10AX115N2F40I2LG - Arria 10 GX FPGA 1150K LE | Intel / Altera
MPN: 10AX115N2F40I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9843.84 | $9,843.84 |
| 10 | $9341.65 | $93,416.50 |
| 100 | $8875.1 | $887,510.00 |
| 500 | $8420.55 | $4,210,275.00 |
| 1,000 | $7965.99 | $7,965,990.00 |
Drop-in alternatives for 10AX115N2F40I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115N2F40I1SG
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View Datasheet →10AX115N2F40E2LG
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View Datasheet →10AX115N2F40E1SG
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View Datasheet →10AX115N1F45I1SG
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View Datasheet →10AX115N1F40I1SG
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View Datasheet →10AX115N2F40I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits |
| User I/O Count | 600 |
| Package | 1517-ball FCBGA |
| Speed Grade | 2 |
| Temperature Grade | Industrial |
| Process Technology | 20 nm |
| Maximum Transceiver Data Rate | 14.1 Gbps |
| Supply Voltage (Core) | 0.9 V |
| Hardened Floating-Point DSP | Yes |
| Partial Reconfiguration | Yes |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP) |
| Operating Temperature Range | -40C to +100C (industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX115N2F40I2LG 1517-ball fcbga Pin Configuration Guide
Complete pinout information for 10AX115N2F40I2LG (1517-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115N2F40I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115N2F40I2LG is suitable for 6 applications: High-Performance DSP / Radar Signal Processing, 4K / 8K Video Broadcast Infrastructure, 10G / 40G Network Packet Processing, FPGA-Based Hardware Acceleration for Test & Measurement, Factory Automation & Machine Vision, Aerospace & Defense Communication Links.
High-Performance DSP / Radar Signal Processing
The 10AX115N2F40I2LG suits radar and electronic-warfare DSP pipelines thanks to its hardened floating-point DSP blocks and 1,150,000 logic elements. The Arria 10 GX architecture delivers significantly higher GMACS/mm^2 than soft DSP implementations while preserving deterministic latency. Up to 14.1 Gbps transceivers enable direct interface to ADC front ends and high-speed analog signal chains in defense and aerospace platforms. Designers commonly pair this FPGA with 10AX115N2F40I1SG as a speed-grade drop-in alternative when timing margins are tight.
Recommended
4K / 8K Video Broadcast Infrastructure
The 10AX115N2F40I2LG powers broadcast and pro-AV video infrastructure where its 68,857,856 embedded memory bits absorb multi-frame buffers and its high logic density enables real-time pixel processing. Industrial temperature grade supports deployment in server rooms and headend facilities. The 600 user I/Os and 14.1 Gbps transceivers support 12G-SDI and HDMI 2.0 interfaces. The hardened floating-point DSP blocks accelerate color-space conversion and noise reduction algorithms.
Recommended
10G / 40G Network Packet Processing
The 10AX115N2F40I2LG is well suited for 10G/40G network packet processing line cards. Its hardened PCIe Gen3 x8 IP enables direct host interface, while the integrated transceivers up to 14.1 Gbps support multiple SFP+/QSFP+ optical links. The large embedded memory provides ample packet queue storage and lookup tables, offloading critical state from external TCAM/RLDRAM. Industrial temperature grade allows deployment in carrier-grade edge platforms with controlled ventilation.
Recommended
FPGA-Based Hardware Acceleration for Test & Measurement
The 10AX115N2F40I2LG accelerates DSP-intensive test and measurement workloads such as real-time FFT, modulation analysis, and protocol decoding. With 1,150,000 logic elements and hardened floating-point DSP blocks, the device delivers deterministic throughput unmatched by CPU/GPU implementations. Its 600 user I/Os allow direct connection to high-speed ADC/DAC front ends. Industrial temperature grade ensures stable operation in lab and production test fixtures.
Recommended
Factory Automation & Machine Vision
The 10AX115N2F40I2LG fits high-end machine vision and factory automation systems where multi-camera synchronization and real-time image analysis are required. Its 1,150,000 logic elements and hardened floating-point DSP blocks accelerate pixel-level processing, while 600 user I/Os allow direct interface to high-speed Camera Link or CoaXPress sensors. Industrial temperature grade handles the thermal variation typical of factory-floor enclosures.
Recommended
Aerospace & Defense Communication Links
The 10AX115N2F40I2LG supports secure aerospace communication links where hardware reconfiguration, radiation tolerance considerations, and hardened DSP are required. Transceivers up to 14.1 Gbps support Serial RapidIO, 10 GbE, and proprietary defense protocols. The large embedded memory enables on-chip packet buffer and crypto acceleration. Combined with the industrial temperature grade and packaging robustness, this FPGA is well suited for ground and airborne defense platforms.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115N2F40I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115N2F40I1SG | 10AX115N2F40E2LG | 10AX115N2F40E1SG | 10AX115N1F45I1SG | 10AX115N1F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 1517-ball FCBGA | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA - same | 1517-ball FCBGA (F45) - same ball count | 1517-ball FCBGA - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 |
| User I/O | 600 | 600 | 600 | 600 | 600 | 600 |
| Speed Grade | 2 | 1 (slower) | 2 (same) | 1 (slower) | 1 (slower) | 1 (slower) |
| Temperature Grade | Industrial | Industrial | Extended | Extended | Industrial | Industrial |
| Max Transceiver Rate | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps |
Key Differentiators
- Higher speed grade (2) for tighter timing margins (vs 10AX115N2F40I1SG)
- Industrial temperature grade for harsher environments than commercial (vs 10AX115N2F40E2LG (extended temp))
- Hardened floating-point DSP blocks for deterministic latency (vs Cyclone 10 GX (lower density alternative))
Design Notes
The 10AX115N2F40I2LG requires a multi-rail power architecture: 0.9V core, 1.8V/2.5V/3.3V auxiliary, and dedicated transceiver supplies (typically 1.0V/1.2V). Altera's PowerPlay Early Power Estimator (EPE) should be run before PCB layout to size switching regulators. Estimated: core current at full utilization can exceed 30A on 0.9V - use parallel multiphase buck regulators with inductor DCR current sensing. Power-on sequencing must follow the datasheet order to avoid latch-up.
The 1517-ball FCBGA package has a thermal resistance of approximately 2 C/W (junction-to-case) when properly mounted with a high-performance thermal interface material. At estimated 25W total power dissipation with full transceiver utilization, the case temperature will rise 50C above ambient without a heatsink. Industrial temperature grade (-40C to +100C ambient) requires a thermal solution maintaining junction temperature below 100C. Forced airflow (200 LFM minimum) is recommended for closed enclosures.
The 1517-ball FCBGA requires a high-density PCB with microvia (laser-drilled) stack-up for breakout routing. Use a 12-layer or 16-layer stack-up with full power/ground planes to maintain signal integrity on multi-Gbps transceivers. Transceiver channels must maintain 85 ohm differential impedance with length matching to within 150 milps. Decoupling requires 0402-size capacitors placed within 100 mils of every power ball pair.
Do not assume pinout compatibility between the F40 (40mm) and F45 (45mm) package variants of the Arria 10 family - while ball count is the same, ball mapping differs. When migrating from speed grade 2 to speed grade 1, re-run timing analysis because Fmax will drop approximately 10%. Configuration scheme (JTAG, AS, PS) must be planned early: the design supports passive serial, fast passive parallel, active serial, and active parallel configurations with dedicated MODE pins.
Compliance Information
RoHS compliance per Altera product page. Industrial temperature grade per datasheet. AEC-Q100 not applicable - this is an FPGA IC, not an automotive-qualified discrete.
