EPF6024AQI208-3 - FLEX 6000 FPGA 24K Gates 208-PQFP | Intel
MPN: EPF6024AQI208-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.75 | $167.50 |
| 100 | $14.2 | $1,420.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $9.85 | $9,850.00 |
EPF6024AQI208-3 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic resources, interconnect, and I/O cells are defined by a user-supplied bitstream after manufacture. FPGAs sit between fixed-function Application-Specific Integrated Circuits (ASICs) and software-driven microcontrollers in the digital design hierarchy: they offer hardware-timed parallelism and deterministic latency unavailable in sequential processors, while avoiding the NRE mask costs of ASICs. The FLEX 6000 series belongs to the broader Programmable Logic Device (PLD) family, which also includes CPLDs and SPLDs.
Key features of the EPF6024AQI208-3 include a register-rich, Look-Up Table (LUT)-based logic architecture, OptiFLEX interconnect that minimizes die area for high logic utilization, four Embedded Array Blocks (EABs) for on-chip memory implementation, and built-in JTAG boundary-scan test support (IEEE Std 1149.1). Each logic element (LE) contains a 4-input LUT, a programmable register, and carry/chain interconnect, allowing efficient implementation of arithmetic, register-intensive, and combinatorial designs without external memory components.
Architecturally, the device employs a continuous, row-and-column interconnect backbone (FastTrack) that routes signals across the die with predictable delay. The 3.3 V supply rail reduces power consumption by roughly 40 percent compared with the 5.0 V FLEX 8000 predecessors, while still supporting 5.0 V tolerant I/O through clamping diodes on input pins. Configuration can be performed via passive serial, active serial, or JTAG modes using industry-standard EPC configuration devices, enabling in-system reconfiguration for field upgrades.
Typical applications span glue-logic consolidation in industrial control boards, peripheral bus interfacing (ISA, PCI, VME), high-speed data-pump controllers, DSP pre-/post-processing front-ends, and low-volume prototypes replacing mask-programmed gate arrays. Because FLEX 6000 silicon is mature and broadly second-sourced on the secondary market, the EPF6024AQI208-3 is also frequently specified for long-lifecycle aerospace, defense, and medical systems that were originally designed in the late 1990s.
When designing with this part, observe that the 3.3 V core cannot be directly powered from a 5 V rail - a regulator is required. Inputs are 5 V tolerant via clamping diodes but prolonged overdrive can inject latch-up current; series resistors of 200–470 Ω are recommended on signals driven from 5 V logic. Decoupling follows the standard FPGA guideline of one 0.1 µF high-frequency cap per VCC/GND pair plus bulk capacitors of 10–47 µF at each supply pin group.
This page aggregates distributor pricing, verified drop-in alternatives within the FLEX 6000 family, and practical design guidance not consolidated in the original datasheet, supporting both new designs and maintenance of long-life legacy systems.
Drop-in alternatives for EPF6024AQI208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024AQI208-3 (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Configuration Method, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024AQI208-2
✅ Drop-In✓ In Stock
$21.75 / Unit
View Datasheet →EPF6024AQI208-2N
✅ Drop-In✓ In Stock
$54 / Unit
View Datasheet →EPF6024AQI208-1N
✅ Drop-In✓ In Stock
$10.3 / Unit
View Datasheet →EPF6024AQI208-1
✅ Drop-In✓ In Stock
$22.85 / Unit
View Datasheet →EPF6016QI208-3
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF6016QI208-3N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EPF6024AQI208-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Logic Elements | 1,960 cells |
| Typical Gate Count | 24,000 gates |
| User I/O Pins | 171 |
| Core Voltage | 3.3 V |
| I/O Voltage Tolerance | 5.0 V (clamping-diode tolerant inputs) |
| Process Technology | 0.42 µm CMOS |
| Internal Performance | 142.86 MHz (max) |
| Logic Architecture | 4-input LUT with programmable register |
| Embedded Array Blocks (EAB) | 4 |
| Configuration Modes | Passive Serial, Active Serial, JTAG (IEEE 1149.1) |
| Package | 208-pin PQFP (Plastic Quad Flat Pack) |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Speed Grade | -3 |
| RoHS Status | Non-compliant (legacy PQFP) |
| Lead-Free | No (SnPb finish typical) |
EPF6024AQI208-3 208-pin pqfp (plastic quad flat pack) Pin Configuration Guide
Pin configuration for EPF6024AQI208-3 (208-pin pqfp (plastic quad flat pack) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF6024AQI208-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF6024AQI208-3 is suitable for 6 applications: Industrial Glue-Logic Consolidation, Legacy Peripheral-Bus Interface (ISA / PCI / VME), High-Speed Datapump / DSP Front-End, Low-Volume ASIC Replacement / Prototype Bridge, Medical Imaging Equipment (Long-Lifecycle Designs), Aerospace & Defense Avionics Retrofit.
Industrial Glue-Logic Consolidation
The EPF6024AQI208-3 is well suited to industrial glue-logic consolidation boards where dozens of 74-series TTL gates, address latches, and bus-arbitration functions would otherwise occupy a large ASIC or many discrete PLDs. Its 1,960 logic cells and 4 EABs deliver roughly 24,000 gates of capacity with 171 user I/Os, easily absorbing address decoding, wait-state generation, and interrupt-aggregation logic on VME, ISA, or PC/104 backplanes. The 3.3 V core reduces board power budget versus legacy 5 V PLDs, while 5 V-tolerant inputs permit direct interface to 5 V peripheral buses without level translators. Industrial-control designers favor this part for its deterministic pin-to-pin timing and its mature MAX+PLUS II toolchain, which is well documented for safety-critical retrofits in long-life machinery.
Recommended
Legacy Peripheral-Bus Interface (ISA / PCI / VME)
The EPF6024AQI208-3 has been widely deployed as a bus-interface controller between microprocessors and ISA, PCI, or VME peripheral cards in telecom and instrumentation chassis. The 208-PQFP package exposes enough user I/O (171 pins) to implement a full 32-bit local bus with parity, plus dedicated hand-shake and interrupt-control signals. The 142.86 MHz internal performance supports 33 MHz PCI target-operation with comfortable timing margin, while the four EABs can host small FIFO buffers or lookup tables for protocol translation. Designers maintain this part on legacy boards because its 5 V input tolerance allows direct attachment to 5 V backplanes, and its bitstream is forward-compatible with the FLEX 6000 toolchain still shipped with Quartus for legacy-device support.
Recommended
High-Speed Datapump / DSP Front-End
In DSP front-ends and high-speed datapump controllers, the EPF6024AQI208-3 provides register-rich LUT-based logic that maps efficiently to FIR filter taps, address generators, and pattern-matching state machines. The 4-input LUT architecture plus dedicated carry-chain interconnect delivers predictable 142 MHz performance suitable for video-processing, sonar beam-forming, and software-defined-radio baseband preprocessing in late-1990s equipment. The four Embedded Array Blocks (EABs) of 2,048 bits each can implement small dual-port RAMs for coefficient storage or delay lines, eliminating external SRAM on cost-sensitive boards. The 208-PQFP package is also desirable for reworking legacy defense and aerospace boards where surface-mount BGA rework equipment is unavailable.
Recommended
Low-Volume ASIC Replacement / Prototype Bridge
The FLEX 6000 family was originally marketed as an ideal low-cost alternative to mask-programmed gate arrays for high-volume applications, and the EPF6024AQI208-3 is still used as a pre-silicon prototype for ASIC designs in the 20K–30K-gate complexity range. Engineers capture the design in MAX+PLUS II or Quartus, verify it on the EPF6024AQI208-3 development board, then port the verified RTL to a masked ASIC for high-volume production. The 208-PQFP package permits easy socket-based swapping during prototype iteration. Because the device is reconfigurable in-system via JTAG (IEEE 1149.1), the same board can host many design revisions without respin, dramatically shortening time-to-market for low-volume industrial, medical, and test-instrument products.
Recommended
Medical Imaging Equipment (Long-Lifecycle Designs)
Medical imaging platforms such as ultrasound front-ends, CT scanner controllers, and patient-monitoring hubs designed in the late 1990s frequently depend on the EPF6024AQI208-3 for glue logic, scan-control timing, and image-buffer arbitration. These systems have 15- to 25-year operational lifecycles, and the FPGA cannot be re-designed without re-submitting the entire instrument for FDA / IEC 60601-1 re-certification. The 208-PQFP package is also preferred in medical electronics because it permits visual inspection and conventional through-hole-style rework, in contrast to BGAs which require X-ray inspection. The 0.42 µm CMOS process combined with the conservative 142.86 MHz timing closure delivers the long-term mean-time-between-failure (MTBF) figures required for FDA-cleared equipment.
Recommended
Aerospace & Defense Avionics Retrofit
The EPF6024AQI208-3 is found in military avionics, naval combat-system displays, and aerospace ground-test equipment originally qualified under DO-254 / MIL-HDBK-454. Because the design and certification artifacts reference a specific Altera / Intel part number, sustainment programs must source the exact FPGA even decades after the original design win. The FLEX 6000 family's 3.3 V core reduces in-flight power dissipation versus older 5 V FLEX 8000 predecessors, an important factor in environmentally sealed avionics enclosures. The 208-PQFP package also tolerates the conformal coating and vibration profiles required by MIL-STD-810 better than BGA alternatives, which is why the EPF6024AQI208-3 remains a standard order for defense logistics suppliers.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024AQI208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024AQI208-2 | EPF6024AQI208-2N | EPF6024AQI208-1N | EPF6016QI208-3 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 208-PQFP | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same | 208-PQFP - same |
| Logic Cells | 1,960 | 1,960 | 1,960 | 1,960 | 1,320 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 16,000 |
| User I/O | 171 | 171 | 171 | 171 | 171 |
| Speed Grade | -3 (fastest, 142.86 MHz) | -2 | -2 | -1 | -3 |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free Finish | No (SnPb) | No (SnPb) | Yes (NiPdAu) | Yes (NiPdAu) | No (SnPb) |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (industrial) | 0 °C to +70 °C |
| Embedded Array Blocks | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Fastest available speed grade in the FLEX 6000 24K PQFP-208 family (vs EPF6024AQI208-2)
- Standard SnPb finish compatible with legacy SnPb reflow profiles (vs EPF6024AQI208-2N)
- Maximum logic density in the FLEX 6000 208-PQFP form factor (vs EPF6016QI208-3)
- Commercial temperature range adequate for indoor industrial enclosures (vs EPF6024AQI208-1N)
Design Notes
Estimated: Power-supply design for the EPF6024AQI208-3 must deliver a regulated 3.3 V rail with ±5 % tolerance and a peak current of approximately 300 mA during configuration plus steady-state ICC of about 150 mA at 142 MHz with 50 % toggle. Bulk-decouple the 3.3 V plane with one 47 µF tantalum or polymer cap near the package, plus a 10 µF ceramic, and place a 0.1 µF X7R cap adjacent to every VCC/GND pair (typically 8 pairs on the PQFP-208). The 5 V-tolerant inputs draw no clamping-diode current if the input signal stays below 3.3 V + Vdiode, but signals driven from a true 5 V rail must be series-resistored (200–470 Ω) to limit injection current during transient over-voltage events.
Estimated: The PQFP-208 package has a θJA of approximately 35 °C/W in still air, so at full-speed 142 MHz operation the device dissipates about 1.5 W and the junction rises about 53 °C above ambient — comfortably below the 125 °C junction limit. In a sealed enclosure without forced airflow, derate toggle activity to 70 % to keep junction rise under 40 °C. A small clip-on heatsink is unnecessary for normal operation but is recommended when the FPGA is mounted adjacent to a high-power ASIC on the same PCB.
PQFP-208 has 0.5 mm pitch leads with a 3.0 mm standoff. Use 0.2 mm-wide SMT pads with a 1:1 pad-to-lead ratio, and do not route any signal trace inside the package outline — keep all breakout traces on the outside of the lead pads on a 0.2 mm trace-and-space grid. Solder-paste stencil should be 0.125–0.150 mm thick with aperture reductions of 0.05 mm per side to prevent solder bridging on the 0.5 mm pitch leads. A ground pour on the top layer directly under the package body acts as a thermal spreader and a partial RF shield for the die.
Do not assume JTAG configuration works without the VCCIO rail stable. The IEEE 1149.1 TAP controller requires VCCINT (3.3 V) and VCCIO (3.3 V or 5 V) both above their POR thresholds before TMS/TCK toggling begins, otherwise the device may latch up. Also note that EPC1/EPC1441 configuration PROMs default to 3.3 V output — driving them into a 5 V-only FLEX 6000 variant will fail; verify the EPC variant matches the FLEX I/O voltage. Finally, configuration files generated for a -3 speed grade cannot be downloaded onto a -1 speed-grade part — Quartus rejects the bitstream, but legacy MAX+PLUS II flows may not, leading to silent timing failure in-system.
Compliance Information
Legacy PQFP-208 plastic package typically ships with SnPb (tin-lead) finish; RoHS-compliant equivalents are only available in BGA package options (e.g. EPF6024ABC256-3). REACH and conflict-minerals status not stated in the public distributor listings for this part.