10CL025ZU256I8G - Cyclone 10 LP FPGA, 25K LE, 256-UBGA | Intel
MPN: 10CL025ZU256I8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.57 | $28.57 |
| 10 | $25.69 | $256.90 |
| 100 | $21.8 | $2,180.00 |
| 500 | $17.9 | $8,950.00 |
| 1,000 | $14.95 | $14,950.00 |
Drop-in alternatives for 10CL025ZU256I8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10CL025ZU256I8G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 LP |
| Series | 10CL025 |
| Logic Elements (LE) | 24,624 |
| Embedded Memory Bits | 608,256 bits |
| Maximum User I/O | 150 |
| Embedded Multipliers (18x18) | 66 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical) / 1.2 V (transceiver supply not present on LP) |
| Process Technology | TSMC 60 nm low-power |
| Package | 256-pin UBGA (Ultra FineLine BGA) |
| Package Dimensions | 17 mm x 17 mm |
| Operating Temperature | -40C to +100C (industrial, I8G) |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | 8 (I8G - industrial, speed grade 8) |
| Configuration Scheme | Active serial (EPCS) / JTAG |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10CL025ZU256I8G 17 mm x 17 mm Pin Configuration Guide
Complete pinout information for 10CL025ZU256I8G (17 mm x 17 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CL025ZU256I8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10CL025ZU256I8G is suitable for 6 applications: Industrial Motor Control, Human-Machine Interface (HMI) Panels, Video Bridging and Image Sensor Aggregation, I/O Expansion and Protocol Bridging, ASIC Prototyping and Pre-Silicon Validation, Portable Test and Measurement Instrumentation.
Industrial Motor Control
The 10CL025ZU256I8G fits industrial motor control designs where deterministic multi-axis PWM generation, encoder feedback capture, and fieldbus protocol bridging (EtherCAT, CANopen, Modbus) must coexist on a single low-power chip. Its 24,624 logic elements plus 66 embedded 18x18 multipliers handle simultaneous current-loop calculations on multiple axes at 32 kHz PWM rates, while the 4 PLLs provide independent clock domains for the fieldbus PHY, encoder interface, and ADC sampling clock. The -40C to +100C industrial temperature grade matches IEC 60068-2-1/2 cabinet environments without derating. Power consumption is a meaningful design consideration: the Cyclone 10 LP low-power architecture typically draws 0.5-1.5 W static at full I/O utilization, making the part suitable for closed-loop drives where heatsinking space is constrained.
Recommended
Human-Machine Interface (HMI) Panels
The 10CL025ZU256I8G is well-matched to HMI panels that aggregate a TFT LCD controller, capacitive touch I2C bridge, RS-485/Modbus master, GPIO key matrix, and backlight PWM into one programmable platform. Its 150 user I/Os in the 256-UBGA package comfortably absorb a 24-bit RGB parallel LCD interface plus touch controller interrupt, buzzer, status LEDs, and an Ethernet RMII PHY data bus. The 608 Kbits of M9K memory buffer double-buffered video frames at common 800x480 WVGA resolutions. The Cyclone 10 LP low static power profile keeps panel idle (backlight off) current below typical ENERGY STAR limits, while the industrial temperature grade tolerates sealed-enclosure heat rise near the backlight driver.
Recommended
Video Bridging and Image Sensor Aggregation
The 10CL025ZU256I8G handles parallel image sensor aggregation where two MIPI-style CSI-2 sensors or one parallel CMOS sensor must be merged into a USB3 Vision or GigE Vision uplink. The 66 embedded 18x18 multipliers perform real-time lens distortion correction (LDC) and demosaicing at VGA to 720p resolutions, while the 4 PLLs synthesize pixel clocks, MIPI byte clocks, and USB reference clocks independently. The 150 I/Os in the 256-UBGA support 10-bit parallel sensor data buses plus I2C, SPI, and GPIO control channels. Industrial -40C to +100C operation enables outdoor machine-vision camera installations. Power budget: typical active power is 1-2 W, so thermal management at sealed enclosures is essential.
Recommended
I/O Expansion and Protocol Bridging
The 10CL025ZU256I8G is a strong choice for industrial PCs and SBCs that need additional GPIO, UART, SPI, I2C, and PWM channels beyond what the host processor exposes natively. The 24,624 LEs easily implement soft IP cores for UART, SPI, I2C, and PWM bridges, while the 150 I/Os aggregate 4-8 serial channels and dozens of GPIO. The 4 PLLs generate independent baud-rate clocks for multiple UART domains. Industrial temperature operation matches factory-floor SBC chassis. Power draw is low enough to power the part from the host's standby rail, enabling wake-on-UART and similar low-power features.
Recommended
ASIC Prototyping and Pre-Silicon Validation
Engineers prototyping ASIC RTL before tape-out often target the 10CL025ZU256I8G because 24,624 LEs plus 66 multipliers and 4 PLLs in a 256-UBGA package match mid-complexity ASIC blocks (custom DMA engines, signal-processing pipelines, encryption accelerators). The Intel Quartus Prime toolchain supports SystemVerilog and VHDL synthesis, and the Cyclone 10 LP's deterministic timing closure accelerates iteration cycles. The 256-UBGA exposes enough I/Os for FPGA-to-ASIC co-simulation breakout headers. Industrial temperature rating lets prototype boards serve in real-environment validation. Caveat: check that target ASIC block fits within the part's M9K memory bandwidth and PLL count before committing.
Recommended
Portable Test and Measurement Instrumentation
The 10CL025ZU256I8G serves portable oscilloscopes, logic analyzers, and protocol analyzers where 24K LEs implement trigger engines, decoders (I2C, SPI, UART, CAN, LIN, USB), and small TFT-driven UIs on a single low-power device. Its 66 embedded 18x18 multipliers enable on-FPGA FFT, FIR filtering, and statistical calculations, while the 4 PLLs synthesize sample clocks from a single reference oscillator. Battery-powered operation benefits from the Cyclone 10 LP low static power architecture. The 256-UBGA package offers 150 I/Os to expose buffered probe inputs (typically 4-16 analog channels plus 32+ digital channels). Industrial temperature grade supports lab-to-field portability.
Recommended
Recommended Products Summary
Engineering reference data for 10CL025ZU256I8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CL016ZU256I8G | 10CL010ZU256I8G | 10CL025YU256I7G | 10CL025YU256C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-UBGA (U256) | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same |
| Logic Elements (LE) | 24,624 | 15,408 (-37%) | 10,320 (-58%) | 24,624 (same) | 24,624 (same) |
| Embedded Memory (bits) | 608,256 | 504,288 (-17%) | 414,720 (-32%) | 608,256 (same) | 608,256 (same) |
| Temperature Grade | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +100C (I8G) | Industrial -40C to +85C (I7G) | Commercial 0C to +85C (C8G) |
| Maximum User I/O | 150 | 150 (same) | 150 (same) | 150 (same) | 150 (same) |
| Embedded Multipliers (18x18) | 66 | 56 (-15%) | 24 (-64%) | 66 (same) | 66 (same) |
| PLLs | 4 | 4 (same) | 2 (-50%) | 4 (same) | 4 (same) |
| Typical 1k-piece price (USD) | 14.95 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest LE density in 256-UBGA package within Cyclone 10 LP family (vs 10CL016ZU256I8G)
- Industrial temperature range up to +100C vs +85C for I7G (vs 10CL025YU256I7G)
- Lower LE count in same package enables BOM cost optimization (vs 10CL010ZU256I8G)
Design Notes
Estimated: at typical 1.0-1.2 W active power dissipation and a 256-UBGA thermal resistance theta_JA of approximately 15-20 C/W (with minimal PCB copper), junction temperature rise is roughly 15-24 C above ambient. For sealed enclosures without airflow, derate ambient by 15-20 C or add thermal vias under the BGA center array to spread heat to inner copper planes. The Cyclone 10 LP's low static power is an advantage here versus older Cyclone IV parts at the same LE count.
BGA escape routing for the 1.0 mm pitch 256-UBGA requires at least 4 PCB routing layers with microvia stacks (any-layer HDI process recommended). Use the Intel Cyclone 10 LP pin connection guidelines to identify JTAG, configuration, and reference-pin locations. Place decoupling capacitors on the bottom side directly under their respective BGA balls with via-in-pad or short traces. Add a ground pour under the entire BGA stitched with 4-8 thermal vias to the inner ground plane for return-path integrity at high-speed I/O.
Do not confuse 'I8G' (industrial, -40C to +100C, speed grade 8) with 'C8G' (commercial, 0C to +85C, speed grade 8) - they share the same family but differ in temperature range, and ordering the wrong one for an outdoor installation is a frequent sourcing error. Verify the configuration mode (AS, AP, PS, FPP) matches the EPCS flash type; mismatch causes a non-booting design that mimics a dead FPGA. Always include JTAG access on test points or headers even on production boards - field programming and factory test require it.
DDR3/LPDDR2 controller I/Os on the Cyclone 10 LP require matched-length traces within +/- 25 mils for the byte lanes and explicit write-leveling calibration during board bring-up. Use the Quartus Prime Fitter report to extract per-pin delay and adjust PCB trace lengths accordingly. For LVDS inputs above 500 Mbps, place 100-ohm differential termination resistors as close as possible to the FPGA receive pins and avoid vias in the differential pair path. SSO (simultaneously switching output) noise on large parallel buses may require adding more GND balls in the switching region.
Compliance Information
RoHS and lead-free status confirmed by Intel Cyclone 10 LP product page. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified component unless explicitly marketed as such). Industrial temperature grade per the 'I' suffix in the part number.
