Samsung Electronics

K3KL5L50DM-BGCU - LPDDR5X 128Gb 8533Mbps DRAM | Samsung

MPN: K3KL5L50DM-BGCU ✓ Active
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[DATA_NEEDED: VDD voltage] Vdss [DATA_NEEDED: package ball count / FBGA code] Package LPDDR5X SDRAM Memory
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Price updated: 2026-09-04
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Drop-in alternatives for K3KL5L50DM-BGCU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

K3KL3L30DM-BGCU

✅ Drop-In ⚠️ 参数待验证
Samsung Electronics
📦 FBGA (BGCU)
LPDDR5X DRAM · 64 Gb · x64 · 8533 Mbps · 1.8 V · 1.05 V · 0.5 V · 0.9 V

✓ In Stock

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K3KL3L30CM-BGCU

✅ Drop-In ⚠️ 参数待验证
Samsung Electronics
📦 FBGA (BGCU)
LPDDR5X SDRAM (Volatile DRAM) · 64 Gb (8 GB) · 8533 Mbps · x64 · LPDDR5X (JEDEC LPDDR5X-class low-power DRAM) · FBGA-496 (BGCU) · Surface Mount · Stacked multi-die DRAM

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K3LK3L30CM-BGCU

✅ Drop-In ⚠️ 参数待验证
Samsung Electronics
📦 FBGA (BGCU)
LPDDR5X SDRAM (Low Power Double Data Rate 5X) · 64 Gb (8 GB) · 8533 Mbps per pin · [DATA_NEEDED: organization / bus width] · 496-ball FBGA (BGC) · Surface Mount (BGA) · Stacked DRAM die (multi-die package) · [DATA_NEEDED: VDD voltage]

✓ In Stock

$29.6 / Unit

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K3KL4L40EM-BGCU

✅ Drop-In ⚠️ 参数待验证
Samsung Electro-Mechanics
📦 FBGA (BGCU)
LPDDR5X DRAM · 96 Gbit (12 GB) · x64 · 8533 Mbps · LPDDR5X (LPDDR5 JEDEC-based) · 496-ball FBGA · Surface Mount · [DATA_NEEDED: core supply voltage (VDD)]

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K3LK4L40DM-BGCT

✅ Drop-In ⚠️ 参数待验证
Samsung Electronics
📦 FBGA (BGCT)
DRAM (SDRAM component) · Samsung Electronics · [DATA_NEEDED: Density] · [DATA_NEEDED: Organization] · [DATA_NEEDED: Data Rate] · [DATA_NEEDED: Supply Voltage] · [DATA_NEEDED: CAS Latency] · BGA (per -BGC ordering-code suffix)

✓ In Stock

$40.5 / Unit

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K3KL5L50DM-BGCU Maximum Ratings & Electrical Characteristics

Memory Type LPDDR5X SDRAM
Density 128 Gb (16 GB)
Data Rate 8533 Mbps per pin
Mounting Type Surface Mount (BGA)
Interface LPDDR5X (JEDEC low-power DRAM interface)
Prefetch 16n (LPDDR5/5X architecture)
Power Efficiency approx. 20% better than LPDDR5 (per Samsung LPDDR5X family page)
RoHS Status unknown
Production Status In production (in stock at distributors)

K3KL5L50DM-BGCU [data_needed: package ball count / fbga code] Pin Configuration Guide

Complete pinout information for K3KL5L50DM-BGCU ([data_needed: package ball count / fbga code] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

[data_needed: package ball count / fbga code] package pinout diagram for K3KL5L50DM-BGCU

No detailed pinout data available for K3KL5L50DM-BGCU.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K3KL5L50DM-BGCU Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K3KL5L50DM-BGCU is suitable for 6 applications: Flagship Smartphone Main Memory, Automotive ADAS and Infotainment, Edge AI Inference Accelerators, Tablets and Mobile Computing Devices, 5G Networking and Communication Infrastructure, High-Resolution Camera and Vision Systems.

📱

Flagship Smartphone Main Memory

The K3KL5L50DM-BGCU is a natural fit for flagship smartphone main memory, where its 128 Gb (16 GB) density and 8533 Mbps pin speed deliver the bandwidth modern SoCs demand for multitasking, gaming, and on-device AI. Samsung's LPDDR5X family provides about 20% better power efficiency than LPDDR5, which directly extends battery life in thermally constrained handset enclosures. Placed on the SoC memory bus in a fly-by or point-to-point topology, the device supports deep sleep and dynamic voltage-frequency scaling so idle power drops sharply between burst workloads. The trade-off is strict layout discipline: 8.5 Gbps signaling demands length-matched traces and controller training.

🚗

Automotive ADAS and Infotainment

Samsung explicitly positions the LPDDR5X family, including parts of this class, for automotive devices, citing 8.5 Gbps speeds and improved efficiency. In ADAS central computers, the K3KL5L50DM-BGCU's 128 Gb density buffers fused data streams from multiple cameras, radar, and LiDAR sensors, while the 8533 Mbps rate sustains the hundreds of GB/s that perception and path-planning algorithms consume. For digital cockpit and infotainment domains, the same bandwidth supports multi-display rendering and voice-assistant inference. Automotive deployment requires confirming the correct temperature-grade suffix and Samsung's automotive qualification path, since mobile-coded parts may not carry the full AEC-level pedigree of automotive ordering codes.

🧩

Edge AI Inference Accelerators

On-device large language model and vision transformer inference are memory-bandwidth bound, making the K3KL5L50DM-BGCU's 8533 Mbps LPDDR5X interface a strong match for edge AI accelerators. With 128 Gb (16 GB) per package, weights and activations for quantized 7B-class models fit locally, and multiple devices can be paired for 32 GB-class configurations. Compared with LPDDR5 at 6400 Mbps, the 33% pin-speed increase of LPDDR5X translates directly into higher tokens-per-second inference, while Samsung's efficiency improvements reduce thermal throttling in fanless enclosures. Designers should budget for the LPDDR5X training flow and verify the accelerator's memory-controller supports 8.5 Gbps signaling before committing to the footprint.

🖥️

Tablets and Mobile Computing Devices

Premium tablets and thin-and-light notebooks with ARM-based SoCs use LPDDR5X as unified system memory, and the K3KL5L50DM-BGCU's 16 GB per package matches the 16 GB configurations common in these products. The 8533 Mbps data rate feeds both CPU and integrated GPU from a shared memory pool, which is essential for 120 Hz display rendering and video editing workloads. Samsung's roughly 20% power-efficiency gain over LPDDR5 reduces heat in passively cooled chassis, sustaining peak performance longer. Because LPDDR5X is typically soldered down (no SO-DIMM), the BGCU BGA footprint is permanent - memory sizing decisions must be made at board design time, favoring the highest density that cost targets allow.

🌐

5G Networking and Communication Infrastructure

Samsung's LPDDR5X materials cite IT industry applications, and 5G small cells, baseband cards, and edge gateways benefit from the K3KL5L50DM-BGCU's combination of bandwidth and power efficiency. The 8533 Mbps interface keeps packet-buffer and forwarding-table working sets responsive for line-rate processing, while LPDDR5X's power states reduce energy draw in thermally limited outdoor enclosures. The 128 Gb density supports the large buffers needed for network acceleration, deep-packet inspection, and edge caching. Designers operating in harsh environments must verify the operating temperature grade of the specific ordering code, since standard mobile-grade temperature ranges may not cover extended industrial requirements without the appropriate suffix variant.

🎥

High-Resolution Camera and Vision Systems

Computational photography modules, machine-vision inspection systems, and video conferencing bars all burst large frame buffers at high frame rates, a workload aligned with the K3KL5L50DM-BGCU's 8533 Mbps bandwidth. Capturing 8K or multi-camera 4K streams requires writing hundreds of MB per frame burst; the 16 GB density of this device sustains deep frame pipelines and on-the-fly AI enhancement (denoise, HDR fusion, depth estimation) without spilling to slower storage. Samsung's LPDDR5X efficiency gains matter in battery-powered camera platforms, and the BGA package supports compact module designs. Fly-by routing and impedance control at 8.5 Gbps are the primary engineering constraints for vision-system boards.

What is the K3KL5L50DM-BGCU?
The K3KL5L50DM-BGCU is a Samsung Semiconductor LPDDR5X DRAM memory IC with 128 Gb (16 GB) of density and an 8533 Mbps per-pin data rate, supplied in a fine-pitch ball grid array package. According to distributor listings (icDirectory), it is Samsung's premium low-power DRAM for mobile and automotive computing, with 16,750 pcs reported in stock as of Aug 31, 2026. It is aimed at flagship smartphones, edge AI, and ADAS platforms requiring high memory bandwidth.
What is the data rate of K3KL5L50DM-BGCU?
The K3KL5L50DM-BGCU operates at 8533 Mbps (8.5 Gbps) per data pin. This matches Samsung's LPDDR5X family top speed tier, which the manufacturer states provides up to 8.5 Gbps data processing speeds and roughly 20% better power efficiency than LPDDR5. Combined with the 16n prefetch architecture of LPDDR5X, this rate enables the multi-hundred-GB/s bandwidth needed for on-device AI inference and high-resolution camera pipelines.
What density does K3KL5L50DM-BGCU offer?
The K3KL5L50DM-BGCU provides 128 Gb of DRAM density, equal to 16 GB of system memory in a single package. For 32 GB configurations, two devices are typically paired on the same memory channel or integrated into a stacked multi-die package. This density class is common in 2025-2026 flagship smartphones and AI-capable edge platforms, where Samsung's LPDDR5X family scales up to 64 GB per package for IT industry and automotive devices.
Where to buy K3KL5L50DM-BGCU online?
The K3KL5L50DM-BGCU is listed by global memory distributors and brokers including icDirectory (16,750 pcs in stock as of Aug 31, 2026), AIChipLink, Kinnotek, Preduo, and Edal Tech International. Because LPDDR5X components are typically sold through franchise distribution or broker channels rather than catalog distributors, request an official quotation, verify lot date codes, and insist on Samsung original packaging and traceability documentation before purchase to avoid counterfeit risk.
What is the price of K3KL5L50DM-BGCU?
No public catalog price is published for the K3KL5L50DM-BGCU; listed reference prices show $0, indicating quote-based procurement as of Sep 4, 2026. LPDDR5X pricing varies with DRAM spot-market conditions and order volume, typically negotiated per lot with MOQs in the reel or tray quantity. Contact Samsung franchised distributors or the listed brokers (icDirectory, AIChipLink, Preduo) with your annual volume forecast to obtain current, binding pricing.
Is K3KL5L50DM-BGCU in stock and what is the lead time?
Yes - icDirectory reports 16,750 pieces of K3KL5L50DM-BGCU in stock, last updated Aug 31, 2026. However, broker-held stock should be verified for authenticity and date code before ordering. For direct Samsung allocation, lead times for premium LPDDR5X typically run through franchised distribution and depend on quarterly capacity; large-volume automotive or mobile customers secure supply via long-term agreements rather than spot purchases.
Where to download K3KL5L50DM-BGCU datasheet PDF?
A K3KL5L50DM-BGCU datasheet PDF is referenced on icDirectory's datasheet page (icdirectory.com/d/integrated-circuits/k3kl5l50dm-bgcu.pdf), and Samsung publishes LPDDR5X family information on its official site at semiconductor.samsung.com/dram/lpddr/lpddr5x. Note that Samsung controls detailed LPDDR5X datasheets under NDA - full electrical and timing specifications usually require registering with Samsung or its franchised distributors as a qualified customer.
What is the difference between K3KL5L50DM-BGCU and K3KL5L50QM-JGCT?
The K3KL5L50DM-BGCU and K3KL5L50QM-JGCT share the Samsung K3KL5L50 base (LPDDR5X, same die generation), but differ in package and grade coding: the DM-BGCU suffix denotes the DM package variant with BGCU ball/package code, while QM-JGCT denotes a different package outline and JGCT grade/temperature coding. Because the ball map and package outline can differ, they are NOT guaranteed drop-in replacements - verify the mechanical footprint and ball assignment against the Samsung datasheet before substituting one for the other.
Can Micron or SK hynix LPDDR5X replace K3KL5L50DM-BGCU?
There is no verified pin-to-pin cross-brand replacement for the K3KL5L50DM-BGCU in the public cross-reference sources reviewed. Micron and SK hynix offer LPDDR5X parts with comparable density and speed classes, but LPDDR5X ball maps, package outlines, and training behavior are vendor-specific, so a board redesign and memory-controller re-validation (including JEDEC LPDDR5X compliance re-characterization) would be required. Treat cross-brand moves as second-source qualification projects, not drop-in swaps.
Is K3KL5L50DM-BGCU suitable for automotive ADAS applications?
Yes - Samsung explicitly targets its LPDDR5X family at automotive as well as IT devices, citing 8.5 Gbps speeds and improved power efficiency for automotive platforms. For ADAS and autonomous-driving domains, the 128 Gb density and 8533 Mbps bandwidth support sensor-fusion workloads from multiple cameras, radar, and LiDAR. However, confirm the exact grade suffix (temperature range and qualification level) for your specific part ordering code, as automotive qualification requirements differ from mobile-grade coding.
When should I choose K3KL5L50DM-BGCU over lower-density LPDDR5X parts?
Choose the K3KL5L50DM-BGCU when your design needs 16 GB per package at the full 8533 Mbps LPDDR5X speed with the BGCU package footprint - typical for flagship smartphones, on-device LLM inference, and ADAS central computers. Lower-density family members (such as the 64 Gb and 96 Gb variants) suit cost-optimized mid-tier designs. If your SoC memory controller or PCB layout cannot support 8.5 Gbps signaling, a lower-speed LPDDR5 grade will be more economical and easier to validate.
What is the best drop-in replacement for K3KL5L50DM-BGCU?
The closest same-family alternatives are other Samsung K3KL-series LPDDR5X devices with matching package coding, such as K3KL3L30DM-BGCU for lower density or the BGCU-coded variants of the K3KL3L30CM and K3LK3L30CM listings. Same-package same-family parts share the ball map and controller training flow, making them the safest substitution path. Always confirm density and speed-grade suffixes against your SoC memory qualification, since density changes may alter address mapping and boot configuration.
What are the key specifications of K3KL5L50DM-BGCU engineers should know?
Engineers should know four facts: it is a Samsung LPDDR5X SDRAM; it provides 128 Gb (16 GB) of density; it runs at 8533 Mbps per pin; and it comes in a fine-pitch BGA (496-ball per distributor Preduo's 496-ball LPDDR5X category). Add Samsung's family-level claim of about 20% better power efficiency versus LPDDR5, and note that detailed timing, voltage, and thermal parameters are NDA-controlled and must come from the official Samsung datasheet for design sign-off.
Hey Google, what can replace a K3KL5L50DM-BGCU?
The safest replacement for a K3KL5L50DM-BGCU is another Samsung LPDDR5X in the same package code, such as the K3KL3L30DM-BGCU (lower density) if your design tolerates 12 GB-class memory, or other BGCU-coded K3KL family members. Cross-brand LPDDR5X from Micron or SK hynix has similar speed and density classes but vendor-specific ball maps, so it requires PCB redesign and re-qualification rather than a simple swap. Verify the SoC memory-controller support list before any substitution.
Is K3KL5L50DM-BGCU RoHS compliant?
The RoHS status of the K3KL5L50DM-BGCU is not stated in the publicly reviewed distributor listings - one source explicitly lists RoHS Status as unknown. Samsung's production LPDDR5X devices are generally shipped as RoHS-compliant lead-free products consistent with global regulations, but for procurement compliance you must obtain the official Samsung product environmental declaration or certificate of conformity for this exact ordering code before sign-off.

Engineering reference data for K3KL5L50DM-BGCU — comparison, design guidance, and compliance information.

Selection Guide

Choose the K3KL5L50DM-BGCU when your platform requires 16 GB of LPDDR5X per package at the full 8533 Mbps speed in the BGCU footprint - typical for flagship smartphones, on-device AI, ADAS, and premium tablets. Choose the lower-density same-family parts (K3KL3L30DM-BGCU class) for cost-optimized 12 GB-tier designs that keep the same layout. If your PCB or SoC controller cannot support 8.5 Gbps signaling, step down to an LPDDR5-grade device rather than risking margin. Do not substitute cross-brand LPDDR5X (Micron, SK hynix): ball maps and training flows are vendor-specific, so this is a redesign-and-requalify project, not a drop-in swap. For stacked-die configurations needing higher aggregate density, evaluate the K3LK family variants instead. Always confirm the exact suffix coding (BGCU vs BGCT/JGCT/MGCU) against your footprint before release.

Comparison with Alternatives

Parameter This Product K3KL3L30DM-BGCU K3KL3L30CM-BGCU K3LK3L30CM-BGCU K3KL4L40EM-BGCU K3LK4L40DM-BGCT
Package FBGA (BGCU code, 496-ball class per distributor category) FBGA (BGCU) - same coding FBGA (BGCU) - same coding FBGA (BGCU) - same coding FBGA (BGCU) - same coding FBGA (BGCT) - adjacent coding
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Memory Type LPDDR5X LPDDR5X LPDDR5X LPDDR5X (stacked) LPDDR5X LPDDR5X (stacked)
Density 128 Gb (16 GB) [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Data Rate 8533 Mbps [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Supply Voltage [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Operating Temperature [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED] [DATA_NEEDED]
Power Efficiency vs LPDDR5 approx. 20% better (Samsung family claim) approx. 20% better (LPDDR5X family) approx. 20% better (LPDDR5X family) approx. 20% better (LPDDR5X family) approx. 20% better (LPDDR5X family) approx. 20% better (LPDDR5X family)

Key Differentiators

  • Top-tier LPDDR5X speed (vs LPDDR5-class DRAM (e.g., lower K3KL grades at 6400 Mbps class))
  • Large single-package density (vs K3KL3L30DM-BGCU (lower-density same-family part))
  • Family power-efficiency gain (vs K3LK4L40DM-BGCT (stacked family variant))

Design Notes

At 8533 Mbps, LPDDR5X signaling is extremely sensitive to channel loss and ISI. Maintain controlled-impedance (typically 40-50 ohm single-ended) routing, keep trace lengths matched within the SoC vendor's specified skew window, minimize stubs and layer transitions, and use the Samsung-recommended on-die termination settings. The memory controller's read/write training (VrefDQ, per-byte delay line) must be re-run for every board revision. Simulate the full channel with IBIS-AMI models obtained from Samsung under NDA before tape-out; do not rely on LPDDR5-era models at 8.5 Gbps.

LPDDR5X uses split rails (VDD2/VDDQ/VDD1-class supplies per the JEDEC LPDDR5X definition; exact voltages are NDA data for this part - verify in the Samsung datasheet). Each rail needs a tight PDN with bulk plus high-frequency ceramic decoupling placed at the BGA via field. Estimated: at 8.5 Gbps, I/O switching current dominates VDDQ; budget per Samsung's IDD measurement conditions rather than LPDDR5 figures, since dynamic per-pin current scales with data rate. Enable DVFSC/DVFSP and self-refresh aggressively in firmware to exploit the family's roughly 20% efficiency advantage.

LPDDR5X ball maps are vendor- and package-code-specific: the BGCU, BGCT, JGCT, and MGCU suffixes denote different package outlines, ball assignments, or grade coding, and are not interchangeable without footprint and schematic changes. Second, do not assume your SoC memory controller supports 8533 Mbps - many support LPDDR5X only to lower speed grades. Third, Samsung's detailed datasheets are NDA-controlled; ordering code suffixes (temperature/qualification grade) must be confirmed with Samsung or franchised distribution before committing to automotive or industrial designs.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Reviewed distributor listings explicitly state RoHS Status unknown for this MPN. Samsung production LPDDR5X is typically RoHS-compliant/lead-free, but no public certificate was found in the provided data - obtain Samsung's official environmental declaration for this ordering code.

Data verified on: 2026-09-04 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Samsung Electronics Samsung Semiconductor K3KL5L50DM-BGCU LPDDR5X LPDDR5 DRAM low-power DRAM SDRAM memory IC JEDEC LPDDR5X standard FBGA ball grid array surface mount RoHS 8533 Mbps 128 Gb smartphone main memory automotive ADAS edge AI inference memory bandwidth K3KL3L30DM-BGCU K3KL5L50QM-JGCT on-die termination 16n prefetch
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