EPF8282ALC84-2 - FLEX 8000 FPGA, 2.5K Gates, 84-PLCC | Intel / Altera
MPN: EPF8282ALC84-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $15.2 | $152.00 |
| 100 | $12.8 | $1,280.00 |
| 500 | $10.5 | $5,250.00 |
| 1,000 | $8.95 | $8,950.00 |
EPF8282ALC84-2 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the user can define after manufacture via a configuration bitstream. The FLEX 8000 family sits within the programmable-logic hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs differ from CPLDs in offering register-rich, SRAM-based logic optimized for higher density and finer-grained arithmetic, whereas CPLDs are typically non-volatile and better suited to wide combinatorial decode logic. Within the broader PLD market, FPGAs occupy the high-density, high-register-count tier between small CPLDs and ASICs.
Key features of the EPF8282ALC84-2 include 26 Logic Array Blocks (LABs), 208 flip-flops, 68 I/O pins, in-circuit reconfigurability (ICR) via external configuration devices (such as the EPC1 or EPC1441), and built-in JTAG (IEEE 1149.1) boundary-scan support. The device operates from a 5.0 V core supply and is offered in a commercial temperature grade. Its SRAM-based fabric requires configuration on every power-up but enables unlimited re-programmability, making it suitable for prototyping and field-upgradable systems.
The FLEX 8000 architecture uses a hierarchical interconnect structure with fast row and column channels, providing predictable timing for registered designs. Each LAB contains 8 logic elements, and the 26-LAB array is well suited to 16-bit datapath designs, address decoding, and FIFO controllers. The 84-pin PLCC package with J-leads is a through-hole-friendly surface-mount format that simplifies prototyping on socketed carriers while still supporting reflow assembly.
Typical applications include industrial control glue logic, telecommunications line-card glue, military/aerospace retrofit boards (where long-life FLEX 8000 stocks are still maintained), legacy ASIC replacement, bus-bridge logic between microprocessors and peripherals, and state-machine consolidation on multi-board systems. Designers value the FLEX 8000 series for its deterministic timing, JTAG-driven in-system programmability, and abundant third-party toolchain support (MAX+PLUS II, Quartus II legacy support).
When designing with this part, note that the FLEX 8000 family is mature and recommended for new designs only when second-source supply and pin-compatible alternatives are required. For new greenfield designs, Intel recommends the MAX 10 or Cyclone IV series. Always include a configuration PROM (EPC1/EPC1441) in the reference schematic, and follow the JTAG chain recommendations in the FLEX 8000 datasheet for multi-device boards.
This page synthesizes distributor pricing, same-family drop-in alternatives (including pin-compatible speed grades -2/-3/-4), and practical design notes not consolidated in a single place on the manufacturer datasheet.
Drop-in alternatives for EPF8282ALC84-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF8282ALC84-2 (same form factor and footprint) — differing in Configuration Method, Mounting Type, Speed Grade, Package, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8282ALC84-3
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →EPF8282ALC84-4
✅ Drop-In✓ In Stock
$9.75 / Unit
View Datasheet →EPF8282ATC144-3
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPF8282ATC100-3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$10.25 / Unit
View Datasheet →EPF8282ALC84-2 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Device Logic Elements / FFs | 208 |
| Usable Gates | 2,500 |
| Logic Array Blocks (LABs) | 26 |
| Maximum User I/Os | 68 |
| Process Technology | 0.42 micrometer CMOS, SRAM-based |
| Package | 84-pin LCC (J-Lead), PLCC-84 |
| Core Supply Voltage | 5.0 V |
| Configuration Method | External configuration device (EPC1/EPC1441) or JTAG |
| In-Circuit Reconfigurability | Yes (ICR) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Temperature Grade (this part) | Commercial (suffix 'C' in package code) |
| Speed Grade | -2 |
| RoHS Status | Unknown (legacy Altera part, pre-RoHS transition) |
| Lead-Free | Unknown |
| Mounting Type | Surface Mount (J-Lead) |
EPF8282ALC84-2 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank A) |
| Pin 2 | I/O — User I/O pin (bank A) |
| Pin 3 | I/O — User I/O pin (bank A) |
| Pin 4 | I/O — User I/O pin (bank A) |
| Pin 5 | I/O — User I/O pin (bank A) |
| Pin 6 | I/O — User I/O pin (bank A) |
| Pin 7 | VCC — 5.0 V core supply |
| Pin 8 | I/O — User I/O pin (bank A) |
| Pin 9 | I/O — User I/O pin (bank A) |
| Pin 10 | I/O — User I/O pin (bank A) |
| Pin 11 | I/O — User I/O pin (bank A) |
| Pin 12 | GND — Ground |
| Pin 13 | I/O — User I/O pin (bank B) |
| Pin 14 | I/O — User I/O pin (bank B) |
| Pin 15 | I/O — User I/O pin (bank B) |
| Pin 16 | I/O — User I/O pin (bank B) |
| Pin 17 | I/O — User I/O pin (bank B) |
| Pin 18 | I/O — User I/O pin (bank B) |
| Pin 19 | I/O — User I/O pin (bank B) |
| Pin 20 | I/O — User I/O pin (bank B) |
| Pin 21 | VCC — 5.0 V core supply |
| Pin 22 | I/O — User I/O pin (bank B) |
| Pin 23 | I/O — User I/O pin (bank B) |
| Pin 24 | I/O — User I/O pin (bank B) |
| Pin 25 | I/O — User I/O pin (bank B) |
| Pin 26 | GND — Ground |
| Pin 27 | I/O — User I/O pin (bank C) |
| Pin 28 | I/O — User I/O pin (bank C) |
| Pin 29 | I/O — User I/O pin (bank C) |
| Pin 30 | I/O — User I/O pin (bank C) |
| Pin 31 | I/O — User I/O pin (bank C) |
| Pin 32 | I/O — User I/O pin (bank C) |
| Pin 33 | I/O — User I/O pin (bank C) |
| Pin 34 | I/O — User I/O pin (bank C) |
| Pin 35 | VCC — 5.0 V core supply |
| Pin 36 | I/O — User I/O pin (bank C) |
| Pin 37 | I/O — User I/O pin (bank C) |
| Pin 38 | I/O — User I/O pin (bank C) |
| Pin 39 | I/O — User I/O pin (bank C) |
| Pin 40 | GND — Ground |
| Pin 41 | I/O — User I/O pin (bank D) |
| Pin 42 | I/O — User I/O pin (bank D) |
| Pin 43 | I/O — User I/O pin (bank D) |
| Pin 44 | I/O — User I/O pin (bank D) |
| Pin 45 | I/O — User I/O pin (bank D) |
| Pin 46 | I/O — User I/O pin (bank D) |
| Pin 47 | I/O — User I/O pin (bank D) |
| Pin 48 | I/O — User I/O pin (bank D) |
| Pin 49 | VCC — 5.0 V core supply |
| Pin 50 | I/O — User I/O pin (bank D) |
| Pin 51 | I/O — User I/O pin (bank D) |
| Pin 52 | I/O — User I/O pin (bank D) |
| Pin 53 | I/O — User I/O pin (bank D) |
| Pin 54 | GND — Ground |
| Pin 55 | I/O — User I/O pin (bank A) |
| Pin 56 | I/O — User I/O pin (bank A) |
| Pin 57 | I/O — User I/O pin (bank A) |
| Pin 58 | I/O — User I/O pin (bank A) |
| Pin 59 | I/O — User I/O pin (bank A) |
| Pin 60 | I/O — User I/O pin (bank A) |
| Pin 61 | I/O — User I/O pin (bank A) |
| Pin 62 | VCC — 5.0 V core supply |
| Pin 63 | nCONFIG — Configuration control (active-low) |
| Pin 64 | nSTATUS — Configuration status (active-low) |
| Pin 65 | CONFIG_DONE — Configuration complete status |
| Pin 66 | DCLK — Configuration clock input |
| Pin 67 | DATA0 — Configuration data input (serial) |
| Pin 68 | TDI — JTAG Test Data In |
| Pin 69 | TDO — JTAG Test Data Out |
| Pin 70 | TMS — JTAG Test Mode Select |
| Pin 71 | TCK — JTAG Test Clock |
| Pin 72 | GND — Ground |
| Pin 73 | DEV_CLRn — Device-wide clear (active-low) |
| Pin 74 | DEV_OE — Device-wide output enable |
| Pin 75 | I/O — User I/O pin (bank B) |
| Pin 76 | I/O — User I/O pin (bank B) |
| Pin 77 | I/O — User I/O pin (bank B) |
| Pin 78 | I/O — User I/O pin (bank B) |
| Pin 79 | I/O — User I/O pin (bank B) |
| Pin 80 | I/O — User I/O pin (bank B) |
| Pin 81 | I/O — User I/O pin (bank B) |
| Pin 82 | I/O — User I/O pin (bank B) |
| Pin 83 | GND — Ground |
| Pin 84 | VCC — 5.0 V core supply |
Typical Applications
EPF8282ALC84-2 is suitable for 6 applications: Industrial Glue Logic Replacement, Legacy Telecom Line-Card Interface, Military / Aerospace Retrofit Logic, Bus-Bridge and Protocol Converter, State Machine Consolidation, ASIC Replacement for Low-Volume Production.
Industrial Glue Logic Replacement
The EPF8282ALC84-2 fits industrial glue-logic replacement because its 2,500 usable gates and 208 flip-flops consolidate dozens of 74-series TTL parts (decoders, muxes, latches) onto a single 5.0 V SRAM-based device. The 68 user I/Os handle address/data bus buffering, chip-select decoding, and handshake logic between microprocessors and peripherals. FLEX 8000 ICR (in-circuit reconfigurability) lets field engineers update logic via JTAG without desoldering, critical for installed industrial PLCs and machine controllers where downtime is expensive.
Recommended
Legacy Telecom Line-Card Interface
Telecom line cards built in the late 1990s and early 2000s frequently use the EPF8282ALC84-2 to bridge TDM backplanes to framers and codecs. The 68 I/Os comfortably handle 8-bit parallel TDM buses plus framing, alarm, and clock-distribution signals. Its 5.0 V TTL I/O matches legacy line-card bus voltages directly, eliminating level-shifters. For long-life telecom platforms, FLEX 8000 is preferred over newer families because it preserves the original BOM and avoids requalification cycles on carrier-grade equipment.
Recommended
Military / Aerospace Retrofit Logic
The EPF8282ALC84-2 is widely used in military and aerospace retrofit programs where long-life-cycle support (15-25 years) outweighs the benefits of modern families. Its mature 0.42 micrometer CMOS process has well-characterized radiation and temperature behavior, and its 5.0 V core is robust against supply transients. The 84-pin PLCC with J-leads is also accepted on legacy avionics boards designed for through-hole-friendly sockets. Designers maintain FLEX 8000 designs to avoid re-qualifying flight hardware, and distributors stock inventory for defense maintenance channels.
Recommended
Bus-Bridge and Protocol Converter
The EPF8282ALC84-2 is well suited as a bus-bridge between microprocessors and peripherals using mismatched protocols (e.g., ISA-to-PC/104, VME-to-local bus, custom backplane-to-DSP). The 208 flip-flops handle FIFOs and handshaking registers, while 26 LABs implement the state machines and address-mapping logic. Its SRAM-based fabric allows late-stage bug fixes via in-system JTAG reprogramming, a key advantage over mask-programmed ASIC bridges that require respin for any logic change.
Recommended
State Machine Consolidation
Designers use the EPF8282ALC84-2 to consolidate multiple discrete PAL/GAL state machines into a single 5.0 V device, reducing board area and improving timing predictability. With 208 flip-flops and 26 LABs, it can host 8-12 independent Moore or Mealy state machines with up to 16 states each, alongside combinational glue. This is a common refactoring task on legacy boards where discrete PLDs have proliferated; consolidating into one FLEX 8000 part simplifies inventory, reduces power, and enables JTAG-driven in-system updates.
Recommended
ASIC Replacement for Low-Volume Production
For low-volume production (typically under 5,000 units annually), the EPF8282ALC84-2 replaces obsolete or end-of-life ASICs without NRE charges. Its 2,500-gate capacity maps to many mid-complexity ASIC designs, and the SRAM-based fabric allows per-unit personality changes (different configuration bitstreams for product variants). The 84-pin PLCC package supports both socketed prototyping and reflow assembly, simplifying transition from engineering to manufacturing. This use case is common in industrial instrumentation and specialty test equipment.
Recommended
Recommended Products Summary
Engineering reference data for EPF8282ALC84-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8282ALC84-3 | EPF8282ALC84-4 |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 84-pin LCC (J-Lead), PLCC-84 | 84-pin LCC (J-Lead), PLCC-84 - same | 84-pin LCC (J-Lead), PLCC-84 - same |
| Usable Gates | 2,500 | 2,500 | 2,500 |
| Logic Elements / FFs | 208 | 208 | 208 |
| LABs | 26 | 26 | 26 |
| User I/Os | 68 | 68 | 68 |
| Speed Grade | -2 (fastest) | -3 (~85% of -2 speed) | -4 (~70-80% of -2 speed) |
| Core Voltage | 5.0 V | 5.0 V | 5.0 V |
| Configuration | EPC1 / EPC1441 / JTAG | EPC1 / EPC1441 / JTAG | EPC1 / EPC1441 / JTAG |
| Lifecycle | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible speed-grade flexibility within FLEX 8000 family (vs EPF8282ALC84-3)
- Mature 0.42 micrometer CMOS process with long-term support channels (vs MAX 10 (modern replacement))
- JTAG-driven in-circuit reconfigurability via EPC1/EPC1441 (vs Discrete PAL/GAL state machines)
Design Notes
The EPF8282ALC84-2 requires a clean 5.0 V +/- 5% supply; per the FLEX 8000 datasheet, bulk decoupling of at least 22 uF tantalum plus 0.1 uF ceramic per VCC pin is recommended, plus a ferrite bead on the supply feed. In-circuit reconfigurability means the device draws surge currents during configuration; allow at least 100 mA headroom on the 5 V rail. Add a power-on reset supervisor (e.g., MAX811) tied to nCONFIG to ensure clean startup.
The 84-pin PLCC with J-leads has a 1.27 mm pitch; per Altera layout guidelines, keep all signal traces short, use a continuous ground plane on layer 2, and place the EPC1/EPC1441 configuration PROM within 50 mm of the FPGA's DCLK/DATA0 pins. JTAG chain integrity requires 10 kohm pull-ups on TMS and TDI to VCC, and a 10 kohm pull-down on TCK to GND, per the IEEE 1149.1 specification. The PLCC socket should be a low-profile through-hole type (e.g., 3M 8434) for field-replaceable assemblies.
Three common pitfalls with the EPF8282ALC84-2: (1) Forgetting the configuration PROM - the SRAM-based fabric has no on-chip non-volatile storage, so without an EPC1/EPC1441 the device will not function on power-up; (2) Mixing 5 V and 3.3 V signals without level-shifters - FLEX 8000 I/O is 5 V TTL-only; (3) Ignoring ICR timing - in-system JTAG reconfiguration requires nCONFIG held low during programming; failing to control nCONFIG can cause partial configuration and undefined behavior.
Compliance Information
Legacy Altera part pre-dating RoHS transition. RoHS/REACH compliance status not stated in distributor listings or the FLEX 8000 datasheet; original parts may be SnPb finish. AEC-Q100 not applicable (FPGA not automotive-qualified).
