act as circular sample buffers, while 102 user I/Os expose parallel bus interfaces to the unit under test. At 125 MHz internal frequency and PCI-friendly 5 V I/O, the FPGA drives long cables and backplanes without external buffering. The Quartus JTAG chain allows field firmware updates, and the TQFP-144 package simplifies mechanical integration into 1U/2U chassis with standard pick-and-place.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K20TC144-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K20TC144-4N | EPF10K10TC144-3N | EPF10K10TC144-3 | EPF10K20TC144 | EPF10K20TC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Logic Elements | 1,152 | 1,152 | 576 (-50%) | 576 (-50%) | 1,152 | 1,152 |
| Total Gates | 20,000 | 20,000 | 10,000 (-50%) | 10,000 (-50%) | 20,000 | 20,000 |
| Embedded RAM (bits) | 12,288 | 12,288 | 6,144 (-50%) | 6,144 (-50%) | 12,288 | 12,288 |
| Speed Grade | -3 | -4 (slower) | -3 | -3 | unspecified | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RoHS Compliant (N suffix) | Yes | Yes | Yes | No | Unknown | No |
| Lifecycle Status | Obsolete (EOL 2016) | Obsolete (EOL 2016) | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible speed-grade variant available (vs EPF10K20TC144-4N)
- Smaller-density same-footprint option (vs EPF10K10TC144-3N)
- RoHS compliance marker (vs EPF10K20TC144-3)
Design Notes
The EPF10K20TC144-3N requires separate VCCINT (core, 5 V) and VCCIO (I/O bank, 5 V) rails; decouple each rail with 0.1 µF ceramic capacitors placed within 5 mm of every VCC pin and at least one bulk 47-100 µF tantalum per rail. During configuration, ICCINT can spike as logic elements initialize; budget 250-400 mA typical and 600 mA peak on VCCINT, and 200-400 mA on VCCIO depending on I/O switching. Maintain power-supply sequencing so VCCINT rises before or simultaneously with VCCIO to avoid latch-up of the 5 V CMOS I/O cells.
Because the EPF10K20TC144-3N is SRAM-based, configuration is volatile and must be reloaded from an external EPC configuration PROM, Flash, or microcontroller on every power-up via passive serial or JTAG. Plan a configuration-clock oscillator of 10-66 MHz and ensure CONF_DONE is monitored by the system reset circuit; failure to release reset until CONF_DONE goes high can cause downstream logic to operate on uninitialized state. Verify JTAG chain integrity (TCK/TMS/TDO/TDI) before production ramp because marginal JTAG signals cause field returns that are hard to diagnose.
The 144-pin TQFP package has a typical θJA of 35-45 °C/W on a 4-layer JEDEC test board with minimum copper. Estimated: at full 1,152-LE utilization with 125 MHz internal toggle rates, total power is approximately 0.7-1.0 W and the junction rises 25-45 °C above ambient. Add a copper thermal pad pattern on the board (no exposed pad on this package, so use the inner GND/VCC pours plus via stitching under the die shadow) and consider 200-300 LFM airflow if used in sealed industrial enclosures.
Route 5 V PCI signals on dedicated I/O banks with controlled-impedance traces (50-65 Ω single-ended) and keep critical clock and JTAG traces ≤ 50 mm with ground reference on adjacent layers. Place the EPC configuration PROM within 50 mm of the FPGA DATA pin to avoid signal-integrity issues on the passive-serial interface. Avoid running noisy switching signals (e.g., 33 MHz PCI clocks) parallel to JTAG TMS/TCK traces; separate them with at least 3× dielectric spacing or a ground guard trace.
Compliance Information
RoHS compliance indicated by 'N' suffix in part number per Altera/Intel convention. Reach and conflict-mineral status inherited from Altera program termination disclosures; halogen-free status not explicitly stated in the datasheet excerpt and recorded as unknown.