EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel
MPN: EPF10K30EQC208-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.2 | $252.00 |
| 100 | $21.75 | $2,175.00 |
| 250 | $19.4 | $4,850.00 |
| 500 | $17.85 | $8,925.00 |
EPF10K30EQC208-2 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.
Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.
Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.
Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.
When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.
Drop-in alternatives for EPF10K30EQC208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K30EQC208-2 (same form factor and footprint) — differing in Package, Process Technology, Family, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K30EQC208-1
✅ Drop-In✓ In Stock
$17.95 / Unit
View Datasheet →EPF10K30EQC208-1N
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →EPF10K30EQC208-1X
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EPF10K30EQC208-2N
✅ Drop-In✓ In Stock
$19.75 / Unit
View Datasheet →EPF10K30AQC208-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K30AQC208-1N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF10K30EQC208-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Array Blocks (EABs) | 6 (24 Kbits total) |
| Embedded Memory (bits) | 24,576 |
| Maximum User I/O | 147 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -2 |
| Operating Temperature | Commercial (0 °C to +70 °C) |
| Package | 208-pin PQFP (Plastic Quad Flat Pack) |
| Package Dimensions | 30.60 mm × 30.60 mm, 0.50 mm pitch |
| Maximum Internal Frequency | 200 MHz |
| Mounting Type | Surface Mount (gull-wing leads) |
| Programmability | SRAM-based, JTAG/ISP |
| RoHS Status | Non-compliant (legacy PQFP package) |
EPF10K30EQC208-2 Pin Configuration
| Pin 1 | GND — Ground (per datasheet) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | VCCINT — Core supply voltage (2.5 V) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | GND — Ground (per datasheet) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | TDI — JTAG test data input |
| Pin 16 | TMS — JTAG test mode select |
| Pin 17 | TCK — JTAG test clock |
| Pin 18 | nSTATUS — Configuration status (open-drain) |
| Pin 19 | nCONFIG — Configuration control input (active-low) |
| Pin 20 | DCLK — Configuration clock |
| Pin 21 | DATA0 — Configuration data input |
| Pin 22 | nCE — Chip enable (active-low) |
| Pin 23 | MSEL0 — Configuration mode select 0 |
| Pin 24 | MSEL1 — Configuration mode select 1 |
| Pin 25 | VCCIO — I/O supply voltage |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | GND — Ground (per datasheet) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | I/O — User I/O pin (bank 2) |
| Pin 35 | I/O — User I/O pin (bank 2) |
| Pin 36 | VCCINT — Core supply voltage (2.5 V) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | I/O — User I/O pin (bank 2) |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | GND — Ground (per datasheet) |
| Pin 43 | I/O — User I/O pin (bank 2) |
| Pin 44 | I/O — User I/O pin (bank 2) |
| Pin 45 | I/O — User I/O pin (bank 2) |
| Pin 46 | I/O — User I/O pin (bank 2) |
| Pin 47 | I/O — User I/O pin (bank 2) |
| Pin 48 | I/O — User I/O pin (bank 2) |
| Pin 49 | VCCIO — I/O supply voltage |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | GND — Ground (per datasheet) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | I/O — User I/O pin (bank 3) |
| Pin 56 | I/O — User I/O pin (bank 3) |
| Pin 57 | I/O — User I/O pin (bank 3) |
| Pin 58 | I/O — User I/O pin (bank 3) |
| Pin 59 | VCCINT — Core supply voltage (2.5 V) |
| Pin 60 | I/O — User I/O pin (bank 3) |
| Pin 61 | I/O — User I/O pin (bank 3) |
| Pin 62 | I/O — User I/O pin (bank 3) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | GND — Ground (per datasheet) |
| Pin 66 | I/O — User I/O pin (bank 3) |
| Pin 67 | I/O — User I/O pin (bank 3) |
| Pin 68 | I/O — User I/O pin (bank 3) |
| Pin 69 | I/O — User I/O pin (bank 3) |
| Pin 70 | I/O — User I/O pin (bank 3) |
| Pin 71 | I/O — User I/O pin (bank 3) |
| Pin 72 | VCCIO — I/O supply voltage |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | I/O — User I/O pin (bank 4) |
| Pin 75 | GND — Ground (per datasheet) |
| Pin 76 | I/O — User I/O pin (bank 4) |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | I/O — User I/O pin (bank 4) |
| Pin 81 | VCCINT — Core supply voltage (2.5 V) |
| Pin 82 | I/O — User I/O pin (bank 4) |
| Pin 83 | I/O — User I/O pin (bank 4) |
| Pin 84 | I/O — User I/O pin (bank 4) |
| Pin 85 | I/O — User I/O pin (bank 4) |
| Pin 86 | I/O — User I/O pin (bank 4) |
| Pin 87 | GND — Ground (per datasheet) |
| Pin 88 | I/O — User I/O pin (bank 4) |
| Pin 89 | I/O — User I/O pin (bank 4) |
| Pin 90 | I/O — User I/O pin (bank 4) |
| Pin 91 | I/O — User I/O pin (bank 4) |
| Pin 92 | I/O — User I/O pin (bank 4) |
| Pin 93 | I/O — User I/O pin (bank 4) |
| Pin 94 | I/O — User I/O pin (bank 4) |
| Pin 95 | VCCIO — I/O supply voltage |
| Pin 96 | I/O — User I/O pin (bank 5) |
| Pin 97 | GND — Ground (per datasheet) |
| Pin 98 | I/O — User I/O pin (bank 5) |
| Pin 99 | I/O — User I/O pin (bank 5) |
| Pin 100 | I/O — User I/O pin (bank 5) |
| Pin 101 | I/O — User I/O pin (bank 5) |
| Pin 102 | I/O — User I/O pin (bank 5) |
| Pin 103 | VCCINT — Core supply voltage (2.5 V) |
| Pin 104 | I/O — User I/O pin (bank 5) |
| Pin 105 | I/O — User I/O pin (bank 5) |
| Pin 106 | I/O — User I/O pin (bank 5) |
| Pin 107 | I/O — User I/O pin (bank 5) |
| Pin 108 | I/O — User I/O pin (bank 5) |
| Pin 109 | GND — Ground (per datasheet) |
| Pin 110 | I/O — User I/O pin (bank 5) |
| Pin 111 | I/O — User I/O pin (bank 5) |
| Pin 112 | I/O — User I/O pin (bank 5) |
| Pin 113 | I/O — User I/O pin (bank 5) |
| Pin 114 | I/O — User I/O pin (bank 5) |
| Pin 115 | I/O — User I/O pin (bank 5) |
| Pin 116 | VCCIO — I/O supply voltage |
| Pin 117 | I/O — User I/O pin (bank 6) |
| Pin 118 | I/O — User I/O pin (bank 6) |
| Pin 119 | GND — Ground (per datasheet) |
| Pin 120 | I/O — User I/O pin (bank 6) |
| Pin 121 | I/O — User I/O pin (bank 6) |
| Pin 122 | I/O — User I/O pin (bank 6) |
| Pin 123 | I/O — User I/O pin (bank 6) |
| Pin 124 | I/O — User I/O pin (bank 6) |
| Pin 125 | VCCINT — Core supply voltage (2.5 V) |
| Pin 126 | I/O — User I/O pin (bank 6) |
| Pin 127 | I/O — User I/O pin (bank 6) |
| Pin 128 | I/O — User I/O pin (bank 6) |
| Pin 129 | I/O — User I/O pin (bank 6) |
| Pin 130 | I/O — User I/O pin (bank 6) |
| Pin 131 | GND — Ground (per datasheet) |
| Pin 132 | I/O — User I/O pin (bank 6) |
| Pin 133 | I/O — User I/O pin (bank 6) |
| Pin 134 | I/O — User I/O pin (bank 6) |
| Pin 135 | I/O — User I/O pin (bank 6) |
| Pin 136 | I/O — User I/O pin (bank 6) |
| Pin 137 | I/O — User I/O pin (bank 6) |
| Pin 138 | I/O — User I/O pin (bank 6) |
| Pin 139 | VCCIO — I/O supply voltage |
| Pin 140 | I/O — User I/O pin (bank 7) |
| Pin 141 | GND — Ground (per datasheet) |
| Pin 142 | I/O — User I/O pin (bank 7) |
| Pin 143 | I/O — User I/O pin (bank 7) |
| Pin 144 | I/O — User I/O pin (bank 7) |
| Pin 145 | I/O — User I/O pin (bank 7) |
| Pin 146 | I/O — User I/O pin (bank 7) |
| Pin 147 | VCCINT — Core supply voltage (2.5 V) |
| Pin 148 | I/O — User I/O pin (bank 7) |
| Pin 149 | I/O — User I/O pin (bank 7) |
| Pin 150 | I/O — User I/O pin (bank 7) |
| Pin 151 | I/O — User I/O pin (bank 7) |
| Pin 152 | I/O — User I/O pin (bank 7) |
| Pin 153 | GND — Ground (per datasheet) |
| Pin 154 | I/O — User I/O pin (bank 7) |
| Pin 155 | I/O — User I/O pin (bank 7) |
| Pin 156 | I/O — User I/O pin (bank 7) |
| Pin 157 | I/O — User I/O pin (bank 7) |
| Pin 158 | I/O — User I/O pin (bank 7) |
| Pin 159 | I/O — User I/O pin (bank 7) |
| Pin 160 | I/O — User I/O pin (bank 7) |
| Pin 161 | VCCIO — I/O supply voltage |
| Pin 162 | I/O — User I/O pin (bank 8) |
| Pin 163 | I/O — User I/O pin (bank 8) |
| Pin 164 | GND — Ground (per datasheet) |
| Pin 165 | I/O — User I/O pin (bank 8) |
| Pin 166 | I/O — User I/O pin (bank 8) |
| Pin 167 | I/O — User I/O pin (bank 8) |
| Pin 168 | I/O — User I/O pin (bank 8) |
| Pin 169 | I/O — User I/O pin (bank 8) |
| Pin 170 | VCCINT — Core supply voltage (2.5 V) |
| Pin 171 | I/O — User I/O pin (bank 8) |
| Pin 172 | I/O — User I/O pin (bank 8) |
| Pin 173 | I/O — User I/O pin (bank 8) |
| Pin 174 | I/O — User I/O pin (bank 8) |
| Pin 175 | I/O — User I/O pin (bank 8) |
| Pin 176 | GND — Ground (per datasheet) |
| Pin 177 | I/O — User I/O pin (bank 8) |
| Pin 178 | I/O — User I/O pin (bank 8) |
| Pin 179 | I/O — User I/O pin (bank 8) |
| Pin 180 | I/O — User I/O pin (bank 8) |
| Pin 181 | I/O — User I/O pin (bank 8) |
| Pin 182 | I/O — User I/O pin (bank 8) |
| Pin 183 | I/O — User I/O pin (bank 8) |
| Pin 184 | I/O — User I/O pin (bank 8) |
| Pin 185 | VCCIO — I/O supply voltage |
| Pin 186 | I/O — User I/O pin (bank 8) |
| Pin 187 | GND — Ground (per datasheet) |
| Pin 188 | I/O — User I/O pin (bank 8) |
| Pin 189 | I/O — User I/O pin (bank 8) |
| Pin 190 | I/O — User I/O pin (bank 8) |
| Pin 191 | I/O — User I/O pin (bank 8) |
| Pin 192 | I/O — User I/O pin (bank 8) |
| Pin 193 | VCCINT — Core supply voltage (2.5 V) |
| Pin 194 | I/O — User I/O pin (bank 8) |
| Pin 195 | I/O — User I/O pin (bank 8) |
| Pin 196 | I/O — User I/O pin (bank 8) |
| Pin 197 | I/O — User I/O pin (bank 8) |
| Pin 198 | I/O — User I/O pin (bank 8) |
| Pin 199 | GND — Ground (per datasheet) |
| Pin 200 | I/O — User I/O pin (bank 8) |
| Pin 201 | I/O — User I/O pin (bank 8) |
| Pin 202 | I/O — User I/O pin (bank 8) |
| Pin 203 | I/O — User I/O pin (bank 8) |
| Pin 204 | I/O — User I/O pin (bank 8) |
| Pin 205 | I/O — User I/O pin (bank 8) |
| Pin 206 | I/O — User I/O pin (bank 8) |
| Pin 207 | TDO — JTAG test data output |
| Pin 208 | DEV_CLRn — Device clear (active-low, optional) |
Typical Applications
EPF10K30EQC208-2 is suitable for 6 applications: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.
Industrial Glue Logic Replacement
The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.
Recommended
Legacy Peripheral Bus Bridge
With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.
Recommended
Telecom Line-Card Interface Logic
The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.
Recommended
ASIC Replacement Prototyping
The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.
Recommended
Test & Measurement Front-End Controller
In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.
Recommended
Avionics Legacy Retrofit
Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K30EQC208-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K30EQC208-1 | EPF10K30EQC208-1N | EPF10K30EQC208-2N | EPF10K30AQC208-2 | EPF10K30AQC208-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 208-PQFP (30.6×30.6 mm) | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Family | FLEX 10KE | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KA | FLEX 10KA |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (bits) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | 24,576 (EAB-based) | Distributed RAM only (no EAB) | Distributed RAM only (no EAB) |
| Maximum User I/O | 147 | 147 | 147 | 147 | 147 | 147 |
| Speed Grade | -2 (faster) | -1 (slower) | -1 (slower) | -2 (faster) | -2 | -1 |
| RoHS / Lead-Free | Non-RoHS (SnPb) | Non-RoHS (SnPb) | Pb-free (RoHS) | Pb-free (RoHS) | Non-RoHS (SnPb) | Pb-free (RoHS) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vs EPF10K30EQC208-1)
- Includes EAB-based synchronous embedded memory (vs EPF10K30AQC208-2 (FLEX 10KA family))
- Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vs Newer Cyclone II/III families)
Design Notes
Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.
Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.
Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.
Compliance Information
Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.