EPF10K30EQI208-2 - FLEX 10KE FPGA 30K Gates 208-PQFP | Intel
MPN: EPF10K30EQI208-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $17.8 | $17,800.00 |
EPF10K30EQI208-2 Overview
What is an FPGA? A Field Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells that can be reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and general-purpose microcontrollers in the design hierarchy, offering hardware-level parallelism, deterministic timing, and rapid design iteration. The FLEX 10KE family was Intel/Altera's mid-1990s generation of SRAM-based FPGAs that pioneered embedded memory blocks (EABs) and dedicated I/O features for glue-logic and datapath applications.
Key features of the EPF10K30EQI208-2 include 1,728 logic elements distributed across 216 LABs, 24,576 RAM bits organized in Embedded Array Blocks (EABs), 147 user I/Os supporting multiple I/O standards (LVTTL, LVCMOS, PCI), four Phase-Locked Loops (PLLs) for clock management, and in-system programmability via the passive serial configuration scheme. The device is fabricated on a 0.42 µm CMOS SRAM process, which gives it non-volatile behavior when paired with a serial configuration EPROM such as the EPC2 or EPC8.
Typical applications include legacy industrial control boards, telecommunications glue logic, military and aerospace systems with long lifecycle support requirements, prototype ASIC replacements, and parallel DSP datapaths. The 208-pin PQFP package is also popular for through-hole rework and socketed designs where BGA rework is impractical.
When designing with this part, ensure that I/O assignments observe the bank's VCCIO grouping and that decoupling follows Intel's classic FLEX 10KE reference design. Because the part is now in the legacy/end-of-life category, plan for last-time-buy procurement or consider the Stratix/Cyclone families for new designs.
Drop-in alternatives for EPF10K30EQI208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EQI208-2 (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EQI208-2N
✅ Drop-In✓ In Stock
$20.75 / Unit
View Datasheet →EPF10K30EQC208-2
✅ Drop-In✓ In Stock
$17.85 / Unit
View Datasheet →EPF10K30EQC208-2N
✅ Drop-In✓ In Stock
$19.75 / Unit
View Datasheet →EPF10K30EQC208-3
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$26.1 / Unit
View Datasheet →EPF10K30EQC208-3N
✅ Drop-In✓ In Stock
$49.1 / Unit
View Datasheet →EPF10K100EQI208-2
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF10K30EQI208-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Typical Gates | 30,000 |
| Maximum System Gates | 119,000 |
| Embedded Memory (RAM bits) | 24,576 |
| User I/Os | 147 |
| Package | 208-PQFP (BFQFP) |
| Pin Count | 208 |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Process Technology | 0.42 µm CMOS SRAM |
| Configuration Method | Passive Serial (with EPC2/EPC8) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
EPF10K30EQI208-2 208-pqfp (bfqfp) Pin Configuration Guide
Pin configuration for EPF10K30EQI208-2 (208-pqfp (bfqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K30EQI208-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K30EQI208-2 is suitable for 6 applications: Legacy Industrial Control Boards, Telecommunications Glue Logic, Military and Aerospace Systems, Prototype ASIC Replacement, Parallel DSP Datapaths, Test and Measurement Instrumentation.
Legacy Industrial Control Boards
The EPF10K30EQI208-2's 1,728 logic elements and 147 user I/Os make it a drop-in for mid-1990s industrial PLC and motion-control boards that require decades-long lifecycle support. Its 208-pin PQFP package is socketable and through-hole reworkable, which is critical when factory-floor systems cannot be re-qualified with BGA-reflowed parts. The device's industrial -40 °C to +85 °C range and 2.5 V core tolerance match the 24 V-to-logic isolated power rails typical of factory automation. The four PLLs derive deterministic clocks for multi-axis stepper/servo timing without external frequency dividers, while the 24,576 bits of EAB memory hold look-up tables for closed-loop PID coefficients.
Recommended
Telecommunications Glue Logic
The EPF10K30EQI208-2 is widely deployed as glue logic in legacy T1/E1 multiplexer, DSLAM line-card, and SONET/SDH framer designs from the late 1990s. Its 30,000-gate fabric comfortably absorbs bus-interface adaptation, framing, and CRC generation tasks that would otherwise require multiple 74-series TTL parts. The 147 user I/Os support the wide parallel backplane buses common in telecom backplanes, while the four PLLs retime recovered clocks to system references. The device's PCI 3.3 V I/O compliance enables direct connection to PowerPC and MIPS host processors used in those line cards without external transceivers.
Recommended
Military and Aerospace Systems
Defense programs that adopted the FLEX 10KE in the late 1990s often retain it in service because the 208-pin PQFP package survives the thermal cycling, vibration, and field-repair requirements of MIL-STD-810 environments better than BGA alternatives. The EPF10K30EQI208-2's industrial -40 °C to +85 °C window and the wider military screening grade of the FLEX 10KE family make it the standard logic integration point for radar signal-conditioning, avionics bus monitors, and encrypted communications boards. The SRAM fabric is one-time-programmable via loadable EPROM, supporting anti-tamper configurations where bitstream modification is undesirable.
Recommended
Prototype ASIC Replacement
The EPF10K30EQI208-2 is a classic ASIC prototype vehicle because its 30,000-gate capacity, JTAG boundary scan, and SRAM-based re-programmability let design teams iterate RTL code without NRE mask charges. Engineers can validate the full system in silicon before committing to a gate-array or standard-cell ASIC, then use the same PQFP footprint on the prototype PCB that the eventual ASIC will populate. The 24,576-bit EAB memory allows designers to prototype dual-port RAMs, FIFOs, and content-addressable memories before ASIC synthesis, while the 147 user I/Os comfortably cover most peripheral interfaces.
Recommended
Parallel DSP Datapaths
The EPF10K30EQI208-2's 1,728 logic elements and 216 LABs are well suited to mid-complexity parallel DSP tasks such as FIR filters, FFT butterflies, and video pre-processing pipelines. The 24,576 bits of distributed EAB memory act as coefficient ROMs and delay lines that would otherwise consume expensive logic cells. The four PLLs let designers derive the multiple phase-aligned clock domains required by polyphase filter banks and parallel-serial converters. While modern DSP FPGAs in 28 nm processes deliver far higher MAC throughput, the FLEX 10KE remains adequate for legacy ultrasound, sonar, and industrial-vision systems.
Recommended
Test and Measurement Instrumentation
The EPF10K30EQI208-2 is found inside legacy bench-top oscilloscopes, logic analyzers, and protocol analyzers as the pattern-generation and triggering engine. Its 147 user I/Os drive parallel test buses, and its four PLLs synthesize the variable clock rates needed for UART, SPI, I2C, and CAN protocol exercisers. The SRAM fabric is rewritten by the instrument's host processor to load new test patterns without requiring the user to open the chassis. Industrial temperature grade and the PQFP package's thermal robustness allow these instruments to operate reliably in production-test racks at elevated ambient temperatures.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EQI208-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EQI208-2N | EPF10K30EQC208-2 | EPF10K30EQC208-2N | EPF10K30EQC208-3 | EPF10K30EQC208-3N | EPF10K100EQI208-2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (BFQFP) | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same | 208-PQFP (BFQFP) - same |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 4,992 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 100,000 |
| Embedded RAM (bits) | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 |
| User I/Os | 147 | 147 | 147 | 147 | 147 | 147 | 147 |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C | Industrial -40C to +85C |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster) | -3 (faster) | -2 |
| Core Voltage (VCCINT) | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Industrial temperature grade in the same PQFP footprint (vs EPF10K30EQC208-2)
- Drop-in upgrade path to larger FLEX 10K100 device (vs EPF10K100EQI208-2)
- Lower-cost -2 speed grade for general-purpose designs (vs EPF10K30EQC208-3)
Design Notes
Estimated: the EPF10K30EQI208-2 core draws roughly 200-300 mA at 2.5 V when fully utilized with all 1,728 logic elements switching, so a low-noise 2.5 V regulator with at least 1 A headroom (e.g. LT1764-2.5 or TPS7A4525) is recommended. The VCCIO banks should be powered from a separate 3.3 V rail; sharing the 2.5 V and 3.3 V regulators couples switching noise into the FPGA core. Place 0.1 µF X7R bypass capacitors within 5 mm of every VCCINT and VCCIO pin, plus a single 47 µF bulk tantalum near each supply pin. Decouple the PLL analog supply pins (VCCA_PLL) with a ferrite bead and 10 µF tantalum to prevent clock jitter.
Configuration pitfalls: 1) Always pull nCONFIG high through a 10 kΩ resistor to VCCIO; leaving it floating causes intermittent configuration failures. 2) MSEL0 and MSEL1 must be tied to the correct logic levels for the chosen configuration mode (PS = 00, AS = 01, JTAG = 10). 3) The CONF_DONE LED can pull significant current through the internal weak pull-up during configuration; use a high-efficiency LED or buffer it. 4) The nSTATUS pin must be monitored because a CRC error during configuration resets the device - watch for noisy power rails if nSTATUS glitches occur at power-up.
The 208-pin PQFP package has 0.5 mm lead pitch and gull-wing leads that require careful PCB layout. Recommended land pattern uses 0.30 mm wide copper pads with 1.0 mm pad length, and a 0.15 mm solder mask expansion. Keep high-speed traces on inner layers with a continuous ground plane beneath the device to control impedance and provide a thermal spreader. Although the 208-PQFP is not as thermally constrained as a BGA, run four thermal vias (0.3 mm drill, 1.0 mm pitch) under the die-attach pad region if the design dissipates more than 1.5 W. Maintain a 5 mm keep-out under the device to allow socketed rework without damaging adjacent components.
Compliance Information
FLEX 10KE family was released before RoHS compliance was widely mandated; the base -2 part is likely SnPb-finished, while -2N variants are typically lead-free. RoHS and REACH compliance must be verified on the specific manufacturer lot because of obsolete-stock repackaging. Not subject to AEC-Q100 because it is an FPGA, not an automotive-grade IC.
