10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA
MPN: 10AX090S2F45E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2750 | $27,500.00 |
| 100 | $2520 | $252,000.00 |
| 500 | $2280 | $1,140,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
Drop-in alternatives for 10AX090S2F45E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S2F45E2LG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AX090S2F45E1SG
✅ Drop-In✓ In Stock
$4890 / Unit
View Datasheet →10AX090S1F45E1SG
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$8200 / Unit
View Datasheet →10AX090S1F45I1SG
✅ Drop-In✓ In Stock
$3890 / Unit
View Datasheet →10AX090S2F45E2SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| User I/O Count | 624 |
| Speed Grade | -2 (mid) |
| Package Type | 1932-BBGA, FCBGA |
| Operating Temperature | -40C to +100C (E2 = extended) |
| Process Node | 20nm TSMC |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Family | Arria 10 |
| Device Variant | GX (transceiver-equipped) |
| Ball Count | 1932 |
10AX090S2F45E2SG 1932-bbga, fcbga Pin Configuration Guide
Complete pinout information for 10AX090S2F45E2SG (1932-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S2F45E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S2F45E2SG is suitable for 6 applications: Wireless Baseband Processing, Radar Signal Processing, Test and Measurement Equipment, Broadcast Video Infrastructure, PCI Express Gen3 Endpoint Card, OTN/CPRI Fronthaul Telecom.
Wireless Baseband Processing
The 10AX090S2F45E2SG is well suited for wireless baseband processing in 4G LTE and 5G NR small-cell base stations. With 900,000 logic elements and 7.2 Mbytes of embedded M20K memory, the device can hold working channel-state information matrices and FFT/IFFT scratch buffers for multi-antenna (MIMO) processing. The integrated multi-gigabit transceivers deliver CPRI fronthaul and JESD204B antenna interfaces at line rates up to 12.5 Gbps per channel, eliminating external SERDES ICs. Compared with a CPU/DSP solution, the FPGA delivers deterministic latency under 1 microsecond for HARQ and beamforming loops, critical for closed-loop wireless control. Pair this FPGA with an Intel Stratix 10 companion for centralized baseband if higher density is needed.
Recommended
Radar Signal Processing
The 10AX090S2F45E2SG is a strong fit for phased-array radar signal processing in defense and weather-radar systems. Its variable-precision DSP blocks implement pulse-Doppler FFTs, MTI filters, and CFAR detectors directly in fabric, sustaining multi-gigasample throughput per second. The 20nm process and 1932-FCBGA package provide the thermal headroom for sustained DSP loads typical of radar processing. The high I/O count (624) supports multi-channel ADC interfaces via JESD204B/C sub-class-1 links at 12.5 Gbps, reducing board complexity. Compared with discrete DSP clusters, the FPGA delivers deterministic latency with deterministic sample alignment, essential for synthetic-aperture radar and SAR imaging. Use the part's on-die M20K blocks as FFT window-storage and overlap-save buffers.
Recommended
Test and Measurement Equipment
The 10AX090S2F45E2SG supports high-end oscilloscope, logic-analyzer, and protocol-analyzer front-end processing. Its 900K logic elements can implement multi-channel protocol decoders (PCIe Gen3, USB 3.1, SATA III, 100GbE) with on-die statistics aggregation. The hard PCI Express Gen3 IP block enables direct host-attached form factors, while the multi-gigabit transceivers interface with high-speed ADCs and DACs commonly used in automated test equipment (ATE). The -2 speed grade delivers the Fmax margin needed for 400 MHz state machines with timing closure across industrial temperature ranges. Compared with ASIC ATE controllers, the FPGA offers reconfigurability for new protocols without respin.
Recommended
Broadcast Video Infrastructure
The 10AX090S2F45E2SG serves in broadcast video routers, contribution encoders, and IP-based playout systems. The FPGA's high transceiver count enables SDI-over-IP (SMPTE 2110) and 12G-SDI multi-stream aggregation at 12 Gbps per channel. The 59 Mbit embedded memory holds reference frames for motion-adaptive deinterlacing and scaling engines used in up/down/cross-converters. The -2 speed grade balances fabric performance against thermal envelopes for 1U rack-mountable chassis. Compared with ASSP video processors, this FPGA allows custom codec and watermarking IP integration. Pair with an Intel Cyclone 10 GX for low-cost edge I/O processing if needed.
Recommended
PCI Express Gen3 Endpoint Card
The 10AX090S2F45E2SG accelerates host-attached workloads such as NVMe controller offload, machine-learning inference, and high-frequency trading. Its hard PCI Express Gen3 x8 IP block provides 8 Gbps lane bandwidth with DMA engines, while the remaining FPGA fabric implements custom acceleration pipelines. The 7.2 Mbyte M20K memory on-chip eliminates off-chip DRAM round-trips for small ML models or trade-book state machines. The 1932-FCBGA package provides the signal-integrity margin required for PCIe Gen3 signaling compliance. Compared with general-purpose GPUs, this FPGA delivers deterministic microsecond-level latency for HFT workloads. Pair with DDR4 ECC memory on the same board for high-throughput data ingest.
Recommended
OTN/CPRI Fronthaul Telecom
The 10AX090S2F45E2SG is well matched to OTN (Optical Transport Network) cross-connects and CPRI fronthaul aggregation in telecom central-office equipment. The FPGA's transceivers support OTU2/OTU4 line rates up to 11.18 Gbps and 9.8 Gbps CPRI with multi-channel aggregation. The high logic density implements forward-error-correction (FEC) codecs such as Reed-Solomon and LDPC at line rate. The 624 user I/Os expose multiple QSFP28/SFP28 cage interfaces for 25G/10G line cards. The -2 speed grade sustains FEC processing at OTU4 line rates without dropping cells. Compared with merchant OTN ASSPs, the FPGA allows custom mapping and OAM (Operations, Administration, Maintenance) extensions.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S2F45E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45E2LG | 10AX090S2F45E1SG | 10AX090S1F45E1SG | 10AX090S1F45I1SG | 10AS066K3F35I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-FCBGA (F45) | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1932-FCBGA (F45) - same | 1152-FCBGA (F35) - different |
| Speed Grade | -2 (mid) | -2 | -1 | -1 | -1 | -3 (Arria 10 SoC) |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 660,000 |
| Embedded Memory (Mbits) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 44.0 Mbit |
| User I/O | 624 | 624 | 624 | 624 | 624 | [DATA_NEEDED] |
| Operating Temperature | Extended (E2) | Extended (E2) | Extended (E2) | Extended (E2) | Industrial (I1) | Industrial (I2) |
| Solder Ball Finish | Gold (G) | Matte tin (L) | Gold (G) | Gold (G) | Gold (G) | Gold (G) |
Key Differentiators
- Lead-free solder ball finish alternative available with identical silicon (vs 10AX090S2F45E2LG)
- Lower-power -1 speed grade available for thermal-constrained designs (vs 10AX090S2F45E1SG)
- 900K LE density within Arria 10 GX positions this part for mid-range infrastructure (vs 10AX090N3F40E2LG)
Design Notes
Estimated: A 900K-LE Arria 10 GX in -2 speed grade can dissipate 8-15 W at full utilization depending on toggle rate. With the 1932-FCBGA package (theta-JA approximately 4-6 C/W in still air), the junction temperature may rise 60-90 C above ambient. Design a 4-layer PCB with a copper pour area of at least 8 square inches under the package and use thermal vias (0.3 mm pitch, filled) to dissipate heat to inner layers. Without adequate cooling, sustained utilization above 70% risks thermal shutdown in sealed enclosures.
The 1932-ball FCBGA requires high-density interconnect (HDI) PCB fabrication with microvia stack-ups. Use 1.0 mm or 0.8 mm pitch BGA escape routing with sequential lamination. Match trace impedance to 50 ohms single-ended / 90 ohms differential for high-speed transceiver channels. Reference the Altera AN 528 (PCB layout guidelines for Arria 10) for via and stack-up recommendations; failure to follow these can degrade signal-integrity at multi-gigabit rates.
Decoupling the Arria 10 GX requires a hierarchical capacitor network: bulk 22 uF polymer capacitors near the power pins, 4.7 uF ceramic at the IC edge, 0.1 uF X7R close to each power pin, and 0.01 uF/0.001 uF high-frequency bypass on the package underside. Estimated: at least 60-80 capacitors are required for full FPGA supply stability. Group PLL power pins with star-routing back to a low-noise LDO; the transceiver PLLs are particularly sensitive to supply noise above 1 MHz.
Do not mix -1, -2, and -3 speed grades on the same I/O bank if your design uses source-synchronous interfaces - timing skew differs between grades. Also ensure the configuration scheme (AS x4, JTAG, or passive parallel) is selected before PCB layout, as MODE pins are shared with user I/O. Estimated: Approximately 5% of Arria 10 designs have configuration-pin conflicts that require re-spinning the PCB.
Compliance Information
RoHS compliance confirmed via Altera/Intel product page. Lead-free solder ball finish variants available (LG suffix). Not AEC-Q100 qualified - FPGAs of this class typically used in industrial/telecom not automotive under-hood applications.
