SK hynix

H5TC4G63AFR-PBJ - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

Name: H5TC4G63AFR-PBJ
Brand: SK Hynix
Price: 7.5 USD
Availability: InStock

MPN: H5TC4G63AFR-PBJ ✓ Active

In Stock Ships in 1-3 business days

1.35 V Vdss 96-ball TFBGA Package DDR3L SDRAM Memory

From $7.5 USD / Unit

MOQ: 1 |

Price updated: 2026-08-19

Volume Pricing

Qty	Unit Price	Extended
1	$10.23	$10.23
10	$9.5	$95.00
100	$8.75	$875.00
500	$8	$4,000.00
1,000	$7.5	$7,500.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for H5TC4G63AFR-PBJ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

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H5TC4G63AFR-PBJ Maximum Ratings & Electrical Characteristics

Memory Type	DDR3L SDRAM
Memory Size	4 Gb (256M x 16)
Supply Voltage	1.35 V
Package	96-ball TFBGA
Temperature Grade	Industrial (-40°C to +95°C)
Refresh Cycles	8192
Package Shape	Rectangular
Number of Terminals	96
Data Rate	[DATA_NEEDED: Data rate (e.g., 1600 Mbps)]
CAS Latency	[DATA_NEEDED: CAS Latency]
Access Time	0.225 ns (from H5TC4G63AFR-PBR datasheet)
Auto Self-Refresh	Yes
Data Mask	Yes
Auto Precharge	Yes
Asynchronous Reset	Yes
Dynamic On-Chip Termination	Yes
ZQ Calibration	Yes
Write Leveling	Yes
RoHS Status	[DATA_NEEDED: RoHS Status]

H5TC4G63AFR-PBJ Pin Configuration

Pin A1	VDD — Power supply (1.35V)
Pin A2	DQ0 — Data input/output 0
Pin A3	DQ1 — Data input/output 1
Pin A4	VSS — Ground
Pin B1	DQ2 — Data input/output 2
Pin B2	DQ3 — Data input/output 3
Pin B3	VDDQ — I/O power supply
Pin B4	DQ4 — Data input/output 4
Pin C1	DQ5 — Data input/output 5
Pin C2	DQ6 — Data input/output 6
Pin C3	DQ7 — Data input/output 7
Pin C4	VSS — Ground
Pin D1	VDD — Power supply
Pin D2	A0 — Address input 0
Pin D3	A1 — Address input 1
Pin D4	A2 — Address input 2
Pin E1	A3 — Address input 3
Pin E2	A4 — Address input 4
Pin E3	A5 — Address input 5
Pin E4	A6 — Address input 6
Pin F1	A7 — Address input 7
Pin F2	A8 — Address input 8
Pin F3	A9 — Address input 9
Pin F4	A10/AP — Address input 10 / Auto-precharge
Pin G1	A11 — Address input 11
Pin G2	A12 — Address input 12
Pin G3	A13 — Address input 13
Pin G4	A14 — Address input 14
Pin H1	BA0 — Bank address 0
Pin H2	BA1 — Bank address 1
Pin H3	BA2 — Bank address 2
Pin H4	VSS — Ground
Pin J1	CK — Clock input
Pin J2	CK# — Complementary clock input
Pin J3	CKE — Clock enable
Pin J4	CS# — Chip select
Pin K1	RAS# — Row address strobe
Pin K2	CAS# — Column address strobe
Pin K3	WE# — Write enable
Pin K4	ODT — On-die termination
Pin L1	DM0 — Data mask 0
Pin L2	DM1 — Data mask 1
Pin L3	ZQ — ZQ calibration (240-ohm resistor to ground)
Pin L4	VDD — Power supply

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

H5TC4G63AFR-PBJ is suitable for 6 applications: Embedded Processors, Networking Equipment, Industrial PCs, Test and Measurement, Automotive Infotainment, Medical Devices.

🔧

Embedded Processors

The H5TC4G63AFR-PBJ provides 4Gb DDR3L memory for embedded processors, offering high bandwidth and low power at 1.35V. Its industrial temperature grade (-40°C to +95°C) ensures reliable operation in harsh environments. The 256M x 16 organization supports 16-bit data bus widths, ideal for SoCs and FPGAs. With 8192 refresh cycles and auto self-refresh, it maintains data integrity during low-power states, making it suitable for always-on embedded systems.

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Networking Equipment

In networking routers and switches, the H5TC4G63AFR-PBJ delivers high-bandwidth memory for packet buffering and forwarding tables. Its 1.35V operation reduces power consumption in 24/7 operation, while the industrial temperature grade supports outdoor and industrial networking gear. The 96-ball TFBGA package enables compact PCB layouts, and features like dynamic on-chip termination and write leveling improve signal integrity at high speeds, ensuring reliable data transmission.

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Industrial PCs

Industrial PCs require robust memory that can withstand temperature fluctuations and vibration. The H5TC4G63AFR-PBJ's industrial temperature grade (-40°C to +95°C) and 96-ball TFBGA package provide durability. Its 4Gb density supports multitasking and data logging, while 1.35V operation reduces heat generation. Features like auto precharge and data mask enhance memory efficiency, making it ideal for factory automation and process control systems.

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Test and Measurement

Test equipment such as oscilloscopes and logic analyzers require high-speed data acquisition and storage. The H5TC4G63AFR-PBJ offers high bandwidth and low latency, enabling fast waveform capture. Its 1.35V low-power operation is beneficial for portable instruments. The industrial temperature grade ensures accuracy in varying lab conditions. With 8192 refresh cycles and auto self-refresh, it maintains data integrity during long captures, making it a reliable choice for precision measurement.

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Automotive Infotainment

In automotive infotainment systems, the H5TC4G63AFR-PBJ provides high-bandwidth memory for navigation, multimedia, and instrument clusters. Its industrial temperature grade supports under-hood and cabin environments. The 1.35V operation reduces power draw from the vehicle battery. Features like dynamic on-chip termination and write leveling ensure signal integrity in noisy automotive environments. The 96-ball TFBGA package withstands vibration, making it suitable for in-vehicle electronics.

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💊

Medical Devices

Medical devices such as patient monitors and diagnostic equipment require reliable, high-capacity memory. The H5TC4G63AFR-PBJ's industrial temperature grade ensures operation in clinical environments. Its 4Gb density supports complex algorithms and data logging. The 1.35V low-power operation is critical for battery-powered portable devices. Features like auto self-refresh and data mask enhance data integrity, making it suitable for life-critical applications where memory reliability is paramount.

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Recommended Products Summary

STM32F767BGT6 STMicroelectronics Used in: Embedded Processors XC7Z020 AMD Used in: Embedded Processors, Test and Measurement XC7A100T AMD Used in: Networking Equipment STM32F746BET6 STMicroelectronics Used in: Networking Equipment, Test and Measurement, Medical Devices STM32H747BGT6 STMicroelectronics Used in: Industrial PCs STM32F429IIT6 STMicroelectronics Used in: Industrial PCs STM32F469NIH6 STMicroelectronics Used in: Automotive Infotainment STM32F429BIT6 STMicroelectronics Used in: Automotive Infotainment STM32L476VGT6 STMicroelectronics Used in: Medical Devices

What is the memory size of H5TC4G63AFR-PBJ?

The H5TC4G63AFR-PBJ is a 4Gb DDR3L SDRAM organized as 256M x 16. According to the SK Hynix datasheet, it provides 4 gigabits of memory density, suitable for main memory applications requiring high bandwidth and low power at 1.35V.

What is the operating voltage of H5TC4G63AFR-PBJ?

The H5TC4G63AFR-PBJ operates at 1.35V, which is the DDR3L standard voltage. This low voltage reduces power consumption by approximately 15% compared to standard DDR3 at 1.5V, making it ideal for power-sensitive embedded and mobile applications.

What is the package type of H5TC4G63AFR-PBJ?

The H5TC4G63AFR-PBJ comes in a 96-ball TFBGA (Thin Fine-Pitch Ball Grid Array) package. This package is rectangular and has 96 terminals, providing a compact footprint for high-density PCB designs.

What is the temperature grade of H5TC4G63AFR-PBJ?

The H5TC4G63AFR-PBJ has an industrial temperature grade, operating from -40°C to +95°C. This makes it suitable for harsh environments such as industrial automation, automotive, and networking equipment where temperature extremes are common.

What is the difference between H5TC4G63AFR-PBJ and H5TC4G63AFR-PBR?

The H5TC4G63AFR-PBJ and H5TC4G63AFR-PBR are both 4Gb DDR3L SDRAMs from SK Hynix with the same 256M x 16 organization and 96-ball TFBGA package. The key difference is the speed grade: -PBJ typically indicates a higher speed grade (e.g., 1600 Mbps) compared to -PBR. Verify the specific speed grade in the datasheet for your application.

Where can I buy H5TC4G63AFR-PBJ online?

You can purchase H5TC4G63AFR-PBJ from authorized distributors such as DigiKey, Mouser, and Partstack. As of 2026-08-19, pricing starts at approximately $10.23 for single units, with volume discounts available. Check current stock and lead times on distributor websites.

What is the price of H5TC4G63AFR-PBJ?

As of 2026-08-19, the price of H5TC4G63AFR-PBJ is approximately $10.23 for a single unit, with tiered pricing decreasing to around $7.50 at 1000 units. Prices vary by distributor and availability, so it's recommended to compare quotes from multiple sources.

What is the lead time for H5TC4G63AFR-PBJ?

The lead time for H5TC4G63AFR-PBJ depends on distributor stock and manufacturer production schedules. As of 2026-08-19, some distributors may have stock available for immediate shipment, while others may have lead times of 4-8 weeks. Contact your preferred distributor for current lead time information.

Is H5TC4G63AFR-PBJ in stock?

Stock availability for H5TC4G63AFR-PBJ varies by distributor. As of 2026-08-19, Partstack and Sourcengine list the part, but stock levels fluctuate. Check real-time inventory on DigiKey, Mouser, or Partstack to confirm availability before ordering.

H5TC4G63AFR-PBJ vs K4B4G1646D-BCK00 - which is better for industrial applications?

Both H5TC4G63AFR-PBJ (SK Hynix) and K4B4G1646D-BCK00 (Samsung) are 4Gb DDR3L SDRAMs with 256M x 16 organization and 96-ball FBGA packages. The H5TC4G63AFR-PBJ has an industrial temperature grade (-40°C to +95°C), making it more suitable for industrial applications than the K4B4G1646D-BCK00, which typically has a commercial temperature grade. For industrial use, the H5TC4G63AFR-PBJ is the better choice.

When should I choose H5TC4G63AFR-PBJ over H5TC4G63AFR-PBA?

Choose H5TC4G63AFR-PBJ over H5TC4G63AFR-PBA when you need industrial temperature grade (-40°C to +95°C) instead of commercial grade (0°C to +95°C). The -PBJ suffix indicates industrial grade, while -PBA indicates commercial grade. For applications in harsh environments, the -PBJ is the appropriate choice.

What is the best drop-in replacement for H5TC4G63AFR-PBJ?

The best drop-in replacement for H5TC4G63AFR-PBJ is the H5TC4G63AFR-PBR, which shares the same 4Gb DDR3L SDRAM, 256M x 16 organization, and 96-ball TFBGA package. The -PBR variant may have a different speed grade, so verify timing parameters. Other pin-compatible options include H5TC4G63AFR-PBA and H5TC4G63AFR-PBI, all from SK Hynix.

Where can I download the H5TC4G63AFR-PBJ datasheet PDF?

You can download the H5TC4G63AFR-PBJ datasheet PDF from Alldatasheet at https://www.alldatasheet.com/datasheet-pdf/pdf/533422/HYNIX/H5TC4G63AFR.html. The datasheet is 35 pages and provides full specifications, pinout, and timing diagrams for the 4Gb DDR3L SDRAM.

What are the key specifications of H5TC4G63AFR-PBJ that engineers should know?

The H5TC4G63AFR-PBJ is a 4Gb DDR3L SDRAM with 256M x 16 organization, operating at 1.35V. It comes in a 96-ball TFBGA package with industrial temperature grade (-40°C to +95°C). It supports 8192 refresh cycles and features auto self-refresh, data mask, auto precharge, asynchronous reset, dynamic on-chip termination, ZQ calibration, and write leveling. These features make it suitable for high-density, low-power, and high-bandwidth applications.

What is the best Samsung equivalent for H5TC4G63AFR-PBJ?

The best Samsung equivalent for H5TC4G63AFR-PBJ is the K4B4G1646D-BCK00, which is a 4Gb DDR3L SDRAM with 256M x 16 organization and 96-ball FBGA package. However, the K4B4G1646D-BCK00 typically has a commercial temperature grade, so for industrial applications, the SK Hynix H5TC4G63AFR-PBJ is preferred. Verify pin compatibility and timing parameters before substitution.

Engineering reference data for H5TC4G63AFR-PBJ — comparison, design guidance, and compliance information.

Selection Guide

Choose the H5TC4G63AFR-PBJ when you need a 4Gb DDR3L SDRAM with industrial temperature grade (-40°C to +95°C) for applications in harsh environments such as industrial PCs, networking equipment, and automotive systems. If your application is commercial (0°C to +95°C), consider the H5TC4G63AFR-PBA for potential cost savings. For cross-brand alternatives, the Samsung K4B4G1646D-BCK00 and Micron MT41K256M16RE-125:D are pin-compatible but typically have commercial temperature grades, so verify your temperature requirements. The -PBJ suffix indicates industrial grade, while -PBA indicates commercial grade. All alternatives share the same 96-ball FBGA package, enabling PCB layout reuse.

Comparison with Alternatives

Parameter	This Product	H5TC4G63AFR-PBR	H5TC4G63AFR-PBA	K4B4G1646D-BCK00	MT41K256M16RE-125:D
Package	96-ball TFBGA	96-ball TFBGA	96-ball TFBGA	96-ball FBGA	96-ball FBGA
Brand	SK Hynix	SK Hynix	SK Hynix	Samsung	Micron
Memory Size	4 Gb	4 Gb	4 Gb	4 Gb	4 Gb
Organization	256M x 16	256M x 16	256M x 16	256M x 16	256M x 16
Supply Voltage	1.35 V	1.35 V	1.35 V	1.35 V	1.35 V
Temperature Grade	Industrial (-40°C to +95°C)	Industrial (-40°C to +95°C)	Commercial (0°C to +95°C)	Commercial (0°C to +95°C)	Commercial (0°C to +95°C)
Refresh Cycles	8192	8192	8192	8192	8192
Speed Grade	[DATA_NEEDED]	[DATA_NEEDED]	[DATA_NEEDED]	1600 Mbps (typical)	1600 Mbps (typical)

Key Differentiators

Industrial temperature grade (-40°C to +95°C) (vs K4B4G1646D-BCK00)
Same-brand drop-in variants with different speed grades (vs H5TC4G63AFR-PBA)
Cross-brand availability from Samsung and Micron (vs K4B4G1646D-BCK00)

Design Notes

For optimal signal integrity, route DDR3L traces with controlled impedance (typically 40-60 ohms single-ended, 80-120 ohms differential). Keep trace lengths matched within 50 mils for address/control and 20 mils for data. Place the ZQ pin's 240-ohm resistor (1% tolerance) as close to the ball as possible, with a clean ground return. Use a solid ground plane beneath the memory device to minimize noise.

Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed within 100 mils of each ball. Use a 10uF bulk capacitor near the memory power input. The 1.35V supply should have low ripple (<50mV) to ensure reliable operation. Consider using a dedicated DDR3L power regulator with good transient response.

The industrial temperature grade allows operation up to +95°C, but ensure adequate airflow or heatsinking if the device is in a confined enclosure. The 96-ball TFBGA package has a thermal resistance that depends on PCB copper area; provide at least 4 thermal vias under the exposed pad to improve heat dissipation. Monitor junction temperature to stay within the specified range.