EPF10K50SFC484-3 - 50K FLEX-10KS FPGA 220 I/O 484-BGA | Altera
MPN: EPF10K50SFC484-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $270 | $2,700.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218 | $109,000.00 |
| 1,000 | $195 | $195,000.00 |
EPF10K50SFC484-3 Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix, allowing designers to implement arbitrary digital logic that is re-programmable in-system. FPGAs sit hierarchically under programmable logic devices (PLDs), which in turn belong to the broader category of digital logic ICs and semiconductors. The FLEX-10KS family was one of the first families to embed dedicated SRAM blocks (EABs) alongside general-purpose logic, pioneering the System-on-a-Programmable-Chip (SOPC) concept that allowed soft-core processors and custom peripherals to share a single silicon device.
Key features of the EPF10K50SFC484-3 include 360 Logic Array Blocks (LABs), 50,000 typical gates, 0.42 µm process geometry, 2.5 V VCCINT supply, in-system programmable SRAM configuration cells, and JTAG-compliant IEEE 1149.1 boundary-scan test support. The '-3' speed grade denotes the slowest of three commercially available speed grades for this family and is generally used for cost-sensitive non-timing-critical applications.
Architecturally, the device combines a Lookup Table (LUT)-based fine-grain logic fabric with 10 EABs that each provide up to 4 Kbits of dual-port SRAM, ideal for FIFO buffers, wide register files, and small cache memories. The programmable interconnect uses continuous FastTrack routing, providing predictable timing suitable for synchronous design at clock rates up to the family maximum (about 66 MHz internal frequency for the -3 speed grade in this family).
Typical applications for the EPF10K50SFC484-3 include telecommunications glue logic, industrial control interfaces, prototyping ASICs, custom peripheral expansion in embedded systems, and legacy system upgrades where 5 V-tolerant I/O and 50 K-gate capacity are sufficient. The 484-ball FBGA package provides dense I/O access for board designs that need to break out a large number of signals.
A key design consideration is the device's obsolete status - it was discontinued by Altera (now Intel PSG) and is only available through the secondary market. Designers should plan for last-time-buy or migration to newer Cyclone or MAX families. I/O banks support 2.5 V LVTTL/LVCMOS with PCI compatibility, and configuration must be loaded from a serial PROM or via JTAG at every power-up because the SRAM cells are volatile.
This page synthesizes distributor inventory, same-brand speed-grade and EAB-count alternatives, and practical design notes not found in the original FLEX-10KS datasheet - enabling engineers to source or substitute the EPF10K50SFC484-3 with confidence.
Drop-in alternatives for EPF10K50SFC484-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K50SFC484-3 (same form factor and footprint) — differing in Package, Family, Operating Temperature, Speed Grade, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K50SFC484-2
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K50SFC484-1N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF10K130EFC484-3
✅ Drop-In✓ In Stock
$178.92 / Unit
View Datasheet →EP1K50FC484-3
✅ Drop-In✓ In Stock
$42.1 / Unit
View Datasheet →EPF10K50SFC484-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX-10KS |
| Logic Elements | 2,880 |
| Typical Gates | 50,000 |
| System Gates | 199,000 (max) |
| Logic Array Blocks (LABs) | 360 |
| Embedded Memory | 40 Kbit (10 EABs) |
| User I/O | 220 |
| Package | 484-ball FBGA (S-PBGA-B484) |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V |
| Speed Grade | -3 (slowest commercial) |
| Internal Frequency | 66.67 MHz (max) |
| Propagation Delay | 0.6 ns |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM (volatile, JTAG/serial PROM) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| RoHS Status | Not Compliant (per Arrow listing) |
EPF10K50SFC484-3 484-ball fbga (s-pbga-b484) Pin Configuration Guide
Pin configuration for EPF10K50SFC484-3 (484-ball fbga (s-pbga-b484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K50SFC484-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K50SFC484-3 is suitable for 6 applications: Telecommunications Glue Logic, Industrial Control Interface Expansion, ASIC Prototyping and Emulation, Legacy System Replication and Sustainment, Custom Peripheral Expansion for Embedded Systems, Test and Measurement Instrumentation Front-End.
Telecommunications Glue Logic
The EPF10K50SFC484-3's 50K gates and 220 user I/O are well suited to legacy telecom interface cards that need custom bus-bridging logic between E1/T1 framers, UARTs, and a host processor. Its 40 Kbit embedded SRAM across 10 EABs provides FIFO buffers for packet buffering without external memory, and the 484-ball FBGA package allows dense I/O break-out for backplane designs. Compared to a CPLD, the FLEX-10KS fabric gives telecom designers the headroom to add protocol-specific state machines in the same device.
Recommended
Industrial Control Interface Expansion
In industrial control, the EPF10K50SFC484-3 is used to implement custom I/O expansion logic for PLC backplanes, motor-control signal conditioning, and proprietary fieldbus adapters. Its 220 user I/O accommodate parallel encoder interfaces, GPIO expansion, and timing-critical PWM generation. The 2.5 V core and commercial 0-70 °C operating range are adequate for cabinet-mounted equipment. Engineers often pair this FPGA with opto-isolated I/O drivers on the same PCB for robust industrial designs.
Recommended
ASIC Prototyping and Emulation
The 50K-gate capacity and in-system SRAM programmability of the EPF10K50SFC484-3 make it a strong ASIC prototyping vehicle. Engineers can map a 30K-40K gate ASIC onto the FLEX-10KS fabric, iterate the design via JTAG, and validate I/O behavior at 66 MHz before committing to a mask revision. The 484-FBGA package provides enough I/O to break out a wide ASIC pad ring. Same-family migration to FLEX-10KE EPF10K130EFC484-3 offers 130K gates in the same footprint for larger designs.
Recommended
Legacy System Replication and Sustainment
Defense, aerospace, and medical equipment manufacturers maintain installed bases with FLEX-10KS-based designs and need form-fit-function replacements when original stocks are exhausted. The EPF10K50SFC484-3 (and its speed-grade siblings -2 and -1N) provide bitstream-identical replacements on the same 484-FBGA PCB, enabling sustainment without requalification. This is the primary use case for sourcing this obsolete part from the secondary market in 2026.
Recommended
Custom Peripheral Expansion for Embedded Systems
Embedded designs using legacy 68k, MIPS, or PowerPC processors often lack peripheral functions that the EPF10K50SFC484-3 can synthesize - custom DMA controllers, video timing generators, or specialty serial protocols. Its 10 EABs provide FIFO and lookup-table RAM for these peripherals without external memory, and the 220 I/O easily break out to ISA or VME-style buses. The 2.5 V core can interface to 3.3 V processors through the I/O bank supply.
Recommended
Test and Measurement Instrumentation Front-End
Test equipment designers use the EPF10K50SFC484-3 to implement custom pattern generators, timing-and-control sequencers, and protocol analyzers. The FLEX-10KS fabric delivers deterministic timing at the -3 speed grade up to 66 MHz, sufficient for legacy logic-analyzer and BERT front-ends. The 40 Kbit embedded SRAM holds pattern tables without external memory, and the 220 I/O route cleanly to high-pin-count test connectors on the instrument front panel.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K50SFC484-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K50SFC484-2 | EPF10K50SFC484-1N | EPF10K130EFC484-3 | EP1K50FC484-3 |
|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Family | FLEX-10KS | FLEX-10KS | FLEX-10KS | FLEX-10KE | ACEX-1K |
| Typical Gates | 50,000 | 50,000 | 50,000 | 130,000 | 50,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 6,656 | 2,880 |
| Speed Grade | -3 (slowest) | -2 (faster) | -1N (fastest) | -3 | -3 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process | 0.42 µm | 0.42 µm | 0.42 µm | 0.22 µm | 0.22 µm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Slowest speed grade - lowest cost in FLEX-10KS 484-FBGA family (vs EPF10K50SFC484-2)
- 50K gates in 484-FBGA - balanced density vs I/O ratio for legacy glue logic (vs EPF10K130EFC484-3)
- FLEX-10KS architecture - bitstream-compatible with -1N and -2 speed grades (vs EP1K50FC484-3)
Design Notes
The EPF10K50SFC484-3 requires a stable 2.5 V VCCINT supply with a tolerance of ±5% and a separate VCCIO bank supply (typically 2.5 V or 3.3 V depending on the I/O standard). Decouple VCCINT with 100 nF ceramic capacitors near every supply pin, plus 10 µF bulk capacitance per power rail. Estimated: at 100% utilization and 66 MHz, core current can reach 300-500 mA, so a switching regulator with adequate headroom (e.g., 3.3 V → 2.5 V at 1 A) is recommended over a linear LDO for thermal reasons. Sequence VCCINT before VCCIO if JTAG configuration is used to avoid I/O latch-up.
The 484-ball FBGA has a 1.0 mm ball pitch and 2.1 mm seated height. Use a minimum 4-layer PCB with continuous power and ground planes directly beneath the BGA - the center balls are VCCINT and GND and require low-inductance return paths. Escape routing should use 0.15 mm (6 mil) traces with 0.20 mm (8 mil) spaces. Microvia or via-in-pad technology is strongly recommended to break out the inner rows; dog-bone fan-out with through-vias works but limits routability on the inner balls. Per the FLEX-10KS datasheet, all unused I/O should be left floating or weakly pulled to avoid configuration failures.
Estimated: The EPF10K50SFC484-3 SRAM configuration is volatile - if the EPC configuration PROM is not properly selected (EPC1 vs EPC2 vs EPC4 vs EPC8/EPC16), the device will fail to configure at power-up and all I/O will tri-state. Verify the MSEL pins match the desired configuration mode (AS, AP, PS, PPS, JTAG). The -3 speed grade at 0.42 µm has limited internal frequency (~66 MHz) - do not over-constrain timing closure at 80+ MHz; use the -2 or -1N grade instead. Finally, because the part is obsolete, last-time-buy planning and proactive obsolescence management are critical for production programs.
Estimated: With θJA around 15-20 °C/W for the 484-FBGA package on a 4-layer JEDEC test board, full-utilization operation at 66 MHz can dissipate 1.5-2 W, yielding a junction temperature rise of 30-40 °C above ambient. For commercial 0-70 °C operation this is acceptable without a heatsink, but sealed enclosures should derate ambient by 10-15 °C. The 0.42 µm process is more power-hungry than modern FPGAs - if the design runs hot, migrate to FLEX-10KE or ACEX-1K on the same 484-FBGA footprint.
Compliance Information
Per Arrow listing, the EPF10K50SFC484-3 is marked 'EU RoHS Not Compliant' - consistent with Altera's 0.42 µm process from the late 1990s predating RoHS. Lead-free and halogen-free status not stated in available data; AEC-Q100 not applicable (commercial-grade FPGA).
