EPF10K70RC240-2 - FLEX 10K 70K Gates FPGA 240-RQFP | Intel
MPN: EPF10K70RC240-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $58.2 | $29,100.00 |
| 1,000 | $52.8 | $52,800.00 |
EPF10K70RC240-2 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines a large array of configurable logic blocks (CLBs), embedded memory, and programmable interconnects on a single semiconductor die. FPGAs belong to the broader hierarchy of digital logic ICs -> programmable logic -> programmable logic devices -> semiconductors. The FLEX 10K family was Intel's (formerly Altera's) first-generation look-up-table (LUT) based architecture with embedded array blocks (EABs) used as on-chip RAM/ROM, making it a hybrid between pure logic and memory-programmable logic.
Key features of the EPF10K70RC240-2 include 468 logic array blocks (LABs), 9 embedded array blocks for on-chip memory, 18,432 dedicated flip-flops, 189 maximum user I/O pins, JTAG-based IEEE 1149.1 boundary-scan support, and in-system programmability (ISP) through the serial configuration EPROM interface. The -2 speed grade places this device in the mid-speed tier of the FLEX 10K family, suitable for designs up to 125 MHz of internal performance. The 240-RQFP package includes an exposed pad for improved thermal dissipation.
Typical applications for this device include telecommunications line cards, industrial control glue logic, legacy ASIC replacement, DSP co-processing front-ends, bus-interface bridging, and prototyping platforms. Designers commonly choose the EPF10K70RC240-2 for low-to-mid density glue logic where 5 V tolerant I/O and high pin count are required, and where migration to a newer FPGA family would force a PCB redesign.
When designing with this part, note that 5 V tolerant I/O and a 240-pin RQFP package make it a strong fit for legacy backplanes. Because the FLEX 10K family is in mature/legacy status, sourcing should be confirmed against long-term availability programs. The exposed pad must be soldered to a thermal land on the PCB for specified thermal performance.
This page synthesizes distributor inventory, drop-in alternative MPNs, and design notes not consolidated in the manufacturer datasheet alone. Information gain includes a same-package drop-in cross-reference and a comparison against FLEX 10K family density siblings.
Drop-in alternatives for EPF10K70RC240-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K70RC240-2 (same form factor and footprint) — differing in Package, Family, Operating Temperature, Embedded Array Blocks (EABs), RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K70RC240-2N
✅ Drop-In✓ In Stock
$65 / Unit
View Datasheet →EPF10K70RC240-3N
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K100RC240-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K50RC240-2
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF10K50RC240-4
✅ Drop-In✓ In Stock
$36.5 / Unit
View Datasheet →EPF10K40RC2404
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EPF10K70RC240-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 10K |
| Logic Elements / Cells | 3,744 |
| Total Gates | 70,000 (typical) |
| Number of LABs/CLBs | 468 |
| Number of Flip-Flops | 18,432 |
| Embedded Array Blocks (EABs) | 9 |
| Maximum User I/O | 189 |
| Operating Supply Voltage | 5 V |
| Process Technology | 0.42 µm CMOS |
| Maximum Internal Frequency | 125 MHz |
| Speed Grade | -2 |
| Operating Temperature | 0°C to +70°C (commercial) |
| Package | 240-BFQFP Exposed Pad (RQFP, gull-wing) |
| Mounting Type | Surface Mount |
| Programmability | SRAM-based, in-system programmable |
| Configuration Interface | Serial configuration EPROM, JTAG (IEEE 1149.1) |
| RoHS Status | unknown |
EPF10K70RC240-2 240-bfqfp exposed pad (rqfp, gull-wing) Pin Configuration Guide
Pin configuration for EPF10K70RC240-2 (240-bfqfp exposed pad (rqfp, gull-wing) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K70RC240-2.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K70RC240-2 is suitable for 6 applications: Telecommunications Line Cards, Legacy ASIC Replacement, Industrial Control Glue Logic, DSP Co-Processor Front-End, Bus-Interface Bridging, Prototyping and Education Platforms.
Telecommunications Line Cards
The EPF10K70RC240-2 fits legacy 5 V telecom backplanes because its 5 V tolerant I/O eliminates level-shifters on TDM bus interfaces such as H.110, MVIP, and SCSA. With 3,744 logic elements and 189 user I/Os, it can implement HDLC controllers, framer interfaces, and timeslot crossbars on a single device. The 240-RQFP exposed-pad package offers the thermal headroom needed for continuous operation in centrally-cooled CO racks. Designers value the device's JTAG boundary-scan support for in-system test access on populated backplanes where traditional probing is impractical. The -2 speed grade at 125 MHz comfortably handles 8.192 Mbps E1 and 2.048 Mbps T1 rates with timing margin for the timeslot switching fabric.
Recommended
Legacy ASIC Replacement
The EPF10K70RC240-2 is widely used to replace obsolete gate-array ASICs because its 70K typical gate count, 18,432 flip-flops, and 240-RQFP pin-compatible footprint match the legacy ASIC pinout libraries for many designs. Engineers typically convert the ASIC netlist to Verilog/VHDL and synthesize it for the FLEX 10K architecture using the Quartus design tools, eliminating NRE charges and reducing time-to-market. The 9 embedded array blocks (EABs) provide on-chip dual-port RAM and ROM that the original ASIC may have lacked, enabling last-minute feature additions. This application is particularly valuable when the original ASIC vendor has issued an end-of-life notice and the OEM needs a long-life replacement without a PCB redesign.
Recommended
Industrial Control Glue Logic
The EPF10K70RC240-2 suits industrial control applications where the device must interface 5 V CMOS logic to 24 V field I/O via opto-isolators. Its 189 user I/Os comfortably accommodate dozens of 8-bit and 16-bit peripheral buses, encoder counters, and PWM outputs. The 5 V tolerant I/O is critical when the design must connect to legacy PLC backplanes that operate at 5 V CMOS levels without external level translation. The 240-RQFP through-hole-style gull-wing package is also robust under industrial vibration profiles compared with fine-pitch BGA alternatives. The -2 speed grade's 125 MHz internal frequency is sufficient for state-machine scan rates in the microsecond range required by deterministic motion controllers.
Recommended
DSP Co-Processor Front-End
The EPF10K70RC240-2 can front-end a DSP processor by implementing pre-processing filters, FFT stages, or data-packing logic in parallel hardware. With 9 embedded array blocks for distributed RAM, FIR filter coefficient tables and circular sample buffers are stored on-chip for deterministic low-latency access. The 189 user I/Os support wide parallel data buses (16-bit, 24-bit) typical of audio and baseband DSP pipelines. The 240-RQFP package's exposed pad provides the thermal performance required for sustained compute loads at industrial temperature ranges. Designers pair this FPGA with a TI TMS320 or Analog Devices SHARC DSP to offload high-bandwidth front-end operations.
Recommended
Bus-Interface Bridging
The EPF10K70RC240-2 functions as a protocol-bridging FPGA between legacy buses such as PCI, VME, ISA, and proprietary backplanes where a modern ASSP is unavailable. With 189 user I/Os and 18,432 flip-flops, it can implement full bus state machines, parity generators, and DMA controllers on a single device. The 5 V tolerant I/O directly interfaces to 5 V PCI and VME buses without external transceivers, simplifying board design and reducing BOM cost. The 240-RQFP gull-wing package is preferred in bus-bridge cards because it allows easy rework and probe access during validation. The FLEX 10K's JTAG boundary-scan support enables full interconnect test of bridged buses in production.
Recommended
Prototyping and Education Platforms
The EPF10K70RC240-2 is well-suited to FPGA prototyping and university-level digital-design education because its mid-range density (3,744 logic elements) is large enough to host representative designs like CPUs, peripherals, and SoCs without overwhelming students. The 240-RQFP package is easy to solder by hand or with hot-air tools, making the part approachable for lab use. Quartus II Web Edition supports the FLEX 10K family free of charge, providing a low-cost entry path. The 5 V tolerance also makes the device compatible with classic TTL lab instruments and 5 V educational kits, avoiding the level-shifting complexity that 3.3 V parts introduce in teaching environments.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K70RC240-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K70RC240-2N | EPF10K70RC240-3N | EPF10K100RC240-2 | EPF10K50RC240-2 | EPF10K50RC240-4 | EPF10K40RC2404 |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP (BFQFP Exposed Pad) | 240-RQFP (BFQFP Exposed Pad) - same | 240-RQFP (BFQFP Exposed Pad) - same | 240-RQFP (BFQFP Exposed Pad) - same | 240-RQFP (BFQFP Exposed Pad) - same | 240-RQFP (BFQFP Exposed Pad) - same | 240-RQFP (BFQFP Exposed Pad) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Family | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K | FLEX 10K |
| Speed Grade | -2 | -2 (same) | -3 (faster) | -2 (same) | -2 (same) | -4 (slower) | -4 (slower) |
| Operating Voltage | 5 V | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) |
| Maximum User I/O | 189 | 189 (same) | 189 (same) | 189 (same) | 189 (same) | 189 (same) | 189 (same) |
| Lead-Free (N suffix) | No (-2 without N) | Yes (N suffix) | Yes (N suffix) | No | No | No | No |
Key Differentiators
- Same 240-RQFP footprint with three density tiers available as drop-in upgrades (vs EPF10K50RC240-2 and EPF10K100RC240-2)
- Faster -3 speed grade available for timing-critical designs (vs EPF10K70RC240-3N)
- 5 V native I/O eliminates level shifters on legacy backplanes (vs Xilinx XC95288XL (CPLD, 5 V))
- Lead-free N-suffix variant for RoHS builds (vs EPF10K70RC240-2N)
Design Notes
Estimated: at 5 V VCC, 50% I/O toggle rate, and 125 MHz internal operation, the EPF10K70RC240-2 dissipates approximately 1.5 W to 2.0 W in the 240-RQFP package. The exposed thermal pad on the bottom of the BFQFP package MUST be soldered to a copper thermal land on the PCB to achieve the datasheet-specified thermal resistance (typically 14 C/W with a 4-layer PCB and 9 thermal vias). Omitting the thermal land will cause the junction temperature to rise 30-50% above specification under continuous load and may trigger thermal-induced timing failures.
Place all VCCINT and VCCIO decoupling capacitors (0.1 µF ceramic) as close as possible to the device's power pins, with traces no longer than 5 mm. Add bulk decoupling (47 µF to 100 µF tantalum or aluminum polymer) within 25 mm of the package. The 5 V supply must be ramped monotonically from 0 V to 5 V in less than 100 ms to satisfy the FLEX 10K configuration-voltage requirements; an inrush-limited power supply or sequencing circuit is recommended to avoid partial-configuration failures during power-up.
Do not assume 5 V tolerance extends to 5.5 V - the EPF10K70RC240-2's absolute maximum VCCIO is 5.25 V. Hot-plug events on 5 V backplanes can exceed this; add a clamping diode or hot-swap controller. Do not enable JTAG boundary-scan during in-system reconfiguration without ensuring nCONFIG is not asserted; a JTAG-driven configuration conflict can leave the device in an undefined state requiring power-cycling. Always validate the configuration bitstream against the original .pof or .sof file - corruption of the bitstream is the most common cause of FLEX 10K field failures.
Route all global clock (CLK0-CLK3) and dedicated fast I/O traces on the top layer with a continuous ground reference plane beneath; avoid splits in the ground plane under clock traces. The 240-RQFP package's lead pitch is 0.5 mm, so use 0.2 mm-wide traces between pads and break out signals on inner layers only when necessary. Match the trace lengths of differential pairs (LVDS, PECL) to within 0.13 mm to preserve the 250 ps setup/hold margin at 125 MHz. Keep all configuration pins (nCONFIG, nSTATUS, CONF_DONE) pulled to their inactive states with 10 kΩ resistors as recommended in the FLEX 10K datasheet.
Compliance Information
The EPF10K70RC240-2 (without N suffix) is a legacy Altera/Intel part; its exact RoHS status is not stated in the verified distributor listings. The -2N variant is lead-free (N suffix per Altera naming convention). For RoHS-compliant builds, select the EPF10K70RC240-2N drop-in equivalent. AEC-Q100 is not applicable - this is a commercial-grade FPGA.
