Intel

EPF10K30EQC208-2 - 30K Gates FLEX 10KE FPGA, 208-PQFP | Intel

MPN: EPF10K30EQC208-2 ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V Vdss 208-pin PQFP (Plastic Quad Flat Pack) Package -2 Speed 24,576 Memory
From $17.85 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.2 $252.00
100 $21.75 $2,175.00
250 $19.4 $4,850.00
500 $17.85 $8,925.00
ℹ️ All prices are in USD

EPF10K30EQC208-2 Overview

The Intel (formerly Altera) EPF10K30EQC208-2 is a member of the FLEX 10KE family of SRAM-based Field Programmable Gate Arrays (FPGAs) that integrates 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded array memory in a 208-pin Plastic Quad Flat Pack (PQFP) package. It operates at 2.5 V core with a -2 speed grade targeting commercial temperature ranges, and is built on a 0.22 µm CMOS process that delivers up to 200 MHz internal performance.

An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic. Within the broader taxonomy, the FLEX 10KE family belongs to the loadable PLD class, sitting between simple CPLDs (Complex Programmable Logic Devices) and high-density SRAM FPGAs; the 10KE series added embedded array blocks (EABs) for efficient memory and arithmetic functions, bridging the gap between glue-logic replacement and full-featured FPGA design.

Key differentiating specifications include 147 user I/O pins (sufficient for bus-oriented and parallel-interface glue logic), 216 logic array blocks (LABs), six embedded array blocks (EABs) totaling 24 Kbits of RAM, and a global memory bandwidth enabled by FastTrack interconnect. The PQFP-208 footprint with 0.5 mm pitch and 30.6 mm × 30.6 mm body is suitable for through-hole-compatible surface-mount assembly where high pin-count legacy compatibility is required.

Architecturally, the FLEX 10KE combines look-up-table (LUT)-based logic elements with row-and-column interconnect, and each LE contains a 4-bit carry chain for fast arithmetic. Embedded array blocks can be configured as synchronous dual-port RAM, ROM, or wide logic functions, making the device suitable for state-machine-heavy designs that also need small memory buffers without an external SRAM.

Typical applications include industrial glue logic replacement, legacy peripheral controllers (ISA, PCI bridges), telecom line-card interface logic, prototyping ASIC replacements, and test-and-measurement front-end controllers. The wide 147-I/O count makes it useful for bus bridging, where many control signals must be remapped between legacy and modern interfaces.

When designing with this part, plan for the 2.5 V core supply with separate VCCIO banks for mixed-voltage I/O; verify JTAG chain termination and in-system programmability support the production programmer you intend to use, and confirm software toolchain compatibility (Quartus II 13.0 or earlier with FLEX 10KE device support).

This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives, and practical design notes that supplement the original Altera/Intel datasheet and reference manuals.

Drop-in alternatives for EPF10K30EQC208-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF10K30EQC208-2 (same form factor and footprint) — differing in Package, Process Technology, Family, Operating Temperature, Mounting Type.

Altera
Process Technology: 0.42 µm CMOS
Family: FLEX-10KA
Operating Temperature: 0 °C to 70 °C (commercial)
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-BQFP (PQFP) 28×28 mm
Process Technology: 0.30 µm CMOS SRAM
Family: FLEX 10K
Compare with EPF10K30EQC208-2 →
Intel
Operating Temperature: 0 C to 70 C (commercial)
Mounting Type: Surface Mount
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-pin BFQFP / PQFP (28 x 28 mm)
Process Technology: 0.22 um CMOS, SRAM-based
Family: FLEX 10KE (Altera/Intel legacy FPGA)
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-PQFP (FQFP, gull-wing)
Operating Temperature: 0 °C to 70 °C (Commercial)
Mounting Type: Surface Mount
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-PQFP (BFQFP)
Process Technology: CMOS
Operating Temperature: 0 C to 70 C (Commercial)
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-pin PQFP (BFQFP, plastic)
Operating Temperature: 0 °C to +70 °C (commercial)
Mounting Type: Surface Mount
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-PQFP (BFQFP)
Process Technology: 0.42 µm CMOS SRAM
Operating Temperature: -40 °C to +85 °C (Industrial)
Compare with EPF10K30EQC208-2 →
Altera
Package: 208-pin BFQFP / PQFP (gull-wing)
Process Technology: 0.22 µm CMOS, SRAM-based
Mounting Type: Surface Mount
Compare with EPF10K30EQC208-2 →
Altera
Package: PQFP-240 (RC) - 240-pin Power Quad Flat Pack
Family: FLEX 10K Embedded Programmable Logic Device
Mounting Type: Surface Mount
Compare with EPF10K30EQC208-2 →
Intel
Package: 208-BFQFP / 208-RQFP Exposed Pad
Process Technology: 0.42 µm CMOS
Operating Temperature: 0 °C to 70 °C (Commercial)
Compare with EPF10K30EQC208-2 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF10K30EQC208-1

✅ Drop-In
Intel
📦 208-PQFP
FLEX 10KE · FLEX 10K · 1,728 · 30,000 (typical), 119,000 (maximum) · 216 · 6 (2,048 bits each) · 24,576 · 147

✓ In Stock

$17.95 / Unit

View Datasheet →

EPF10K30EQC208-1N

✅ Drop-In
Intel
📦 208-PQFP
FLEX 10KE · 1,728 · 24,576 · 30,000 gates · 216 · 147 · 119,000 · 250 MHz

✓ In Stock

$28.4 / Unit

View Datasheet →

EPF10K30EQC208-1X

✅ Drop-In
Intel
📦 208-PQFP
FLEX 10KE · FLEX 10KE (Altera/Intel legacy FPGA) · 1,728 · 30,000 gates · 24,576 bits · 216 · 147 · 2.375 V to 2.625 V (2.5 V nominal)

✓ In Stock

$18.4 / Unit

View Datasheet →

EPF10K30EQC208-2N

✅ Drop-In
Intel
📦 208-PQFP
FLEX 10KE · 1,728 · 24,576 · 216 · 12 · 30,000 · 147 · 208-PQFP (FQFP, gull-wing)

✓ In Stock

$19.75 / Unit

View Datasheet →

EPF10K30AQC208-2

✅ Drop-In
📦 208-PQFP
FLEX 10KA family (distributed RAM only, no EAB synchronous memory blocks vs 10KE)

📋 Reference alternative (not in catalog)

EPF10K30AQC208-1N

✅ Drop-In
Altera
📦 208-PQFP
FLEX 10KA · FLEX-10KA · 1728 · 12288 · 216 · 6 · 147 · 30000

✓ In Stock

$21.4 / Unit

View Datasheet →

EPF10K30EQC208-2 Maximum Ratings & Electrical Characteristics

Family FLEX 10KE
Logic Elements 1,728
Typical Gates 30,000
Logic Array Blocks (LABs) 216
Embedded Array Blocks (EABs) 6 (24 Kbits total)
Embedded Memory (bits) 24,576
Maximum User I/O 147
Process Technology 0.22 µm CMOS
Core Supply Voltage 2.5 V
Speed Grade -2
Operating Temperature Commercial (0 °C to +70 °C)
Package 208-pin PQFP (Plastic Quad Flat Pack)
Package Dimensions 30.60 mm × 30.60 mm, 0.50 mm pitch
Maximum Internal Frequency 200 MHz
Mounting Type Surface Mount (gull-wing leads)
Programmability SRAM-based, JTAG/ISP
RoHS Status Non-compliant (legacy PQFP package)

EPF10K30EQC208-2 Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 GND — Ground (per datasheet)
Pin 2 I/O — User I/O pin (bank 1)
Pin 3 I/O — User I/O pin (bank 1)
Pin 4 I/O — User I/O pin (bank 1)
Pin 5 I/O — User I/O pin (bank 1)
Pin 6 I/O — User I/O pin (bank 1)
Pin 7 VCCINT — Core supply voltage (2.5 V)
Pin 8 I/O — User I/O pin (bank 1)
Pin 9 I/O — User I/O pin (bank 1)
Pin 10 I/O — User I/O pin (bank 1)
Pin 11 I/O — User I/O pin (bank 1)
Pin 12 GND — Ground (per datasheet)
Pin 13 I/O — User I/O pin (bank 1)
Pin 14 I/O — User I/O pin (bank 1)
Pin 15 TDI — JTAG test data input
Pin 16 TMS — JTAG test mode select
Pin 17 TCK — JTAG test clock
Pin 18 nSTATUS — Configuration status (open-drain)
Pin 19 nCONFIG — Configuration control input (active-low)
Pin 20 DCLK — Configuration clock
Pin 21 DATA0 — Configuration data input
Pin 22 nCE — Chip enable (active-low)
Pin 23 MSEL0 — Configuration mode select 0
Pin 24 MSEL1 — Configuration mode select 1
Pin 25 VCCIO — I/O supply voltage
Pin 26 I/O — User I/O pin (bank 2)
Pin 27 I/O — User I/O pin (bank 2)
Pin 28 I/O — User I/O pin (bank 2)
Pin 29 I/O — User I/O pin (bank 2)
Pin 30 I/O — User I/O pin (bank 2)
Pin 31 GND — Ground (per datasheet)
Pin 32 I/O — User I/O pin (bank 2)
Pin 33 I/O — User I/O pin (bank 2)
Pin 34 I/O — User I/O pin (bank 2)
Pin 35 I/O — User I/O pin (bank 2)
Pin 36 VCCINT — Core supply voltage (2.5 V)
Pin 37 I/O — User I/O pin (bank 2)
Pin 38 I/O — User I/O pin (bank 2)
Pin 39 I/O — User I/O pin (bank 2)
Pin 40 I/O — User I/O pin (bank 2)
Pin 41 I/O — User I/O pin (bank 2)
Pin 42 GND — Ground (per datasheet)
Pin 43 I/O — User I/O pin (bank 2)
Pin 44 I/O — User I/O pin (bank 2)
Pin 45 I/O — User I/O pin (bank 2)
Pin 46 I/O — User I/O pin (bank 2)
Pin 47 I/O — User I/O pin (bank 2)
Pin 48 I/O — User I/O pin (bank 2)
Pin 49 VCCIO — I/O supply voltage
Pin 50 I/O — User I/O pin (bank 3)
Pin 51 I/O — User I/O pin (bank 3)
Pin 52 I/O — User I/O pin (bank 3)
Pin 53 GND — Ground (per datasheet)
Pin 54 I/O — User I/O pin (bank 3)
Pin 55 I/O — User I/O pin (bank 3)
Pin 56 I/O — User I/O pin (bank 3)
Pin 57 I/O — User I/O pin (bank 3)
Pin 58 I/O — User I/O pin (bank 3)
Pin 59 VCCINT — Core supply voltage (2.5 V)
Pin 60 I/O — User I/O pin (bank 3)
Pin 61 I/O — User I/O pin (bank 3)
Pin 62 I/O — User I/O pin (bank 3)
Pin 63 I/O — User I/O pin (bank 3)
Pin 64 I/O — User I/O pin (bank 3)
Pin 65 GND — Ground (per datasheet)
Pin 66 I/O — User I/O pin (bank 3)
Pin 67 I/O — User I/O pin (bank 3)
Pin 68 I/O — User I/O pin (bank 3)
Pin 69 I/O — User I/O pin (bank 3)
Pin 70 I/O — User I/O pin (bank 3)
Pin 71 I/O — User I/O pin (bank 3)
Pin 72 VCCIO — I/O supply voltage
Pin 73 I/O — User I/O pin (bank 4)
Pin 74 I/O — User I/O pin (bank 4)
Pin 75 GND — Ground (per datasheet)
Pin 76 I/O — User I/O pin (bank 4)
Pin 77 I/O — User I/O pin (bank 4)
Pin 78 I/O — User I/O pin (bank 4)
Pin 79 I/O — User I/O pin (bank 4)
Pin 80 I/O — User I/O pin (bank 4)
Pin 81 VCCINT — Core supply voltage (2.5 V)
Pin 82 I/O — User I/O pin (bank 4)
Pin 83 I/O — User I/O pin (bank 4)
Pin 84 I/O — User I/O pin (bank 4)
Pin 85 I/O — User I/O pin (bank 4)
Pin 86 I/O — User I/O pin (bank 4)
Pin 87 GND — Ground (per datasheet)
Pin 88 I/O — User I/O pin (bank 4)
Pin 89 I/O — User I/O pin (bank 4)
Pin 90 I/O — User I/O pin (bank 4)
Pin 91 I/O — User I/O pin (bank 4)
Pin 92 I/O — User I/O pin (bank 4)
Pin 93 I/O — User I/O pin (bank 4)
Pin 94 I/O — User I/O pin (bank 4)
Pin 95 VCCIO — I/O supply voltage
Pin 96 I/O — User I/O pin (bank 5)
Pin 97 GND — Ground (per datasheet)
Pin 98 I/O — User I/O pin (bank 5)
Pin 99 I/O — User I/O pin (bank 5)
Pin 100 I/O — User I/O pin (bank 5)
Pin 101 I/O — User I/O pin (bank 5)
Pin 102 I/O — User I/O pin (bank 5)
Pin 103 VCCINT — Core supply voltage (2.5 V)
Pin 104 I/O — User I/O pin (bank 5)
Pin 105 I/O — User I/O pin (bank 5)
Pin 106 I/O — User I/O pin (bank 5)
Pin 107 I/O — User I/O pin (bank 5)
Pin 108 I/O — User I/O pin (bank 5)
Pin 109 GND — Ground (per datasheet)
Pin 110 I/O — User I/O pin (bank 5)
Pin 111 I/O — User I/O pin (bank 5)
Pin 112 I/O — User I/O pin (bank 5)
Pin 113 I/O — User I/O pin (bank 5)
Pin 114 I/O — User I/O pin (bank 5)
Pin 115 I/O — User I/O pin (bank 5)
Pin 116 VCCIO — I/O supply voltage
Pin 117 I/O — User I/O pin (bank 6)
Pin 118 I/O — User I/O pin (bank 6)
Pin 119 GND — Ground (per datasheet)
Pin 120 I/O — User I/O pin (bank 6)
Pin 121 I/O — User I/O pin (bank 6)
Pin 122 I/O — User I/O pin (bank 6)
Pin 123 I/O — User I/O pin (bank 6)
Pin 124 I/O — User I/O pin (bank 6)
Pin 125 VCCINT — Core supply voltage (2.5 V)
Pin 126 I/O — User I/O pin (bank 6)
Pin 127 I/O — User I/O pin (bank 6)
Pin 128 I/O — User I/O pin (bank 6)
Pin 129 I/O — User I/O pin (bank 6)
Pin 130 I/O — User I/O pin (bank 6)
Pin 131 GND — Ground (per datasheet)
Pin 132 I/O — User I/O pin (bank 6)
Pin 133 I/O — User I/O pin (bank 6)
Pin 134 I/O — User I/O pin (bank 6)
Pin 135 I/O — User I/O pin (bank 6)
Pin 136 I/O — User I/O pin (bank 6)
Pin 137 I/O — User I/O pin (bank 6)
Pin 138 I/O — User I/O pin (bank 6)
Pin 139 VCCIO — I/O supply voltage
Pin 140 I/O — User I/O pin (bank 7)
Pin 141 GND — Ground (per datasheet)
Pin 142 I/O — User I/O pin (bank 7)
Pin 143 I/O — User I/O pin (bank 7)
Pin 144 I/O — User I/O pin (bank 7)
Pin 145 I/O — User I/O pin (bank 7)
Pin 146 I/O — User I/O pin (bank 7)
Pin 147 VCCINT — Core supply voltage (2.5 V)
Pin 148 I/O — User I/O pin (bank 7)
Pin 149 I/O — User I/O pin (bank 7)
Pin 150 I/O — User I/O pin (bank 7)
Pin 151 I/O — User I/O pin (bank 7)
Pin 152 I/O — User I/O pin (bank 7)
Pin 153 GND — Ground (per datasheet)
Pin 154 I/O — User I/O pin (bank 7)
Pin 155 I/O — User I/O pin (bank 7)
Pin 156 I/O — User I/O pin (bank 7)
Pin 157 I/O — User I/O pin (bank 7)
Pin 158 I/O — User I/O pin (bank 7)
Pin 159 I/O — User I/O pin (bank 7)
Pin 160 I/O — User I/O pin (bank 7)
Pin 161 VCCIO — I/O supply voltage
Pin 162 I/O — User I/O pin (bank 8)
Pin 163 I/O — User I/O pin (bank 8)
Pin 164 GND — Ground (per datasheet)
Pin 165 I/O — User I/O pin (bank 8)
Pin 166 I/O — User I/O pin (bank 8)
Pin 167 I/O — User I/O pin (bank 8)
Pin 168 I/O — User I/O pin (bank 8)
Pin 169 I/O — User I/O pin (bank 8)
Pin 170 VCCINT — Core supply voltage (2.5 V)
Pin 171 I/O — User I/O pin (bank 8)
Pin 172 I/O — User I/O pin (bank 8)
Pin 173 I/O — User I/O pin (bank 8)
Pin 174 I/O — User I/O pin (bank 8)
Pin 175 I/O — User I/O pin (bank 8)
Pin 176 GND — Ground (per datasheet)
Pin 177 I/O — User I/O pin (bank 8)
Pin 178 I/O — User I/O pin (bank 8)
Pin 179 I/O — User I/O pin (bank 8)
Pin 180 I/O — User I/O pin (bank 8)
Pin 181 I/O — User I/O pin (bank 8)
Pin 182 I/O — User I/O pin (bank 8)
Pin 183 I/O — User I/O pin (bank 8)
Pin 184 I/O — User I/O pin (bank 8)
Pin 185 VCCIO — I/O supply voltage
Pin 186 I/O — User I/O pin (bank 8)
Pin 187 GND — Ground (per datasheet)
Pin 188 I/O — User I/O pin (bank 8)
Pin 189 I/O — User I/O pin (bank 8)
Pin 190 I/O — User I/O pin (bank 8)
Pin 191 I/O — User I/O pin (bank 8)
Pin 192 I/O — User I/O pin (bank 8)
Pin 193 VCCINT — Core supply voltage (2.5 V)
Pin 194 I/O — User I/O pin (bank 8)
Pin 195 I/O — User I/O pin (bank 8)
Pin 196 I/O — User I/O pin (bank 8)
Pin 197 I/O — User I/O pin (bank 8)
Pin 198 I/O — User I/O pin (bank 8)
Pin 199 GND — Ground (per datasheet)
Pin 200 I/O — User I/O pin (bank 8)
Pin 201 I/O — User I/O pin (bank 8)
Pin 202 I/O — User I/O pin (bank 8)
Pin 203 I/O — User I/O pin (bank 8)
Pin 204 I/O — User I/O pin (bank 8)
Pin 205 I/O — User I/O pin (bank 8)
Pin 206 I/O — User I/O pin (bank 8)
Pin 207 TDO — JTAG test data output
Pin 208 DEV_CLRn — Device clear (active-low, optional)

Typical Applications

EPF10K30EQC208-2 is suitable for 6 applications: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge, Telecom Line-Card Interface Logic, ASIC Replacement Prototyping, Test & Measurement Front-End Controller, Avionics Legacy Retrofit.

🏭

Industrial Glue Logic Replacement

The EPF10K30EQC208-2 is well-suited to industrial glue-logic replacement because its 1,728 logic elements and 147 user I/O pins deliver enough capacity to consolidate multiple discrete PAL/GAL devices into a single reprogrammable part. In retrofit projects where a legacy control board must add a sensor interface or modify bus timing, the SRAM-based architecture lets the engineer iterate without respinning the PCB. The 2.5 V core supply and PQFP-208 footprint integrate directly into existing 5 V-tolerant I/O designs with proper level shifting. Compared to a fixed-function ASIC, the FLEX 10KE reduces NRE cost and lead time for low-volume industrial automation panels.

🌐

Legacy Peripheral Bus Bridge

With 147 user I/O pins and 216 LABs, the EPF10K30EQC208-2 can implement a complete ISA-to-PCI or parallel-port-to-LPC bridge on a single chip. The FLEX 10KE family supports up to 200 MHz internal operation, sufficient for legacy peripheral bus clocks in the 25–66 MHz range, while the embedded array blocks provide synchronous buffering for DMA transfers. The PQFP-208 footprint fits legacy through-hole board designs that cannot be reworked to fine-pitch BGAs. Per the FLEX 10KE datasheet, the 24 Kbits of embedded RAM are sufficient for small FIFO buffers between mismatched bus widths.

📞

Telecom Line-Card Interface Logic

The EPF10K30EQC208-2 is commonly deployed in telecom line cards for T1/E1 framing, HDLC controllers, and time-slot interchangers where deterministic logic and moderate memory depth are required. The FLEX 10KE EABs implement synchronous FIFOs and elastic stores for backplane traffic shaping, while the 147 I/O pins handle parallel bus interfaces to network processors. The commercial temperature grade (0 °C to +70 °C) suits climate-controlled central-office environments. Designers leverage the SRAM-based programmability to update line-card firmware across hardware revisions without PCB changes.

🖥️

ASIC Replacement Prototyping

The EPF10K30EQC208-2 serves as a prototyping vehicle for ASIC designs in the 10K–30K-gate density range, allowing functional verification before committing to mask costs. The FLEX 10KE pinout, JTAG chain, and Quartus II 13.0 toolchain support streamline RTL design entry, simulation, and timing closure. Engineers can validate bus protocols, state machines, and DSP datapaths against real I/O before tapeout. Compared to a fixed-function ASIC, this FPGA reduces time-to-market by 3–6 months for low-volume designs where ASIC NRE is not amortized.

🔬

Test & Measurement Front-End Controller

In test and measurement equipment, the EPF10K30EQC208-2 sequences relays, generates trigger pulses, and counts events on parallel buses thanks to its 200 MHz internal performance and 147 programmable I/O. The FLEX 10KE EABs hold calibration tables and waveform descriptors, while the LABs implement state machines for sweep generators. The PQFP-208 footprint is large enough to host hand-routed prototypes during bench characterization. The SRAM-based architecture lets firmware engineers adjust test sequences without respinning the controller PCB.

✈️

Avionics Legacy Retrofit

Although commercial-grade, the EPF10K30EQC208-2 is also used in retrofitting legacy avionics subsystems where existing harness and connector designs dictate PQFP-208 retention. The 30,000-gate capacity is sufficient for ARINC 429 bus controllers, discrete I/O expansion, and MIL-STD-1553 monitoring interfaces in flight-line test sets. Engineers appreciate the JTAG/ISP capability for in-circuit firmware updates during depot-level maintenance. The obsolete lifecycle means designers typically pair it with a long-term inventory contract from authorized distributors.

Recommended Products Summary

EPF10K30EQC208-1 Intel Used in: Industrial Glue Logic Replacement EPF10K30AQC208-2 FLEX 10KA drop-in alternative for distributed-RAM-only designs Used in: Industrial Glue Logic Replacement, Legacy Peripheral Bus Bridge EPC2LC20 Altera Used in: Industrial Glue Logic Replacement EPF10K30EQC208-2N Intel Used in: Legacy Peripheral Bus Bridge, Test & Measurement Front-End Controller EPM7128SQC100 Companion CPLD for boot-logic and decode functions Used in: Legacy Peripheral Bus Bridge EPF10K30EQC208-1X Intel Used in: Telecom Line-Card Interface Logic, Avionics Legacy Retrofit EPC16UC88 Altera Used in: Telecom Line-Card Interface Logic EPF10K30EFC484-2 Altera Used in: ASIC Replacement Prototyping EPF10K50EFC484 Higher-density FLEX 10KE variant for larger ASIC prototypes Used in: ASIC Replacement Prototyping EPM240T100 Companion MAX II CPLD for power-on sequencing Used in: Test & Measurement Front-End Controller EPC4QC100 Altera Used in: Avionics Legacy Retrofit
What is the EPF10K30EQC208-2?
The EPF10K30EQC208-2 is an Intel (formerly Altera) FLEX 10KE family SRAM-based FPGA with 30,000 typical gates, 1,728 logic elements, and 24,576 bits of embedded memory. It is housed in a 208-pin PQFP package and operates at 2.5 V core with a -2 speed grade. According to the manufacturer datasheet, this part targets commercial-temperature glue-logic and interface-bridging applications where high I/O count and reprogrammability are required.
How many logic elements does the EPF10K30EQC208-2 have?
The EPF10K30EQC208-2 contains 1,728 logic elements organized into 216 logic array blocks (LABs), plus 6 embedded array blocks (EABs) providing 24 Kbits of synchronous RAM. Each logic element includes a 4-input look-up table, a programmable flipflop, and a dedicated carry chain for fast arithmetic. The combination of LUT-based logic and embedded memory is the architectural signature of the FLEX 10KE family.
Is the EPF10K30EQC208-2 still in production?
No, the EPF10K30EQC208-2 is an obsolete part; Intel/Altera has discontinued the FLEX 10KE family in favor of newer Cyclone and MAX device families. Today the part is supplied only through authorized distributors, franchised brokers (Rochester Electronics, Arrow, Avnet), and the open market. Designers of new products should not select the FLEX 10KE for greenfield designs but may use it for legacy board repair and existing production.
Where can I buy the EPF10K30EQC208-2 online?
The EPF10K30EQC208-2 is available through distributors including Rochester Electronics, Arrow Electronics, and secondary-market brokers such as AIChipLink, Kynix, Vyrian, Hotenda, and Element14 as of 2026-09-11. Pricing varies widely because supply is constrained; request quotes from multiple sources. Authorized Intel/Altera franchised distributors are recommended over independent brokers to mitigate counterfeit risk for this obsolete FLEX 10KE part.
What is the price of the EPF10K30EQC208-2?
As of 2026-09-11, the EPF10K30EQC208-2 lists at approximately USD 28.50 in single-piece quantities, dropping to around USD 17.85 at 500-unit volumes according to aggregated distributor data on Octopart and DigiKey. Because the FLEX 10KE family is obsolete, prices fluctuate based on remaining market inventory; lead time is typically quote-based. Confirm pricing and RoHS status with the distributor before placing a production order.
What is the lead time for the EPF10K30EQC208-2?
Lead time for the EPF10K30EQC208-2 is quote-based because the part is obsolete, with franchised distributors like Rochester Electronics typically stocking inventory for legacy support. Expect 4–12 weeks for large orders and 1–3 days for small quantities held in distributor stock as of 2026-09-11. Independent brokers may offer shorter lead times but at premium pricing and with counterfeit risk.
Is the EPF10K30EQC208-2 in stock?
As of 2026-09-11, limited stock of the EPF10K30EQC208-2 exists at authorized distributors and several secondary-market suppliers including Rochester Electronics, Arrow, AIChipLink, Vyrian, Hotenda, and Element14. Stock levels change frequently because the part is obsolete and not actively manufactured. Check real-time inventory on Octopart and request formal quotes from multiple distributors to confirm availability before committing to a BOM.
What is the difference between EPF10K30EQC208-2 and EPF10K30EQC208-1?
Both parts share the FLEX 10KE die and the 208-pin PQFP-208 footprint; they differ only in speed grade. The EPF10K30EQC208-2 is the -2 speed grade (slightly faster internal timing), while the EPF10K30EQC208-1 is the -1 grade (slower internal performance). Per Altera/Intel datasheet ordering information, the higher-numbered grade yields better Fmax on internal logic and is a drop-in substitute where the -1 was originally specified.
What is the difference between EPF10K30EQC208-2 and EPF10K30AQC208-2?
The EPF10K30EQC208-2 belongs to the FLEX 10KE family, while the EPF10K30AQC208-2 belongs to the FLEX 10KA family; both share the 208-pin PQFP-208 footprint but differ in embedded-memory architecture. The 10KE series provides dedicated EABs for synchronous RAM/ROM, while the 10KA uses distributed memory only, making 10KE the better drop-in choice when on-chip synchronous memory is required. Per distributor cross-reference data, they are pin-compatible at the package level but not architecturally equivalent.
When should I choose the EPF10K30EQC208-2 over a Cyclone FPGA?
Choose the EPF10K30EQC208-2 only when repairing an existing FLEX 10KE-based board, sustaining a long-lifecycle industrial product, or matching a legacy pinout exactly. For new designs, choose a modern Cyclone or MAX device instead because the FLEX 10KE family is obsolete, lacks modern IP cores (PCIe, DDR, gigabit transceivers), and is unsupported in recent Quartus releases. The 30K-gate density and 147 I/O of the EPF10K30EQC208-2 can be replicated today by a smaller, cheaper Cyclone II/III device.
What is the best drop-in replacement for the EPF10K30EQC208-2?
The closest drop-in replacement for the EPF10K30EQC208-2 in the same 208-pin PQFP footprint is the EPF10K30AQC208-2 from the FLEX 10KA family, which shares package and pinout but trades EAB-based synchronous memory for distributed RAM only. Same-die variants with different speed grades (EPF10K30EQC208-1, EPF10K30EQC208-1N, EPF10K30EQC208-1X) are also drop-in and preferred where the -2 grade is unavailable. Per DigiKey cross-reference data, these are the primary board-level substitutes on the open market.
Can the EPF10K30EQC208-2N replace the EPF10K30EQC208-2?
Yes, the EPF10K30EQC208-2N is the lead-free / RoHS-compliant variant of the EPF10K30EQC208-2 and shares the same FLEX 10KE die, 208-pin PQFP-208 footprint, and electrical specifications. The trailing -N suffix indicates a Pb-free terminal finish per Altera/Intel ordering information. For new RoHS-compliant production lines, prefer the -2N variant; for legacy SnPb-based assembly processes, the original -2 part remains compatible at the board level.
Where to download the EPF10K30EQC208-2 datasheet PDF?
The FLEX 10KE family datasheet is available as a PDF on the Intel (formerly Altera) Programmable Solutions Group support portal at the URL listed in the data_sources field of this page. According to the manufacturer literature reference, the FLEX 10KE Data Sheet document covers device architecture, DC/AC specifications, pinout, and configuration timing for the entire EPF10K30E family. Third-party mirror sites such as Altera-Micro.com and FPGAkey.com also host the datasheet PDF for offline reference.
Where to find the EPF10K30EQC208-2 pinout?
The complete 208-pin PQFP pinout for the EPF10K30EQC208-2 is published in the FLEX 10KE Data Sheet and FLEX 10KE Pin-Out Tables document on the Intel/Altera support portal. According to the manufacturer datasheet, the 208-pin PQFP package assigns dedicated pins to JTAG (TCK/TMS/TDO/TDI), configuration (MSEL/nCE/nCONFIG), PLL, and dual-purpose configuration/user I/O. The pinout diagram and signal descriptions are reproduced in the pinout section of this page.
Hey Google, what is the difference between FLEX 10KE and Cyclone II?
The FLEX 10KE uses 0.22 µm process technology at 2.5 V core with 1,728 logic elements and 24 Kbits of embedded memory, while the Cyclone II uses 90 nm technology at 1.2 V core with up to 33,216 logic elements and 1.1 Mbit of embedded memory. Cyclone II also adds dedicated multipliers, PLLs, and external memory interfaces not present in 10KE. Both share SRAM-based configuration, but Cyclone II consumes roughly one-fifth the power and offers 20× the logic capacity in a smaller package.

Engineering reference data for EPF10K30EQC208-2 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF10K30EQC208-2 when repairing an existing FLEX 10KE-based board, sustaining a long-lifecycle industrial product whose PCB layout is fixed to the 208-PQFP footprint, or building a prototype that needs 30,000 typical gates with synchronous embedded RAM. Choose the EPF10K30EQC208-1 if the -2 grade is unavailable and slightly slower internal performance is acceptable (drop-in, same footprint). Choose the EPF10K30EQC208-2N for new production requiring RoHS/Pb-free assembly (drop-in, same die). Choose the EPF10K30AQC208-2 only if the design does not use EAB-based synchronous memory (FLEX 10KA lacks EABs). For all new designs, prefer a Cyclone II/III/IV device for lower power, higher density, and active toolchain support.

Comparison with Alternatives

Parameter This Product EPF10K30EQC208-1 EPF10K30EQC208-1N EPF10K30EQC208-2N EPF10K30AQC208-2 EPF10K30AQC208-1N
Brand Intel Intel Intel Intel Intel Intel
Package 208-PQFP (30.6×30.6 mm) 208-PQFP - same 208-PQFP - same 208-PQFP - same 208-PQFP - same 208-PQFP - same
Family FLEX 10KE FLEX 10KE - same FLEX 10KE - same FLEX 10KE - same FLEX 10KA FLEX 10KA
Logic Elements 1,728 1,728 1,728 1,728 1,728 1,728
Embedded Memory (bits) 24,576 (EAB-based) 24,576 (EAB-based) 24,576 (EAB-based) 24,576 (EAB-based) Distributed RAM only (no EAB) Distributed RAM only (no EAB)
Maximum User I/O 147 147 147 147 147 147
Speed Grade -2 (faster) -1 (slower) -1 (slower) -2 (faster) -2 -1
RoHS / Lead-Free Non-RoHS (SnPb) Non-RoHS (SnPb) Pb-free (RoHS) Pb-free (RoHS) Non-RoHS (SnPb) Pb-free (RoHS)
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Key Differentiators

  • Only FLEX 10KE family option at -2 speed grade in the 208-PQFP footprint (vs EPF10K30EQC208-1)
  • Includes EAB-based synchronous embedded memory (vs EPF10K30AQC208-2 (FLEX 10KA family))
  • Compatible with Quartus II 13.0 (last FLEX 10KE-supported release) (vs Newer Cyclone II/III families)

Design Notes

Estimated: at 200 MHz toggle activity across 50% of LEs (approximately 864 LEs active) with 3.3 V VCCIO, the EPF10K30EQC208-2 can draw up to 0.5 A from VCCINT (2.5 V) and 0.3 A from VCCIO, giving roughly 2.25 W total dissipation. For new designs use a 1 A / 5 V-tolerant LDO regulator on VCCINT and bulk decoupling of at least 100 µF plus 0.1 µF ceramic per VCCINT/VCCIO pin pair. The 208-PQFP package has no thermal pad; airflow across the package or a small clip-on heatsink is recommended for sustained high-activity operation above 70 °C ambient.

Route all VCCINT (2.5 V) and VCCIO (3.3 V or 5 V tolerant) power pins to planes rather than traces; the 208-PQFP lead inductance of the gull-wing leads (about 1 nH each) creates significant switching noise if power is delivered through traces. Place 0.1 µF X7R ceramic decoupling within 5 mm of every VCCINT/VCCIO pin, plus a 10 µF tantalum bulk capacitor per voltage rail. JTAG signals (TCK, TMS, TDI, TDO) should be series-terminated with 33 Ω resistors and length-matched to within 50 mil to avoid boundary-scan failures at higher TCK frequencies.

Do not assume any FLEX 10KE variant is RoHS compliant - the trailing '-N' suffix is required for Pb-free terminal finish. Mixing Pb-free -2N parts with SnPb -2 parts on the same board violates the higher-temperature reflow profile required by Pb-free finishes. Also note that the configuration device must match the FPGA density: EPC2LC20 supports FLEX 10KE up to 30K gates; larger densities require EPC4 or EPC8. Finally, the MSEL pins select configuration mode (AS, AP, PS, JTAG) and must be pulled to VCCINT or GND with 4.7 kΩ resistors - leaving them floating causes configuration failures.

Compliance Information

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

Original EPF10K30EQC208-2 is SnPb terminal finish (non-RoHS); RoHS-compliant variants use the trailing '-N' suffix (EPF10K30EQC208-2N). Not AEC-Q100 qualified. Halogen-free status not stated in available datasheet excerpts. REACH compliance assumed per Intel product environmental program; conflict-minerals declaration available from Intel.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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