10CL016ZU256I8G - 15K Logic Elements FPGA | Intel | Embedded
MPN: 10CL016ZU256I8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.59 | $24.59 |
| 10 | $22.13 | $221.30 |
| 100 | $19.67 | $1,967.00 |
| 500 | $17.22 | $8,610.00 |
| 1,000 | $14.76 | $14,760.00 |
Drop-in alternatives for 10CL016ZU256I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CL016ZU256I8G Maximum Ratings & Electrical Characteristics
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | Cyclone 10 LP |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| User I/O Count | 162 |
| Package | 256-LFBGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Order Code Temperature Segment | I8G |
| Mounting Type | Surface Mount |
| Programmability | Field programmable |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
| Lead-Free Status | unknown |
| Halogen-Free Status | unknown |
10CL016ZU256I8G [data_needed: package dimensions] Pin Configuration Guide
Complete pinout information for 10CL016ZU256I8G ([data_needed: package dimensions] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL016ZU256I8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL016ZU256I8G is suitable for 6 applications: Industrial Control and Automation, Machine Vision and Image Processing, Test and Measurement Equipment, Communications and Protocol Bridging, Embedded Video and Display Processing, Low-Power Embedded Processing Platform.
Industrial Control and Automation
The 10CL016ZU256I8G fits industrial control and automation designs that need parallel digital processing and a substantial number of board-level connections. Its verified 15,408 logic elements can implement control state machines, sensor-data processing, protocol conversion, and deterministic timing functions. The 162 user I/O provide resources for digital inputs, actuator controls, counters, and communications interfaces, while the industrial temperature-grade designation supports consideration in non-automotive industrial equipment. The FPGA can replace several smaller fixed-function devices when processing must occur concurrently or interfaces must be reconfigured without changing the PCB. Design implementation should still confirm the exact supported voltage rails, I/O standards, temperature limits, and configuration requirements from Intel documentation.
Recommended
Machine Vision and Image Processing
The 10CL016ZU256I8G can serve as a configurable processing and interface platform in machine-vision systems where parallel datapaths and camera timing are required. Its 15,408 logic elements support pixel processing, line buffering control, filtering, region-of-interest logic, and protocol adaptation. The verified 516,096 bits of embedded memory can assist with moderate image-line buffers, lookup tables, or packet state, although the final architecture must account for memory bandwidth and implementation utilization. The 162 I/O allow connections to image sensors, frame grabbers, motor-control devices, and host interfaces. Unlike a processor-only solution, the FPGA can process multiple streams in parallel with predictable hardware timing. Pin assignment, memory placement, and high-speed signal integrity must be validated in the actual board design.
Recommended
Test and Measurement Equipment
The 10CL016ZU256I8G is well suited to test and measurement equipment that requires flexible acquisition timing, parallel data reduction, and multiple instrument interfaces. The FPGA's 15,408 logic elements can implement trigger logic, counters, timing generators, data formatting, and communication-protocol blocks. Its 162 user I/O support connections to analog-front-end control signals, clocks, displays, and host processors. The 516,096 bits of embedded memory can hold captured data, calibration coefficients, or intermediate buffers for moderate workloads, but memory depth and bandwidth must be checked after synthesis. The programmable architecture allows instrument functions to be updated without replacing the entire PCB. Confirm timing constraints, supported I/O voltage levels, clock resources, and configuration behavior before using it in a precision measurement design.
Recommended
Communications and Protocol Bridging
The 10CL016ZU256I8G can provide configurable communications infrastructure when a system must bridge multiple interface formats or process traffic in hardware. The verified 15,408 logic elements are sufficient for moderate protocol parsing, framing, error detection, routing, and buffering control. Its 162 I/O enable parallel connections to serializers, transceivers, processors, backplanes, and control devices, while the 516,096 bits of embedded memory can support packet descriptors, lookup data, or short queues. FPGA parallelism helps maintain deterministic throughput under bursty input conditions and allows interface changes to be implemented in logic rather than in a fixed-function device. The supplied data does not verify a specific transceiver count or supported communication protocol, so designers must use the official Cyclone 10 LP documentation and validate signal integrity, timing, and licensing requirements.
Recommended
Embedded Video and Display Processing
The 10CL016ZU256I8G can support embedded video and display designs that need pixel-level processing, timing generation, and configurable interface conversion. Its 15,408 logic elements can implement synchronization extraction, format conversion, overlays, color-space processing, timing controllers, and limited frame-buffer management. The verified 162 user I/O allow connections to image sources, display bridges, memory devices, and control buses. The 516,096 bits of embedded memory can support small line buffers or lookup tables, but the design should not assume that this capacity replaces a large external frame buffer. The FPGA's parallel architecture is useful when several pixel operations must occur on every clock cycle. Confirm supported display interfaces, I/O standards, clocking resources, and timing constraints from Intel's device documentation before schematic release.
Recommended
Low-Power Embedded Processing Platform
The 10CL016ZU256I8G provides a low-power-oriented Cyclone 10 LP platform for embedded systems that need hardware acceleration without the fixed function set of an application-specific IC. The FPGA can implement dedicated arithmetic, control, filtering, and interface functions in parallel while a host processor manages configuration, storage, and application services. Its 15,408 logic elements, 162 I/O, and 516,096 bits of embedded memory provide a balanced resource set for moderate embedded workloads. The industrial temperature-grade designation is useful for equipment operating beyond benign consumer environments, although the exact operating range remains data-needed. Designers should compare implemented power, thermal performance, package escape routing, and configuration memory against the final design rather than selecting the device from family-level marketing claims.
Recommended
Recommended Products Summary
Engineering reference data for 10CL016ZU256I8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL010ZU256I8G | 10CL006ZU256I8G | 10CL016ZM164I8G | 10CL016ZF484I8G | 10CL016ZE144I8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA |
| Logic Elements | 15,408 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded Memory | 516,096 bits | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 162 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial | [DATA_NEEDED] | [DATA_NEEDED] | Industrial | Industrial | Industrial |
| Configuration Architecture | Field programmable FPGA | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Pinout Compatibility | Verified target pinout unavailable in supplied data | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Drops-in Without Redesign | Target product | Not verified | Not verified | Not verified | Not verified | Not verified |
Key Differentiators
- Higher verified logic capacity (vs 10CL010ZU256I8G)
- Integrated memory resource (vs 10CL006ZU256I8G)
- Large verified I/O resource (vs 10CL016ZM164I8G)
- Industrial-grade ordering code (vs 10CL016YU256I7G)
Design Notes
Start with a bank-by-bank power budget for the 10CL016ZU256I8G and separate core, I/O, auxiliary, and configuration requirements. The supplied verified data does not state voltage limits or current consumption, so do not copy values from a generic Cyclone 10 LP family page. Use the official datasheet and power-estimation tools for the implemented design. Place local bulk and high-frequency decoupling close to the 256-LFBGA power balls, provide a low-impedance ground reference, and check startup sequencing before power is applied.
Generate the footprint only from the official 256-LFBGA package drawing and the CAD library rule set. The verified sources confirm 256 ball terminals and a square package, but do not provide ball coordinates, pitch, or dimensions. Confirm pin-one orientation, ball numbering, keepout zones, paste-mask rules, escape-routing clearance, and assembly tolerances with the manufacturer package specification. Use the Intel pin planner to assign I/O banks, clocks, differential pairs, and configuration pins before freezing the PCB layout.
Plan high-speed and parallel interfaces from the selected Cyclone 10 LP I/O bank rules rather than treating the verified 162-I/O count as 162 simultaneously unrestricted signals. Control trace impedance, reference-plane continuity, via stubs, return paths, and simultaneous-switching-noise budget during schematic and layout review. Place source termination and clocking components according to the selected interface standard. After place-and-route, confirm that timing constraints close for the actual board and device corner conditions.
Thermal analysis for 10CL016ZU256I8G must be based on the post-place-and-route design because switching activity, I/O loading, utilization, and voltage determine heating. The supplied data does not include thermal resistance, maximum junction temperature, or power ratings, so any numerical estimate would be unsupported. Use the manufacturer thermal model and characterize the finished PCB in its enclosure. Preserve a continuous ground plane and use package thermal-pad or copper-spreading guidance only after confirming the actual package construction.
Avoid assuming that a similar Cyclone 10 LP suffix or 256-LFBGA package name guarantees a drop-in replacement. The supplied cross-reference results do not verify pin maps, resource counts, voltage rails, timing, or configuration compatibility for any alternate. Validate the exact orderable MPN against the Intel device table, compare the package drawing, rerun synthesis and timing analysis, and test programming and configuration on a prototype. Treat procurement listings for the target MPN as sourcing evidence, not as a substitute for engineering equivalence documentation.
Compliance Information
The supplied verified material does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals claims. Industrial temperature grade is not equivalent to AEC-Q100 qualification.