EPF10K70RC240-2N - FLEX 10K FPGA, 70K Gates, 240-RQFP | Intel
MPN: EPF10K70RC240-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $78 | $7,800.00 |
| 500 | $71.25 | $35,625.00 |
| 1,000 | $65 | $65,000.00 |
EPF10K70RC240-2N Overview
What is a FLEX 10K FPGA? The FLEX 10K family was the industry's first embedded programmable logic device (PLD) family to provide System-on-a-Programmable-Chip (SOPC) integration. It combines a coarse-grained logic array with an embedded array block (EAB) for implementing RAM, ROM, FIFO, and multiplier functions in dedicated silicon. Architecturally, FLEX 10K sits between classic PLDs (PAL/GAL) and modern FPGAs: the device hierarchy is PLD -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 10K family, and it is recognized as a foundational step in the evolution toward today's high-density Cyclone and Stratix families.
Key features of the EPF10K70RC240-2N include in-system programmability via SRAM configuration bitstream, multi-volt I/O support, built-in JTAG boundary-scan testing, and an exposed thermal pad for improved heat dissipation. The commercial-grade temperature range is 0 °C to 70 °C. The wide 189-pin user I/O count and 18,432-bit embedded memory make it suitable for glue-logic, bus-interface bridging, custom state machines, and small to mid-density data-path processing.
The EPF10K70RC240-2N uses a Look-Up Table (LUT) based logic element feeding into a hierarchical LAB routing fabric, with EAB blocks providing true dual-port RAM up to 2,048 bits per block. Its 5 V core and I/O simplify interfacing with TTL/CMOS peripherals of its era, removing the need for level shifters in legacy designs.
Typical applications for this part include industrial control systems, telecommunications glue logic, data-acquisition front ends, legacy ASIC prototyping, and migration from older discrete-logic designs. It is also used in educational platforms for teaching VLSI design concepts.
Design consideration: This part is SRAM-based, so an external configuration ROM is required at every power-up. Designers should also budget for the in-rush current caused by simultaneous I/O toggling on the 189 user I/Os, and ensure the exposed pad is soldered to a sufficiently large copper pour for thermal relief.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same FLEX 10K family, and practical design notes that are not duplicated on standard distributor listings.
Drop-in alternatives for EPF10K70RC240-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF10K70RC240-2N (same form factor and footprint) — differing in Package, Operating Temperature, Configuration Method, RoHS Status, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF10K70RC240-4N
✅ Drop-In✓ In Stock
$36.5 / Unit
View Datasheet →EPF10K70RC240-3N
✅ Drop-In✓ In Stock
$95 / Unit
View Datasheet →EPF10K70RC240-2
✅ Drop-In✓ In Stock
$52.8 / Unit
View Datasheet →EPF10K130EQI240-2N
✅ Drop-In✓ In Stock
$60 / Unit
View Datasheet →EPF10K50VRC240-2N
✅ Drop-In✓ In Stock
$81.2 / Unit
View Datasheet →EPF10K50VRC240-4N
✅ Drop-In✓ In Stock
$89.5 / Unit
View Datasheet →EPF10K70RC240-2N Maximum Ratings & Electrical Characteristics
| Series | FLEX 10K |
| Logic Elements / Cells | 3,744 |
| Total Gates | 70,000 (typical) |
| System Gates | 118,000 |
| Number of LABs | 468 |
| Embedded Memory (bits) | 18,432 |
| User I/O Pins | 189 |
| Supply Voltage | 5 V |
| Logic Family | CMOS |
| Process Technology | 0.42 µm |
| Maximum Operating Frequency | 125 MHz |
| Propagation Delay | 0.4 ns |
| Package Type | 240-RQFP (BFQFP with exposed pad) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 70 °C (Commercial) |
| Configuration Technology | SRAM-based (volatile, requires external config ROM) |
| Programming Interface | JTAG / passive serial |
EPF10K70RC240-2N 240-rqfp (bfqfp with exposed pad) Pin Configuration Guide
Pin configuration for EPF10K70RC240-2N (240-rqfp (bfqfp with exposed pad) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF10K70RC240-2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF10K70RC240-2N is suitable for 6 applications: Industrial Control Logic, Telecom Glue Logic and Bus Bridging, Data Acquisition Front End, Legacy ASIC Prototyping, Migration from Discrete TTL Logic, Educational VLSI Design Platform.
Industrial Control Logic
The EPF10K70RC240-2N's 70K-gate capacity and 189 user I/O pins make it a strong fit for industrial PLC and process-control logic subsystems. With 3,744 logic elements it can absorb an entire machine-state controller, encoder counters, and PWM generation, while the 18,432-bit embedded SRAM handles FIFO buffers between field I/O and the host CPU. The 5V single supply simplifies interfacing to legacy 5V industrial peripherals, level-shift-free, and the 240-RQFP exposed pad survives 0-70°C shop-floor environments when properly heatsinked. Replace the upstream HC/HCT glue logic on legacy PLC backplanes with a single chip.
Recommended
Telecom Glue Logic and Bus Bridging
In telecom infrastructure the EPF10K70RC240-2N was historically deployed as bus-bridge logic between legacy TTL buses, E1/T1 framers, and emerging backplane fabrics. Its 189 user I/Os are wide enough to multiplex multiple parallel PCM buses, and the 125 MHz internal frequency supports mid-rate framing and HDLC channelization. The embedded 18,432-bit SRAM provides per-channel jitter buffers, while the JTAG interface simplifies board-test and field-upgrade workflows. Modern alternatives exist but the part remains in service in installed-base switching equipment worldwide.
Recommended
Data Acquisition Front End
The EPF10K70RC240-2N serves well as a data-acquisition front-end controller, where its 189 user I/Os can directly drive parallel ADC/DAC banks and capture high-speed digital sensor arrays. The 0.4 ns propagation delay and 125 MHz fMAX enable precise sample-timing generation, while the 18,432-bit embedded SRAM acts as a circular capture buffer between the converter bank and the host DMA. The 5V I/O matches the swing range of legacy industrial ADCs without additional buffering. Pair with an external sample clock and JTAG for in-system timing calibration.
Recommended
Legacy ASIC Prototyping
Throughout the late 1990s and early 2000s the EPF10K70RC240-2N was a workhorse ASIC prototype target, providing 70K gates sufficient to validate full sub-system designs before committing to mask ROM. Engineers mapped RTL directly onto the FLEX 10K logic array, validated timing with the Max+Plus II / Quartus toolchain, and reused the same prototype board for multiple design spins via SRAM reconfiguration. The exposed-pad 240-RQFP delivers the thermal headroom needed for sustained worst-case vector testing under JTAG stepping.
Recommended
Migration from Discrete TTL Logic
The EPF10K70RC240-2N is well suited to consolidating racks of 74-series glue logic into a single programmable device. Its 189 user I/Os and 3,744 logic elements can absorb dozens of MSI gates, latches, multiplexers, and small state machines that previously consumed significant board area. The 5V supply and TTL-compatible I/O thresholds match the original logic without buffer translation, simplifying the re-spin. Embedded 18,432-bit SRAM replaces external latches for bus-isolator and address-latch functions, shrinking the BOM and reducing board complexity.
Recommended
Educational VLSI Design Platform
Universities used the EPF10K70RC240-2N as the heart of digital-design laboratory platforms, where the 70K-gate capacity allowed students to implement a full RISC-style CPU, custom peripherals, and bus interfaces on a single device. The SRAM reconfigurability enabled rapid design-rev cycles without board rework, while the JTAG port gave instructors visibility into the students' running state machines. The 240-RQFP package was breadboard-friendly on adapter PCBs and survived repeated soldering cycles in teaching labs. The Max+Plus II / Quartus toolchain remains in use today for legacy coursework.
Recommended
Recommended Products Summary
Engineering reference data for EPF10K70RC240-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF10K70RC240-4N | EPF10K70RC240-3N | EPF10K130EQI240-2N | EPF10K50VRC240-2N |
|---|---|---|---|---|---|
| Package | 240-RQFP (BFQFP) | 240-RQFP (BFQFP) | 240-RQFP (BFQFP) | 240-RQFP (BFQFP) | 240-RQFP (BFQFP) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Total Gates | 70,000 (118,000 system gates) | 70,000 | 70,000 | 130,000 | 50,000 |
| Logic Elements | 3,744 | 3,744 | 3,744 | 6,656 | 2,880 |
| Embedded Memory (bits) | 18,432 | 18,432 | 18,432 | 32,768 | 20,480 |
| User I/O Pins | 189 | 189 | 189 | 186 | 189 |
| Speed Grade | -2 | -4 | -3 | -2 | -2 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 3.3 V |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0 °C to 70 °C | 0 °C to 70 °C | -40 °C to 85 °C (Industrial) | 0 °C to 70 °C |
| Approx. Price (qty-1, USD) | $95.00 | $70.00 | $85.00 | $140.00 | $60.00 |
Key Differentiators
- Mid-range density sweet spot of FLEX 10K family (vs EPF10K50VRC240-2N)
- Fastest commercial speed grade in the FLEX 10K family (vs EPF10K70RC240-4N)
- 5 V core supply matches legacy TTL/CMOS interfaces directly (vs EPF10K50VRC240-2N)
Design Notes
Because the EPF10K70RC240-2N is SRAM-based, its configuration is volatile and must be re-loaded on every power-up from an external EPC configuration ROM (commonly EPC2LC20) or a microcontroller. Failing to provide a valid configuration device leaves the device in an undefined state with all I/Os tri-stated, which can confuse downstream logic. Always include a reset supervisor on the configuration device's CE pin to ensure deterministic boot.
Solder the exposed thermal pad on the bottom of the 240-RQFP package to a ground copper pour of at least 1 square inch to provide a low-impedance thermal path. The exposed pad also serves as the primary ground bond; omitting this connection causes supply-voltage transients and potential device damage. Place the EPC configuration ROM no more than 50 mm from the FLEX 10K's DCLK and DATA0 pins to keep the configuration signal integrity within timing margins.
Estimated: At 189 simultaneously-switching I/Os with 5 V swing into 50 pF loads at 25 MHz, the EPF10K70RC240-2N draws approximately 1.2 A from its 5 V supply during worst-case toggling. Use at least four VCCINT and four GND pins with wide power planes, and place 0.1 µF ceramic decoupling capacitors within 5 mm of every VCC pin. Bulk 47 µF tantalum capacitors near the supply entry point reduce voltage transients during the configuration in-rush.
On long PCB traces to the 189 user I/Os, add 33 Ω series-termination resistors to dampen ringing from the 5 V TTL edge rates. Keep clock-distribution traces matched to within 1 mm to avoid skew across the LAB columns. When interfacing to 3.3 V peripherals, use a 74LVC245-style level translator; do not rely on the FLEX 10K I/O clamp diodes to clamp 3.3 V signals into 5 V tolerance, as the input threshold range can shift.
Compliance Information
Compliance information is not specified in the verified distributor listings for EPF10K70RC240-2N. FLEX 10K family parts are legacy; RoHS compliance varies by date-code lot. Contact Intel Programmable Solutions for the specific lot's compliance documentation.
