PIC12F1572-I/RF - 8-bit MCU, 32MHz, 3.5KB Flash, 16-bit PWM | Microchip
MPN: PIC12F1572-I/RF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.85 | $0.85 |
| 10 | $0.78 | $7.80 |
| 100 | $0.67 | $67.00 |
| 500 | $0.55 | $275.00 |
| 1,000 | $0.45 | $450.00 |
PIC12F1572-I/RF Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and peripheral subsystems into one IC. MCUs sit one level below microprocessors in the embedded hierarchy and are categorized by bus width (8-bit, 16-bit, 32-bit), Flash size, and integrated peripheral set. PIC12F-series parts target low-pin-count (8-pin) applications where PCB area, BOM count, and power budget are critical, making them a sweet spot for compact analog-and-control designs.
Key differentiating features of the PIC12F1572-I/RF include the three 16-bit PWMs with independent time bases (uncommon in an 8-pin device), 4-channel 10-bit ADC with hardware capacitive voltage divider (CVD) support, complementary waveform generator for half-bridge / full-bridge / push-pull drive, and on-board 5-bit DAC usable as a programmable reference. The instruction set is enhanced mid-range with 200 ns instruction execution at 20 MHz oscillator.
Typical applications include high-resolution LED dimming and color mixing, stepper motor microstepping control, switched-mode power supply control loops, sensor signal conditioning, low-cost fan/lighting control, and battery-powered portable instrumentation. The 8-pin UDFN footprint also makes it a strong fit for space-constrained wearables and IoT edge nodes.
When designing with this device, note the UDFN package has an exposed thermal pad that must be soldered to the PCB ground pour for mechanical reliability. Decouple VDD with a 100 nF ceramic capacitor placed within 3 mm of the pin, and reserve an unused GPIO for in-system debug via the ICSP/ICD pins to retain code-development flexibility.
This page synthesizes distributor pricing, drop-in PIC12 alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC12F1572-I/RF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC12F1572-I/RF (same form factor and footprint) — differing in Package, ADC, DAC, Operating Temperature, I/O Pins.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC12F1571-I/RF
✅ Drop-In✓ In Stock
$0.72 / Unit
View Datasheet →PIC12LF1572-I/RF
✅ Drop-In✓ In Stock
$0.84 / Unit
View Datasheet →PIC10F322-I/MC
✅ Drop-In✓ In Stock
$0.52 / Unit
View Datasheet →PIC12F1822-I/MF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC12F1572-I/RF Maximum Ratings & Electrical Characteristics
| Core | PIC12 enhanced mid-range 8-bit RISC |
| Instruction Set Architecture | PIC12 (RISC) |
| Program Memory | 3.5 KB (2K x 14) Flash |
| RAM | 256 bytes |
| Maximum CPU Frequency | 32 MHz |
| Instruction Execution Time | 200 ns at 20 MHz oscillator |
| I/O Pins | 6 (8-pin package minus VDD/VSS) |
| ADC | 10-bit, 4 channels |
| DAC | 5-bit, 1 channel |
| Comparators | 2 |
| 16-bit PWM Channels | 3 (independent time bases) |
| Timers | 6 (Timer0/1/2/4/6 + WDT) |
| Complementary Waveform Generator (CWG) | Yes |
| Package | 8-UDFN (3x3 mm) |
| Operating Temperature Range | -40C to +85C (Industrial, "I" suffix) |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
PIC12F1572-I/RF Pin Configuration
| Pin 1 | VDD — Positive power supply |
| Pin 2 | RA5/ICSPDAT/PWM3 — GPIO RA5 / ICSP data / PWM3 output |
| Pin 3 | RA4/AN3/CWG1A/CLKOUT — GPIO RA4 / ADC input / CWG output A / CLKOUT |
| Pin 4 | RA3/MCLR/VPP — GPIO RA3 / Master Clear (reset) / ICSP VPP |
| Pin 5 | RA2/AN2/DAC1OUT/PWM2 — GPIO RA2 / ADC input / DAC output / PWM2 output |
| Pin 6 | RA1/AN1/CIN-/PWM1/ICSPCLK — GPIO RA1 / ADC input / Comparator input- / PWM1 / ICSP clock |
| Pin 7 | RA0/AN0/CIN+/PWM0 — GPIO RA0 / ADC input / Comparator input+ / PWM0 output |
| Pin 8 | VSS — Ground reference |
Typical Applications
PIC12F1572-I/RF is suitable for 6 applications: High-Resolution LED Lighting & Color Mixing, Stepper Motor Microstepping Control, Switched-Mode Power Supply (SMPS) Control, Battery-Powered Sensor Hubs, Wearable / Fitness Device Sub-Controller, Industrial Control Loops & Fan/Pump Speed Control.
High-Resolution LED Lighting & Color Mixing
The PIC12F1572-I/RF's three independent 16-bit PWM channels make it a natural fit for RGBW LED color-mixing fixtures. With 16-bit resolution per channel the designer can fade between color points without visible stepping, and the CWG module can directly drive a half-bridge FET pair for buck-style constant-current regulation. The 32 MHz core executes the color-mixing math loop in under 5 us, leaving plenty of headroom for ambient-light feedback sampling on the 10-bit ADC. The 8-pin UDFN keeps the BOM and PCB area small enough to integrate into a screw-in lamp base.
Recommended
Stepper Motor Microstepping Control
Microstepping a bipolar stepper requires two synchronized PWMs at >10 kHz with adjustable phase offset. The PIC12F1572's two of three 16-bit PWMs can be phase-locked through the same time base, while the third drives an enable or chopper-control signal. Sine-lookup computation fits in the 3.5 KB Flash with room for acceleration/deceleration ramps. The 8-pin UDFN footprint lets the MCU sit on the same PCB as the H-bridge, minimizing gate-drive loop area and reducing EMI emissions on the switching edges.
Recommended
Switched-Mode Power Supply (SMPS) Control
Voltage-mode and peak-current-mode SMPS control loops run comfortably on the PIC12F1572-I/RF. The 32 MHz core provides the ADC-to-PWM latency needed for sub-100 ns duty-cycle updates, while the CWG module can directly synthesize complementary gate drive for a synchronous buck converter. The 5-bit DAC can serve as the soft-start reference, eliminating an external component. The 8-UDFN package's exposed thermal pad keeps the die within thermal limits even at full 32 MHz CPU load with all peripherals active.
Recommended
Battery-Powered Sensor Hubs
In a wireless sensor node, the PIC12F1572-I/RF can serve as the analog front-end that digitizes a sensor, performs on-chip filtering using the ADC's hardware CVD mode, and then wakes the radio SoC only when a meaningful event is detected. The 256 B RAM and 3.5 KB Flash are sufficient for simple threshold/filters without external memory. The Industrial -40C to +85C temperature grade and 2.3V-5.5V VDD range make it compatible with single-cell Li-Ion, 2x AA, and 3V coin-cell supplies.
Recommended
Wearable / Fitness Device Sub-Controller
In a fitness band or smart-watch, the PIC12F1572-I/RF can drive haptic feedback (PWM to a small LRA motor), control RGB status LEDs, and read a heart-rate or SpO2 sensor via the 10-bit ADC. The 8-UDFN 3 mm x 3 mm footprint fits inside the device's compact enclosure without competing for space with the main application processor. Low-power sleep modes and the wide industrial temperature range help extend battery life across varied wear conditions.
Recommended
Industrial Control Loops & Fan/Pump Speed Control
Closed-loop fan or pump speed control leverages the PIC12F1572's 16-bit PWM for tachometer feedback generation and the comparator for zero-cross detection of the AC line. The on-chip CWG can implement a 4-quadrant variable-frequency drive on a small BLDC fan. Industrial designers favor the part for its wide VDD tolerance, -40C to +85C rating, and Microchip's long-term supply continuity program for industrial SKUs.
Recommended
Recommended Products Summary
Engineering reference data for PIC12F1572-I/RF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC12F1571-I/RF | PIC12LF1572-I/RF | PIC10F322-I/MC | PIC12F1822-I/MF |
|---|---|---|---|---|---|
| Package | 8-UDFN (3x3 mm) | 8-UDFN (3x3 mm) - same | 8-UDFN (3x3 mm) - same | 8-DFN - same footprint family | 8-DFN - same footprint family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 3.5 KB | 1.75 KB | 3.5 KB | 512 B | 3.5 KB |
| RAM | 256 B | 128 B | 256 B | 64 B | 128 B |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 16 MHz | 32 MHz |
| 16-bit PWM Channels | 3 (independent) | 3 (independent) | 3 (independent) | 2 (enhanced 16-bit) | 1 (16-bit) + ECCP module |
| ADC | 10-bit, 4 channels | 10-bit, 4 channels | 10-bit, 4 channels | 8-bit, 3 channels | 10-bit, 7 channels |
| DAC | 5-bit, 1 channel | 5-bit, 1 channel | 5-bit, 1 channel | None | None |
| Operating Voltage | 2.3V - 5.5V | 2.3V - 5.5V | 1.8V - 3.6V | 2.3V - 5.5V | 1.8V - 5.5V |
Key Differentiators
- Three independent 16-bit PWMs in an 8-pin package (vs PIC10F322-I/MC)
- On-chip 5-bit DAC and hardware CVD support (vs PIC12F1822-I/MF)
- Same 8-UDFN footprint, more memory than PIC12F1571 (vs PIC12F1571-I/RF)
Design Notes
The 8-UDFN (3x3 mm) package exposes a thermal pad on the underside that must be soldered to a continuous PCB ground pour, not only for thermal dissipation but also for mechanical reliability. Missing the thermal-pad solder joint is the leading cause of UDFN field failures under thermal cycling. Place at least four thermal vias in the pad land pattern to conduct heat into inner ground planes, and keep the pour clearance at least 0.2 mm from signal traces.
Decouple VDD (pin 1) with a 100 nF X7R ceramic capacitor placed within 3 mm of the package and routed with a wide, short trace to pin 8 (VSS). For designs that switch high currents near the MCU (LED strings, motor coils), add a 10 uF bulk tantalum or ceramic on the same VDD net to absorb load transients. The PIC12F1572's ADC readings are particularly sensitive to VDD ripple; route noisy digital traces (PWM, ICSP) away from the VDD pour and the analog ADC pins (RA0-RA3).
Always disable the JTAGEN fuse (FICD.JTAGEN) in the configuration word to free up RA0/RA1/RA2/RA3 as general-purpose GPIO. By default the silicon enables JTAG and these pins are unavailable for application use, which is the most common cause of "missing GPIO" on first-time PIC12F1572 designs. Also reserve RA3 (MCLR) for ICSP if you plan to debug in-circuit; repurposing it as a general input requires careful configuration-word workarounds.
For designs using the CWG module to drive external FETs, keep the CWG output traces (RA4/RA5) physically short (<15 mm) and away from the analog ADC inputs. The complementary gate-drive edges have sub-50 ns rise times and couple capacitively into adjacent analog traces. A ground guard trace between the CWG output pins and the ADC input pins noticeably improves ADC noise performance.
Compliance Information
RoHS and REACH compliant per Microchip product declaration; lead-free matte-tin terminations. Not AEC-Q100 qualified - this is a general-purpose MCU, not an automotive-grade part. Halogen-free status not explicitly published in the verified data and marked unknown.
