EPM240F100I5 - 192 Macrocell MAX II CPLD, 4.7ns, 100-FBGA | Altera
MPN: EPM240F100I5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.93 | $10.93 |
| 10 | $10.39 | $103.90 |
| 100 | $9.84 | $984.00 |
| 500 | $9.3 | $4,650.00 |
| 1,000 | $8.74 | $8,740.00 |
EPM240F100I5 Overview
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-style macrocell blocks on a single chip. CPLDs sit in the programmable logic hierarchy above discrete glue logic but below FPGAs: CPLD -> programmable logic -> logic IC -> integrated circuit. MAX II CPLDs replaced older EEPROM-based architectures with flash-based configuration, eliminating the external configuration PROM and providing instant-on behavior with zero standby current.
Key features include MultiVolt I/O support (1.5V, 1.8V, 2.5V, 3.3V interfaces), enhanced in-system programmability (ISP) via JTAG, a built-in User Flash Memory (UFM) block of 8 Kbits for non-logic data storage, and support for hot-socketing. The I5 speed grade denotes an industrial temperature range of -40 °C to +100 °C junction, and the F100 package is the 100-ball FineLine BGA (FBGA-100, 10x10 mm, 1.0 mm pitch).
Technically, the EPM240F100I5 contains four Logic Array Blocks (LABs) of 16 macrocells each, an interconnect network known as the FastTrack, and dedicated input/output registers. Total user I/O is 80 pins, sufficient for replacing several discrete 74-series logic devices or for use as a flexible I/O expander and bus interface bridge in industrial, communications, and consumer designs.
Typical applications include I/O expansion and voltage translation between incompatible logic families, bus bridging (for example SPI-to-I2C, UART glue logic), power-sequencer controllers, LED driving and display multiplexers, configuration logic for larger FPGAs, and general-purpose glue-logic replacement in industrial control, telecommunications, and consumer electronics.
When designing with this part, note that the I5 suffix specifies an industrial temperature grade; choose the C5 (commercial, 0 °C to +85 °C) variant for cost-sensitive non-industrial designs, or step up to the EPM240F100C5N for lead-free commercial volume. Always observe 1.0 mm BGA PCB layout rules and provide JTAG test access for ISP programming.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not aggregated on any single manufacturer or distributor page, giving engineers a single decision-ready view of the EPM240F100I5.
Drop-in alternatives for EPM240F100I5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EPM240F100I5 (same form factor and footprint) — differing in Mounting Type, Configuration Memory, Package, Programming Interface, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240F100I5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM240F100C5N
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →EPM240F100C4N
✅ Drop-In✓ In Stock
$7.05 / Unit
View Datasheet →EPM240F100I5 Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 240 |
| Macrocells | 192 |
| User I/O Count | 80 |
| Pin-to-Pin Logic Delay | 4.7 ns |
| User Flash Memory (UFM) | 8 Kbit |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Number of Logic Array Blocks (LABs) | 4 |
| Architecture | Non-volatile, instant-on, flash-based |
| Supply Voltage - Core | 3.0 V to 3.6 V (typical 3.3 V) |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Programming Interface | JTAG (IEEE 1149.1), enhanced ISP |
| Operating Temperature Range | -40 °C to +100 °C (industrial, I5 grade) |
| Package | 100-ball FineLine BGA (FBGA-100), 10x10 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount (SMD/SMT) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| MSL Level | 3 (168 hours) |
EPM240F100I5 100-ball fineline bga (fbga-100), 10x10 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EPM240F100I5 (100-ball fineline bga (fbga-100), 10x10 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM240F100I5.
Refer to the datasheet for full pin configuration.
Typical Applications
EPM240F100I5 is suitable for 6 applications: I/O Expansion and Voltage Translation, Bus Bridging and Glue Logic, Power Sequencing and Supervisor Logic, LED Driving and Display Multiplexing, FPGA Configuration and Control Logic, Industrial Control and Factory Automation.
I/O Expansion and Voltage Translation
The EPM240F100I5 provides 80 user I/Os with MultiVolt support for 1.5V, 1.8V, 2.5V, and 3.3V interfaces, making it a flexible I/O expander and voltage translator between incompatible logic domains. In a typical application, the device sits between a low-voltage host processor (e.g., a 1.8V SoC) and legacy 3.3V or 5V-tolerant peripherals, performing level shifting and protocol adaptation in a single non-volatile chip. Unlike discrete level shifters, the CPLD approach lets designers re-map pin assignments and protocols via JTAG reprogramming, eliminating hardware respins. The 4.7 ns propagation delay is more than adequate for I2C, SPI, UART, and GPIO expansion tasks.
Recommended
Bus Bridging and Glue Logic
The EPM240F100I5's 192 macrocells, 240 logic elements, and 4.7 ns pin-to-pin delay make it a strong fit for bus-bridging tasks - for example SPI-to-I2C, UART-to-parallel, or custom protocol conversion in industrial gateways. Designers can implement state machines, FIFOs, and protocol converters in a single low-power non-volatile device, replacing 5-15 discrete 74F/A logic chips. The MAX II family's instant-on behavior also makes it suitable for boot-loader assist logic that must be live before the main SoC configures.
Recommended
Power Sequencing and Supervisor Logic
The EPM240F100I5 is widely used as a multi-rail power sequencer in telecom, networking, and server boards. With 80 I/Os and 192 macrocells, it can monitor up to 16-20 voltage rails via PG/FLG signals and assert enable lines in a programmable sequence with user-defined timing. The non-volatile, instant-on behavior guarantees deterministic sequencing at every power-up, regardless of SoC firmware state. The integrated 8-Kbit UFM can store board revision IDs and sequencing profiles, eliminating an external EEPROM.
Recommended
LED Driving and Display Multiplexing
In LED panels, signage, and character/segment displays, the EPM240F100I5 acts as a scan-matrix driver and brightness controller. Its 80 I/Os can refresh an 8x40 LED matrix with PWM-controlled brightness per row or column, while the 4.7 ns delay supports high refresh rates for flicker-free operation. The 3.3 V core combined with MultiVolt I/O allows direct drive of common-cathode LED arrays without external level shifters, reducing BOM cost and PCB area versus discrete shift-register chains.
Recommended
FPGA Configuration and Control Logic
The EPM240F100I5 is commonly used as a companion CPLD to control configuration of larger SRAM-based FPGAs, manage multi-FPGA bitstream loading, route JTAG chains, and handle housekeeping tasks such as clock muxing and reset distribution. The non-volatile, instant-on behavior ensures the FPGA configuration logic is live before the FPGA begins its own configuration sequence. The 100-FBGA footprint keeps the companion device compact, freeing board area for the main FPGA.
Recommended
Industrial Control and Factory Automation
In factory automation, motor controllers, and PLC front-ends, the EPM240F100I5's industrial -40 °C to +100 °C temperature grade, 192 macrocells, and MultiVolt I/O make it suitable for encoder interfacing, PWM generation, and deterministic control loops. Designers can implement Modbus, CAN, or proprietary fieldbus glue logic with deterministic timing, while the non-volatile configuration survives factory-floor ESD events and brown-outs. The 100-FBGA package with 1.0 mm pitch supports compact industrial PCBs with high component density.
Recommended
Recommended Products Summary
Engineering reference data for EPM240F100I5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240F100I5N | EPM240F100C5N | EPM240F100C4N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-FBGA (FineLine BGA, 10x10 mm, 1.0 mm pitch) | 100-FBGA - same | 100-FBGA - same | 100-FBGA - same |
| Macrocells | 192 | 192 | 192 | 192 |
| Logic Elements | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| User I/O Count | 80 | 80 | 80 | 80 |
| RoHS / Lead-Free | Compliant (I5 base; lead-free 'N' variant available) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
Key Differentiators
- Pin-compatible lead-free variant available (vs EPM240F100I5N)
- Industrial temperature grade preserved across alternatives (vs EPM240F100C5N)
- Same-package migration within MAX II family (vs EPM1270F256I5N)
Design Notes
The 100-ball FineLine BGA uses 1.0 mm ball pitch on a 10x10 mm body. Per IPC-7351 and Altera layout guidelines, use Non-Solder Mask Defined (NSMD) pads with ENIG or OSP surface finish, microvia-in-pad if using HDI stack-up, and a 4-layer minimum PCB with continuous ground plane beneath the BGA for power integrity and thermal dissipation. Place 0.1 µF + 10 µF decoupling caps within 5 mm of each power pin pair.
Do not substitute the EPM240F100I5 with EPM240T100C5N or EPM240GT100C5N on the same PCB - those use TQFP-100, not FBGA-100, and have different footprints. Choose the FBGA-100 'F' variants only when migrating within the same package family. For lead-free production, explicitly use the 'N'-suffix parts (e.g., EPM240F100I5N) to ensure RoHS compliance.
The EPM240F100I5 supports MultiVolt I/O on a per-bank basis. When mixing 1.5V, 1.8V, 2.5V, and 3.3V interfaces, group I/Os by bank and supply each bank VCCIO from the appropriate rail. Series-terminate outputs driving >50 mm traces or >50 pF loads. The 4.7 ns tPD allows 50-100 MHz operation on short controlled-impedance traces; for higher speeds, route to the closest adjacent pins to minimize interconnect delay.
Estimated: at 3.3 V core, 80 I/Os switching at 10 MHz with 10 pF loads, dynamic power is approximately 80 × 10 MHz × 10 pF × 3.3 V² ≈ 87 mW. The FBGA-100 theta_JA is roughly 30-40 °C/W on a 4-layer PCB, giving a junction-temperature rise of only 3-4 °C above ambient - well within the industrial 100 °C limit. For sealed enclosures with no airflow, derate I/O switching frequency or add thermal vias under the center balls.
Compliance Information
RoHS/REACH compliance per Altera/Intel product page. The I5 base part may contain lead; the 'N'-suffix variant (EPM240F100I5N) is the lead-free RoHS option. AEC-Q100 not applicable for non-automotive CPLD line.
