EPF8282ATC100-3 - FLEX 8000 FPGA 2.5K Gates 78 I/O TQFP-100 | Intel
MPN: EPF8282ATC100-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.6 | $5,800.00 |
| 1,000 | $10.25 | $10,250.00 |
EPF8282ATC100-3 Overview
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that sits within the broader integrated circuit hierarchy of semiconductor devices. It uses look-up tables, flip-flops, and programmable interconnect to implement arbitrary digital logic, allowing engineers to reconfigure hardware functionality in-circuit via SRAM configuration memory. FPGAs bridge the gap between fixed-function ASICs and discrete logic, offering high integration, fast time-to-market, and in-system reconfigurability.
Key features of the EPF8282ATC100-3 include 2,500 usable gates, 208 logic elements, 12,000 typical gates equivalent, 78 I/O pins, multiVolt I/O support for 3.3V/5V mixed-voltage interfacing, in-circuit reconfigurability (ICR), and JTAG boundary-scan test support. The device is configured at system power-up via industry-standard parallel EPROM, Altera serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441), or a microprocessor.
The FLEX 8000 architecture employs a segmented fast-track interconnect that links LABs horizontally and vertically with predictable delay, simplifying timing closure. Each EAB provides up to 2 Kbits of dual-port RAM or ROM, useful for FIFO buffers, lookup tables, and DSP datapaths. Designers can implement 32-bit buses and integrate glue logic around microprocessors without external bus drivers.
Typical applications include telecommunications switching equipment, industrial control systems, test and measurement instrumentation, glue logic around microprocessors and microcontrollers, peripheral bus interfacing, and legacy embedded system retrofits. The wide I/O count and 5V tolerance make it useful for replacing discrete TTL/CMOS logic on 5V backplanes.
When designing with this device, ensure configuration data is available at power-up using a compatible EPC series configuration device or microcontroller-driven configuration. Decoupling capacitors should be placed within 0.5 cm of each VCC pin, and unused I/O pins must be configured as outputs driving ground to minimize switching noise.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and design considerations for the EPF8282ATC100-3, supplementing the manufacturer datasheet with engineering guidance and cross-brand equivalents sourced from current distributor data.
Drop-in alternatives for EPF8282ATC100-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF8282ATC100-3 (same form factor and footprint) — differing in Process Technology, Configuration Method, Speed Grade, Package, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8282ATC100-2
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF8282ATC100-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8282ATC100-2W
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$7.4 / Unit
View Datasheet →EPF8282ATC100-4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.95 / Unit
View Datasheet →EPF8282ATI100-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$15.6 / Unit
View Datasheet →EPF8282ATC100-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Cells (LEs) | 208 |
| Usable Gates | 2,500 |
| Typical Gates Equivalent | 12,000 |
| Maximum User I/O | 78 |
| Number of Logic Array Blocks (LABs) | 26 |
| Embedded Array Blocks (EABs) | 6 |
| Total RAM Bits | 12 Kbits |
| Process Technology | 0.42 micron CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| MultiVolt I/O Support | 3.3 V / 5 V |
| Maximum Frequency | 125 MHz |
| Speed Grade | -3 |
| Package | 100-pin TQFP (100-TQFP) |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor |
| Operating Temperature (Commercial) | 0 C to +70 C |
| In-Circuit Reconfigurable | Yes (ICR) |
| Boundary Scan | JTAG IEEE 1149.1 |
EPF8282ATC100-3 100-pin tqfp (100-tqfp) Pin Configuration Guide
Pin configuration for EPF8282ATC100-3 (100-pin tqfp (100-tqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8282ATC100-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF8282ATC100-3 is suitable for 6 applications: Telecommunications Switching and Routing, Industrial Control and Automation, Test and Measurement Instrumentation, Legacy Embedded System Retrofit, Peripheral Bus Interfacing and Bridging, Glue Logic for Microprocessor Systems.
Telecommunications Switching and Routing
The EPF8282ATC100-3 fits telecommunications switching equipment because its 78 I/O count and 125 MHz operation handle 32-bit bus aggregation, packet header parsing, and glue logic between network processors and PHYs. The 5V core and MultiVolt I/O simplify interfacing to legacy TDM backplanes, while the 2,500 usable gates are sufficient for state machines, FIFO controllers, and serial-to-parallel converters. Compared with discrete 74-series logic, integrating these functions into one FPGA reduces board area by 50-70% and improves timing margin through deterministic fast-track interconnect delays.
Recommended
Industrial Control and Automation
In industrial control PLCs and motor drives, the EPF8282ATC100-3 serves as glue logic between microcontrollers, sensor interfaces, and power-stage gate drivers. Its 78 I/O support multiple encoder inputs, PWM channels, and discrete I/O banks without external bus expanders. The device's deterministic interconnect delays simplify timing closure for safety-critical signal paths. Engineers use the 12 Kbits of embedded RAM for encoder tables, PID coefficient storage, and communication protocol buffers, eliminating external SRAM in cost-sensitive designs.
Recommended
Test and Measurement Instrumentation
The EPF8282ATC100-3 is well suited for test instruments such as logic analyzers, protocol analyzers, and stimulus generators. Its 125 MHz operation captures 32-bit parallel bus traffic at full speed, while 208 logic elements implement address decoding, trigger logic, and pattern generation. The JTAG boundary-scan support simplifies board-level test and in-system programming, allowing factory test engineers to verify interconnect without bed-of-nails fixtures.
Recommended
Legacy Embedded System Retrofit
The EPF8282ATC100-3 is frequently deployed to retrofit legacy embedded systems where the original discrete-logic or PAL-based glue logic has reached end-of-life. Its 100-pin TQFP footprint fits the same PCB land pattern as older 84-pin PLCC packages when a small adapter board is used. Engineers replace 5-15 discrete 74-series ICs with a single FLEX 8000 device, reducing power consumption by 30-50% and improving signal integrity through controlled-impedance interconnect.
Recommended
Peripheral Bus Interfacing and Bridging
The EPF8282ATC100-3 bridges between incompatible peripheral buses such as ISA, PC/104, VME, and custom backplanes. Its 78 I/O can drive a 32-bit data bus plus full address and control signals without external buffers, and the 5V tolerance matches legacy bus levels. The MultiVolt I/O supports 3.3V peripherals when interfacing modern ASICs. Bus-bridge designs use the embedded RAM for FIFO buffering and the logic elements for protocol state machines, achieving lower latency than software-based bridging.
Recommended
Glue Logic for Microprocessor Systems
The EPF8282ATC100-3 replaces 5-20 discrete glue-logic ICs around 80x86, 68k, MIPS, and PowerPC microprocessors, integrating address decoding, wait-state generation, bus arbitration, chip-select logic, and interrupt prioritization. Designers reclaim significant board area and improve timing margin by replacing asynchronous discrete logic with deterministic FLEX 8000 interconnect. The JTAG support enables boundary-scan test of the entire glue-logic layer, simplifying manufacturing test.
Recommended
Recommended Products Summary
Engineering reference data for EPF8282ATC100-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8282ATC100-2 | EPF8282ATC100-3N | EPF8282ATC100-2W | EPF8282ATC100-4 | EPF8282ATI100-3 |
|---|---|---|---|---|---|---|
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Usable Gates | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 |
| Logic Elements | 208 | 208 | 208 | 208 | 208 | 208 |
| User I/O | 78 | 78 | 78 | 78 | 78 | 78 |
| Speed Grade | -3 | -2 (slower) | -3 (same) | -2 (slower, extended temp) | -4 (slowest) | -3 (industrial temp) |
| Maximum Frequency | 125 MHz | ~90 MHz | 125 MHz | ~90 MHz | ~75 MHz | 125 MHz |
| Supply Voltage | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O | 5 V core, 3.3/5 V I/O |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C | 0 C to +70 C | -40 C to +85 C (Extended) | 0 C to +70 C | -40 C to +85 C (Industrial) |
| Lead-Free / Pb-Free | No (SnPb finish standard) | No | Yes (Pb-free) | No | No | No |
Key Differentiators
- Highest speed grade in the FLEX 8000 TQFP-100 family (vs EPF8282ATC100-2)
- Lead-free variant available for RoHS-compliant designs (vs EPF8282ATC100-3N)
- Industrial temperature grade available in same package (vs EPF8282ATI100-3)
- On-chip RAM and EABs eliminate external memory (vs Discrete 74-series glue logic)
Design Notes
The EPF8282ATC100-3 requires a stable 5 V +/- 5% supply for the core and dedicated VCC pins for the I/O banks. Place 0.1 uF ceramic decoupling capacitors within 0.5 cm of every VCC pin and bulk 10-47 uF tantalum capacitors at the board entry point. In-circuit reconfiguration draws transient currents of up to 200 mA during configuration; ensure the regulator can source this without droop.
Use a 4-layer PCB with continuous ground plane beneath the TQFP-100 package to control impedance and reduce SSO (simultaneous switching output) noise. Route all 78 user I/O traces with matched impedance (typically 50 ohms single-ended) and keep clock traces shorter than 25 mm to avoid reflections. The TQFP-100 has a 0.5 mm pitch requiring fine-pitch assembly; follow IPC-7351 land pattern guidelines.
Configure all unused I/O pins as outputs driving ground to minimize power consumption and SSO noise. Do not leave user I/O floating during configuration - this can cause unpredictable behavior. Ensure the configuration device (EPC1, EPC1064, or EPC1441) is sized correctly for the design bitstream; undersized configuration memory causes configuration failures. Verify the nCONFIG, nSTATUS, and CONF_DONE pull-up/pull-down resistor values match the datasheet reference design.
The 78 user I/O can drive up to 24 mA per pin, but simultaneous switching of many outputs (SSO) creates ground bounce. Limit SSO to 8-10 outputs per I/O bank and use staggered output enable timing in high-speed designs. Place series damping resistors (22-33 ohms) on clock outputs driving long traces to reduce ringing.
Compliance Information
Standard EPF8282ATC100-3 is SnPb finish (non-RoHS); EPF8282ATC100-3N variant is Pb-free for RoHS-compliant designs. Not AEC-Q100 qualified - not recommended for new automotive applications.
