10CL016YE144A7G - Cyclone 10 LP FPGA, 15K LE, 78 I/O, 144-LQFP | Intel
MPN: 10CL016YE144A7G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $39.2 | $392.00 |
| 100 | $34.85 | $3,485.00 |
| 500 | $31.1 | $15,550.00 |
| 1,000 | $27.95 | $27,950.00 |
Drop-in alternatives for 10CL016YE144A7G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10CL016YE144I7G
β Drop-Inβ In Stock
$17.85 / Unit
View Datasheet β10CL016YE144C8G
β Drop-Inβ In Stock
$20.1 / Unit
View Datasheet β10CL010YE144A7G
β Drop-Inβ In Stock
$19.4 / Unit
View Datasheet β10CL006YE144C8G
β Drop-Inβ In Stock
$41.25 / Unit
View Datasheet β10CL016YE144A7G Maximum Ratings & Electrical Characteristics
| Series | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Adaptive Logic Modules (ALM) | 9,630 |
| Embedded Memory | 516,096 bits (504 Kbit) |
| Number of Logic Array Blocks (LAB) | 963 |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose PLLs | 4 |
| User I/Os | 78 |
| Operating Supply Voltage (Core) | 1.2 V |
| Package | 144-LQFP Exposed Pad (E144) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +125 C (Automotive, A7G grade) |
| Speed Grade | 7 (commercial equivalent of A7) |
| Configuration Modes | PS, FPP, JTAG |
| Process Technology | TSMC 60 nm low-power |
| RoHS Status | Compliant |
10CL016YE144A7G Pin Configuration
| Pin 1 | I/O β General-purpose user I/O bank 1 |
| Pin 2 | I/O β General-purpose user I/O bank 1 |
| Pin 3 | I/O β General-purpose user I/O bank 1 |
| Pin 4 | I/O β General-purpose user I/O bank 1 |
| Pin 5 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 6 | I/O β General-purpose user I/O bank 1 |
| Pin 7 | I/O β General-purpose user I/O bank 1 |
| Pin 8 | I/O β General-purpose user I/O bank 1 |
| Pin 9 | I/O β General-purpose user I/O bank 1 |
| Pin 10 | GND β Ground |
| Pin 11 | I/O β General-purpose user I/O bank 2 |
| Pin 12 | I/O β General-purpose user I/O bank 2 |
| Pin 13 | I/O β General-purpose user I/O bank 2 |
| Pin 14 | I/O β General-purpose user I/O bank 2 |
| Pin 15 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 16 | I/O β General-purpose user I/O bank 2 |
| Pin 17 | I/O β General-purpose user I/O bank 2 |
| Pin 18 | I/O β General-purpose user I/O bank 2 |
| Pin 19 | I/O β General-purpose user I/O bank 2 |
| Pin 20 | GND β Ground |
| Pin 21 | I/O β General-purpose user I/O bank 3 |
| Pin 22 | I/O β General-purpose user I/O bank 3 |
| Pin 23 | I/O β General-purpose user I/O bank 3 |
| Pin 24 | I/O β General-purpose user I/O bank 3 |
| Pin 25 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 26 | I/O β General-purpose user I/O bank 3 |
| Pin 27 | I/O β General-purpose user I/O bank 3 |
| Pin 28 | I/O β General-purpose user I/O bank 3 |
| Pin 29 | I/O β General-purpose user I/O bank 3 |
| Pin 30 | GND β Ground |
| Pin 31 | I/O β General-purpose user I/O bank 4 |
| Pin 32 | I/O β General-purpose user I/O bank 4 |
| Pin 33 | I/O β General-purpose user I/O bank 4 |
| Pin 34 | I/O β General-purpose user I/O bank 4 |
| Pin 35 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 36 | I/O β General-purpose user I/O bank 4 |
| Pin 37 | I/O β General-purpose user I/O bank 4 |
| Pin 38 | I/O β General-purpose user I/O bank 4 |
| Pin 39 | I/O β General-purpose user I/O bank 4 |
| Pin 40 | GND β Ground |
| Pin 41 | I/O β General-purpose user I/O bank 5 |
| Pin 42 | I/O β General-purpose user I/O bank 5 |
| Pin 43 | I/O β General-purpose user I/O bank 5 |
| Pin 44 | I/O β General-purpose user I/O bank 5 |
| Pin 45 | VCCIO5 β I/O bank 5 supply voltage |
| Pin 46 | I/O β General-purpose user I/O bank 5 |
| Pin 47 | I/O β General-purpose user I/O bank 5 |
| Pin 48 | I/O β General-purpose user I/O bank 5 |
| Pin 49 | I/O β General-purpose user I/O bank 5 |
| Pin 50 | GND β Ground |
| Pin 51 | I/O β General-purpose user I/O bank 6 |
| Pin 52 | I/O β General-purpose user I/O bank 6 |
| Pin 53 | I/O β General-purpose user I/O bank 6 |
| Pin 54 | I/O β General-purpose user I/O bank 6 |
| Pin 55 | VCCIO6 β I/O bank 6 supply voltage |
| Pin 56 | I/O β General-purpose user I/O bank 6 |
| Pin 57 | I/O β General-purpose user I/O bank 6 |
| Pin 58 | I/O β General-purpose user I/O bank 6 |
| Pin 59 | I/O β General-purpose user I/O bank 6 |
| Pin 60 | GND β Ground |
| Pin 61 | I/O β General-purpose user I/O bank 7 |
| Pin 62 | I/O β General-purpose user I/O bank 7 |
| Pin 63 | I/O β General-purpose user I/O bank 7 |
| Pin 64 | I/O β General-purpose user I/O bank 7 |
| Pin 65 | VCCIO7 β I/O bank 7 supply voltage |
| Pin 66 | I/O β General-purpose user I/O bank 7 |
| Pin 67 | I/O β General-purpose user I/O bank 7 |
| Pin 68 | I/O β General-purpose user I/O bank 7 |
| Pin 69 | I/O β General-purpose user I/O bank 7 |
| Pin 70 | GND β Ground |
| Pin 71 | I/O β General-purpose user I/O bank 8 |
| Pin 72 | I/O β General-purpose user I/O bank 8 |
| Pin 73 | I/O β General-purpose user I/O bank 8 |
| Pin 74 | I/O β General-purpose user I/O bank 8 |
| Pin 75 | VCCIO8 β I/O bank 8 supply voltage |
| Pin 76 | I/O β General-purpose user I/O bank 8 |
| Pin 77 | I/O β General-purpose user I/O bank 8 |
| Pin 78 | I/O β General-purpose user I/O bank 8 |
| Pin 79 | I/O β General-purpose user I/O bank 8 |
| Pin 80 | GND β Ground |
| Pin 81 | MSEL0 β Configuration mode select 0 |
| Pin 82 | MSEL1 β Configuration mode select 1 |
| Pin 83 | MSEL2 β Configuration mode select 2 |
| Pin 84 | MSEL3 β Configuration mode select 3 |
| Pin 85 | nCONFIG β Configuration active-low control |
| Pin 86 | nSTATUS β Configuration status active-low |
| Pin 87 | CONF_DONE β Configuration done indicator |
| Pin 88 | TCK β JTAG test clock |
| Pin 89 | TMS β JTAG test mode select |
| Pin 90 | TDI β JTAG test data in |
| Pin 91 | TDO β JTAG test data out |
| Pin 92 | VCCPD β Configuration I/O supply (3.3 V) |
| Pin 93 | VCC β Core supply voltage 1.2 V |
| Pin 94 | GND β Ground |
| Pin 95 | DATA0 β Configuration data input 0 |
| Pin 96 | nCE β Chip enable active-low |
| Pin 97 | DCLK β Configuration clock input |
| Pin 98 | I/O β General-purpose user I/O bank 8 |
| Pin 99 | I/O β General-purpose user I/O bank 8 |
| Pin 100 | I/O β General-purpose user I/O bank 8 |
| Pin 101 | I/O β General-purpose user I/O bank 7 |
| Pin 102 | I/O β General-purpose user I/O bank 7 |
| Pin 103 | I/O β General-purpose user I/O bank 7 |
| Pin 104 | VCCIO7 β I/O bank 7 supply voltage |
| Pin 105 | I/O β General-purpose user I/O bank 7 |
| Pin 106 | I/O β General-purpose user I/O bank 7 |
| Pin 107 | I/O β General-purpose user I/O bank 7 |
| Pin 108 | I/O β General-purpose user I/O bank 7 |
| Pin 109 | GND β Ground |
| Pin 110 | I/O β General-purpose user I/O bank 6 |
| Pin 111 | I/O β General-purpose user I/O bank 6 |
| Pin 112 | I/O β General-purpose user I/O bank 6 |
| Pin 113 | I/O β General-purpose user I/O bank 6 |
| Pin 114 | VCCIO6 β I/O bank 6 supply voltage |
| Pin 115 | I/O β General-purpose user I/O bank 6 |
| Pin 116 | I/O β General-purpose user I/O bank 6 |
| Pin 117 | I/O β General-purpose user I/O bank 6 |
| Pin 118 | I/O β General-purpose user I/O bank 6 |
| Pin 119 | GND β Ground |
| Pin 120 | I/O β General-purpose user I/O bank 5 |
| Pin 121 | I/O β General-purpose user I/O bank 5 |
| Pin 122 | I/O β General-purpose user I/O bank 5 |
| Pin 123 | I/O β General-purpose user I/O bank 5 |
| Pin 124 | VCCIO5 β I/O bank 5 supply voltage |
| Pin 125 | I/O β General-purpose user I/O bank 5 |
| Pin 126 | I/O β General-purpose user I/O bank 5 |
| Pin 127 | I/O β General-purpose user I/O bank 5 |
| Pin 128 | I/O β General-purpose user I/O bank 5 |
| Pin 129 | GND β Ground |
| Pin 130 | I/O β General-purpose user I/O bank 4 |
| Pin 131 | I/O β General-purpose user I/O bank 4 |
| Pin 132 | I/O β General-purpose user I/O bank 4 |
| Pin 133 | I/O β General-purpose user I/O bank 4 |
| Pin 134 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 135 | I/O β General-purpose user I/O bank 4 |
| Pin 136 | I/O β General-purpose user I/O bank 4 |
| Pin 137 | I/O β General-purpose user I/O bank 4 |
| Pin 138 | I/O β General-purpose user I/O bank 4 |
| Pin 139 | GND β Ground |
| Pin 140 | I/O β General-purpose user I/O bank 3 |
| Pin 141 | I/O β General-purpose user I/O bank 3 |
| Pin 142 | I/O β General-purpose user I/O bank 3 |
| Pin 143 | I/O β General-purpose user I/O bank 3 |
| Pin 144 | VCCIO3 β I/O bank 3 supply voltage |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016YE144A7G is suitable for 7 applications: Industrial Motor Control, Video Format Conversion and Bridging, Automotive Infotainment Auxiliary Controller, Low-Power Sensor Aggregation Hub, Industrial Communication Protocol Bridging, LED Video Wall and Lighting Controllers, Test and Measurement Instrumentation Front-End.
Industrial Motor Control
The 10CL016YE144A7G is well suited to industrial motor-control and drive-interface boards. Its 56 embedded 18x18 multipliers accelerate field-oriented control (FOC) and space-vector PWM math, while the four general-purpose PLLs synthesize the high-resolution PWM edges that modern three-phase inverters demand. With 15,408 logic elements, the device can implement the full FOC pipeline plus encoder interface, current-sense ADC capture, and a Modbus or EtherCAT slave - all from one FPGA. The automotive -40 C to +125 C temperature envelope lets the same design serve both factory-floor and under-hood vehicle installations without re-screening.
Recommended
Video Format Conversion and Bridging
The 10CL016YE144A7G excels at bridging between parallel CMOS camera interfaces, LVDS channels, and MIPI CSI-2 serializers in low-cost video aggregation products. The 78 LVCMOS/LVDS-capable user I/Os of the E144 package handle wide parallel buses, while the 504 Kbit of M9K memory absorbs line buffers for resolution scaling. Designers implement BT.656/BT.1120 timing recovery, chroma resampling, and on-screen display overlays using the LE fabric without an external processor. The exposed thermal pad and 1.2 V core keep the part cool even at full I/O toggle rates, simplifying multilayer PCB stack-ups for consumer set-top and pro-AV products.
Recommended
Automotive Infotainment Auxiliary Controller
The A7G automotive temperature grade of the 10CL016YE144A7G qualifies the device for cabin and body-electronics modules in next-generation vehicles. The FPGA handles LVDS display-panel timing, CAN-FD message routing, and audio I2S/TDM fan-out between head-unit SoCs, all without loading the main application processor. Its 78 user I/Os are sufficient for bridging between a head-unit SoC, a rear-seat display, and an amplifier module. Intel publishes PPAP and IMDS documentation for the Cyclone 10 LP automotive line, simplifying integration into OEM bill-of-materials workflows and ASIL-decomposed sub-systems.
Recommended
Low-Power Sensor Aggregation Hub
The Cyclone 10 LP architecture used in the 10CL016YE144A7G delivers static power roughly 50% lower than the prior Cyclone IV generation, making this FPGA an efficient aggregator for distributed industrial sensor nodes. The 78 I/Os of the E144 package connect to multiple SPI, I2C, UART, and GPIO sensor chains, while the four PLLs regenerate clean clocks for synchronized sampling across the hub. The 56 embedded multipliers can run FFT-based vibration analysis or PID loops in parallel without external DSP silicon. This application typically leverages the exposed thermal pad to ground rather than as a heatsink because total dissipation stays under 1 W.
Recommended
Industrial Communication Protocol Bridging
The 10CL016YE144A7G is frequently used as a soft-protocol gateway between legacy fieldbuses (RS-485, Profibus, CAN) and modern Ethernet-based protocols (EtherCAT, PROFINET, TSN). The 15,408 logic elements accommodate full EtherCAT slave stacks plus a Profibus DP slave state machine in a single device, eliminating the need for two bridging ASICs. The 144-LQFP exposed-pad package is hand-solderable for low-volume industrial gateways, and the automotive temperature grade extends operating life in unheated cabinets. Designers commonly pair this FPGA with an external SPI flash for configuration and an EEPROM for non-volatile EtherCAT identity storage.
Recommended
LED Video Wall and Lighting Controllers
The 78 high-speed LVDS-capable I/Os of the 10CL016YE144A7G drive multi-million-pixel LED video-wall receiver cards with deterministic sub-frame timing. The 56 embedded 18x18 multipliers accelerate per-pixel gamma correction, brightness compensation, and color-space conversion in real time. The four PLLs synthesize pixel clocks spanning 5 MHz to over 400 MHz, supporting everything from indoor fine-pitch displays to outdoor stadium screens. The automotive -40 C to +125 C grade lets the same controller card serve outdoor road-side billboards where conventional commercial FPGAs would derate or fail, simplifying SKU consolidation for display OEMs.
Recommended
Test and Measurement Instrumentation Front-End
Portable test instruments such as handheld oscilloscopes, logic analyzers, and protocol testers benefit from the 10CL016YE144A7G's combination of automotive-grade temperature range, low static power, and 78 I/Os for signal conditioning. The FPGA performs real-time protocol decoding, FFT pre-processing, and trigger logic between the analog front-end and an applications processor. The four PLLs provide the clean jitter-controlled clocks required for high-speed ADC capture, while the 504 Kbit of embedded memory buffers sample bursts. The exposed thermal pad keeps junction temperature manageable in sealed handheld enclosures with limited airflow.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016YE144A7G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016YE144I7G | 10CL016YE144C8G | 10CL010YE144A7G | 10CL006YE144C8G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (E144) | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same | 144-LQFP Exposed Pad (E144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,408 | 15,408 (same silicon) | 15,408 (same silicon) | 9,648 (-37%) | 6,272 (-59%) |
| Adaptive Logic Modules (ALM) | 9,630 | 9,630 (same) | 9,630 (same) | 6,030 (-37%) | 3,920 (-59%) |
| Embedded Memory | 516,096 bits (504 Kbit) | 516,096 bits (same) | 516,096 bits (same) | 423,936 bits (-18%) | 270,336 bits (-48%) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 46 (-18%) | 30 (-46%) |
| User I/Os | 78 | 78 (same) | 78 (same) | 78 (same) | 78 (same) |
| Temperature Grade | Automotive -40 C to +125 C (A7G) | Industrial -40 C to +100 C (I7G) | Commercial 0 C to +85 C (C8G) | Automotive -40 C to +125 C (A7G) - same | Commercial 0 C to +85 C (C8G) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Approximate Unit Price (qty-1) | $42.50 | $38.00 (-11%) | $32.00 (-25%) | $28.00 (-34%) | $22.00 (-48%) |
Key Differentiators
- Pin-compatible E144 family spans 6K to 16K LE without PCB change (vs 10CL006YE144C8G and 10CL010YE144A7G)
- Automotive -40 C to +125 C temperature grade at A7G speed (vs 10CL016YE144C8G)
- Higher density than 10CL010 with identical package and footprint (vs 10CL010YE144A7G)
Design Notes
The 144-LQFP exposed-pad (E144) package relies on the bottom thermal pad as the primary heat-dissipation path. For automotive A7G designs that must operate across -40 C to +125 C junction temperature, solder the exposed pad to a continuous ground copper pour of at least 1 square inch on the top layer, plus a 4x4 thermal-via array (0.3 mm drill, 1.0 mm pitch) connecting to internal ground planes. Without this, junction-to-ambient thermal resistance can exceed 35 C/W and the device will derate well before 125 C. Estimated: with a 1 sq-in 1 oz copper pour and 4x4 vias, theta_JA drops to approximately 25 C/W, supporting about 1.5 W continuous dissipation at 85 C ambient.
The Cyclone 10 LP core requires a clean 1.2 V supply capable of delivering up to 500 mA during configuration plus steady-state I/O and logic current. Use a ferrite bead and 10 uF + 0.1 uF ceramic decoupling network on each VCC pin pair, placed within 5 mm of the package. VCCPD (configuration supply) must ramp monotonically to 3.3 V within the Intel-specified 2 ms window - failure to do so causes configuration errors and bitstream corruption. Estimated: 10 uF bulk + 0.1 uF HF bypass per pin pair meets the 50 mV pk-pk ripple budget under full I/O toggle load.
Route all eight VCCIO bank supplies independently with their own decoupling so mixed-voltage designs (1.8 V/2.5 V/3.3 V on different banks) do not share return paths. Keep all configuration traces (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) short and guarded by ground pours to prevent crosstalk during the 100 MHz FPP configuration mode. The E144 package uses a 0.5 mm lead pitch - reflow profile must follow JEDEC J-STD-020 with peak temperature of 245 C +0/-5 C and TAL of 60-90 seconds. Estimated: trace widths of 0.15 mm with 0.15 mm clearance on a 4-layer FR-4 stack-up give 50 ohm single-ended impedance when referenced to a solid ground plane 0.2 mm below.
A common mistake is treating MSEL[3:0] pins as no-connect when using JTAG-only configuration - they still must be tied to valid logic levels per the Cyclone 10 LP configuration guide (typically MSEL=0000 for JTAG, MSEL=0100 for PS, MSEL=1101 for FPP). Floating MSEL pins cause intermittent configuration failure on power-up. Additionally, the nCONFIG signal must see a clean rising edge after VCC and VCCPD are stable - design the power-on reset circuit to release nCONFIG at least 1 ms after VCCPD reaches 3.0 V.
For LVDS signaling on the E144 package, use 100 ohm differential impedance traces with matched length (within 150 mil) across each LVDS pair. Place the external 100 ohm termination resistor within 7 mm of the receiver pin. Cyclone 10 LP internal LVDS receivers include on-chip termination (OCT) that can be enabled in Quartus Prime pin assignments - when OCT is used, omit the external resistor to avoid double termination. Estimated: with OCT enabled and 7 mm trace length, eye opening at 800 Mbps exceeds 60% of UI margin.
Compliance Information
RoHS and REACH compliant per Intel product declaration. AEC-Q100 is not applicable - this is an FPGA, not a discrete automotive IC; however the A7G grade is automotive-qualified per Intel's automotive-grade FPGA program. Lead-free and halogen-free per Intel MDDS. Conflict-mineral reporting (CMRT) published by Intel.