EPM240F100C4N - MAX II 192 Macro Cell CPLD, 4.7ns, 100-FBGA | Intel
MPN: EPM240F100C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.05 | $12.05 |
| 10 | $10.85 | $108.50 |
| 100 | $9.4 | $940.00 |
| 500 | $8.2 | $4,100.00 |
| 1,000 | $7.05 | $7,050.00 |
EPM240F100C4N Overview
A Complex Programmable Logic Device (CPLD) is a non-volatile, deterministic-latency logic IC that sits between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy. CPLDs use flash or EPROM configuration cells and a classic AND/OR PLA-style macro structure to provide predictable propagation delays independent of routing complexity, making them ideal for I/O expansion, bus bridging, and power-up control tasks that must execute before a host processor or FPGA boots.
Key features of the EPM240F100C4N include 192 logic elements, 80 user I/Os, 4.7 ns tPD (commercial speed grade C4), in-system programmability via JTAG, and a multi-voltage I/O bank that supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on the same die. The MAX II architecture eliminates external configuration memory, reducing BOM cost and PCB footprint versus traditional SRAM-based CPLDs that require a boot PROM.
Technically, the MAX II family uses a homogeneous Logic Array Block (LAB) fabric with each macro cell containing a programmable AND/OR term array and a flip-flop. The on-chip User Flash Memory (UFM) block can store up to 8 Kbits of user data, enabling embedded serial EEPROM replacement. The 100-ball FineLine BGA measures 11 mm × 11 mm with a 1.0 mm ball pitch, balancing routability with manufacturability for mainstream boards.
Typical applications include I/O expansion and level translation in industrial control, glue logic and bus decoding around processors and FPGAs, power-sequencer controllers, LED and display driving, and communication interface bridging (UART, SPI, I²C). The instant-on behavior also suits safety-critical deterministic start-up logic in automotive subsystems and medical devices.
When designing with this device, allocate decoupling capacitance within 5 mm of each supply pin, observe the I/O bank voltage constraints, and respect JTAG chain ordering when multiple programmable devices share a single download cable. The commercial C4 speed grade is the fastest available for the 100-FBGA package and is appropriate for general-purpose logic consolidation.
Drop-in alternatives for EPM240F100C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM240F100C4N (same form factor and footprint) — differing in Operating Temperature, Package, Programming Interface, RoHS Status, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240F100C5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM240F100C3N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM570F100C4N
✅ Drop-In✓ In Stock
$14.32 / Unit
View Datasheet →EPM240F100I5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM1270F256C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.2 / Unit
View Datasheet →EPM240F100C4N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Device Family | CPLD - Complex Programmable Logic Device |
| Macro Cells | 192 |
| Logic Elements | 240 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 4.7 ns |
| Maximum Internal Frequency | 247.5 MHz |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| I/O Bank Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 µm Flash |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| User Flash Memory (UFM) | 8 Kbit |
| Package | 100-ball FineLine BGA (FBGA), 11 mm × 11 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Speed Grade | C4 (fastest) |
| Programming Interface | JTAG (IEEE 1149.1) |
| RoHS Status | Compliant (lead-free) |
EPM240F100C4N 100-ball fineline bga (fbga), 11 mm × 11 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPM240F100C4N (100-ball fineline bga (fbga), 11 mm × 11 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM240F100C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM240F100C4N is suitable for 6 applications: I/O Expansion and Level Translation, Power-Sequencer and Reset Controller, Industrial Bus Bridging (UART/SPI/I²C), FPGA Configuration and Glue Logic, LED Matrix and Display Driver, Automotive Subsystem Deterministic Logic.
I/O Expansion and Level Translation
The EPM240F100C4N's 80 user I/Os and multi-voltage I/O banks (1.5/1.8/2.5/3.3 V) make it an ideal I/O expander and level translator between processors, sensors, and legacy peripherals. Each I/O bank can be powered independently, so a 1.8 V MCU can communicate with 3.3 V peripherals and 5 V-tolerant legacy devices without external level-shift ICs. The 4.7 ns tPD keeps glue-logic latency well below typical MCU interrupt response times. Designers place the CPLD between the processor bus and the peripheral cluster, using macro cells to encode/decode chip selects and bus protocols.
Recommended
Power-Sequencer and Reset Controller
The MAX II's instant-on non-volatile flash configuration makes the EPM240F100C4N a deterministic power-sequencer for multi-rail systems. Macro cells implement cascaded timers and watchdog logic that hold the host processor in reset until all rails are within tolerance, then sequence FPGA, ASIC, and memory power-up in the required order. The 247.5 MHz internal frequency supports fine-grained timing resolution, while the 8 Kbit User Flash Memory stores rail configuration parameters. Unlike an MCU-based sequencer, the CPLD has no firmware boot window and starts valid logic microseconds after VCC stabilizes.
Recommended
Industrial Bus Bridging (UART/SPI/I²C)
Industrial systems routinely bridge UART, SPI, and I²C buses between incompatible voltage domains and packet formats. The EPM240F100C4N's 80 I/Os and 4.7 ns tPD handle multi-master arbitration, CRC generation, and protocol translation without software round-trip latency. The 2.5 V/3.3 V core plus 1.5-3.3 V I/O banks connect legacy RS-485 transceivers, modern 1.8 V SoCs, and 3.3 V sensors on the same board. The instant-on behavior ensures bus bridges are live before the host CPU boots, simplifying bring-up.
Recommended
FPGA Configuration and Glue Logic
FPGA-based designs often need a CPLD companion to perform housekeeping before the FPGA finishes SRAM configuration. The EPM240F100C4N drives FPGA configuration mode pins, holds the FPGA in PROG_B, monitors DONE, and routes peripheral chips-selects during the FPGA's boot window. Its 192 macro cells easily hold the configuration state machine plus several decoded chip-selects, and the 4.7 ns tPD aligns with FPGAs that need sub-10 ns peripheral access latency at first power-up. The JTAG chain supports in-system programming of both the CPLD and the FPGA in one boundary-scan session.
Recommended
LED Matrix and Display Driver
The EPM240F100C4N's 80 user I/Os and 247.5 MHz internal frequency make it a flexible LED matrix driver for commercial signage and industrial HMIs. Each macro cell implements one row/column PWM channel with refresh logic, and the on-chip UFM stores lookup tables for animations, gamma correction, and font data. The instant-on flash-based configuration means the display lights up the moment power is applied - critical for safety signage and emergency information panels. Designers pair the CPLD with external constant-current drivers for high-brightness LED arrays.
Recommended
Automotive Subsystem Deterministic Logic
Although the EPM240F100C4N is a commercial-grade part, it is widely used as deterministic glue logic in non-safety automotive subsystems such as body controllers, infotainment I/O hubs, and instrument-cluster pre-processors. The MAX II architecture provides predictable tPD across all operating conditions, enabling sensor-fusion pre-processing and CAN/LIN bus gating without software variability. Designers needing full AEC-Q100 qualification select the EPM240F100I5N industrial-temp variant in the same footprint. The 8 Kbit UFM stores calibration constants that are read at every power-up.
Recommended
Recommended Products Summary
Engineering reference data for EPM240F100C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240F100C5N | EPM240F100C3N | EPM570F100C4N | EPM240F100I5N | EPM1270F256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 100-ball FineLine BGA (11x11 mm) | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 256-ball FineLine BGA - same family, larger |
| Macro Cells | 192 | 192 | 192 | 440 | 192 | 980 |
| Logic Elements | 240 | 240 | 240 | 570 | 240 | 1270 |
| User I/Os | 80 | 80 | 80 | 76 | 80 | 212 |
| tPD (Propagation Delay) | 4.7 ns | ~5.0 ns | ~6.5 ns | 5.4 ns | ~5.5 ns | 6.2 ns |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
Key Differentiators
- Fastest commercial speed grade in the MAX II family (vs EPM240F100C5N)
- Higher logic density than the C5/C3 siblings (vs EPM240F100C5N)
- Same density as EPM570 family but faster timing closure (vs EPM570F100C4N)
Design Notes
Estimated: at typical 50% toggle rate on 80 I/Os at 100 MHz, the 3.3 V core draws roughly 30-50 mA. Place one 0.1 µF X7R decoupling capacitor within 5 mm of every VCCINT/VCCIO supply ball, and add a bulk 10 µF tantalum or ceramic cap near the package. The MAX II datasheet recommends separate analog and digital ground returns joined at a single point under the package to reduce SSO noise.
The 100-ball FineLine BGA uses a 1.0 mm pitch, which is well within the capability of standard 4/4 mil (0.1/0.1 mm) PCB manufacturing. Use microvias-in-pad if the board stack-up budget allows; otherwise dog-bone fan-out to inner signal layers. Per the MAX II handbook, route JTAG signals (TDO, TDI, TMS, TCK) with 50 Ω characteristic impedance and keep total chain length under 6 inches to avoid signal-integrity issues across the IEEE 1149.1 boundary-scan interface.
Do not mix I/O bank voltages on the same bank - the MAX II datasheet requires all I/Os in a single bank to share one VCCIO rail. Configure unused I/Os as outputs driving low or as inputs with internal pull-ups enabled to prevent floating-pin supply current. The C4 speed grade is the fastest commercial grade; if your design has timing margin, drop to C5 to gain 5-10% cost savings without changing the PCB footprint.
Compliance Information
RoHS-compliant per distributor listings (lead-free FBGA). Commercial temperature grade; choose EPM240F100I5N for industrial-temperature requirements. No AEC-Q100 qualification - not recommended for safety-critical automotive subsystems.
