10AX090N4F40I3LG - Arria 10 GX FPGA, 900K LE, 1517-FCBGA | Intel
MPN: 10AX090N4F40I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 100 | $3750 | $375,000.00 |
| 500 | $3520 | $1,760,000.00 |
| 1,000 | $3290 | $3,290,000.00 |
Drop-in alternatives for 10AX090N4F40I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090N4F40I3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX090N3F40I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9800 / Unit
View Datasheet →10AX090N2F40I2LG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$6903.28 / Unit
View Datasheet →10AX090N4F40I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory | 59,234,304 bits |
| User I/Os | 600 |
| Transceivers | 24 channels, up to 14.1 Gbps |
| Package | 1517-ball FCBGA (F40) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I3 |
| Process Node | 20 nm |
| DSP Blocks | Hardened floating-point DSP |
| PCIe Hard IP | PCIe Gen3 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free G suffix) |
| Configuration Method | SRAM-based, JTAG/AS/PS supported |
10AX090N4F40I3LG 1517-ball fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX090N4F40I3LG (1517-ball fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N4F40I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N4F40I3LG is suitable for 6 applications: 100G/400G Telecom Line Card, PCIe Gen3 Host Adapter and Accelerator, Test and Measurement Instrumentation, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator Board, Broadcast Video Processing and Studio Router.
100G/400G Telecom Line Card
The 10AX090N4F40I3LG's 900K logic elements and 24 transceivers running up to 14.1 Gbps make it well-suited for 100G and 400G telecom line-card designs requiring OTN framer/mapper, MAC, and packet processing. Hardened PCIe Gen3 and 100G Ethernet MAC IP reduce soft-logic overhead and timing risk. Industrial temperature grade (-40C to +100C) supports carrier-grade outdoor equipment. Per the Arria 10 device datasheet, the device's transceiver count and DSP resources align with OTU4/OTUCn line-side processing.
Recommended
PCIe Gen3 Host Adapter and Accelerator
The 10AX090N4F40I3LG integrates hardened PCIe Gen3 IP, eliminating soft-logic PHY implementation and reducing development time for accelerator cards. Combined with 900K logic elements and 24 transceivers, designers can implement NVMe controllers, FPGA-based compute accelerators, and protocol bridges. The 600 user I/Os support DDR4 memory interfaces and high-speed parallel peripherals, providing ample bandwidth for compute and storage workloads.
Recommended
Test and Measurement Instrumentation
The 10AX090N4F40I3LG delivers 900K logic elements with hardened floating-point DSP blocks ideal for high-speed digitizer, oscilloscope, and protocol-analyzer ASIC/ASSP replacements. Its 600 I/Os and 24 transceivers support multi-channel ADC/DAC interfacing, JESD204B/C links, and high-speed serial protocols. The industrial temperature range and speed grade I3 ensure deterministic timing in calibrated lab and production-test environments.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AX090N4F40I3LG's 900K logic elements plus hardened floating-point DSP blocks enable wideband radar pulse compression, beamforming, and electronic-warfare signal-processing pipelines. Its 24 transceivers up to 14.1 Gbps support high-speed ADC/DAC JESD204B/C interfaces. Industrial temperature grade is appropriate for military and aerospace-grade ground or shipboard platforms with extended thermal environments.
Recommended
Medical Imaging Accelerator Board
The 10AX090N4F40I3LG supports CT, MRI, and ultrasound image-reconstruction pipelines by combining 900K logic elements with hardened floating-point DSP and high-bandwidth transceiver links. Its DDR4 memory interface capability through 600 I/Os handles large frame buffers, and PCIe Gen3 hard IP enables host attachment to medical workstations. Industrial temperature grade is suitable for controlled clinical environments.
Recommended
Broadcast Video Processing and Studio Router
The 10AX090N4F40I3LG serves as a core processing engine for broadcast video routers, multiviewers, and 4K/UHD processing pipelines. Its 24 transceivers support SDI-over-IP (SMPTE 2110, 2022-6) and HDMI/DisplayPort bridging, while 900K logic elements handle pixel processing and color-space conversion. Industrial temperature grade ensures reliability in equipment-room installations.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N4F40I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N4F40I3SG | 10AX090N3F40I2LG | 10AX090N2F40I2LG | 10AX090N3F45I2LG | 10AX090N3F45I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1932-FBGA (F45) - different | 1932-FBGA (F45) - different |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | I3 | I3 | I2 (slower) | I2 (slower) | I2 (slower) | I2 (slower) |
| Transceivers per Quad | 4 | 4 | 3 | 2 | 3 | 3 |
| Embedded Memory (Mbits) | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 | 59.2 |
| User I/Os | 600 | 600 | 600 | 600 | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
Key Differentiators
- Same die/package with industry-standard lead-free termination (vs 10AX090N4F40I3SG)
- Faster speed grade I3 versus I2 (vs 10AX090N3F40I2LG)
- Higher transceiver density per quad (vs 10AX090N2F40I2LG)
Design Notes
Estimated: the 10AX090N4F40I3LG in a 1517-ball FCBGA at typical Arria 10 utilization (60-80 percent logic, 50 percent transceiver, full DSP) dissipates 15-25 W. Without a heat spreader or forced airflow, junction temperature can exceed the 100C industrial limit. Intel's Arria 10 thermal management guidelines recommend a heat sink with thermal interface material and at minimum 200 LFM airflow for full-utilization designs.
The 1517-ball FCBGA at 1.0 mm ball pitch requires HDI PCB stack-up with microvias (laser-drilled), sequential lamination, and 0.4 mm trace/space routing. Per the Arria 10 device datasheet pin-out files, all signal and power balls must escape the BGA fanout region cleanly. Use Intel's PCB design guidelines and reference design stack-ups for impedance control on transceivers and DDR interfaces.
Estimated: transceiver channel placement must follow the Arria 10 device pin-out files for the F40 package. Reference-clock routing requires length matching within +/- 10 mil and impedance-controlled differential traces (typically 100 ohm differential). Power-rail decoupling requires dozens of 0.1 uF and 10 uF low-ESR ceramic capacitors placed within 100 mil of the relevant BGA balls per Intel's PowerTree recommendations.
Common pitfalls for the 10AX090N4F40I3LG include: (1) failing to follow the Arria 10 PowerTree sequencing requirements, which can damage the device during configuration; (2) ignoring transceiver reference-clock jitter requirements, causing link instability; (3) using commercial-grade designs in industrial environments (use industrial I3 speed grade parts); (4) omitting MSL handling for the FCBGA package, leading to solder-joint reliability issues.
Compliance Information
RoHS compliant per the G suffix in ordering code (lead-free termination). Intel's product environmental compliance documentation should be consulted for halogen-free and full REACH compliance details.
