EP1K50FC484-3 - ACEX-1K 50K Gates FPGA, 484-FBGA | Intel / Altera
MPN: EP1K50FC484-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $55.04 | $55.04 |
| 10 | $52.5 | $525.00 |
| 100 | $49.2 | $4,920.00 |
| 500 | $45.8 | $22,900.00 |
| 1,000 | $42.1 | $42,100.00 |
EP1K50FC484-3 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device that integrates configurable logic blocks (LCs), programmable interconnect, and dedicated memory into a single silicon die. The ACEX-1K family targets low-cost system-on-a-programmable-chip (SOPC) integration, providing an enhanced embedded array structure that is optimized for implementing megafunctions such as efficient memory blocks, specialized DSP-like logic, and dual-port RAM. Within the broader taxonomy, an FPGA sits between programmable logic devices (PLDs/CPLDs) and mask-programmed ASICs, offering higher density than CPLDs and faster time-to-market than ASICs.
Key features include 360 Logic Array Blocks (LABs) grouped into a multiplexed network, 249 user I/Os, embedded memory of 40 Kbits (EAB-based), in-system programmability via SRAM configuration, and JTAG-based IEEE 1149.1 boundary-scan test support. The device is rated for a maximum internal clock frequency of 166.67 MHz. SRAM-based configuration means the design bitstream must be loaded at every power-up from an external PROM or microcontroller, which is a defining architectural trade-off versus antifuse or flash-based FPGAs.
The EP1K50FC484-3 is built on a look-up-table (LUT) architecture with 4-input LEs and a continuous routing fabric, paired with Embedded Array Blocks (EABs) for true dual-port RAM, ROM, and multiplier functions. Five metal layers reduce signal skew across the 484-ball BGA package, and a -3 speed grade indicates the slowest grade in this family, with the -1 and -2 grades offering progressively faster timing. Designers targeting higher FMAX should consider EP1K50FC484-2N or EP1K50FC484-1 from the same family.
Typical applications include glue-logic replacement, bus-bridging interfaces (PCI, ISA), prototyping of ASIC designs, industrial control logic, low-density DSP preprocessing, and communications glue functions. Designers moving to a modern footprint should evaluate Cyclone-series equivalents from the Cyclone, Cyclone II, or Cyclone III families, none of which retain the 484-FBGA pinout.
When designing with this device, remember that ACEX-1K devices are listed as obsolete by Altera/Intel, and Long-Term Supply (LTS) availability is limited. Plan for last-time-buy strategies and validate second-source options within the ACEX-1K family (EP1K50FC484-2N, EP1K50FC484-1) before committing to new designs.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical end-of-life design notes not aggregated on the manufacturer product page.
Drop-in alternatives for EP1K50FC484-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP1K50FC484-3 (same form factor and footprint) — differing in Package, Speed Grade, Process Technology, Configuration Method, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC484-2N
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EP1K50FC484-1
✅ Drop-In✓ In Stock
$26.4 / Unit
View Datasheet →EP1K50FC484-1N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP1K50FC484-2
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EP1K100FC484-2
✅ Drop-In✓ In Stock
$33.4 / Unit
View Datasheet →EP1K100FC484-3
✅ Drop-In✓ In Stock
$52.5 / Unit
View Datasheet →EP1K50FC484-3 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements | 2880 |
| System Gates | 50000 (199000 maximum per Arrow) |
| Number of LABs | 360 |
| Embedded Memory (EAB RAM) | 40 Kbit |
| Maximum User I/Os | 249 |
| Process Technology | 0.22 µm CMOS |
| Number of Metal Layers | 5 |
| Core Supply Voltage | 2.5 V |
| Speed Grade | -3 (slowest) |
| Maximum Internal Frequency | 166.67 MHz |
| Package | 484-FBGA (FineLine BGA) |
| Configuration Method | SRAM-based (volatile) |
| Operating Temperature Grade | Commercial |
| RoHS Status | Non-compliant (per Arrow / Heisener listing) |
| Lead-Free | No (SnPb ball composition historically) |
| Programming Interface | JTAG (IEEE 1149.1) + serial/parallel passive / active configuration |
| Logic Element Structure | 4-input LUT + programmable register |
EP1K50FC484-3 484-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP1K50FC484-3 (484-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K50FC484-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EP1K50FC484-3 is suitable for 7 applications: ASIC Prototyping & Logic Emulation, Industrial Control Logic Replacement, Legacy Communications Interface Bridging, Test & Measurement Front-End Logic, Military & Aerospace Legacy Systems, Education & FPGA Learning Platforms, Image & Video Processing Pre-Processors.
ASIC Prototyping & Logic Emulation
The EP1K50FC484-3 with 2,880 logic elements and 40 Kbit embedded EAB memory is well suited to early-stage ASIC prototyping where fast iteration and design changes are required. The SRAM-based configuration enables unlimited reprogramming cycles, letting engineers validate functionality, timing closure, and I/O behavior before committing to a mask-programmed ASIC. The 249 user I/Os connect to virtually any bus or peripheral. Performance note: the -3 speed grade caps internal clock frequency at ~166 MHz; engineers targeting higher FMAX should select the -2N or -1 grade drop-in part on the same 484-FBGA footprint.
Recommended
Industrial Control Logic Replacement
In factory automation and process control systems, the EP1K50FC484-3 replaces discrete 74-series glue logic, PALs, and small CPLDs with a single programmable device. Its 360 LABs handle state machines, encoder/decoder logic, and interrupt controllers for PLC front-ends. The 2.5 V core plus selectable I/O standards (3.3 V, 5 V tolerant with level-shifting) integrate easily with legacy industrial buses. Trade-off: industrial temperature grades are not available for this part, so designers must specify commercial-temperature BOMs and screen at the board level.
Recommended
Legacy Communications Interface Bridging
The EP1K50FC484-3 implements bus-bridging functions between legacy interfaces (ISA, PCI 33 MHz, VME) and modern processors, with 2,880 LEs providing ample room for protocol conversion state machines and FIFO buffers backed by 40 Kbit of EAB RAM. The 484-FBGA ballout exposes enough I/O for 32-bit data plus full addressing and control. This part is widely deployed in telecom and datacom infrastructure built between 2000 and 2008, so it remains in long-lived systems requiring spare-part support.
Recommended
Test & Measurement Front-End Logic
Bench-top and ATE-class test instruments use the EP1K50FC484-3 to implement custom timing generators, vector capture logic, and protocol-aware triggering. The 166.67 MHz max internal clock plus 249 user I/Os support parallel-data acquisition front-ends, while 40 Kbit of EAB memory provides sample buffering. The SRAM-based architecture lets developers upload new test patterns over JTAG in seconds. Engineers should note that -3 speed grade timing margins are tighter than -1; reserve timing margins when targeting 100 MHz+ sample rates.
Recommended
Military & Aerospace Legacy Systems
Many avionics and defense platforms designed in the early 2000s embed the EP1K50FC484-3 as mission-critical glue logic, where revalidation of new parts is prohibitively expensive. The 2.5 V core, 484-FBGA footprint, and proven SRAM architecture are documented in long-standing system qualification packages. For ongoing sustainment programs, this part supports last-time-buy buffers and authorized aftermarket sourcing. Performance note: -3 speed grade is sufficient for control-loop rates typical of legacy flight systems, where processor busses operate well below 100 MHz.
Recommended
Education & FPGA Learning Platforms
Universities and training labs still use EP1K50FC484-3 in introductory digital-logic curricula because of its small but illustrative architecture (4-input LUTs, LABs, EABs) and QUARTUS II / MAX+PLUS II tool support. Students can implement small RISC cores, VGA controllers, or PWM generators within the 2,880-LE budget. Note: MAX+PLUS II has been superseded by Quartus Prime, so most modern labs use legacy software. The 484-FBGA package is typically mounted on a developer board that breaks out JTAG and user I/Os.
Recommended
Image & Video Processing Pre-Processors
Low-resolution image preprocessing pipelines (e.g., simple FIR filtering, thresholding, frame buffering) fit within the EP1K50FC484-3's 2,880 LEs and 40 Kbit EAB memory. The 249 user I/Os accommodate parallel video buses such as ITU-R BT.601, while the 166.67 MHz internal clock supports ~140 MHz pixel rates after timing overhead. For modern MIPI or HDMI pipelines the part is undersized — engineers should evaluate Cyclone IV / V for new designs. For legacy PAL/NTSC preprocessing, the part remains a cost-effective drop-in option.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50FC484-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC484-2N | EP1K50FC484-1 | EP1K50FC484-1N | EP1K50FC484-2 | EP1K100FC484-2 | EP1K100FC484-3 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K | ACEX-1K |
| Speed Grade | -3 (slowest) | -2N (mid) | -1 (fastest) | -1N (fastest, lead-free) | -2 (mid) | -2 (mid) | -3 (slowest) |
| Logic Elements | 2880 | 2880 | 2880 | 2880 | 2880 | 4960 (+72%) | 4960 (+72%) |
| System Gates | 50000 | 50000 | 50000 | 50000 | 50000 | 100000 | 100000 |
| Embedded Memory (EAB) | 40 Kbit | 40 Kbit | 40 Kbit | 40 Kbit | 40 Kbit | 80 Kbit | 80 Kbit |
| User I/Os | 249 | 249 | 249 | 249 | 249 | 333 | 333 |
| RoHS / Lead-Free | Non-RoHS | RoHS (lead-free) | Non-RoHS | RoHS (lead-free) | Non-RoHS | Non-RoHS | Non-RoHS |
Key Differentiators
- Lowest-cost option in the EP1K50 484-FBGA family (vs EP1K50FC484-2N)
- Pin-compatible density upgrade path within ACEX-1K (vs EP1K100FC484-3)
- Same-footprint FMAX headroom for timing closure (vs EP1K50FC484-1)
Design Notes
The EP1K50FC484-3 requires a clean 2.5 V core supply (VCCINT) plus one or more VCCIO rails for the I/O banks. Decoupling: place one 0.1 µF X7R ceramic cap per VCCINT pin and 33 µF bulk tantalum near the regulator. Estimated: ICCINT at 166 MHz with 80% utilization is typically 150-250 mA — verify with Quartus PowerPlay before finalizing the regulator. Power-on ramp must follow Altera's recommended sequence (VCCINT before VCCIO by ≥0 ms) to avoid latch-up.
FineLine BGA escape routing requires microvia or laser-drilled stack-up. Recommended stack-up: 1 oz copper on outer layers, 0.5 oz on internal; signal trace width 100 µm (4 mil) preferred. Power planes should be split into VCCINT and VCCIO islands with stitching vias every 5 mm to suppress ground bounce. Matched-length groups (within 50 mil) are required for clock and DQS lines. Estimated: a 4-layer board with 1 oz copper can dissipate 1.5-2 W without external heatsinking; add thermal vias for higher loads.
Pitfall #1: The SRAM configuration is volatile — a bitstream must be reloaded at every power-up from a configuration PROM (EPC2, EPC16) or external controller. Use nCONFIG reset properly or the device fails to enter user mode. Pitfall #2: JTAG chain ordering matters when cascading multiple devices. Pitfall #3: -3 speed grade timing margins are tighter; reserve at least 15% timing margin in TimeQuest analysis. Pitfall #4: 5 V inputs exceed absolute-max ratings — use external level shifters.
Place the EPC configuration PROM within 50 mm of the FPGA DATA/DCLK pins and route the 25 MHz reference clock with controlled impedance (50 Ω). Differential clock pairs (CLK[0..3]) should be 100 Ω differential; route length-matched to within 25 mil of each other. Place JTAG TDO/TDI terminators at the device pins, not at the connector, to avoid stubs. Estimated: with proper layout, the EP1K50FC484-3 reliably achieves 100 MHz LVDS at -3 speed grade.
Compliance Information
RoHS non-compliant per Arrow listing ("EU RoHS Not Compliant"). For RoHS-compliant alternatives, choose the "N" suffix variants (EP1K50FC484-3N / -2N / -1N). AEC-Q100 is not applicable — ACEX-1K family does not offer automotive-grade qualification.
