EPF6024ATC144-4 - FLEX 6000 FPGA, 24K Gates, 144-TQFP | Intel
MPN: EPF6024ATC144-4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.95 | $249.50 |
| 100 | $21.4 | $2,140.00 |
| 500 | $18.75 | $9,375.00 |
| 1,000 | $16.2 | $16,200.00 |
EPF6024ATC144-4 Overview
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, and perimeter I/O cells on a single semiconductor die. FPGAs sit hierarchically above Complex Programmable Logic Devices (CPLDs) and below Application-Specific Integrated Circuits (ASICs) in the digital logic taxonomy: programmable logic device (PLD) -> CPLD/FPGA -> SRAM-based FPGA -> FLEX 6000 family. Unlike mask-programmed gate arrays, FPGAs ship unconfigured and are programmed by the end user, enabling rapid prototyping, field upgrades, and low-volume production without NRE charges.
Key features of the EPF6024ATC144-4 include 117 user I/O pins (versus 218 I/O on the BGA-256 package option), a maximum internal toggle frequency of approximately 200 MHz, support for 3.3 V LVTTL/LVCMOS I/O standards, JTAG (IEEE 1149.1) boundary-scan testability, and continuous SRAM configuration memory that allows unlimited reconfiguration cycles. The device also incorporates MultiVolt I/O technology for mixed-voltage interfacing on selected banks, and embedded carry/cascade chains for high-speed arithmetic and wide-fan-in logic functions.
Typical applications include bus-bridging glue logic between microprocessors and peripherals, custom interface controllers for legacy industrial protocols, low-volume ASIC replacements, parallel I/O expansion, and educational or development platforms where repeatable SRAM-based programming is required. The 144-pin TQFP package offers a 0.5 mm pitch, gull-wing lead format suitable for hand-soldering and conventional SMT assembly lines.
When designing with this part, ensure the configuration PROM or download cable supports the FLEX 6000 PS (Passive Serial) mode, and budget adequate VCC decoupling (0.1 µF + 10 µF per supply pin) near each VCC/GND pair. Note that the FLEX 6000 family has been superseded by newer Cyclone and MAX series devices; verify long-term availability before committing to new designs.
Drop-in alternatives for EPF6024ATC144-4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF6024ATC144-4 (same form factor and footprint) — differing in Operating Temperature, Process Technology, Package, Speed Grade, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF6024ATC144-3N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EPF6024ATC144-2N
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$20.95 / Unit
View Datasheet →EPF6024ATC144-1N
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$20.95 / Unit
View Datasheet →EPF6024ATC144
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EPF6024ATC144-3
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$14.1 / Unit
View Datasheet →EPF6024ATC144-1
✅ Drop-In✓ In Stock
$8.2 / Unit
View Datasheet →EPF6024ATC144-4 Maximum Ratings & Electrical Characteristics
| Family | FLEX 6000 |
| Device Type | FPGA (Field-Programmable Gate Array) |
| Typical Gates | 24,000 |
| Logic Elements | 1,960 |
| Logic Array Blocks (LABs) | 196 |
| Maximum User I/O | 117 |
| Supply Voltage (VCCINT) | 3.3 V |
| Process Technology | 0.42 µm CMOS SRAM |
| Maximum Internal Frequency | 200 MHz |
| Package | 144-pin TQFP (TQFP-144) |
| Pin Pitch | 0.5 mm |
| Configuration Mode | Passive Serial (PS) with SRAM |
| JTAG Support | IEEE 1149.1 Boundary Scan |
| Operating Temperature | -40°C to +85°C (Industrial) |
EPF6024ATC144-4 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank dependent) |
| Pin 37 | VCCINT — Core supply voltage (3.3 V) |
| Pin 73 | GND — Ground reference |
| Pin 109 | VCCIO — I/O supply voltage (3.3 V or 5 V tolerant) |
| Pin 138 | nCONFIG — Configuration control (active low) |
| Pin 139 | DCLK — Configuration clock input |
| Pin 140 | DATA0 — Configuration data input |
| Pin 141 | nSTATUS — Configuration status (active low) |
| Pin 142 | CONFIG_DONE — Configuration complete indicator |
| Pin 143 | TDI — JTAG test data input |
| Pin 144 | TMS — JTAG test mode select |
Typical Applications
EPF6024ATC144-4 is suitable for 6 applications: Bus-Bridging Glue Logic, Legacy Industrial Protocol Interface, ASIC Replacement for Low-Volume Production, Parallel I/O Expansion, Educational FPGA Development Platform, Custom State Machine and Timing Controller.
Bus-Bridging Glue Logic
The EPF6024ATC144-4 is well-suited as a bus-bridging glue-logic device between microprocessors, memory, and peripheral ICs in industrial control systems. Its 1,960 logic elements and 117 user I/O pins are more than sufficient to translate between 8/16/32-bit buses of varying widths and timing requirements, while the 200 MHz maximum internal frequency comfortably meets typical 50-100 MHz bus speeds. Unlike discrete 74-series TTL glue logic that consumes board area and power, a single FLEX 6000 device integrates the entire address decoder, chip-select generator, and wait-state logic in one chip, reducing PCB complexity. The 144-pin TQFP package is hand-solder-friendly for prototypes and small production runs. Compared with modern Cyclone equivalents, the EPF6024ATC144-4 is preferred only when legacy design re-synthesis or pin-compatible replacement is required in long-life industrial equipment.
Recommended
Legacy Industrial Protocol Interface
Industrial equipment using legacy protocols such as parallel SCSI, ISA bus, or proprietary backplane interfaces can leverage the EPF6024ATC144-4 to implement custom interface controllers. The 117 user I/O pins handle wide parallel buses including 16-bit data plus control signals, while the SRAM-based configuration allows field firmware updates without removing the device. The device operates reliably across the -40°C to +85°C industrial temperature range, making it suitable for factory floor installations. Compared with a hard-wired ASIC solution, the FLEX 6000 eliminates NRE charges and enables last-minute protocol revisions during certification. Typical implementations include protocol converters, format translators, and timing-critical handshake generators that benefit from the device's deterministic logic-element architecture.
Recommended
ASIC Replacement for Low-Volume Production
For low-volume production runs (typically <10,000 units) where ASIC NRE costs cannot be amortized, the EPF6024ATC144-4 provides a cost-effective programmable alternative. With 24,000 typical gates available, the device can integrate what would otherwise require multiple MSI/LSI discrete logic packages, reducing BOM cost and board area. The SRAM configuration memory allows post-production design changes via in-system programming, useful for late-stage product differentiation. The 3.3 V core supply with MultiVolt I/O enables interfacing with both 3.3 V and 5 V peripherals, simplifying mixed-voltage designs. Although newer Cyclone devices offer more logic capacity per dollar, the EPF6024ATC144-4 remains attractive for maintenance of legacy designs where PCB layout and pinout compatibility are mandatory.
Recommended
Parallel I/O Expansion
The EPF6024ATC144-4's 117 user I/O pins make it ideal for parallel I/O expansion tasks such as multiplexing sensor arrays, driving LED matrices, or interfacing with parallel data converters (ADCs/DACs). Each I/O pin is individually configurable for input, output, or bidirectional operation with programmable slew rate and drive strength, allowing fine-grained control of signal integrity. The JTAG (IEEE 1149.1) interface supports boundary-scan testability, which is critical for verifying solder joints on high-pin-count TQFP packages during manufacturing. The 144-pin TQFP form factor at 0.5 mm pitch is compatible with standard SMT assembly lines and reflow profiles. Compared with discrete shift-register or buffer-based expansion, the FPGA-based approach enables custom timing sequences and on-the-fly protocol adaptation.
Recommended
Educational FPGA Development Platform
The EPF6024ATC144-4 remains popular in university-level digital logic courses and educational laboratories where students learn VHDL/Verilog synthesis and FPGA design flows. Its 1,960 logic elements provide enough capacity to implement moderate-complexity designs such as UART controllers, simple CPUs, and FSMs while remaining small enough that students can fully comprehend the synthesized netlist. The 144-pin TQFP package is easy to breadboard with breakout adapters and the Quartus II Web Edition toolchain (legacy) supports the device free of charge. The SRAM configuration allows instant re-programming via USB-Blaster download cable, enabling rapid design iteration. Compared with modern Cyclone IV boards, the FLEX 6000 is preferred for teaching legacy design methodologies and understanding pre-Cyclone Altera architecture fundamentals.
Recommended
Custom State Machine and Timing Controller
The EPF6024ATC144-4 excels at implementing complex state machines and precision timing controllers in test and measurement equipment. Its deterministic LUT-based logic-element architecture provides predictable timing closure, while the 200 MHz maximum internal frequency enables fast state transitions and high-resolution timing generators. The 3.3 V core with MultiVolt I/O allows direct interfacing with both 3.3 V and 5 V measurement circuits without level shifters. The device's four-input LUTs are well-suited to implementing arithmetic functions, comparators, and counter chains for pulse-width modulation or frequency synthesis. In instrumentation applications, the EPF6024ATC144-4 can replace multiple discrete timer ICs (74LS123, NE555 equivalents) and PAL/GAL devices, reducing PCB complexity while adding reconfigurability for different test scenarios.
Recommended
Recommended Products Summary
Engineering reference data for EPF6024ATC144-4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF6024ATC144-3N | EPF6024ATC144-2N | EPF6024ATC144-1N | EPF6024ATC144 | EPF6024ATC144-3 | EPF6024ATC144-1 |
|---|---|---|---|---|---|---|---|
| Package | TQFP-144 (0.5 mm pitch) | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Speed Grade | -4 (fastest) | -3 (slower) | -2 (slower) | -1 (slowest) | default (no grade) | -3 (slower) | -1 (slowest) |
| Logic Elements | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 | 1,960 |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Typical Gates | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 | 24,000 |
| Operating Temperature | Industrial (-40 to +85 C) | Industrial | Industrial | Commercial (0 to +70 C) | Industrial | Industrial | Industrial |
| Configuration Memory | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Highest speed grade in TQFP-144 FLEX 6000 family (vs EPF6024ATC144-3N)
- Same 117 I/O count and 24K gates as all 144-pin FLEX 6000 variants (vs EPF6024ATC144-1N)
- Industrial temperature range with documented reliability (vs EPF6024ATC144-1N (commercial temp))
Design Notes
The EPF6024ATC144-4 requires 0.1 µF ceramic decoupling capacitors placed within 5 mm of every VCCINT and VCCIO pin, plus one bulk 10 µF tantalum or ceramic capacitor per supply rail. Power-on reset (POR) timing must satisfy the datasheet minimum VCC ramp rate to avoid configuration errors. Add a series ferrite bead on the VCCIO supply if mixed 3.3 V/5 V banks are used to suppress simultaneous switching noise. Decoupling is critical because SRAM-based FPGAs draw dynamic current proportional to toggle frequency, unlike CPLDs with more constant Icc.
Route all high-speed signals (DCLK, JTAG, clock inputs) with controlled impedance and length matching. Place the EPF6024ATC144-4 TQFP-144 package with its thermal pad soldered to a ground pour to reduce thermal resistance. JTAG chain connections (TDI/TDO/TMS/TCK) should be daisy-chained with no stubs and include 10 kΩ pull-ups on TMS and TCK per IEEE 1149.1 recommendations. Keep configuration PROM or download cable within 150 mm of the FPGA to avoid signal integrity issues on DCLK and DATA0.
A common pitfall is forgetting that SRAM-based FPGAs lose their configuration on power-down and require either a configuration PROM (EPC1/EPC2) or a download cable for every power-up. Do not leave unused I/O pins floating - configure them as outputs driving ground to minimize power consumption and noise. The MSEL pins must be tied to the correct logic levels for Passive Serial mode; incorrect MSEL settings cause configuration failure. Finally, verify timing constraints with Quartus II TimeQuest before tape-out, especially for designs using the '-4' speed grade advantage.
Compliance Information
RoHS compliance status not consistently documented for FLEX 6000 family parts, which pre-date RoHS transition. Not AEC-Q100 qualified (FPGA is not an automotive-grade IC by default). For automotive applications, use a dedicated automotive FPGA such as Cyclone IV E GX or newer.
