EPF8452AQC160-3 - 4K-Gate FLEX 8000 FPGA, 160-PQFP | Altera
MPN: EPF8452AQC160-3 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.75 | $247.50 |
| 100 | $19.9 | $1,990.00 |
| 500 | $16.4 | $8,200.00 |
| 1,000 | $13.85 | $13,850.00 |
EPF8452AQC160-3 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing channels, and programmable I/O cells. Unlike an ASIC, an FPGA's logic and interconnections are defined by SRAM configuration bits loaded at power-up, allowing in-circuit reconfigurability. FPGAs sit at the top of the programmable logic hierarchy: PLD (programmable logic device) -> CPLD (complex PLD) -> FPGA. The FLEX 8000 family pioneered high-density, register-rich FPGA fabrics in the early/mid-1990s.
Key features of the EPF8452AQC160-3 include 42 Logic Array Blocks (LABs), 120 flip-flops, 68 user I/Os, in-circuit reconfigurability via SRAM configuration, JTAG support for boundary-scan testing, and built-in multi-volt I/O compatibility. The device supports Altera's MAX+plus II and Quartus design toolchains and can be configured from industry-standard parallel EPROMs or serial configuration devices (EPC1, EPC1064, EPC1213, EPC1441).
Architecturally, FLEX 8000 combines fine-grained look-up-table logic with continuous FastTrack interconnect, giving dense, predictable timing for glue-logic, bus-interface, and state-machine applications. The 5 V core and 5 V-tolerant I/O make the part compatible with TTL and CMOS 5 V logic families common in legacy industrial, telecom, and test-equipment designs. Operating temperature is 0 °C to 70 °C (commercial grade).
Typical applications include legacy bus-interface bridging, custom peripheral glue logic, industrial control boards, telecom backplane controllers, and test & measurement instrumentation that still depends on 5 V logic. Designers select the FLEX 8000 family when they need high register count and reconfigurability on a 5 V rail without migrating to a newer 3.3 V/2.5 V FPGA.
When designing with this part, allocate a configuration EPROM or Altera EPC1/EPC1441 device on the board and route JTAG TMS/TCK/TDO/TDI to a header for in-system programming. Decouple each VCC pin with 0.1 µF and 10 µF capacitors placed within 5 mm of the package. Avoid routing high-speed signals on adjacent layers under the PQFP to limit crosstalk.
This page synthesizes distributor pricing, drop-in FLEX 8000 alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers source and qualify the EPF8452AQC160-3 quickly.
Drop-in alternatives for EPF8452AQC160-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPF8452AQC160-3 (same form factor and footprint) — differing in Configuration Method, Package, Usable Gates, Process Technology, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPF8452AQC160-2
✅ Drop-In✓ In Stock
$23.85 / Unit
View Datasheet →EPF8452AQC160-3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPF8452AGC160-3
✅ Drop-In✓ In Stock
$23.1 / Unit
View Datasheet →EPF8452AGC160-3N
✅ Drop-In✓ In Stock
$64 / Unit
View Datasheet →EPF8452AQC160-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Usable Gates | 4,000 |
| Logic Cells / Elements | 336 |
| Logic Array Blocks (LABs) | 42 |
| Flip-Flops | 120 |
| User I/Os | 68 |
| Speed Grade | -3 |
| Technology Node | 0.42 µm CMOS |
| Supply Voltage | 5 V |
| Operating Temperature | 0 °C to +70 °C (Commercial) |
| Package | 160-pin PQFP (BQFP) |
| Configuration Method | SRAM, in-circuit reconfigurable |
| Configuration Devices | EPC1, EPC1064, EPC1213, EPC1441 |
| JTAG Support | Yes (boundary-scan) |
EPF8452AQC160-3 160-pin pqfp (bqfp) Pin Configuration Guide
Pin configuration for EPF8452AQC160-3 (160-pin pqfp (bqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8452AQC160-3.
Refer to the datasheet for full pin configuration.
Typical Applications
EPF8452AQC160-3 is suitable for 6 applications: Legacy 5 V Bus-Interface Bridge, Industrial PLC I/O Expander, Telecom Backplane Glue Logic, Test & Measurement Instrumentation Front-End, Automotive Aftermarket ECU Re-flashing Station, Custom Peripheral Controller for Embedded CPU Boards.
Legacy 5 V Bus-Interface Bridge
The EPF8452AQC160-3's 5 V tolerant I/O and 68 user I/Os make it a natural fit for bridging legacy 5 V peripheral buses (ISA, VME, parallel ATA) to modern controllers in industrial backplanes. Its 4,000 usable gates and 120 flip-flops are sufficient to implement address decoding, wait-state generation, and DMA arbitration in a single device. Designers place it between the 5 V peripheral bus and a downstream 3.3 V controller, using the FLEX 8000 I/O cells for level translation. Unlike a discrete 74-series glue-logic implementation, the FPGA allows field upgrades via SRAM reconfiguration without board rework.
Recommended
Industrial PLC I/O Expander
In a programmable-logic-controller chassis, the EPF8452AQC160-3 provides 68 user I/Os of 5 V-tolerant glue logic for input debouncing, output pulse generation, and isolated relay/SSR drivers. Its 42 LABs comfortably hold the state machines for encoder decoding, PWM output, and PID-loop pre-processing. The 5 V supply matches the legacy PLC backplane rails, avoiding the need for level shifters. The device's commercial 0-70 °C operating range suits most factory-floor enclosures. Compared to a CPLD, the FLEX 8000 offers more flip-flops (120) for dense state machines, and JTAG boundary-scan simplifies post-assembly in-circuit test.
Recommended
Telecom Backplane Glue Logic
Telecom backplanes from the late 1990s and early 2000s commonly deploy FLEX 8000 FPGAs as the per-slot glue between an H.110 CT-bus, TDM time-slot switch, and DSP/MIPS processor. The EPF8452AQC160-3's 4,000 gates handle time-slot interchange, framing, and HDLC/PPP framing/encoding with 120 flip-flops providing ample pipeline registers for byte-parallel TDM streams. Its 5 V I/O is directly compatible with 5 V backplane drivers. Engineers using it in maintenance boards of legacy systems rely on the part's documented longevity in service and ability to be re-configured in-circuit to patch logic bugs.
Recommended
Test & Measurement Instrumentation Front-End
Bench-top instruments such as logic analyzers, protocol exercisers, and waveform generators use FLEX 8000 FPGAs to capture or generate parallel digital patterns with deterministic timing. The EPF8452AQC160-3's 68 user I/Os provide a wide capture window, while the 120 flip-flops form deep sample-and-shift registers for 8- or 16-bit parallel acquisitions at the instrument's sample clock. The 5 V tolerance matches TTL/CMOS probe inputs. JTAG boundary-scan supports post-assembly fixture test. Engineers value the part for repeatable, in-circuit reconfigurable pattern generation when validating new DUTs.
Recommended
Automotive Aftermarket ECU Re-flashing Station
Although the EPF8452AQC160-3 itself is not AEC-Q100 qualified, it is widely deployed in off-vehicle ECU re-flashing and diagnostic stations in aftermarket garages. Its 68 user I/Os handle K-Line, CAN, J1850 VPW/PWM, and ISO-9141-2 interfaces simultaneously, with 42 LABs providing soft UART/SPI/I2C controllers and protocol decoders. Its 5 V I/O simplifies level shifting to 12 V vehicle buses via external transceivers. The SRAM-based fabric lets the station load different protocol stacks per vehicle without changing hardware.
Recommended
Custom Peripheral Controller for Embedded CPU Boards
Embedded CPU boards (x86, 68k, MIPS) commonly offload custom I/O to a companion FPGA. The EPF8452AQC160-3's 4,000 gates and 120 flip-flops host memory-mapped peripheral cores - UARTs, timers, GPIO banks, custom bus masters - that the CPU accesses over an address/data bus. Its 5 V I/O is compatible with 5 V CPU local buses and SRAM/ROM cycles. The 68 user I/Os expose enough pins for parallel bus plus peripheral signals. Engineers use the in-circuit reconfigurability of the SRAM fabric to fix bugs or add cores after board fab without re-spinning the PCB.
Recommended
Recommended Products Summary
Engineering reference data for EPF8452AQC160-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8452AQC160-2 | EPF8452AQC160-3N | EPF8452AGC160-3 | EPF8452AGC160-3N |
|---|---|---|---|---|---|
| Package | 160-PQFP (BQFP) | 160-PQFP - same | 160-PQFP - same | 160-PQFP - same | 160-PQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Logic Elements | 336 | 336 | 336 | 336 | 336 |
| Speed Grade | -3 (slowest commercial) | -2 (faster) | -3 | -3 | -3 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| User I/Os | 68 | 68 | 68 | 68 | 68 |
| Terminal Finish | SnPb (standard) | SnPb (standard) | Pb-free (lead-free) | SnPb (standard) | Pb-free (lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Cost-optimized slowest speed grade (-3) of the FLEX 8000 family (vs EPF8452AQC160-2)
- Standard SnPb terminal finish (AQC package code) (vs EPF8452AQC160-3N)
- Same 160-PQFP footprint across all FLEX 8000 8452 variants (vs Xilinx XC4005XL-PQ160)
Design Notes
Decouple every VCC and GND pair on the 160-pin PQFP with a 0.1 µF ceramic plus a bulk 10 µF tantalum or ceramic placed within 5 mm of the package. The FLEX 8000 family datasheet specifies multiple VCC pins around the PQFP perimeter to suppress simultaneous-switching noise (SSN) from the 68 I/O drivers. Place input and output capacitors symmetrically so no logic pin is more than one trace length from a decoupling cap. Estimated: with 68 I/O at 5 V TTL driving 25 pF loads toggling at 25 MHz, dynamic current can reach 200 mA - the bulk 10 µF handles this transient while 0.1 µF supplies instantaneous charge.
Route the JTAG chain (TMS, TCK, TDI, TDO) as a daisy chain with no stubs, and place a 4.7 kΩ pull-up on TCK per IEEE 1149.1. The 160-pin PQFP has generous lead pitch (0.65 mm typical for BQFP), so 8 mil traces between PQFP and the configuration EPROM are achievable on a 4-layer FR-4 board. Keep the configuration EPROM within 50 mm of the FPGA to avoid signal-integrity issues on DCLK and DATA0.
Do not leave nCONFIG floating - tie it to VCC through a 10 kΩ pull-up and provide a push-button to ground for manual re-configuration. CONF_DONE must be pulled high by an external 4.7 kΩ resistor to VCC so the FPGA indicates successful configuration completion to downstream circuitry. nSTATUS similarly requires a 4.7 kΩ pull-up. Forgetting these pulls is the single most common cause of 'bricked' FLEX 8000 boards after a brown-out.
Compliance Information
EPF8452AQC160-3 uses SnPb (tin-lead) terminal finish and is RoHS non-compliant by exemption. The EPF8452AQC160-3N variant provides a Pb-free finish for RoHS compliance. Not AEC-Q100 qualified - not suitable for new automotive designs. REACH, halogen-free, and conflict-minerals compliance status not explicitly published by Altera/Intel for this legacy part.
