10AX115S2F45I2SG - Arria 10 GX FPGA, 1.15M LE, 1932-BGA | Altera
MPN: 10AX115S2F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8450 | $8,450.00 |
| 10 | $8125 | $81,250.00 |
| 50 | $7800 | $390,000.00 |
| 100 | $7450 | $745,000.00 |
| 250 | $7100 | $1,775,000.00 |
Drop-in alternatives for 10AX115S2F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX115S2F45I2LG
✅ Drop-In✓ In Stock
$3895 / Unit
View Datasheet →10AX115S2F45E2SG
✅ Drop-In✓ In Stock
$6975.76 / Unit
View Datasheet →10AX115S1F45I1SG
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10AX115S2F45I1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AX090S2F45I2SG
✅ Drop-In✓ In Stock
$3750 / Unit
View Datasheet →10AX115S3F45I2SG
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$2020 / Unit
View Datasheet →10AX115H2F34I2SG
✅ Drop-In✓ In Stock
$3640 / Unit
View Datasheet →10AX115S2F45I2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| User I/O Count | 624 |
| Transceiver Channels | 24 |
| Transceiver Data Rate (max) | 14.1 Gbps |
| DSP Blocks | 1,518 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-ball FCBGA |
| Temperature Grade | Industrial |
| Speed Grade | S2 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (G suffix) |
| Lead-Free | Yes |
10AX115S2F45I2SG 1932-ball fcbga Pin Configuration Guide
Complete pinout information for 10AX115S2F45I2SG (1932-ball fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115S2F45I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115S2F45I2SG is suitable for 7 applications: 10G/40G Ethernet Aggregation Switch, PCIe Gen3 Accelerator Card, Software-Defined Radio / Wireless Base Station, Radar and Beamforming Signal Processing, Video Broadcast and Encoding Platform, Test & Measurement Instrumentation, Medical Imaging and Diagnostics.
10G/40G Ethernet Aggregation Switch
The 10AX115S2F45I2SG is well-suited for 10G/40G Ethernet aggregation switches because its 24 transceivers operate up to 14.1 Gbps - exceeding the 10.3125 Gbps line rate required for 10GbE (10GBASE-R) and supporting multiple 10G SFP+ uplinks or a single 40G QSFP uplink. The hard PCIe Gen3 x8 IP enables direct attachment to a switch CPU or co-processor. The 1,150,000 logic elements support deep packet buffers, lookup tables, and Quality-of-Service queues at line rate. Placed as the central fabric processor with 1932-ball FCBGA, the design typically uses DDR4 external memory via the hard memory controller; for top-of-rack designs, the industrial temperature grade permits deployment in thermally constrained switch chassis.
Recommended
PCIe Gen3 Accelerator Card
The 10AX115S2F45I2SG is widely deployed in FPGA accelerator cards (e.g., for AI inference, compression, or financial compute) because it integrates PCIe Gen3 x8 hard IP and exposes 24 transceivers at up to 14.1 Gbps - covering both PCIe and any auxiliary 10G/40G links. The 1,518 DSP blocks accelerate fixed- and floating-point workloads, while 68,857,856 bits of embedded SRAM provide on-die storage for activation maps and intermediate results. Typical designs place the FPGA as the central compute element with DDR4 attached via the hard memory controller, communicating with the host CPU through x8 Gen3; the industrial temperature grade allows deployment in air-cooled server chassis without derating.
Recommended
Software-Defined Radio / Wireless Base Station
The 10AX115S2F45I2SG is a strong fit for software-defined radio (SDR) baseband processing and small-cell LTE/5G base stations because its 24 transceivers up to 14.1 Gbps directly interface CPRI, OBSAI, and JESD204B/C fronthaul links to RFICs and DACs/ADCs. The 1,518 DSP blocks deliver hundreds of GMACs of FIR and FFT throughput, essential for channelization, crest-factor reduction, and digital predistortion. The hard memory controller supports DDR4/QDR-IV for high-bandwidth sample buffers. Deployments use the FPGA between the RF front end and the baseband CPU; the industrial temperature grade permits unheated outdoor small-cell enclosures.
Recommended
Radar and Beamforming Signal Processing
The 10AX115S2F45I2SG excels in phased-array radar, electronic-warfare, and beamforming signal processing where thousands of FIR filter taps must run in real time. With 1,518 DSP blocks operating at 20nm efficiency, the device delivers the GMAC throughput needed for sub-microsecond beam updates across large arrays. The 24 transceivers up to 14.1 Gbps aggregate to multi-GSPS sample rates when multiple channels are deserialized through JESD204B/C ADCs. Designs typically route digital beam data through DDR4 buffers before downlink transmission; the industrial temperature grade allows deployment in avionics, ground-mobile, and shipboard radar enclosures.
Recommended
Video Broadcast and Encoding Platform
The 10AX115S2F45I2SG is used in broadcast contribution encoders and 4K/8K video processing because its 1,150,000 logic elements and 1,518 DSP blocks implement multi-stream HEVC/H.264 codecs, color-space conversion, and frame-rate conversion in a single device. The 24 transceivers connect to 12G-SDI or SMPTE ST 2022/2110 IP-based broadcast interfaces, while the hard memory controller interfaces DDR4 for reference frame buffers. Studio and master-control deployments rely on the industrial temperature grade to operate in air-cooled equipment racks without thermal derating. The 1932-ball FCBGA fits typical ATX form-factor cards.
Recommended
Test & Measurement Instrumentation
The 10AX115S2F45I2SG is found in high-end oscilloscopes, logic analyzers, protocol analyzers, and arbitrary waveform generators because its 24 transceivers at up to 14.1 Gbps allow multi-channel acquisition at multi-GSPS rates when paired with high-speed ADCs/DACs over JESD204B/C. The 1,150,000 logic elements implement real-time triggers, deep acquisition memory addressing, and protocol decoding across PCIe, USB 3.x, SATA, and Ethernet. The hard PCIe Gen3 x8 IP enables direct integration into modular instrument chassis. The industrial temperature grade permits deployment in lab and production-floor environments, and the 1932-ball FCBGA supports dense front-panel I/O.
Recommended
Medical Imaging and Diagnostics
The 10AX115S2F45I2SG is used in MRI, CT, ultrasound, and PET imaging systems where real-time image reconstruction (FFT, back-projection, beamforming) and high-speed serial I/O are required. The 1,518 DSP blocks accelerate FIR and FFT pipelines at sub-millisecond latency, while 24 transceivers up to 14.1 Gbps aggregate high-speed ADC sample streams from detector arrays. The 1,150,000 logic elements handle data formatting, compression, and DICOM framing. The hard memory controller attaches DDR4 buffers for image volumes. Medical deployments leverage the industrial temperature grade for scanner-room installations.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115S2F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115S2F45I2LG | 10AX115S2F45E2SG | 10AX115S1F45I1SG | 10AX115S2F45I1SG | 10AX090S2F45I2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 |
| Speed Grade | S2 | S2 | S2 | S1 | S2 | S2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Extended (0C to +100C) | Industrial | Industrial | Industrial |
| Transceiver Channels | 24 | 24 | 24 | 24 | 24 | 24 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Lead-Free Finish | Yes (G suffix) | Yes (LG suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) | Yes (G suffix) |
Key Differentiators
- Highest density Arria 10 GX in the F45 package (vs 10AX090S2F45I2SG)
- Hard PCIe Gen3 x8 IP block (vs 10AX090S2F45I2SG)
- Industrial temperature grade qualification (vs 10AX115S2F45E2SG)
- Speed-grade 2 balance between Fmax and power (vs 10AX115S3F45I2SG)
Design Notes
Estimated: At full transceiver utilization (24 channels at 14.1 Gbps with PRBS-31) and high toggle-rate logic, the 10AX115S2F45I2SG can dissipate 30-45 W on a typical design. The 1932-ball FCBGA requires a thermal interface to either a heatsink or cold-plate through the top of the package; refer to the Altera Arria 10 GX Thermal Design Guide for theta_JA vs airflow curves. Without forced airflow (>200 LFM), the device will thermally throttle. A 6-layer PCB with internal copper planes stitched under the BGA footprint is recommended for heat spreading.
Estimated: The 1932-ball FCBGA has a fine 1.0 mm ball pitch, requiring laser-drilled microvias and sequential lamination. Plan for an 8-10 layer stackup with controlled-impedance traces for transceivers (100-ohm differential for 10-14 Gbps) and DDR4 (single-ended 50-ohm, differential 100-ohm). Use length-matching within 0.127 mm for all high-speed serial pairs and DDR4 address/command/clock groups; the Quartus Prime pin planner will output the exact rules per pin once the design is loaded.
The 10AX115S2F45I2SG requires a multi-rail power system: 0.9 V core (high current, often 30+ A at full load), 1.8 V/2.5 V auxiliary, and per-bank I/O voltages (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V). Power-on sequencing is required - core voltage must ramp before auxiliary supplies per the device handbook. Use a Power Management IC (PMIC) or controller designed for Altera/Intel FPGA power sequencing. Decoupling: place 0402/0201 ceramic capacitors at every power pin, plus bulk polymer/tantalum capacitors near the package perimeter.
Transceiver channels 0-23 are located on specific bank groups; consult the F45 package pin connection guidelines to map serial I/O to board layout. Reference clocks (refclk) must be routed as 100-ohm differential pairs with length matching and isolated from noisy signals. The PCIe Gen3 x8 hard IP uses dedicated transceiver channels; reserve these in the floorplan early. JTAG, MSEL configuration pins, and configuration mode straps must be pulled correctly per the Configuration Handbook before power-up.
Common pitfalls with the 10AX115S2F45I2SG include: (1) mixing up I2 vs E2 temperature grades in production; (2) mis-wiring MSEL pins causing configuration failure; (3) under-sizing the heatsink for high-utilization designs leading to thermal throttling; (4) using standard HASL PCB finish instead of ENIG which can cause BGA solder joint defects; (5) violating DDR4 write leveling / read calibration timing causing intermittent data corruption. Always validate with Quartus Prime's PowerPlay and Timing Analyzer before tape-out.
Compliance Information
RoHS compliant per the 'G' suffix in the Altera ordering scheme (lead-free solder ball finish). Halogen-free per Altera's material declaration. AEC-Q100 is not applicable for FPGAs of this complexity - this is a commercial/industrial-grade device. Conflict minerals compliance is documented in Altera/Intel's annual CMRT filing.
