10AX115N1F40E1SG - Arria 10 GX FPGA, 1150K LE, 1517-FCBGA | Intel
MPN: 10AX115N1F40E1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8450 | $8,450.00 |
| 10 | $8120 | $81,200.00 |
| 100 | $7650 | $765,000.00 |
| 500 | $7280 | $3,640,000.00 |
| 1,000 | $6995 | $6,995,000.00 |
Drop-in alternatives for 10AX115N1F40E1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F40E1SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3325 / Unit
View Datasheet →10AX115N1F40E2SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115N1F40E3SG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AX115N1F40I1SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3450 / Unit
View Datasheet →10AX115N2F40I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$3750 / Unit
View Datasheet →10AX115N1F40E1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits |
| User I/O Count | 600 |
| Package | 1517-BBGA, FCBGA (F40) |
| Ball Pitch | 1.0 mm |
| Speed Grade | -E1 (fastest) |
| Process Technology | 20 nm |
| Transceiver Data Rate (max) | 28.05 Gbps |
| DSP Blocks | Hardened IEEE 754 single-precision floating-point |
| Embedded Hard Memory Controllers | Yes (DDR4/DDR3) |
| PCIe Hard IP | Gen3 x8 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore |
| Operating Temperature | Extended grade |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
10AX115N1F40E1SG 1517-bbga, fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115N1F40E1SG (1517-bbga, fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N1F40E1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N1F40E1SG is suitable for 6 applications: 100G/400G Ethernet Line Card, Military Radar Signal Processing, Medical Imaging Accelerator, Professional 4K/8K Video Broadcast, High-Performance Computing Test Infrastructure, Industrial Multi-Axis Motor Control.
100G/400G Ethernet Line Card
The 10AX115N1F40E1SG's 28.05 Gbps transceivers and hard 100G MAC IP make it a strong fit for 100G Ethernet line cards in carrier-grade switches and OTN muxponder designs. Its 1150K logic elements and 68 Mbit embedded memory sustain multi-channel PCS and MAC functions without external buffering. Hard PCIe Gen3 x8 enables direct host CPU offload, reducing board complexity. Compared to soft-logic MAC implementations, the hardened MAC saves ~25% of logic and power, allowing higher port density per PCB.
Recommended
Military Radar Signal Processing
The 10AX115N1F40E1SG's hardened IEEE 754 single-precision DSP blocks deliver up to ~1.5 TFLOPS, ideal for weather and surveillance radar front-end beamforming. Its 600 user I/Os accommodate multiple ADC/DAC channels (e.g., 16x JESD204B lanes) without external muxing. The -E1 speed grade minimizes FFT latency, supporting sub-microsecond pulse processing. Extended temperature grade meets MIL-STD-810 shock and vibration envelopes when paired with appropriate PCB stack-up.
Recommended
Medical Imaging Accelerator
The 10AX115N1F40E1SG supplies the compute density required for CT and MRI image reconstruction pipelines (filtered back-projection, iterative reconstruction). Its dual ARM Cortex-A9 hard cores host the patient-side application stack, while FPGA fabric accelerates kernels like FFT2D and convolution. Hard DDR4 controllers move multi-gigabyte volume datasets at line rate. The 28 Gbps transceivers push reconstructed frames to display GPUs over low-latency links, reducing radiologist review time.
Recommended
Professional 4K/8K Video Broadcast
The 10AX115N1F40E1SG supports 12G-SDI and quad-link 3G-SDI pipelines required for 4K/8K UHD broadcast workflows. Its 1150K LEs implement multi-channel deinterlacers, color-space converters, and HDR tone-mapping in parallel, sustaining sub-frame latency for live production. Hard DDR4 controllers buffer uncompressed video streams up to 12 Gbps per channel. The -E1 speed grade is critical for pixel-rate processing; slower bins risk underrun on multi-stream boards.
Recommended
High-Performance Computing Test Infrastructure
The 10AX115N1F40E1SG serves as a PCIe Gen3 accelerator card in HPC validation racks, emulating ASIC prototypes and stress-testing CPU/GPU fabrics. Its 1150K LEs and 68 Mbit memory host large transaction queues, while 28 Gbps transceivers provide front-panel debug taps. Hard ARM cores run RTOS-controlled stimulus generators, offloading host CPU. The -E1 bin meets tight PCIe turnaround latency budgets without external retimers.
Recommended
Industrial Multi-Axis Motor Control
The 10AX115N1F40E1SG drives high-axis-count CNC and robotics platforms requiring deterministic sub-microsecond control loops. Its hardened DSP blocks execute FOC (field-oriented control) and SVPWM for 12+ axis machines in parallel, replacing stacks of discrete MCUs. The 600 user I/Os support encoder interfaces, sigma-delta ADC buses, and EtherCAT slaves via external PHYs. Extended temperature operation and conformal coating enable factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N1F40E1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F40E1SG | 10AX115N1F40E2SG | 10AX115N1F40E3SG | 10AX115N1F40I1SG | 10AX115N2F40I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | -E1 (fastest) | -E1 | -E2 | -E3 | -I1 (industrial) | -I2 (industrial) |
| Transceiver Speed Tier | N1 (28.05 Gbps max) | N2 (slightly lower) | N1 | N1 | N1 | N2 |
| User I/O | 600 | 600 | 600 | 600 | 600 | 600 |
| Operating Temperature | Extended | Extended | Extended | Extended | Industrial | Industrial |
| Embedded Memory (Mbit) | 65.7 | 65.7 | 65.7 | 65.7 | 65.7 | 65.7 |
Key Differentiators
- Fastest extended-temperature speed grade in the 1150K-LE Arria 10 class (vs 10AX115N1F40E2SG)
- N1 transceiver tier for full 28.05 Gbps support (vs 10AX115N2F40E1SG)
- Pin-compatible industrial upgrade path (vs 10AX115N1F40E1SG vs 10AX115N1F40I1SG)
- High I/O count versus F34-package alternatives (vs 10AX115H4F34E3SG)
Design Notes
The 10AX115N1F40E1SG requires separate voltage rails: core at 0.9V (nominal) or 0.95V (high-performance), transceiver PLL at 2.5V, transceiver TX/RX at 1.0-1.2V, and I/O banks at 1.2V-3.3V. Use the Quartus PowerPlay early power estimator before PCB commitment. Decoupling must include 200+ 0402/0201 ceramics plus bulk tantalums. Power sequencing: bring up core before I/O banks to avoid latch-up.
The 1517-FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8 C/W with proper heatsink attachment. Estimated: at a 25W power envelope with ambient of 55C, junction rises about 200C above ambient without cooling - exceeding the 100C junction limit. A thermal interface material plus finned heatsink is mandatory; consider liquid cooling for >40W applications.
Use 12 PCB layers minimum with 1oz copper on outer and 0.5oz on inner for the FCBGA escape routing. The 1.0mm ball pitch allows microvia escape from inner pads. Maintain a 4-6 layer stackup dedicated to core/pre-emphasis rails. Series capacitors on TX/RX buffers require 0201 footprints placed within 200 mil of the BGA balls to meet signal integrity for 28 Gbps channels.
Do not confuse speed grade -E1 (fastest) with -I1 (industrial). The letter denotes the temperature grade; the digit denotes the speed bin. Migrating a bitstream from -E1 to -E3 may fail timing closure at 28 Gbps without recompilation. Always validate bitstream across all environment corners before mass production. Configuration via JTAG or AS mode requires proper MSEL pinstrapping.
Place the configuration flash (EPCQ-L) within 2 inches of the dedicated AS pins. Route clock inputs with 100 ohm differential and avoid stubs. For multi-protocol transceivers, isolate PLL power with their own ferrite beads. Maintain at least 100 mil spacing between analog transceiver traces and digital logic to avoid noise coupling into the CDR blocks.
Compliance Information
RoHS and REACH compliance per Altera/Intel product page. Not AEC-Q100 qualified - Arria 10 is not marketed for automotive. Conflict minerals statement available from Intel.
