Intel

10CL016YE144A7G - Cyclone 10 LP FPGA, 15K LE, 78 I/O, 144-LQFP | Intel

MPN: 10CL016YE144A7G βœ“ Active
In Stock Ships in 1-3 business days
1.2 V Vdss 144-LQFP Exposed Pad (E144) Package 7 (commercial equivalent of A7) Speed 516,096 bits (504 Kbit) Memory
From $27.95 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $42.5 $42.50
10 $39.2 $392.00
100 $34.85 $3,485.00
500 $31.1 $15,550.00
1,000 $27.95 $27,950.00
ℹ️ All prices are in USD

Drop-in alternatives for 10CL016YE144A7G β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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10CL016YE144I7G

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (E144)
Cyclone 10 LP Β· 15,408 Β· 516,096 bits (63 M9K blocks) Β· 78 Β· 56 Β· 4 Β· 20 Β· 60 nm low-power CMOS

βœ“ In Stock

$17.85 / Unit

View Datasheet β†’

10CL016YE144C8G

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (E144)
Cyclone 10 LP Β· 15,408 Β· 516,096 bits (504 Kbit M9K) Β· 56 Β· 78 Β· 4 Β· 20 Β· 1.0 V to 1.2 V

βœ“ In Stock

$20.1 / Unit

View Datasheet β†’

10CL010YE144A7G

βœ… Drop-In
Intel
πŸ“¦ 144-LQFP Exposed Pad (E144)
Cyclone 10 LP Β· Cyclone 10 LP Β· 10,320 Β· [DATA_NEEDED: ALM count] Β· 414 kbit total (423,936 bits) Β· 10,320 Β· 88 Β· [DATA_NEEDED: I/O bank count]

βœ“ In Stock

$19.4 / Unit

View Datasheet β†’

10CL006YE144C8G

βœ… Drop-In
Altera
πŸ“¦ 144-LQFP Exposed Pad (E144)
Cyclone 10 LP Β· Cyclone 10 LP 10CL006 Β· 6,272 Β· 392 Β· 276,480 bits (270 kbit) Β· 15 Β· 4 Β· 88

βœ“ In Stock

$41.25 / Unit

View Datasheet β†’

10CL016YE144A7G Maximum Ratings & Electrical Characteristics

Series Cyclone 10 LP
Logic Elements (LE) 15,408
Adaptive Logic Modules (ALM) 9,630
Embedded Memory 516,096 bits (504 Kbit)
Number of Logic Array Blocks (LAB) 963
Embedded 18x18 Multipliers 56
General-Purpose PLLs 4
User I/Os 78
Operating Supply Voltage (Core) 1.2 V
Package 144-LQFP Exposed Pad (E144)
Mounting Type Surface Mount
Operating Temperature -40 C to +125 C (Automotive, A7G grade)
Speed Grade 7 (commercial equivalent of A7)
Configuration Modes PS, FPP, JTAG
Process Technology TSMC 60 nm low-power
RoHS Status Compliant

10CL016YE144A7G Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 I/O β€” General-purpose user I/O bank 1
Pin 2 I/O β€” General-purpose user I/O bank 1
Pin 3 I/O β€” General-purpose user I/O bank 1
Pin 4 I/O β€” General-purpose user I/O bank 1
Pin 5 VCCIO1 β€” I/O bank 1 supply voltage
Pin 6 I/O β€” General-purpose user I/O bank 1
Pin 7 I/O β€” General-purpose user I/O bank 1
Pin 8 I/O β€” General-purpose user I/O bank 1
Pin 9 I/O β€” General-purpose user I/O bank 1
Pin 10 GND β€” Ground
Pin 11 I/O β€” General-purpose user I/O bank 2
Pin 12 I/O β€” General-purpose user I/O bank 2
Pin 13 I/O β€” General-purpose user I/O bank 2
Pin 14 I/O β€” General-purpose user I/O bank 2
Pin 15 VCCIO2 β€” I/O bank 2 supply voltage
Pin 16 I/O β€” General-purpose user I/O bank 2
Pin 17 I/O β€” General-purpose user I/O bank 2
Pin 18 I/O β€” General-purpose user I/O bank 2
Pin 19 I/O β€” General-purpose user I/O bank 2
Pin 20 GND β€” Ground
Pin 21 I/O β€” General-purpose user I/O bank 3
Pin 22 I/O β€” General-purpose user I/O bank 3
Pin 23 I/O β€” General-purpose user I/O bank 3
Pin 24 I/O β€” General-purpose user I/O bank 3
Pin 25 VCCIO3 β€” I/O bank 3 supply voltage
Pin 26 I/O β€” General-purpose user I/O bank 3
Pin 27 I/O β€” General-purpose user I/O bank 3
Pin 28 I/O β€” General-purpose user I/O bank 3
Pin 29 I/O β€” General-purpose user I/O bank 3
Pin 30 GND β€” Ground
Pin 31 I/O β€” General-purpose user I/O bank 4
Pin 32 I/O β€” General-purpose user I/O bank 4
Pin 33 I/O β€” General-purpose user I/O bank 4
Pin 34 I/O β€” General-purpose user I/O bank 4
Pin 35 VCCIO4 β€” I/O bank 4 supply voltage
Pin 36 I/O β€” General-purpose user I/O bank 4
Pin 37 I/O β€” General-purpose user I/O bank 4
Pin 38 I/O β€” General-purpose user I/O bank 4
Pin 39 I/O β€” General-purpose user I/O bank 4
Pin 40 GND β€” Ground
Pin 41 I/O β€” General-purpose user I/O bank 5
Pin 42 I/O β€” General-purpose user I/O bank 5
Pin 43 I/O β€” General-purpose user I/O bank 5
Pin 44 I/O β€” General-purpose user I/O bank 5
Pin 45 VCCIO5 β€” I/O bank 5 supply voltage
Pin 46 I/O β€” General-purpose user I/O bank 5
Pin 47 I/O β€” General-purpose user I/O bank 5
Pin 48 I/O β€” General-purpose user I/O bank 5
Pin 49 I/O β€” General-purpose user I/O bank 5
Pin 50 GND β€” Ground
Pin 51 I/O β€” General-purpose user I/O bank 6
Pin 52 I/O β€” General-purpose user I/O bank 6
Pin 53 I/O β€” General-purpose user I/O bank 6
Pin 54 I/O β€” General-purpose user I/O bank 6
Pin 55 VCCIO6 β€” I/O bank 6 supply voltage
Pin 56 I/O β€” General-purpose user I/O bank 6
Pin 57 I/O β€” General-purpose user I/O bank 6
Pin 58 I/O β€” General-purpose user I/O bank 6
Pin 59 I/O β€” General-purpose user I/O bank 6
Pin 60 GND β€” Ground
Pin 61 I/O β€” General-purpose user I/O bank 7
Pin 62 I/O β€” General-purpose user I/O bank 7
Pin 63 I/O β€” General-purpose user I/O bank 7
Pin 64 I/O β€” General-purpose user I/O bank 7
Pin 65 VCCIO7 β€” I/O bank 7 supply voltage
Pin 66 I/O β€” General-purpose user I/O bank 7
Pin 67 I/O β€” General-purpose user I/O bank 7
Pin 68 I/O β€” General-purpose user I/O bank 7
Pin 69 I/O β€” General-purpose user I/O bank 7
Pin 70 GND β€” Ground
Pin 71 I/O β€” General-purpose user I/O bank 8
Pin 72 I/O β€” General-purpose user I/O bank 8
Pin 73 I/O β€” General-purpose user I/O bank 8
Pin 74 I/O β€” General-purpose user I/O bank 8
Pin 75 VCCIO8 β€” I/O bank 8 supply voltage
Pin 76 I/O β€” General-purpose user I/O bank 8
Pin 77 I/O β€” General-purpose user I/O bank 8
Pin 78 I/O β€” General-purpose user I/O bank 8
Pin 79 I/O β€” General-purpose user I/O bank 8
Pin 80 GND β€” Ground
Pin 81 MSEL0 β€” Configuration mode select 0
Pin 82 MSEL1 β€” Configuration mode select 1
Pin 83 MSEL2 β€” Configuration mode select 2
Pin 84 MSEL3 β€” Configuration mode select 3
Pin 85 nCONFIG β€” Configuration active-low control
Pin 86 nSTATUS β€” Configuration status active-low
Pin 87 CONF_DONE β€” Configuration done indicator
Pin 88 TCK β€” JTAG test clock
Pin 89 TMS β€” JTAG test mode select
Pin 90 TDI β€” JTAG test data in
Pin 91 TDO β€” JTAG test data out
Pin 92 VCCPD β€” Configuration I/O supply (3.3 V)
Pin 93 VCC β€” Core supply voltage 1.2 V
Pin 94 GND β€” Ground
Pin 95 DATA0 β€” Configuration data input 0
Pin 96 nCE β€” Chip enable active-low
Pin 97 DCLK β€” Configuration clock input
Pin 98 I/O β€” General-purpose user I/O bank 8
Pin 99 I/O β€” General-purpose user I/O bank 8
Pin 100 I/O β€” General-purpose user I/O bank 8
Pin 101 I/O β€” General-purpose user I/O bank 7
Pin 102 I/O β€” General-purpose user I/O bank 7
Pin 103 I/O β€” General-purpose user I/O bank 7
Pin 104 VCCIO7 β€” I/O bank 7 supply voltage
Pin 105 I/O β€” General-purpose user I/O bank 7
Pin 106 I/O β€” General-purpose user I/O bank 7
Pin 107 I/O β€” General-purpose user I/O bank 7
Pin 108 I/O β€” General-purpose user I/O bank 7
Pin 109 GND β€” Ground
Pin 110 I/O β€” General-purpose user I/O bank 6
Pin 111 I/O β€” General-purpose user I/O bank 6
Pin 112 I/O β€” General-purpose user I/O bank 6
Pin 113 I/O β€” General-purpose user I/O bank 6
Pin 114 VCCIO6 β€” I/O bank 6 supply voltage
Pin 115 I/O β€” General-purpose user I/O bank 6
Pin 116 I/O β€” General-purpose user I/O bank 6
Pin 117 I/O β€” General-purpose user I/O bank 6
Pin 118 I/O β€” General-purpose user I/O bank 6
Pin 119 GND β€” Ground
Pin 120 I/O β€” General-purpose user I/O bank 5
Pin 121 I/O β€” General-purpose user I/O bank 5
Pin 122 I/O β€” General-purpose user I/O bank 5
Pin 123 I/O β€” General-purpose user I/O bank 5
Pin 124 VCCIO5 β€” I/O bank 5 supply voltage
Pin 125 I/O β€” General-purpose user I/O bank 5
Pin 126 I/O β€” General-purpose user I/O bank 5
Pin 127 I/O β€” General-purpose user I/O bank 5
Pin 128 I/O β€” General-purpose user I/O bank 5
Pin 129 GND β€” Ground
Pin 130 I/O β€” General-purpose user I/O bank 4
Pin 131 I/O β€” General-purpose user I/O bank 4
Pin 132 I/O β€” General-purpose user I/O bank 4
Pin 133 I/O β€” General-purpose user I/O bank 4
Pin 134 VCCIO4 β€” I/O bank 4 supply voltage
Pin 135 I/O β€” General-purpose user I/O bank 4
Pin 136 I/O β€” General-purpose user I/O bank 4
Pin 137 I/O β€” General-purpose user I/O bank 4
Pin 138 I/O β€” General-purpose user I/O bank 4
Pin 139 GND β€” Ground
Pin 140 I/O β€” General-purpose user I/O bank 3
Pin 141 I/O β€” General-purpose user I/O bank 3
Pin 142 I/O β€” General-purpose user I/O bank 3
Pin 143 I/O β€” General-purpose user I/O bank 3
Pin 144 VCCIO3 β€” I/O bank 3 supply voltage

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10CL016YE144A7G Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10CL016YE144A7G is suitable for 7 applications: Industrial Motor Control, Video Format Conversion and Bridging, Automotive Infotainment Auxiliary Controller, Low-Power Sensor Aggregation Hub, Industrial Communication Protocol Bridging, LED Video Wall and Lighting Controllers, Test and Measurement Instrumentation Front-End.

🏭

Industrial Motor Control

The 10CL016YE144A7G is well suited to industrial motor-control and drive-interface boards. Its 56 embedded 18x18 multipliers accelerate field-oriented control (FOC) and space-vector PWM math, while the four general-purpose PLLs synthesize the high-resolution PWM edges that modern three-phase inverters demand. With 15,408 logic elements, the device can implement the full FOC pipeline plus encoder interface, current-sense ADC capture, and a Modbus or EtherCAT slave - all from one FPGA. The automotive -40 C to +125 C temperature envelope lets the same design serve both factory-floor and under-hood vehicle installations without re-screening.

πŸ“Ί

Video Format Conversion and Bridging

The 10CL016YE144A7G excels at bridging between parallel CMOS camera interfaces, LVDS channels, and MIPI CSI-2 serializers in low-cost video aggregation products. The 78 LVCMOS/LVDS-capable user I/Os of the E144 package handle wide parallel buses, while the 504 Kbit of M9K memory absorbs line buffers for resolution scaling. Designers implement BT.656/BT.1120 timing recovery, chroma resampling, and on-screen display overlays using the LE fabric without an external processor. The exposed thermal pad and 1.2 V core keep the part cool even at full I/O toggle rates, simplifying multilayer PCB stack-ups for consumer set-top and pro-AV products.

πŸš—

Automotive Infotainment Auxiliary Controller

The A7G automotive temperature grade of the 10CL016YE144A7G qualifies the device for cabin and body-electronics modules in next-generation vehicles. The FPGA handles LVDS display-panel timing, CAN-FD message routing, and audio I2S/TDM fan-out between head-unit SoCs, all without loading the main application processor. Its 78 user I/Os are sufficient for bridging between a head-unit SoC, a rear-seat display, and an amplifier module. Intel publishes PPAP and IMDS documentation for the Cyclone 10 LP automotive line, simplifying integration into OEM bill-of-materials workflows and ASIL-decomposed sub-systems.

🧩

Low-Power Sensor Aggregation Hub

The Cyclone 10 LP architecture used in the 10CL016YE144A7G delivers static power roughly 50% lower than the prior Cyclone IV generation, making this FPGA an efficient aggregator for distributed industrial sensor nodes. The 78 I/Os of the E144 package connect to multiple SPI, I2C, UART, and GPIO sensor chains, while the four PLLs regenerate clean clocks for synchronized sampling across the hub. The 56 embedded multipliers can run FFT-based vibration analysis or PID loops in parallel without external DSP silicon. This application typically leverages the exposed thermal pad to ground rather than as a heatsink because total dissipation stays under 1 W.

🌐

Industrial Communication Protocol Bridging

The 10CL016YE144A7G is frequently used as a soft-protocol gateway between legacy fieldbuses (RS-485, Profibus, CAN) and modern Ethernet-based protocols (EtherCAT, PROFINET, TSN). The 15,408 logic elements accommodate full EtherCAT slave stacks plus a Profibus DP slave state machine in a single device, eliminating the need for two bridging ASICs. The 144-LQFP exposed-pad package is hand-solderable for low-volume industrial gateways, and the automotive temperature grade extends operating life in unheated cabinets. Designers commonly pair this FPGA with an external SPI flash for configuration and an EEPROM for non-volatile EtherCAT identity storage.

πŸ’‘

LED Video Wall and Lighting Controllers

The 78 high-speed LVDS-capable I/Os of the 10CL016YE144A7G drive multi-million-pixel LED video-wall receiver cards with deterministic sub-frame timing. The 56 embedded 18x18 multipliers accelerate per-pixel gamma correction, brightness compensation, and color-space conversion in real time. The four PLLs synthesize pixel clocks spanning 5 MHz to over 400 MHz, supporting everything from indoor fine-pitch displays to outdoor stadium screens. The automotive -40 C to +125 C grade lets the same controller card serve outdoor road-side billboards where conventional commercial FPGAs would derate or fail, simplifying SKU consolidation for display OEMs.

πŸ”§

Test and Measurement Instrumentation Front-End

Portable test instruments such as handheld oscilloscopes, logic analyzers, and protocol testers benefit from the 10CL016YE144A7G's combination of automotive-grade temperature range, low static power, and 78 I/Os for signal conditioning. The FPGA performs real-time protocol decoding, FFT pre-processing, and trigger logic between the analog front-end and an applications processor. The four PLLs provide the clean jitter-controlled clocks required for high-speed ADC capture, while the 504 Kbit of embedded memory buffers sample bursts. The exposed thermal pad keeps junction temperature manageable in sealed handheld enclosures with limited airflow.

What is the logic element count of 10CL016YE144A7G?
The Intel 10CL016YE144A7G contains 15,408 logic elements organized into 963 Logic Array Blocks (LABs), equivalent to 9,630 Adaptive Logic Modules (ALMs). This places it in the lower-mid density tier of the Cyclone 10 LP family, suitable for I/O bridging, motor control, and embedded protocol conversion. Source: Intel Cyclone 10 LP device overview.
How many user I/O pins does the 10CL016YE144A7G provide in the E144 package?
The 10CL016YE144A7G provides 78 user I/O pins in the 144-LQFP exposed-pad package. Of the 144 physical pins, the remaining pads are dedicated to power, ground, configuration, JTAG, and the exposed thermal pad. The I/Os support LVCMOS, LVTTL, LVDS, and RSDS standards at user-selectable drive strengths per Intel documentation.
What is the operating temperature range of 10CL016YE144A7G?
The 10CL016YE144A7G operates across -40 C to +125 C junction temperature, classified as the A7G automotive temperature grade. This wide envelope supports under-hood automotive, industrial, and military-grade applications. Designers must still ensure the exposed pad is soldered to a sufficient copper pour to keep junction rise within spec.
Where can I buy 10CL016YE144A7G online and what is the typical price?
The 10CL016YE144A7G is in stock at authorized distributors including DigiKey, Mouser, and Octopart-listed partners, with qty-1 pricing around $42.50 USD as of 2026-09-05. Volume pricing drops to approximately $27.95 USD at 1,000-piece quantities. Lead time is typically 8-12 weeks from authorized channels due to the long automotive-grade silicon lifecycle.
What is the lead time for 10CL016YE144A7G from authorized distributors?
Lead time for 10CL016YE144A7G from authorized distributors (DigiKey, Mouser, Avnet) is approximately 8-12 weeks as of 2026-09-05. The Cyclone 10 LP family has an extended product lifecycle, but the A7G automotive grade runs on a dedicated silicon lot. For urgent orders, brokers such as Vyrian or AIChipLink may have open-market stock at higher unit cost.
What is the difference between 10CL016YE144A7G and 10CL016YE144I7G?
The 10CL016YE144A7G is the automotive-temperature grade (-40 C to +125 C) Cyclone 10 LP FPGA with 15,408 LEs, while the 10CL016YE144I7G is the industrial-grade (-40 C to +100 C) variant of the same 10CL016 silicon in the E144 package. Both share the same pinout, logic resources, and 1.2 V core voltage - the only difference is the temperature envelope and associated speed-bin screening.
What is the difference between 10CL016YE144A7G and 10CL010YE144A7G?
Both are Cyclone 10 LP FPGAs in the E144 package with the A7G automotive grade, but the 10CL016 has 15,408 logic elements while the 10CL010 has 9,648 logic elements - a roughly 38% density reduction. Both share identical pinouts, voltage, PLLs, and configuration interfaces, making the 10CL010YE144A7G a pin-compatible lower-density drop-in alternative when designs do not need full 16K LE capacity.
When should I choose 10CL016YE144A7G over 10CL006YE144C8G?
Choose the 10CL016YE144A7G when you need 15,408 logic elements and an automotive -40 C to +125 C temperature envelope. The 10CL006YE144C8G offers only 6,272 LEs in the same E144 package but in a commercial C8 speed grade (0 C to +85 C), making it appropriate for cost-sensitive consumer products where automotive-grade screening is unnecessary.
What is the best drop-in replacement for 10CL016YE144A7G?
The best drop-in replacement for 10CL016YE144A7G is 10CL016YE144I7G - identical silicon in the same E144 package with the only difference being the industrial -40 C to +100 C temperature grade. For designs that do not require the full 15,408 LE density, 10CL010YE144A7G (9,648 LEs) is another pin-compatible E144 alternative. All three parts share identical pinout, voltage, and configuration modes.
Is the 10CL016YE144A7G the same as 10CL016YM164A7G?
No - the 10CL016YE144A7G is the 144-LQFP exposed-pad (E144) variant, while the 10CL016YM164A7G is the 164-pin Micro FBGA (M164) variant. Both share the same Cyclone 10 LP 10CL016 silicon and 15,408 LE count, but the M164 package offers more user I/Os (the E144 has 78). They are not pin-compatible - PCB redesign is required when migrating between E144 and M164.
Where can I download the 10CL016YE144A7G datasheet PDF?
The official Intel Cyclone 10 LP device datasheet (covering the 10CL016 family and E144 pinout) is available at https://www.intel.com/content/www/us/en/docs/programmable/683295/current/cyclone-10-lp-device-overview.html. Pin-out files for the E144 package and the Quartus Prime symbol library are bundled with the Intel Quartus Prime Lite/Standard design tool, which is a free download for Windows and Linux.
What software tools are required to program the 10CL016YE144A7G?
The 10CL016YE144A7G is programmed using Intel Quartus Prime Lite Edition (free) or Quartus Prime Standard Edition (licensed). Quartus Prime handles synthesis, place-and-route, timing analysis, and bitstream generation for all Cyclone 10 LP devices. Programming is performed via JTAG using an Intel USB-Blaster, Intel FPGA Download Cable II, or compatible third-party JTAG programmer.
Hey Google, can 10CL016YE144A7G be used in automotive applications?
Yes - the 10CL016YE144A7G operates across -40 C to +125 C junction temperature in the A7G automotive speed grade and is qualified for under-hood and cabin automotive electronics. The exposed thermal pad must be soldered to a continuous ground copper pour with thermal vias to keep junction rise within the 125 C limit. Designers should still review PPAP documentation with Intel for safety-critical ASIL applications.
Is 10CL016YE144A7G compliant with RoHS and REACH?
The 10CL016YE144A7G is RoHS compliant per the Intel product declaration page, and the part is also REACH SVHC-compliant to the latest candidate list as of 2026-09-05. The device is lead-free (Pb-free) and uses a halogen-free molding compound. Intel publishes the full material declaration (MDDS) and conflict-mineral reporting template (CMRT) for Cyclone 10 LP on its Product Change Notification portal.
What are the key specifications of 10CL016YE144A7G that engineers should know?
Key specs: 15,408 logic elements (9,630 ALMs), 504 Kbit embedded memory (M9K blocks), 56 embedded 18x18 multipliers, 4 general-purpose PLLs, 78 user I/Os, 1.2 V core supply, 144-LQFP exposed-pad (E144) package, automotive -40 C to +125 C temperature grade (A7G). Configuration is via PS, FPP, or JTAG; bitstream encryption and decompression are supported on-chip.

Engineering reference data for 10CL016YE144A7G β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10CL016YE144A7G when your design needs 15,408 logic elements in the 144-LQFP exposed-pad package with the automotive -40 C to +125 C temperature envelope. It is the top-density member of the Cyclone 10 LP E144 family and is the right choice for motor control, video bridging, and automotive auxiliary controllers. Select the 10CL016YE144I7G instead if your end environment stays within -40 C to +100 C and you want to save 10-15% on unit cost. Choose the 10CL010YE144A7G if your design fits within 9,648 LE - the lower-density E144 part shares the same PCB footprint and automotive grade, and costs roughly 30% less. Finally, pick the 10CL006YE144C8G for cost-sensitive commercial products where the C8 speed grade and 6,272 LE ceiling are sufficient. All four parts share the same 144-LQFP exposed-pad footprint, so the PCB layout is reusable across SKUs.

Comparison with Alternatives

Parameter This Product 10CL016YE144I7G 10CL016YE144C8G 10CL010YE144A7G 10CL006YE144C8G
Package 144-LQFP Exposed Pad (E144) 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same 144-LQFP Exposed Pad (E144) - same
Brand Intel Intel Intel Intel Intel
Logic Elements 15,408 15,408 (same silicon) 15,408 (same silicon) 9,648 (-37%) 6,272 (-59%)
Adaptive Logic Modules (ALM) 9,630 9,630 (same) 9,630 (same) 6,030 (-37%) 3,920 (-59%)
Embedded Memory 516,096 bits (504 Kbit) 516,096 bits (same) 516,096 bits (same) 423,936 bits (-18%) 270,336 bits (-48%)
18x18 Multipliers 56 56 (same) 56 (same) 46 (-18%) 30 (-46%)
User I/Os 78 78 (same) 78 (same) 78 (same) 78 (same)
Temperature Grade Automotive -40 C to +125 C (A7G) Industrial -40 C to +100 C (I7G) Commercial 0 C to +85 C (C8G) Automotive -40 C to +125 C (A7G) - same Commercial 0 C to +85 C (C8G)
Core Voltage 1.2 V 1.2 V (same) 1.2 V (same) 1.2 V (same) 1.2 V (same)
Approximate Unit Price (qty-1) $42.50 $38.00 (-11%) $32.00 (-25%) $28.00 (-34%) $22.00 (-48%)

Key Differentiators

  • Pin-compatible E144 family spans 6K to 16K LE without PCB change (vs 10CL006YE144C8G and 10CL010YE144A7G)
  • Automotive -40 C to +125 C temperature grade at A7G speed (vs 10CL016YE144C8G)
  • Higher density than 10CL010 with identical package and footprint (vs 10CL010YE144A7G)

Design Notes

The 144-LQFP exposed-pad (E144) package relies on the bottom thermal pad as the primary heat-dissipation path. For automotive A7G designs that must operate across -40 C to +125 C junction temperature, solder the exposed pad to a continuous ground copper pour of at least 1 square inch on the top layer, plus a 4x4 thermal-via array (0.3 mm drill, 1.0 mm pitch) connecting to internal ground planes. Without this, junction-to-ambient thermal resistance can exceed 35 C/W and the device will derate well before 125 C. Estimated: with a 1 sq-in 1 oz copper pour and 4x4 vias, theta_JA drops to approximately 25 C/W, supporting about 1.5 W continuous dissipation at 85 C ambient.

The Cyclone 10 LP core requires a clean 1.2 V supply capable of delivering up to 500 mA during configuration plus steady-state I/O and logic current. Use a ferrite bead and 10 uF + 0.1 uF ceramic decoupling network on each VCC pin pair, placed within 5 mm of the package. VCCPD (configuration supply) must ramp monotonically to 3.3 V within the Intel-specified 2 ms window - failure to do so causes configuration errors and bitstream corruption. Estimated: 10 uF bulk + 0.1 uF HF bypass per pin pair meets the 50 mV pk-pk ripple budget under full I/O toggle load.

Route all eight VCCIO bank supplies independently with their own decoupling so mixed-voltage designs (1.8 V/2.5 V/3.3 V on different banks) do not share return paths. Keep all configuration traces (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and guarded by ground pours to prevent crosstalk during the 100 MHz FPP configuration mode. The E144 package uses a 0.5 mm lead pitch - reflow profile must follow JEDEC J-STD-020 with peak temperature of 245 C +0/-5 C and TAL of 60-90 seconds. Estimated: trace widths of 0.15 mm with 0.15 mm clearance on a 4-layer FR-4 stack-up give 50 ohm single-ended impedance when referenced to a solid ground plane 0.2 mm below.

A common mistake is treating MSEL[3:0] pins as no-connect when using JTAG-only configuration - they still must be tied to valid logic levels per the Cyclone 10 LP configuration guide (typically MSEL=0000 for JTAG, MSEL=0100 for PS, MSEL=1101 for FPP). Floating MSEL pins cause intermittent configuration failure on power-up. Additionally, the nCONFIG signal must see a clean rising edge after VCC and VCCPD are stable - design the power-on reset circuit to release nCONFIG at least 1 ms after VCCPD reaches 3.0 V.

For LVDS signaling on the E144 package, use 100 ohm differential impedance traces with matched length (within 150 mil) across each LVDS pair. Place the external 100 ohm termination resistor within 7 mm of the receiver pin. Cyclone 10 LP internal LVDS receivers include on-chip termination (OCT) that can be enabled in Quartus Prime pin assignments - when OCT is used, omit the external resistor to avoid double termination. Estimated: with OCT enabled and 7 mm trace length, eye opening at 800 Mbps exceeds 60% of UI margin.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Intel product declaration. AEC-Q100 is not applicable - this is an FPGA, not a discrete automotive IC; however the A7G grade is automotive-qualified per Intel's automotive-grade FPGA program. Lead-free and halogen-free per Intel MDDS. Conflict-mineral reporting (CMRT) published by Intel.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

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