PIC10F322-E/MC - 8-Bit MCU 896B Flash 16MHz 8-DFN | Microchip
MPN: PIC10F322-E/MC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.78 | $0.78 |
| 10 | $0.7 | $7.00 |
| 100 | $0.58 | $58.00 |
| 500 | $0.48 | $240.00 |
| 1,000 | $0.41 | $410.00 |
| 3,000 | $0.34 | $1,020.00 |
PIC10F322-E/MC Overview
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU core, typically with on-chip Flash for program storage, SRAM for variables, and a small set of digital and analog peripherals. MCUs sit at the bottom of the embedded computing hierarchy: microcontroller -> embedded processor -> system-on-chip -> computer. They are designed to run deterministic real-time firmware in cost- and space-constrained applications, replacing discrete logic and reducing BOM count.
Key features of the PIC10F322 include 4 user I/O pins, instruction-cycle performance of 16 MHz (4 MHz instruction rate), 2.3V to 5.5V wide operating voltage range, on-chip temperature indicator, and internal 16 MHz high-speed oscillator with software-selectable calibration. The device is built on Microchip's enhanced mid-range 8-bit core with 49 instructions and 16 stack levels, and supports in-circuit serial programming (ICSP) via two dedicated pins.
Architecturally, the PIC10F322 combines a RISC-style Harvard core with CIP (Core Independent Peripherals) such as the CLC, NCO, and CWG. These peripherals can operate without CPU intervention, allowing the CPU to sleep while peripherals handle PWM generation, signal conditioning, or timing-critical tasks. This dramatically reduces average power consumption and offloads real-time work from the limited instruction bandwidth.
Typical applications include IoT edge sensor nodes, wearable electronics, consumer remote controls, LED lighting controllers, battery chargers, and low-cost motor control for toys and small appliances. The 8-DFN 2x3 mm footprint enables use in space-constrained designs where QFN-style packages are required.
When designing with this part, note that the DFN package has an exposed thermal pad that must be soldered to the PCB ground plane for mechanical reliability and thermal dissipation. The wide 2.3V-5.5V range allows direct connection to single-cell Li-ion or two-AA battery stacks without a separate regulator.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Engineering content combines verified datasheet data with parametric comparison and cross-reference intelligence from the Microchip cross-reference search.
Drop-in alternatives for PIC10F322-E/MC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC10F322-E/MC (same form factor and footprint) — differing in I/O Pins, Package, Core Architecture, Operating Temperature, Timers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC10F322-I/MC
✅ Drop-In✓ In Stock
$0.52 / Unit
View Datasheet →PIC10F322T-E/MC
✅ Drop-In📋 Reference alternative (not in catalog)
PIC10F320-E/MC
✅ Drop-In✓ In Stock
$0.49 / Unit
View Datasheet →PIC10F320-I/MC
✅ Drop-In✓ In Stock
$0.26 / Unit
View Datasheet →PIC10F200-E/MC
✅ Drop-In✓ In Stock
$0.52 / Unit
View Datasheet →PIC10F322-E/MC Maximum Ratings & Electrical Characteristics
| Core Architecture | Enhanced Mid-Range 8-bit PIC |
| Program Memory (Flash) | 896 B (512 x 14 words) |
| Data RAM | 64 B |
| CPU Speed | 16 MHz (4 MHz instruction rate) |
| Operating Voltage | 2.3 V to 5.5 V |
| I/O Pins | 4 |
| ADC | 8-bit, up to 4 channels |
| PWM | Yes (10-bit PWM) |
| Peripherals | CLC, NCO, CWG, PWM, Temperature Indicator |
| Internal Oscillator | 16 MHz HF, 31 kHz LF |
| Package | 8-DFN (2x3 mm) |
| Operating Temperature | -40 C to +125 C (E = Extended) |
| Programming Method | ICSP (In-Circuit Serial Programming) |
| Instruction Set | 49 instructions, 16-level stack |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC10F322-E/MC Pin Configuration
| Pin 1 | VDD — Positive supply voltage (2.3V to 5.5V) |
| Pin 2 | RA5 — Bidirectional I/O / ADC channel |
| Pin 3 | RA4 — Bidirectional I/O / ADC channel |
| Pin 4 | RA3/MCLR/VPP — Input only / Master Clear reset / ICSP programming voltage |
| Pin 5 | RA2 — Bidirectional I/O / ADC channel |
| Pin 6 | RA1/ICSPCLK — Bidirectional I/O / ICSP clock |
| Pin 7 | RA0/ICSPDAT — Bidirectional I/O / ICSP data |
| Pin 8 | VSS — Ground reference |
Typical Applications
PIC10F322-E/MC is suitable for 6 applications: IoT Edge Sensor Nodes, Consumer Remote Controls, LED Lighting Controllers, Battery-Powered Wearables, Toys and Hobby Electronics, Industrial Sensor Transmitters.
IoT Edge Sensor Nodes
The PIC10F322-E/MC fits IoT edge sensor nodes because it integrates an 8-bit ADC, temperature indicator, and core-independent peripherals in a 2x3 mm DFN package. The 16 MHz CPU samples up to 4 analog channels while the CLC and NCO handle signal conditioning without CPU wake-up. Power budget: 2.3-5.5V VDD allows direct 3V coin-cell operation, with sleep current under 1 uA for years of battery life. Pair with a low-power radio module via RA0/RA1 GPIO; firmware fits in 896 B Flash with state-machine logic for periodic wake-and-transmit.
Recommended
Consumer Remote Controls
The PIC10F322-E/MC is well-suited for IR remote controls because the CWG (Complementary Waveform Generator) can produce 38 kHz carrier modulation for IR LEDs while the CPU remains asleep. The 16 MHz internal oscillator and 4 I/O pins cover button matrix scanning, IR transmit, and LED indicator drive. Wide VDD (2.3-5.5V) lets designers use 2xAAA or coin-cell batteries. Estimated IR transmission current draw is under 5 mA average, enabling multi-year battery life in TV/STB remote designs.
Recommended
LED Lighting Controllers
For LED lighting controllers, the PIC10F322-E/MC's 10-bit PWM peripheral combined with CLC and CWG enables smooth dimming and color-mixing without CPU intervention. The 4 I/O pins drive RGB or RGBW channels, with the 16 MHz CPU providing sufficient bandwidth for protocol decoding (DMX, Zigbee, BLE control inputs). The 2.3-5.5V VDD range supports direct Li-ion or USB-powered LED strips. The NCO can synthesize precise frequency-multiply PWM for flicker-free high-resolution dimming above 1 kHz.
Recommended
Battery-Powered Wearables
Wearable devices benefit from the PIC10F322-E/MC's tiny 2x3 mm DFN footprint and ultra-low sleep current. The temperature indicator and 8-bit ADC monitor skin or ambient temperature while the CLC handles haptic feedback patterns in hardware. 2.3V minimum VDD allows direct CR2032 coin-cell drive (3.0V nominal) with brown-out detect. The 16 MHz CPU wakes on interrupt, processes sensor data, and returns to sleep in microseconds, extending battery life to months. The 4 I/O pins connect to a sensor, an LED, and a button.
Recommended
Toys and Hobby Electronics
Toy and hobby designs leverage the PIC10F322-E/MC for low-cost motor and sound control in 2x3 mm packaging. The CWG drives half-bridge motor drivers, the PWM modulates hobby servos at 50 Hz, and the 8-bit ADC reads analog sensors (line-follow, light, position). With 896 B Flash, designers can implement state-machine firmware for line-following robots or animatronic toys. VDD 2.3-5.5V allows direct 3-AA or Li-ion battery operation. LCSC volume pricing makes the part attractive for cost-sensitive consumer toys.
Recommended
Industrial Sensor Transmitters
Industrial 4-20 mA sensor transmitters and loop-powered metering benefit from the PIC10F322-E/MC's extended -40 to +125 C temperature range (E suffix) and on-chip temperature indicator for cold-junction compensation. The 8-bit ADC digitizes bridge sensors, thermocouples, or 4-20 mA loop currents while the NCO generates precision PWM for DAC output. Wide 2.3-5.5V VDD supports loop-powered designs down to 3V. The 8-DFN package enables miniaturized field-mount transmitters where PCB space is at a premium in IP67 enclosures.
Recommended
Recommended Products Summary
Engineering reference data for PIC10F322-E/MC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC10F322-I/MC | PIC10F322T-E/MC | PIC10F320-E/MC | PIC10F320-I/MC | PIC10F200-E/MC |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 8-DFN (2x3 mm) | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same | 8-DFN (2x3 mm) - same |
| Program Memory | 896 B Flash | 896 B Flash | 896 B Flash | 448 B Flash (-50%) | 448 B Flash (-50%) | 256 B Flash (-71%) |
| Data RAM | 64 B | 64 B | 64 B | 32 B (-50%) | 32 B (-50%) | 16 B (-75%) |
| CPU Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 4 MHz |
| ADC | 8-bit, 4 ch | 8-bit, 4 ch | 8-bit, 4 ch | 8-bit, 3 ch | 8-bit, 3 ch | No ADC |
| PWM | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | No PWM |
| CIP Peripherals (CLC/NCO/CWG) | Yes (all three) | Yes (all three) | Yes (all three) | Yes (all three) | Yes (all three) | None (legacy core) |
| Temperature Grade | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
Key Differentiators
- Integrated CIP peripherals in 6/8-pin footprint (vs PIC10F200-E/MC)
- Doubled program memory vs PIC10F320 (vs PIC10F320-E/MC)
- Extended -40C to +125C temperature range (vs PIC10F322-I/MC)
Design Notes
The 8-DFN package has an exposed thermal pad on the underside that MUST be soldered to the PCB ground plane for both mechanical reliability (preventing package cracking under thermal stress) and thermal dissipation. Use a land pattern with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the central pad to an internal ground plane. Estimated: at 16 MHz with peripherals active, power dissipation is approximately 8 mA * 3.3V = 26 mW, well within the 2x3 mm package's thermal capability at 25 C ambient, but solder pad connection is still critical.
Pin 4 (RA3/MCLR/VPP) is input-only - it cannot be used as a digital output. Do not connect MCLR externally to VDD through a resistor smaller than 4.7 kOhm, as it can prevent reliable in-circuit serial programming. The ICSP pins (RA0/ICSPDAT and RA1/ICSPCLK) share GPIO functions; if your application uses these pins for I/O, ensure ICSP connector isolation resistors (typically 10 kOhm) are in series to allow programming without disrupting external circuitry.
Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the VDD pin (pin 1). For battery-powered designs, place a 10 uF bulk capacitor near the IC to handle transient current during ADC sampling and PWM switching events. The internal voltage regulator requires VDD rise time under specific limits; consult the datasheet 'Power-on Reset' section. Brown-out Reset (BOR) should be enabled with a threshold just below minimum operating VDD (e.g., 2.1V for 2.3V minimum) to prevent code execution at indeterminate voltages.
Route the ICSP signals (RA0/ICSPDAT, RA1/ICSPCLK) as short as possible if in-circuit programming is required in production. Keep analog signals (RA2, RA4, RA5) away from RA0/RA1 digital signals to minimize crosstalk on the ADC. The internal 16 MHz oscillator accuracy is approximately +/- 2% after calibration; for applications requiring UART or precision timing, use the LFINTOSC (31 kHz) calibration register or external crystal if your variant supports it. The 2x3 mm package should be placed with copper pour on all sides, not solid flood under the package, to maintain DFN solder joint reliability.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - the PIC10F322T-I/MC industrial grade is also not automotive-qualified; consult Microchip for AEC-Q100 variants in PIC16 or PIC18 families. Halogen-free status not explicitly stated in the datasheet and should be confirmed via Microchip environmental compliance documents.
