10AX090S2F45I2LG - Arria 10 GX FPGA 900K LE | Intel | 1932-FCBGA
MPN: 10AX090S2F45I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5200 | $5,200.00 |
| 10 | $4900 | $49,000.00 |
| 100 | $4500 | $450,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3800 | $3,800,000.00 |
Drop-in alternatives for 10AX090S2F45I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S2F45I1SG
✅ Drop-In✓ In Stock
$3620 / Unit
View Datasheet →10AX090S2F45E2LG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AX090S2F45E2SG
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →10AX090S2F45E1SG
✅ Drop-In✓ In Stock
$4890 / Unit
View Datasheet →10AX090S2F45E1LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX090S2F45I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Device Model | 10AX090 |
| Logic Elements | 900000 |
| Embedded Memory Bits | 59234304 |
| Number of User I/Os | 624 |
| Package Type | 1932-BBGA, FCBGA |
| Operating Voltage (Core) | 0.9 V |
| Process Technology | 20 nm |
| Operating Temperature Grade | Industrial |
| Temperature Range (I2 suffix) | -40C to +100C |
| Speed Grade | 2 |
| Lead Finish | Lead-free (LG suffix, RoHS compliant) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Package Code | BGA, FCBGA |
| Package Shape | Square |
10AX090S2F45I2LG square Pin Configuration Guide
Complete pinout information for 10AX090S2F45I2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S2F45I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S2F45I2LG is suitable for 6 applications: 100G/400G Ethernet Line Cards, OTN/WDM Optical Transport Platforms, Broadcast Video Processing, Radar and DSP Front-End Processing, PCIe Gen3 Accelerator Cards, Test & Measurement Instrumentation.
100G/400G Ethernet Line Cards
The 10AX090S2F45I2LG is well matched to 100G and 400G Ethernet line-card designs because its Arria 10 GX architecture integrates transceivers capable of up to 28.05 Gbps per channel (speed grade dependent). With 900K logic elements and 624 user I/Os, designers can implement MAC, PCS, and FEC blocks in fabric alongside the hard SerDes. The 59 Mbit of embedded memory supports packet buffering and statistics counters without external SRAM. Industrial temperature grade (I2) suits telecom central-office environments where ambient air may reach 55-65C inside sealed enclosures.
Recommended
OTN/WDM Optical Transport Platforms
For OTN (Optical Transport Network) and WDM platforms, the 10AX090S2F45I2LG delivers the DSP horsepower and SerDes density required for OTU4 framer/mapper functions and DSP-based chromatic-dispersion compensation. The 20nm Arria 10 fabric supports 100G coherent optical DSP blocks while the integrated hard IP for forward error correction (FEC) accelerates soft-decision decoding. With 624 user I/Os, designers can directly interface to CFP/CFP2 ACO modules and backplane connectors. The 1932-ball FCBGA footprint is shared across the F45 family, simplifying board reuse between 10AX090, 10AX066, and 10AX048 SKUs.
Recommended
Broadcast Video Processing
The 10AX090S2F45I2LG is widely deployed in broadcast video infrastructure such as 4K/UHD up-converters, multiviewers, and contribution encoders. Its 900K logic elements plus embedded DSP blocks deliver real-time processing of uncompressed 4K streams at 60 fps. The 624 user I/Os accommodate multiple SDI interfaces (SD/HD/3G/12G-SDI) and HDMI/DisplayPort bridging. Industrial temperature grade suits outdoor broadcast antenna farms and mobile production units. Designers benefit from the F45 family pinout compatibility that allows scaling logic density without board re-spin.
Recommended
Radar and DSP Front-End Processing
Radar and electronic-warfare front-end processing demands both high DSP throughput and low-latency serial I/O - both of which the 10AX090S2F45I2LG provides via its hardened floating-point DSP blocks and 28 Gbps capable transceivers. Engineers can implement FFT, beamforming, and pulse-Doppler processing entirely in fabric, while the 59 Mbit embedded memory absorbs intermediate samples between FFT stages. The F45 1932-ball FCBGA footprint is compatible with the 10AX115 and 10AX130 SKUs, enabling a single PCB design that scales with mission requirements.
Recommended
PCIe Gen3 Accelerator Cards
The 10AX090S2F45I2LG integrates a hard PCIe Gen3 IP core, eliminating soft IP timing closure headaches and freeing logic for the user's acceleration algorithm. Combined with 624 user I/Os and 900K logic elements, designers can implement x8/x16 PCIe interfaces plus the compute engine on a single device. Industrial temperature grade (I2) suits edge-acceleration servers and factory-floor compute nodes. The F45 BGA footprint matches the wider Arria 10 family, allowing the same host board to host larger or smaller FPGAs across product tiers.
Recommended
Test & Measurement Instrumentation
In test and measurement instruments such as protocol analyzers, oscilloscopes, and high-speed digitizers, the 10AX090S2F45I2LG provides the simultaneous combination of high-speed serial I/O (for compliance test patterns), large logic capacity (for real-time protocol decoding), and abundant memory bandwidth. The industrial temperature grade ensures stable operation in lab environments that may not be climate controlled. The 1932-ball FCBGA is shared across the Arria 10 family, enabling OEMs to reuse PCB designs across product lines.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S2F45I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45I1SG | 10AX090S2F45E2LG | 10AX090S2F45E2SG | 10AX090S2F45E1SG | 10AX090S2F45E1LG |
|---|---|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 900000 | 900000 - same | 900000 - same | 900000 - same | 900000 - same | 900000 - same |
| Embedded Memory Bits | 59234304 | 59234304 - same | 59234304 - same | 59234304 - same | 59234304 - same | 59234304 - same |
| User I/Os | 624 | 624 - same | 624 - same | 624 - same | 624 - same | 624 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) |
| Speed Grade | 2 | 1 (faster Fmax) | 2 - same | 2 - same | 1 (faster Fmax) | 1 (faster Fmax) |
| Lead Finish | Lead-free (LG, RoHS compliant) | Leaded (SG) | Lead-free (LG, RoHS compliant) - same | Leaded (SG) | Leaded (SG) | Lead-free (LG, RoHS compliant) - same |
Key Differentiators
- Industrial temperature grade I2 vs E-temp siblings (vs 10AX090S2F45E2LG)
- Higher Fmax margin than speed-grade-2 alternatives (vs 10AX090S2F45I1SG)
- Drop-in scalable across the 10AX090 F45 family (vs 10AX066N2F40E1SG)
Design Notes
The 1932-ball FCBGA package of the 10AX090S2F45I2LG demands HDI PCB technology (any-layer microvia stackup) to escape signals from the dense inner-row balls. Use Intel's package mechanical drawing to plan escape patterns: typically a 1mm ball pitch allows 4-mil trace and 0.4mm via pad diameters, requiring at least a 1-2-1 or 2-4-2 stackup. Estimate: each escape fan-out uses one signal layer for every two rows of balls, so plan at least 10-12 routing layers plus dedicated power planes.
The Arria 10 GX device requires multiple supply rails: core (VCC, 0.9V typical), VCCPT (0.85V), VCCAUX/VCCAUX_PLL, multiple transceiver rails (VCCR/VCCT/VCCP/VCCPT for the GX channels), and I/O banks at 1.2-3.0V. Decoupling must follow the Intel Quartus PDN tool output: typically 10s of low-ESR MLCCs (0201/0402 100nF-10uF) plus bulk polymer or tantalum capacitors near the package. Estimate: peak core current can exceed 30A during heavy logic utilization, so use a 6+ layer stackup with two dedicated core power planes.
Industrial-grade Arria 10 GX parts in a 1932-ball FCBGA can dissipate 20-40W depending on transceiver and logic utilization. Use the Intel Thermal Modeling tool and follow the device datasheet's theta_JA (junction-to-ambient) figures. Recommended approach: thermal vias in the BGA land pad area, top-side heatsink retention frame for airflow >1 m/s, and monitor the on-die temperature via the internal ALT_VOLTAGE_TEMPERATURE sensor available through the System Console. Estimate: without airflow, junction temperature can rise 30-40C above ambient in dense designs.
The GX transceivers on this device support data rates up to 28.05 Gbps (speed-grade dependent). Use the Arria 10 GX Transceiver User Guide and Intel's PCB design guidelines: target differential impedance of 85-100 ohms for transceiver channels, length matching within 150 mils for any pair, and connector breakouts sized for the selected Phoenix/Tyco backplane footprint. Pre-emphasis and equalization settings should be tuned per-channel using the Transceiver Toolkit in Quartus Prime.
Common pitfalls when designing with the 10AX090S2F45I2LG include: (1) mis-assigning the F45 BGA pinout file to a different package code, (2) using wrong MSL rating for the FCBGA (the part is MSL3 or MSL4 - dry-pack and floor-life controls required), (3) omitting the configuration flash (e.g., EPCQ256) which is mandatory because Arria 10 requires external configuration memory for SRAM-based FPGA bitstream loading, (4) confusing I-temp and E-temp parts during assembly - both share the same ball finish but different operating ranges. Always double-check the ordering suffix against the BOM.
Compliance Information
RoHS compliance and lead-free finish confirmed by the LG suffix per the Altera/Intel ordering information. REACH, halogen-free, and conflict-mineral status not stated in the Verified Web Data.
