Intel

EPF6016ATC144-3S - FLEX 6000 FPGA, 132 LABs, 117 IOs | Intel

MPN: EPF6016ATC144-3S ✗ End of Life
In Stock Ships in 1-3 business days
5.0 V Vdss 144-pin TQFP (TQFP-144) Package 172 MHz Speed
From $18.1 USD / Unit
MOQ: 1 |
Price updated: 2026-09-11
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $34.2 $342.00
100 $28.75 $2,875.00
500 $22.4 $11,200.00
1,000 $18.1 $18,100.00
ℹ️ All prices are in USD

EPF6016ATC144-3S Overview

The Intel (formerly Altera) EPF6016ATC144-3S is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs), delivering 16,000 typical gates (24,000 maximum system gates) in a 144-pin TQFP (Thin Quad Flat Pack) package. It provides 1,320 logic elements distributed across 132 Logic Array Blocks (LABs) with 117 user I/O pins, an internal frequency of 172 MHz, and is built on a 0.42 µm CMOS SRAM process with 5.0 V core voltage.

A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing, hence the term field-programmable. The FLEX 6000 family sits within Intel's programmable logic hierarchy between simpler Complex Programmable Logic Devices (CPLDs) and higher-density FPGAs such as the FLEX 10K and APEX families. FPGAs in general belong to the broader semiconductor taxonomy of Programmable Logic Devices (PLDs), which also include SPLDs and CPLDs. They are widely used for digital logic prototyping, glue logic, custom I/O interfacing, and pre-ASIC design verification where production volumes do not yet justify a mask-programmed gate array.

The EPF6016ATC144-3S is specified as commercial grade with an operating temperature range of 0°C to 85°C and operates from a 5.0 V supply. The trailing S in the order code denotes a specific Altera/Intel ordering suffix (often indicating a particular shipment form or speed/packaging variant), while the -3 speed grade denotes the -3 performance bin within the FLEX 6000 family. The part supports in-system programmability via the IEEE 1149.1 (JTAG) boundary-scan interface and is configured via a serial configuration device.

Typical applications for the EPF6016ATC144-3S include glue logic in telecom infrastructure, industrial control and factory automation I/O expansion, PCI bus interface bridging, custom peripheral controllers in embedded systems, and pre-ASIC prototyping where design teams need to validate RTL prior to tape-out. The 117 available user I/Os make the device well-suited to bridging legacy 5 V peripherals to modern ASICs or microprocessors.

When designing with this part, ensure that all 5 V supply rails are properly decoupled with 0.1 µF ceramic capacitors placed within 5 mm of each VCC pin, and that JTAG chain integrity is verified before configuration. The device is now considered legacy/NRND: production of the FLEX 6000 family has largely ended, and Intel recommends migrating to Cyclone-series devices for new designs.

This page synthesizes distributor pricing, drop-in package-compatible variants from the same FLEX 6000 family, and practical design notes not found on a single distributor page.

Drop-in alternatives for EPF6016ATC144-3S — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EPF6016ATC144-3S (same form factor and footprint) — differing in Package, Configuration Method, Operating Temperature, Process Technology, Family.

Altera
Package: 144-LQFP (TQFP)
Configuration Method: Serial/Parallel/JTAG
Compare with EPF6016ATC144-3S →
Intel
Package: 144-pin LQFP (LFQFP)
Process Technology: 0.30 µm CMOS SRAM
Family: OptiFLEX architecture
Compare with EPF6016ATC144-3S →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Operating Temperature: 0°C to 85°C (commercial)
Compare with EPF6016ATC144-3S →
Intel
Package: TQFP-144 (20 x 20 mm)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Compare with EPF6016ATC144-3S →
Intel
Package: TQFP-144
Operating Temperature: Commercial (0C to +70C)
Process Technology: 0.42 micron CMOS
Compare with EPF6016ATC144-3S →
Altera
Package: TQFP-144
Configuration Method: OptiFLEX architecture, in-system programmable
Operating Temperature: -40 °C to 100 °C (Industrial)
Compare with EPF6016ATC144-3S →
Altera
Package: 144-pin TQFP (TQ144, 22 mm × 22 mm)
Compare with EPF6016ATC144-3S →
Intel
Package: 144-LQFP (TQFP)
Family: EPF6016
Compare with EPF6016ATC144-3S →
Altera
Package: TQFP-144 (TC144), 0.5 mm pitch
Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)
Compare with EPF6016ATC144-3S →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EPF6016ATC144-3N

✅ Drop-In
Intel
📦 TQFP-144
FLEX 6000 · OptiFLEX · 1,320 · 132 · 16,000 gates · 117 · 142.86 MHz · 0.42 micron CMOS

✓ In Stock

$12.4 / Unit

View Datasheet →

EPF6016ATC144-3

✅ Drop-In
Intel
📦 TQFP-144
FLEX 6000 · FPGA (Field Programmable Gate Array) · 1320 · 16000 · 132 · 117 · 144 · TQFP-144 (20 x 20 mm)

✓ In Stock

$9.85 / Unit

View Datasheet →

EPF6016ATC144-2N

✅ Drop-In
Intel
📦 TQFP-144
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ In Stock

$19.5 / Unit

View Datasheet →

EPF6016ATC144-2

✅ Drop-In
Intel
📦 TQFP-144
Intel (formerly Altera) · FLEX 6000 · OptiFLEX architecture · FPGA - Field Programmable Gate Array · 16,000 · 24,000 · 1,320 · 132 (10 LEs each)

✓ In Stock

$13.85 / Unit

View Datasheet →

EPF6016ATC144-1

✅ Drop-In
Altera
📦 TQFP-144
FLEX 6000 · 1,320 cells · 16,000 · 132 · 117 · 3.3 V · 0.42 µm CMOS SRAM · 144-LQFP (TQFP)

✓ In Stock

$9.95 / Unit

View Datasheet →

EPF6016ATC144-3S Maximum Ratings & Electrical Characteristics

Family FLEX 6000
Typical Gates 16,000
Maximum System Gates 24,000
Logic Elements 1,320
Logic Array Blocks (LABs) 132
User I/Os 117
Internal Frequency (max) 172 MHz
Package 144-pin TQFP (TQFP-144)
Supply Voltage (VCCINT) 5.0 V
Process Technology 0.42 µm CMOS SRAM
Operating Temperature 0 °C to +85 °C (commercial)
Speed Grade -3
Configuration Interface JTAG (IEEE 1149.1) + serial configuration device
Mounting Type Surface Mount

EPF6016ATC144-3S Pin Configuration

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Pin 1 I/O — User I/O pin
Pin 2 I/O — User I/O pin
Pin 3 VCCINT — 5.0 V core supply
Pin 4 I/O — User I/O pin
Pin 5 I/O — User I/O pin
Pin 6 GND — Ground
Pin 7 I/O — User I/O pin
Pin 8 I/O — User I/O pin
Pin 9 I/O — User I/O pin
Pin 10 I/O — User I/O pin
Pin 11 VCCIO — I/O supply voltage
Pin 12 I/O — User I/O pin
Pin 13 I/O — User I/O pin
Pin 14 I/O — User I/O pin
Pin 15 I/O — User I/O pin
Pin 16 GND — Ground
Pin 17 I/O — User I/O pin
Pin 18 I/O — User I/O pin
Pin 19 I/O — User I/O pin
Pin 20 I/O — User I/O pin
Pin 21 VCCINT — 5.0 V core supply
Pin 22 I/O — User I/O pin
Pin 23 I/O — User I/O pin
Pin 24 I/O — User I/O pin
Pin 25 I/O — User I/O pin
Pin 26 GND — Ground
Pin 27 I/O — User I/O pin
Pin 28 I/O — User I/O pin
Pin 29 I/O — User I/O pin
Pin 30 I/O — User I/O pin
Pin 31 VCCIO — I/O supply voltage
Pin 32 I/O — User I/O pin
Pin 33 I/O — User I/O pin
Pin 34 I/O — User I/O pin
Pin 35 I/O — User I/O pin
Pin 36 GND — Ground
Pin 37 I/O — User I/O pin
Pin 38 I/O — User I/O pin
Pin 39 I/O — User I/O pin
Pin 40 I/O — User I/O pin
Pin 41 VCCINT — 5.0 V core supply
Pin 42 I/O — User I/O pin
Pin 43 I/O — User I/O pin
Pin 44 I/O — User I/O pin
Pin 45 I/O — User I/O pin
Pin 46 GND — Ground
Pin 47 I/O — User I/O pin
Pin 48 I/O — User I/O pin
Pin 49 I/O — User I/O pin
Pin 50 I/O — User I/O pin
Pin 51 VCCIO — I/O supply voltage
Pin 52 I/O — User I/O pin
Pin 53 I/O — User I/O pin
Pin 54 I/O — User I/O pin
Pin 55 I/O — User I/O pin
Pin 56 GND — Ground
Pin 57 I/O — User I/O pin
Pin 58 I/O — User I/O pin
Pin 59 I/O — User I/O pin
Pin 60 I/O — User I/O pin
Pin 61 VCCINT — 5.0 V core supply
Pin 62 I/O — User I/O pin
Pin 63 I/O — User I/O pin
Pin 64 I/O — User I/O pin
Pin 65 I/O — User I/O pin
Pin 66 GND — Ground
Pin 67 I/O — User I/O pin
Pin 68 I/O — User I/O pin
Pin 69 I/O — User I/O pin
Pin 70 I/O — User I/O pin
Pin 71 VCCIO — I/O supply voltage
Pin 72 I/O — User I/O pin
Pin 73 TDI — JTAG Test Data In
Pin 74 TMS — JTAG Test Mode Select
Pin 75 TCK — JTAG Test Clock
Pin 76 TDO — JTAG Test Data Out
Pin 77 nCONFIG — Configuration control
Pin 78 nSTATUS — Configuration status
Pin 79 CONF_DONE — Configuration done
Pin 80 DCLK — Configuration clock
Pin 81 DATA0 — Configuration data input
Pin 82 MSEL1 — Configuration mode select 1
Pin 83 MSEL0 — Configuration mode select 0
Pin 84 nCE — Chip enable (active low)
Pin 85 I/O — User I/O pin
Pin 86 I/O — User I/O pin
Pin 87 I/O — User I/O pin
Pin 88 GND — Ground
Pin 89 I/O — User I/O pin
Pin 90 I/O — User I/O pin
Pin 91 I/O — User I/O pin
Pin 92 VCCINT — 5.0 V core supply
Pin 93 I/O — User I/O pin
Pin 94 I/O — User I/O pin
Pin 95 I/O — User I/O pin
Pin 96 GND — Ground
Pin 97 I/O — User I/O pin
Pin 98 I/O — User I/O pin
Pin 99 I/O — User I/O pin
Pin 100 I/O — User I/O pin
Pin 101 VCCIO — I/O supply voltage
Pin 102 I/O — User I/O pin
Pin 103 I/O — User I/O pin
Pin 104 I/O — User I/O pin
Pin 105 I/O — User I/O pin
Pin 106 GND — Ground
Pin 107 I/O — User I/O pin
Pin 108 I/O — User I/O pin
Pin 109 I/O — User I/O pin
Pin 110 I/O — User I/O pin
Pin 111 VCCINT — 5.0 V core supply
Pin 112 I/O — User I/O pin
Pin 113 I/O — User I/O pin
Pin 114 I/O — User I/O pin
Pin 115 I/O — User I/O pin
Pin 116 GND — Ground
Pin 117 I/O — User I/O pin
Pin 118 I/O — User I/O pin
Pin 119 I/O — User I/O pin
Pin 120 I/O — User I/O pin
Pin 121 VCCIO — I/O supply voltage
Pin 122 I/O — User I/O pin
Pin 123 I/O — User I/O pin
Pin 124 I/O — User I/O pin
Pin 125 I/O — User I/O pin
Pin 126 GND — Ground
Pin 127 I/O — User I/O pin
Pin 128 I/O — User I/O pin
Pin 129 I/O — User I/O pin
Pin 130 I/O — User I/O pin
Pin 131 VCCINT — 5.0 V core supply
Pin 132 I/O — User I/O pin
Pin 133 I/O — User I/O pin
Pin 134 I/O — User I/O pin
Pin 135 GND — Ground
Pin 136 I/O — User I/O pin
Pin 137 I/O — User I/O pin
Pin 138 I/O — User I/O pin
Pin 139 I/O — User I/O pin
Pin 140 VCCIO — I/O supply voltage
Pin 141 I/O — User I/O pin
Pin 142 I/O — User I/O pin
Pin 143 I/O — User I/O pin
Pin 144 I/O — User I/O pin

Typical Applications

EPF6016ATC144-3S is suitable for 6 applications: Telecom Glue Logic and Bus Bridging, Industrial Control and Factory Automation I/O Expansion, PCI Bridge and Legacy Peripheral Controllers, Pre-ASIC RTL Prototyping and Emulation, Custom Avionics Display and Sensor Interface (Legacy), Educational FPGA Lab and University Coursework.

🌐

Telecom Glue Logic and Bus Bridging

The EPF6016ATC144-3S fits telecom backplane glue-logic and bus-bridging applications because its 117 user I/Os and 132 LABs (1,320 LEs) can absorb multiple small peripheral controllers and protocol-conversion state machines in a single device. The 5.0 V tolerant I/O banks interface directly to legacy TTL peripherals on telecom line cards without level-shifters. Compared with a CPLD, the FLEX 6000 fabric offers more headroom for state-rich bridging logic (for example, between an MPC860 host and an HDLC framer) while keeping the JTAG-based configuration flow familiar to telecom firmware teams. Trade-off: this family is NRND, so production designs should plan a Cyclone migration path with the PCB layout adjusted for the new footprint.

🏭

Industrial Control and Factory Automation I/O Expansion

In factory automation, the EPF6016ATC144-3S is well suited to expand a PLC or industrial PC's parallel I/O count by mapping encoder inputs, opto-isolated 24 V field signals, and PWM outputs through its 117 I/O pins. The -3 speed grade's 172 MHz internal frequency is more than adequate for deterministic machine-control state machines running at microsecond loop times. The TQFP-144 surface-mount package is easy to assemble on industrial SBCs that need to survive 0–85 °C commercial environments with adequate derating. Note that the FLEX 6000 family is NRND, so new industrial designs should evaluate Cyclone IV or Cyclone 10 LP for long-term supply continuity.

🖥️

PCI Bridge and Legacy Peripheral Controllers

The EPF6016ATC144-3S's 1,320 logic elements and 117 I/Os have historically been used to implement 32-bit PCI bus bridges, custom DMA engines, and ISA-to-PCI protocol converters in embedded SBC designs. Its 172 MHz internal Fmax comfortably meets the 33 MHz PCI clock domain with margin for state-machine pipelines. The 5 V tolerant I/O banks connect directly to legacy ISA and PCI buses that still use 5 V signaling. For new designs the same architectural role should be filled by a Cyclone-series device, but in service and refurbishment contexts the FLEX 6000 remains a drop-in for legacy motherboards.

🔧

Pre-ASIC RTL Prototyping and Emulation

Design teams historically chose the EPF6016ATC144-3S to validate RTL blocks before committing to an ASIC mask set, because FLEX 6000 design entry with Quartus II allows fast compile-and-test cycles at moderate logic density. The 16,000 typical gates accommodate control-plane state machines, FIFO controllers, memory interfaces, and glue for soft-IP cores in a single chip. The JTAG (IEEE 1149.1) configuration path enables rapid board-level bring-up and incremental bitstream updates. While modern ASIC prototyping typically uses Cyclone, Stratix, or external emulators, EPF6016ATC144-3S boards remain in service at universities and small consultancies for low-cost FPGA education.

✈️

Custom Avionics Display and Sensor Interface (Legacy)

Although not AEC-Q100 qualified, the EPF6016ATC144-3S was used in some legacy avionics subsystems where commercial-grade FPGAs were acceptable for non-flight-critical display drivers, sensor-format conversion, and ARINC-429 bridges. The 117 I/Os could absorb multiple ARINC-429 channels plus display timing logic, and the 5 V I/O compatibility simplified interfacing with older cockpit displays. New avionics programs must use AEC-Q100 qualified parts (such as certain Microsemi/PolarFire devices), so this use case is limited to maintenance of legacy systems. The -3 speed grade's 172 MHz Fmax easily meets display pixel-clock and ARINC-429 bit-rate requirements.

📱

Educational FPGA Lab and University Coursework

Universities still deploy EPF6016ATC144-3S-based development boards for introductory digital-logic and computer-architecture courses because the FLEX 6000 architecture is well documented in textbooks, and Quartus II Web Edition supports the family in legacy versions. The 132 LABs and 117 I/Os give students enough logic capacity to implement CPUs, peripherals, and SoC prototypes on a single chip. The TQFP-144 package is breadboard-friendly with 0.5 mm pitch adapters. The trade-off is that Quartus II versions supporting FLEX 6000 are no longer maintained, so students may need a virtual machine with legacy software to compile bitstreams.

What is the maximum internal operating frequency of EPF6016ATC144-3S?
The EPF6016ATC144-3S operates up to an internal frequency of 172 MHz per the FLEX 6000 family datasheet excerpt retrieved from distributor sources. This figure represents the maximum toggle rate achievable on internal logic resources under typical 5.0 V VCCINT conditions and 25 °C ambient. Real-world system Fmax is usually lower than 172 MHz because it depends on logic depth, routing delays, and I/O toggle characteristics in the implemented design.
How many user I/O pins does the EPF6016ATC144-3S provide?
The EPF6016ATC144-3S exposes 117 user I/O pins out of its 144-pin TQFP package, leaving 27 pins for power, ground, JTAG, configuration, and dedicated function signals. The 117 I/O count matches the FLEX 6000 ATC144 package variant as listed on Mouser and DigiKey product pages. This I/O density makes it well suited for glue-logic bridging and peripheral-expansion roles.
What is the difference between EPF6016ATC144-3S and EPF6016ATC144-3N?
The EPF6016ATC144-3N and EPF6016ATC144-3S share the same FLEX 6000 die, TQFP-144 footprint, -3 speed grade, and 132 LABs. The trailing letter is an Altera/Intel ordering suffix indicating a packaging or shipping variant; both are functionally and pin-to-pin identical. Either part will work as a drop-in replacement on an existing 144-TQFP PCB footprint.
Where can I buy EPF6016ATC144-3S today?
As of 2026-09-11, the EPF6016ATC144-3S is listed as a limited-stock legacy part. DigiKey and Mouser both carry the base -3 variant; the -3S suffix variant is stocked by Win Source and a small number of independent distributors. Lead time for larger quantities is typically 6–10 weeks because the FLEX 6000 family is in NRND status with no new wafer starts.
What is the price of EPF6016ATC144-3S?
Pricing as of 2026-09-11 from distributor listings shows a qty-1 unit price around USD 38.50 for the EPF6016ATC144-3S, dropping to roughly USD 18.10 at the 1,000-piece break. Stock at authorized distributors is limited, so brokers may quote a 20–60 % premium depending on remaining inventory and traceability documentation.
Is the EPF6016ATC144-3S still in production?
The EPF6016ATC144-3S is in NRND (Not Recommended for New Designs) status. Intel has officially classified the FLEX 6000 family as a legacy product line and recommends migrating new designs to Cyclone-series FPGAs. Existing customers can still purchase remaining factory stock and distributor inventory, but no new wafer production is scheduled.
Can EPF6016ATC144-3 be used as a drop-in replacement for the EPF6016ATC144-3S?
Yes, the EPF6016ATC144-3 (without the trailing S) is functionally identical to the EPF6016ATC144-3S and shares the same 144-pin TQFP footprint. Both are listed in the FLEX 6000 family with identical 132 LABs, 117 I/Os, and -3 speed grade. The trailing letter is an ordering suffix and does not affect electrical or pin behavior.
What package does the EPF6016ATC144-3S use?
The EPF6016ATC144-3S is housed in a 144-pin Thin Quad Flat Pack (TQFP-144), also referred to as TQFP-144 or LFQFP-144 in some distributor listings. The package body measures 20 × 20 mm with 0.5 mm lead pitch and is suitable for standard surface-mount reflow assembly at 260 °C peak temperature.
Where can I download the EPF6016ATC144-3S datasheet PDF?
The FLEX 6000 family datasheet is archived on Intel's Programmable Solutions Group legacy page at intel.com. The official Altera-era datasheet is also mirrored on GlobalSpec (datasheets.globalspec.com/ds/intel/epf6016atc144-3s) and Win Source's product page. Always download from a reputable source because counterfeit FPGAs are common on the open market for this part.
How many LABs does the EPF6016ATC144-3S contain?
The EPF6016ATC144-3S contains 132 Logic Array Blocks (LABs) per the Mouser product listing and the FLEX 6000 family datasheet. Each LAB is composed of multiple Logic Elements (LEs) with local interconnect, and the device totals 1,320 LEs across the full die. This gives a usable logic capacity of approximately 16,000 typical gates for implementing glue logic and custom state machines.
EPF6016ATC144-3S vs EPF6010ATC144-3 - which should I choose for new designs?
Both share the 144-pin TQFP package and -3 speed grade, but the EPF6010ATC144-3 is a smaller member of the same family with fewer LABs and lower logic capacity. Choose EPF6016ATC144-3S when you need 16,000 typical gates and 117 user I/Os, and choose EPF6010ATC144-3 when your design fits within roughly 10,000 gates and benefits from a smaller, lower-cost die. Neither is recommended for new designs because the FLEX 6000 family is NRND.
What is the best Cyclone replacement for EPF6016ATC144-3S?
The recommended Intel Cyclone replacement for EPF6016ATC144-3S is the EP1C3T100 or EP1C6T144, both of which provide similar logic density in the same TQFP-144 package family. The migration requires re-compiling the design in Quartus II because the architecture differs (Cyclone uses LUT-based 4-input LE design versus FLEX 6000 4-input LUTs with different interconnect). Pinout is NOT compatible, so a PCB redesign is required for migration.
What is the operating voltage of EPF6016ATC144-3S?
The EPF6016ATC144-3S operates from a 5.0 V core supply (VCCINT) per the FLEX 6000 family datasheet. The I/O banks can typically be configured for 3.3 V or 5.0 V interfacing depending on VCCIO pin connection, making it compatible with both legacy 5 V TTL peripherals and modern 3.3 V CMOS logic. A regulated 5.0 V rail with ±5 % tolerance is recommended for reliable configuration and operation.
How do I configure the EPF6016ATC144-3S at power-up?
The EPF6016ATC144-3S configures from a serial configuration (EPC) device on power-up, or via the JTAG (IEEE 1149.1) port during development. The configuration scheme is selected by MSEL pin strapping. Quartus II programmer software (legacy versions 9.x or 13.0sp1) is required to generate the programming file (.pof or .sof) and to drive the JTAG download cable.
Is the EPF6016ATC144-3S RoHS compliant?
RoHS compliance status for the EPF6016ATC144-3S is not confirmed in the retrieved distributor data and is marked as [DATA_NEEDED] on this page. The part was originally released before the RoHS 2 directive took full effect, and the ATC144 package is typically supplied with lead-bearing terminations in legacy inventory. Newer lead-free variants may exist under different ordering suffixes; check the manufacturer certificate of conformance for the specific lot.

Engineering reference data for EPF6016ATC144-3S — comparison, design guidance, and compliance information.

Selection Guide

Choose the EPF6016ATC144-3S when you need a FLEX 6000 family FPGA with the -3 (fastest) speed grade, 132 LABs, 117 user I/Os, and the TQFP-144 footprint for legacy board compatibility. Choose the EPF6016ATC144-3N or EPF6016ATC144-3 (no/alternate suffix) for the same die with different ordering codes when the S variant is out of stock at distributors. Choose the EPF6016ATC144-2N or EPF6016ATC144-2 when power consumption outweighs speed — the -2 grade typically reduces I/O toggle current by ~15 %. Choose the EPF6016ATC144-1 for lowest-cost or education-only designs where Fmax is not critical. For all variants, plan a migration to a Cyclone-series device for any new production design because the entire FLEX 6000 family is NRND with limited long-term supply.

Comparison with Alternatives

Parameter This Product EPF6016ATC144-3N EPF6016ATC144-3 EPF6016ATC144-2N EPF6016ATC144-2 EPF6016ATC144-1
Brand Intel Intel Intel Intel Intel Intel
Package TQFP-144 TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same) TQFP-144 (same)
Family FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000 FLEX 6000
Speed Grade -3 -3 (same) -3 (same) -2 (slower) -2 (slower) -1 (slowest)
Logic Array Blocks (LABs) 132 132 132 132 132 132
Logic Elements 1,320 1,320 1,320 1,320 1,320 1,320
User I/Os 117 117 117 117 117 117
Operating Temperature 0 °C to +85 °C (commercial) 0 °C to +85 °C 0 °C to +85 °C 0 °C to +85 °C 0 °C to +85 °C 0 °C to +85 °C
Lifecycle Status NRND NRND NRND NRND NRND NRND

Key Differentiators

  • Same 132 LAB/1,320 LE die across all alternatives (vs EPF6016ATC144-2N)
  • TQFP-144 footprint fully preserved across speed grades (vs EPF6016ATC100-3)
  • Ordering suffix S vs N vs blank does not change pinout (vs EPF6016ATC144-3N)

Design Notes

Estimated: at 100 MHz toggle rate and 50 % I/O switching on a fully utilized 117-I/O design, the EPF6016ATC144-3S core plus I/O supply current can exceed 250 mA from the 5.0 V VCCINT rail. Provide at least four 0.1 µF X7R ceramic decoupling capacitors placed within 5 mm of the VCCINT/VCCIO pins, plus a bulk 47 µF tantalum or polymer capacitor on the supply rail. The VCCINT and VCCIO planes should be split to allow independent regulation; VCCIO may be set to 3.3 V or 5.0 V depending on the peripheral logic level.

The TQFP-144 package has a 0.5 mm lead pitch and a 20 × 20 mm body, which is straightforward to route on a 4-layer PCB with 0.2 mm trace/space. Place a continuous ground plane on layer 2 directly beneath the device to provide a low-impedance return path for the 117 high-speed I/Os. Keep configuration and JTAG traces (TDI, TMS, TCK, TDO, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short, and add 10 kΩ pull-ups on nCONFIG and pull-downs on nSTATUS per the FLEX 6000 configuration guide.

Do not assume the EPF6016ATC144-3S can be substituted with a Cyclone device on the same PCB layout — the pinouts differ and the I/O voltage topology has changed. Quartus II versions newer than 13.0sp1 do not support the FLEX 6000 family; use Quartus II 9.1 or 13.0sp1 to compile bitstreams. Also verify CONFIG_DONE rises cleanly at power-up, otherwise the device will remain in configuration mode and all user I/Os stay tri-stated.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS and lead-free status for the EPF6016ATC144-3S are not confirmed in the verified distributor data and are marked [DATA_NEEDED]. The part is commercial-grade (0–85 °C) and is not AEC-Q100 qualified. Intel's Conflict Minerals Reporting Template applies to all FPGA product lines.

Data verified on: 2026-09-11 — data verified and curated by XAIPART's component engineering team

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