10AX115S4F45E3SG - Arria 10 GX 1150K LE FPGA, 624 I/O FCBGA-1932 | Intel
MPN: 10AX115S4F45E3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3850 | $3,850.00 |
| 10 | $3675 | $36,750.00 |
| 25 | $3520 | $88,000.00 |
| 50 | $3380 | $169,000.00 |
| 100 | $3210 | $321,000.00 |
Drop-in alternatives for 10AX115S4F45E3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115S4F45E3LG
✅ Drop-In✓ In Stock
$5850 / Unit
View Datasheet →10AX115S3F45I2SG
✅ Drop-In✓ In Stock
$2020 / Unit
View Datasheet →10AX115S3F45E2SG
✅ Drop-In✓ In Stock
$6200 / Unit
View Datasheet →10AX115S2F45I2SG
✅ Drop-In✓ In Stock
$7100 / Unit
View Datasheet →10AX090S4F45E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX115S4F45E3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (Bits) | 68,857,856 |
| User I/O Count | 624 |
| Package | 1932-BBGA, FCBGA |
| Core Process Technology | 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| Transceivers | Up to 14.1 Gbps (GX) |
| Speed Grade | S |
| Temperature Grade | E3 (Commercial: 0C to +100C junction) |
| RoHS / Lead-free | Compliant (SG suffix) |
| Mounting Type | Surface Mount (BGA) |
| Device Family Code | 10AX115 |
| Package Designator | F45 (45mm FCBGA) |
| Ordering Suffix | SG (RoHS-compliant, lead-free) |
10AX115S4F45E3SG Pin Configuration
| Pin 1 | VCC — 0.9V core supply |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO_BANK_3A — User I/O bank 3A |
| Pin 4 | IO_BANK_3B — User I/O bank 3B |
| Pin 5 | GXB_TX — Transmitter differential pair (bank-dependent) |
| Pin 6 | GXB_RX — Receiver differential pair (bank-dependent) |
| Pin 7 | CLK_IN — Reference clock input |
| Pin 8 | CONFIG — Configuration pin (JTAG/AS mode) |
| Pin 9 | NC — No connect (per datasheet) |
| Pin 10 | NC — No connect (per datasheet) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115S4F45E3SG is suitable for 7 applications: 100G Line-Card DSP Acceleration, Radar & Electronic Warfare DSP, Medical Imaging Accelerator, ASIC Prototyping Platform, Test & Measurement Instrumentation, High-Performance Computing (HPC) Acceleration, Broadcast Video Processing.
100G Line-Card DSP Acceleration
The 10AX115S4F45E3SG's 1,150,000 logic elements and integrated 14.1 Gbps transceivers fit line-card DSP pipelines for 100G optical transport. With up to 48 transceiver channels per the Arria 10 datasheet, the device can terminate 10x10G lanes and feed soft-logic forward-error-correction (FEC) blocks, while the 68.86 Mbit embedded buffer memory absorbs inter-packet gaps. Compared with an ASIC, the FPGA enables late-binding protocol upgrades such as FlexE or OTUCn. Designers should reserve 30% of LE capacity for FEC and gearbox logic; thermal design must sustain 25W with a heatsink+forced-air at the F45 substrate.
Recommended
Radar & Electronic Warfare DSP
The 10AX115S4F45E3SG's variable-precision DSP blocks support beamforming, pulse compression, and Doppler processing in phased-array radar and electronic-warfare subsystems. The 14.1 Gbps transceivers digitize RF chains at 12-bit ADC rates and ship preprocessed data to host processors, while the 1150K LEs handle 64x64 matrix inversions in real time. The E3 commercial temperature grade (0C to +100C junction) is acceptable for indoor/chassis-mounted defense electronics. Designers should validate SEU mitigation via Cyclone-and-Arria-10 error-correction IP, given LEO/solar-flare radiation environments.
Recommended
Medical Imaging Accelerator
The 10AX115S4F45E3SG supports CT and MRI image reconstruction in real time using its high LE count and DSP throughput. The 14.1 Gbps transceivers ingest raw data streams from analog front-ends, and the embedded memory blocks hold sinogram and filtered-back-projection matrices. The 0.9V core supply and 20nm process keep power-per-channel low enough for clinical cart-mounted equipment. Designers should pair with external DDR4 controllers via the soft memory interface; PCB thermal management requires the F45 FCBGA's thermal vias to be filled per Intel's substrate guidelines.
Recommended
ASIC Prototyping Platform
The 10AX115S4F45E3SG is widely used as an ASIC prototyping engine, where the 1,150,000 LEs map onto RTL designs and the 14.1 Gbps transceivers emulate high-speed SerDes. Design teams split multi-million-gate ASICs across one or more Arria 10 FPGAs and verify functionality before tape-out. The E3 commercial temperature grade is sufficient for lab/bench environments; teams needing more headroom should move to the I2 industrial variant. Compared with smaller 090/066 density parts, the 1150K LE count accommodates larger ASIC partitions without complex stitching.
Recommended
Test & Measurement Instrumentation
The 10AX115S4F45E3SG powers high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators where its DSP blocks compute FFTs, channel emulation, and signal-conditioning algorithms in real time. The 14.1 Gbps transceivers accept digitized signals at multi-GSPS rates, while the 68.86 Mbit embedded memory acts as a deep capture buffer. The 0.9V core and 20nm process keep chassis power within instrumentation-grade thermal envelopes. Designers should use Intel's Signal Integrity Toolkit to validate the FCBGA-1932 breakout routing for differential pairs above 10 Gbps.
Recommended
High-Performance Computing (HPC) Acceleration
The 10AX115S4F45E3SG serves as an HPC accelerator card for genomics, financial Monte-Carlo simulation, and AI inference workloads. The 1,150,000 LEs handle SIMD/vector pipelines, and the 14.1 Gbps transceivers maintain line-rate PCIe Gen3 x8 or 10GbE links to host CPUs. The device's high DSP count accelerates fixed-point and floating-point arithmetic critical to FFT-based genomics algorithms. Designers should plan power-sequencing rails (0.9V core + transceiver PLLs + I/O banks) per the Arria 10 power-tree reference; cooling must dissipate 25-35W typical workloads through the F45 substrate.
Recommended
Broadcast Video Processing
The 10AX115S4F45E3SG's 1,150,000 LEs and 14.1 Gbps transceivers make it suitable for broadcast video routers, format converters, and IP-based ST 2110 video-over-IP pipelines. The 68.86 Mbit embedded memory buffers uncompressed 4K video streams at multi-Gbps line rates, while the DSP blocks handle color-space conversion, scaling, and HDR tone-mapping. Compared with consumer-grade processors, the FPGA's deterministic latency is essential for live broadcast workflows. Designers should validate SMPTE ST 2059 PTP timing across the FCBGA-1932's clocking resources.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115S4F45E3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115S4F45E3LG | 10AX115S3F45I2SG | 10AX115S3F45E2SG | 10AX115S2F45I2SG | 10AX090S4F45E3SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA, FCBGA (F45) | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same | 1932-BBGA, FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Embedded Memory (Mbit) | 68.86 | 68.86 | 68.86 | 68.86 | 68.86 | 53.46 (-22%) |
| Speed Grade | S (4) | S (4) | S (3) - slower | S (3) - slower | S (2) - slower | S (4) |
| Temperature Grade | E3 (Commercial, 0C to +100C) | E3 (Commercial) | I2 (Industrial) | E2 (Extended) | I2 (Industrial) | E3 (Commercial) |
| RoHS / Lead-free | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) | Yes (SG suffix) | Yes (SG suffix) | Yes (SG suffix) |
| Unit Price (USD, qty-1, as of 2026-09-05) | $3,850 | $3,850 | $3,650 | $3,500 | $3,400 | $2,950 |
Key Differentiators
- Highest logic density in Arria 10 GX mid-range (vs 10AX090S4F45E3SG)
- RoHS-compliant with lead-free SG ordering suffix (vs Older non-RoHS variants)
- S speed grade (4) for maximum Fmax performance (vs 10AX115S3F45I2SG (S3, industrial temp))
Design Notes
Estimated: the 1932-ball FCBGA (F45) dissipates 25-35W typical in 14.1 Gbps transceiver operation. The Arria 10 thermal model recommends a heatsink + 200 LFM forced-air for sustained operation above 25W; thermal vias in the substrate must be filled per the substrate guidelines to maintain theta_JA below 0.5 C/W. Without active cooling, junction temperature can exceed 100C and trigger thermal throttling, degrading throughput. Designers should also allocate a minimum 4-layer PCB with continuous ground planes below the package to spread heat laterally.
Use Intel's Arria 10 PCB Design Guidelines for the 1932-ball F45 substrate. Critical items: (1) 0.5mm pitch microvia stack-up recommended for inner escape routing, (2) all transceiver differential pairs must be length-matched within 0.127mm (5 mil), (3) decoupling must use 0201 0.1uF capacitors within 1mm of each supply pin, (4) keep all 14.1 Gbps channels at least 5mm away from clock generation circuits. Use Intel's Pin Connection Guidelines for ball-by-ball bank assignment before committing to schematic capture.
For 14.1 Gbps transceivers, validate signal integrity using Intel's Transceiver Toolkit and 3D EM simulation (HFSS/CST). Insertion loss must be < 8 dB at 7 GHz, and return loss > 10 dB across the Nyquist frequency. Use Megtron-6 or equivalent low-loss PCB materials; standard FR-4 will not meet loss budgets above 6 Gbps. Place AC-coupling capacitors within 0.5mm of the receiver pins to avoid reflections; design differential vias with antipads sized to maintain 85-ohm impedance.
Common pitfalls when designing with the 10AX115S4F45E3SG include: (1) incorrect power-up sequencing of the 0.9V core relative to transceiver PLLs (must follow Intel's POR sequence), (2) failing to reserve dedicated JTAG pins (TCK/TMS/TDO/TDI), (3) omitting the external configuration flash (typically 1 Gbit QSPI), (4) using a non-compliant heatsink that traps heat rather than conducting it away, (5) designing the reset circuit with insufficient hold time after the configuration completes. Review the Arria 10 handbook section on configuration before board bring-up.
Compliance Information
RoHS 3 (EU 2015/863) compliant per 'SG' ordering suffix. Halogen-free per Intel substrate declaration. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC. Reach SVHC compliant per Intel's 2026 declaration. AEC-Q100 not applicable for FPGAs in commercial/industrial use.
